HT82V737 16-Bit Stereo Audio D/A Converter with Earphone Driver Features · Wide supply voltage range: 2.4V~5.5V · Data in 2¢s complement format, TTL · Low power consumption · Minimum number of external components is required · 16-bit dynamic range · Low clock jitter sensitivity · Low total harmonic distortion · Built-in highly efficient earphone driver · Stereo audio outputs · 16-pin NSOP package Applications · MP3 player · Satellite/cable STB · CD/VCD ROM and player · Digital portable audio/video equipment General Description HT82V737 is a low power consumption stereo DAC with an integrated earphone driver. The device utilizes CMOS technology specially for portable MP3 players, VCD and CD machines. HT82V737 provides users a low cost means of implementing high quality audio voltage outputs. It also builds in a class AB stereo driver and some application circuits, thus, requires minimal external components. It converts the 16 bits serial data into an analog output voltage by high precision D/A converter. It can be used with the Japanese input format: time multiplexed, two¢s complement, MSB first TTL level serial input. With its excellent frequency response characteristics, the The HT82V737 can support low voltage operation at 2.4V so it is very suitable for portable battery powered audio device. A low supply in power down mode current reduces power consumption. It is available in small 16-pin NSOP package. Block Diagram S e r ia l- to - p a r a lle l C o n v e r s io n V + o p D A C O u t R C H D D B C K W S D a ta L a tc h + D IN o p O u t + D V D D S e r ia l- