TI TL971ID

TL971, TL972, TL974
OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS
www.ti.com
FEATURES
•
•
•
•
•
•
•
Rail-to-Rail Output Voltage Swing: ±2.4 V at
VCC = ±2.5 V
Very Low Noise Level: 4 nV/√Hz
Ultra-Low Distortion: 0.003%
High Dynamic Features: 12 MHz, 4 V/µs
Operating Range: 2.7 V to 15 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model (A114-B)
– 200-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006
TL971...DBV PACKAGE
(TOP VIEW)
OUT
VCC–
IN+
1
5
VCC+
4
IN–
2
3
TL971...D PACKAGE
(TOP VIEW)
NC
IN–
IN+
VCC–
1
8
2
7
3
6
4
5
NC
VCC+
OUT
NC
NC – No internal connection
APPLICATIONS
•
•
•
•
Portable Equipment (CD Players, PDAs)
Portable Communications (Cell Phones,
Pagers)
Instrumentation and Sensors
Professional Audio Circuits
DESCRIPTION/ORDERING
INFORMATION
The TL97x family of operational amplifiers operates
at voltages as low as ±1.35 V and features output
rail-to-rail signal swing. The TL97x boast
characteristics that make them particularly well
suited for portable and battery-supplied equipment.
Very low noise and low distortion characteristics
make them ideal for audio preamplification.
The TL971 is housed in the space-saving 5-pin
SOT-23 package, which simplifies board design
because of the ability to be placed anywhere
(outside dimensions are 2.8 mm × 2.9 mm).
TL972...D, P, OR PW PACKAGE
(TOP VIEW)
OUT1
IN1–
IN1+
VCC–
1
8
VCC+
2
7
3
6
4
5
OUT2
IN2–
IN2+
TL972...DRG PACKAGE
(TOP VIEW)
OUT1 1
IN1– 2
8
VCC+
7
OUT2
IN1+ 3
6
IN2–
VCC– 4
5
IN2+
TL974...D, N, OR PW PACKAGE
(TOP VIEW)
OUT1
IN1–
IN1+
VCC+
1
14
2
13
3
12
4
11
IN2+
IN2–
OUT2
5
10
6
9
7
8
OUT4
IN4–
IN4+
VCC–
IN3+
IN3–
OUT3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
TL971, TL972, TL974
OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006
ORDERING INFORMATION
PACKAGE (1)
TA
Reel of 2500
TL971IDR
Tube of 75
TL971ID
Reel of 3000
TL971IDBVR
Reel of 250
TL971IDBVT
PDIP – P
Tube of 50
TL972IP
QFN – DRG
Reel of 1000
TL972IDRGR
Reel of 2500
TL972IDR
Tube of 75
TL972ID
Reel of 2000
TL972IPWR
Tube of 150
TL972IPW
Tube of 25
TL974IN
Reel of 2500
TL974IDR
Tube of 50
TL974ID
Reel of 2000
TL974IPWR
Tube of 90
TL974IPW
SOIC – D
Single
SOT-23 – DBV
–40°C to 125°C
Dual
SOIC – D
TSSOP – PW
PDIP – N
Quad
SOIC – D
TSSOP – PW
(1)
2
ORDERABLE PART NUMBER
TOP-SIDE MARKING
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
TL974IN
SR974I
SR974I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Submit Documentation Feedback
TL971, TL972, TL974
OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage range (2)
VID
Differential input voltage (3)
VIN
Input
voltage (4)
MAX
2.7
17
V
±1
V
VCC+ + 0.3
V
VCC– – 0.3
D package (5)
Package thermal impedance, junction to free air
8 pin
97
14 pin
86
package (5)
206
DRG package (6)
44
N package (5)
80
DBV
θJA
MIN
P package (5)
PW package (5)
TJ
Maximum junction temperature
Tlead
Maximum lead temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
°C/W
85
8 pin
149
14 pin
113
Soldering, 10 s
–65
Human-Body Model (HBM)
ESD
UNIT
150
°C
260
°C
150
°C
2
kV
Machine Model (MM)
200
V
Charged-Device Model (CDM)
1.5
kV
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to network ground terminal.
Differential voltages for the noninverting input terminal are with respect to the inverting input terminal.
The input and output voltages must never exceed VCC + 0.3 V.
Package thermal impedance is calculated in accordance with JESD 51-7.
Package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions
VCC
Supply voltage
VICM
Common-mode input voltage
TA
Operating free-air temperature
MIN
MAX
2.7
15
VCC– + 1.15 VCC+ – 1.15
–40
Submit Documentation Feedback
125
UNIT
V
V
°C
3
TL971, TL972, TL974
OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006
Electrical Characteristics
VCC+ = 2.5 V, VCC– = –2.5 V, full-range TA = –40°C to 125°C (unless otherwise noted)
PARAMETER
4
TEST CONDITIONS
TA
MIN
25°C
TYP
MAX
1
4
VIO
Input offset voltage
αVIO
Input offset voltage drift
VICM = 0 V, VO = 0 V
25°C
5
IIO
Input offset current
VICM = 0 V, VO = 0 V
25°C
10
150
25°C
200
750
Full range
VICM = 0 V, VO = 0 V
6
UNIT
mV
µV/°C
nA
IIB
Input bias current
VICM
Common-mode input voltage
25°C
–1.35
CMRR
Common-mode rejection ratio
VICM = ±1.35 V
25°C
60
85
dB
SVR
Supply-voltage rejection ratio
VCC = ±2 V to ±3 V
25°C
60
70
dB
AVD
Large-signal voltage gain
RL = 2 kΩ
25°C
70
80
dB
VOH
High-level output voltage
RL = 2 kΩ
25°C
2
2.4
VOL
Low-level output voltage
RL = 2 kΩ
25°C
Isource
Output source current
Isink
Output sink current
ICC
Supply current (per amplifier)
Unity gain, No load
GBWP
Gain bandwidth product
f = 100 kHz, RL = 2 kΩ, CL = 100 pF
Full range
25°C
VCC = 2.5 V
VCC = 2.5 V
1000
1.35
–2.4
1.3
Full range
1
25°C
50
Full range
25
25°C
mA
2.8
3.2
25°C
8.5
12
25°C
3.5
5
V
mA
80
2
V
V
–2
1.5
Full range
nA
mA
MHz
SR
Slew rate
AV = 1, VIN = ±1 V
Φm
Phase margin at unity gain
RL = 2kΩ, CL =100 pF
25°C
60
Gm
Gain margin
RL = 2kΩ, CL =100 pF
25°C
10
dB
en
Equivalent input noise voltage
f = 100 kHz
25°C
4
nV/√Hz
THD
Total harmonic distortion
f = 1 kHz, Av = –1, RL = 10 kΩ
25°C
0.003
Submit Documentation Feedback
Full range
3
V/µs
°
%
TL971, TL972, TL974
OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
160
50
40
120
40
120
30
80
30
80
20
40
20
40
10
0
10
0
50
f O = 8.4 MHz
0
-40
-10
-20
-30
Gain – dB
60
ΦMM = 63.7°
Phase – °
200
60
Gain – dB
GAIN AND PHASE
vs
FREQUENCY
-40
1k
1.E+03
10k
1.E+04
100k
1.E+05
1M
1.E+06
10M
1.E+07
-40
-80
VCC = 5 V
-160
CL = 100 pF
-40
1k
1.E+03
-200
100M
1.E+08
-120
RL = 10 k©
kΩ
-30
-160
CL = 100 pF
0
-20
-120
k©
RL = 10 kΩ
160
f O = 17.3 MHz
-10
-80
VCC = 2.7 V
200
Φ M = 64.4°
Phase – °
GAIN AND PHASE
vs
FREQUENCY
10k
1.E+04
100k
1.E+05
1M
1.E+06
10M
1.E+07
-200
100M
1.E+08
f – Frequency – Hz
f – Frequency – Hz
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT VOLTAGE
1
1
VCC = 2.7 V
f = 1 kHz
Gain = -1 V/V
VCC = 5 V
VIN = 1 Vrms
Gain = -1 V/V
THD + Noise – %
THD – %
0.1
0.01
RL = 2 kΩ
k◊
0.1
RL = 10 kΩ
kΩ
RL = 2 k
0.01
0.001
RL = 10 kΩ
k◊
0.0001
10
1.E+01
0.001
100
1.E+02
1.E+03
1k
10k
1.E+04
1.E+05
100k
0
Frequency – Hz
0.25
0.5
0.75
1
1.25
1.5
Output Voltage – Vrms
Submit Documentation Feedback
5
TL971, TL972, TL974
OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS (continued)
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT VOLTAGE
INPUT VOLTAGE NOISE
vs
FREQUENCY
100
1
nV/√Hz
Input Voltage Noise – nV/sqrt(Hz)
VCC = 5 V
f = 1 kHz
Gain = -1 V/V
THD + Noise – %
0.1
0.01
kΩ
RL = 2 k
0.001
RL = 10 kΩ
k
0.25
0.5
0.75
1
1.25
1.5
1.75
VCC = 10 V
RS = 100 Ω
©
AV = 40 dB
1
10
100
1.E+01
1.E+02
0.0001
0
10
2
1k
1.E+03
10k
1.E+04
100k
1.E+05
f – Frequency – Hz
Output Voltage – Vrms
GAIN BANDWIDTH PRODUCT
vs
OUTPUT CURRENT
GAIN BANDWIDTH PRODUCT
vs
SUPPLY VOLTAGE
20
32
CL = 250 pF
Gain Bandwidth Product – MHz
Gain Bandwidth Product – MHz
28
16
12
8
4
CL = 130 pF
24
CL = 30 pF
20
16
12
8
4
0
0
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2
6
8
10
Supply Voltage – V
Output Current – mA
6
4
Submit Documentation Feedback
12
14
TL971, TL972, TL974
OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS (continued)
PHASE MARGIN
vs
SUPPLY VOLTAGE
100
100
90
90
80
80
70
70
Phase Margin – °
Phase Margin – °
PHASE MARGIN
vs
OUTPUT CURRENT
60
50
40
CL = 30 pF
CL = 130 pF
60
50
CL = 250 pF
40
30
30
20
20
10
10
0
0
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2
4
6
8
10
12
14
Supply Voltage – V
Output Current – mA
GAIN MARGIN
vs
SUPPLY VOLTAGE
INPUT RESPONSE
20
18
CL = 30 pF
CL = 130 pF
14
CL = 250 pF
12
0.25 V/div
Gain Margin – dB
16
10
8
6
4
2
0
2
4
6
8
10
12
14
1 µs/div
Supply Voltage – V
Submit Documentation Feedback
7
TL971, TL972, TL974
OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS
www.ti.com
SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS (continued)
POWER-SUPPLY RIPPLE REJECTION
vs
FREQUENCY
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
10
100
VIN- = -0.2 V
Output Voltage to Supply Voltage – V
90
80
PSRR – dB
70
60
50
40
30
20
VIN+ = 0 V
1
VCC = 2.7 V
VCC = 5 V
0.1
0.01
10
0
1k
1.E+03
0.001
0.01
1.E-02
10k
1.E+04
100k
1.E+05
0.1
1.E-01
1M
1.E+06
10
1.E+01
1
1.E+00
Output Current – mA
Frequency – Hz
OUTPUT IMPEDANCE
vs
FREQUENCY
SLEW RATE
vs
SUPPLY VOLTAGE
100
12
11
Fall
9
Slew Rate – V/µs
ℵ
Output Impedance – Ω
10
10
1
VCC = 2.7 V
Rise
8
7
6
5
4
0.1
3
2
VCC = 5 V
0.01
100
1.E+02
1.E+03
1k
10k
1.E+04
Frequency – Hz
1
100k
1.E+05
1.E+06
1M
0
2
4
6
8
10
Supply Voltage – V
8
Submit Documentation Feedback
12
14
16
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TL974ID
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL974IDG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL974IDR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL974IDRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL974IN
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TL974INE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TL974IPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL974IPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL974IPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL974IPWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
30-Apr-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TL974IDR
D
14
FMX
330
0
6.5
9.0
2.1
8
16
Q1
TL974IPWR
PW
14
MLA
330
12
7.0
5.6
1.6
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TL974IDR
D
14
FMX
333.2
333.2
28.58
TL974IPWR
PW
14
MLA
338.1
340.5
20.64
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated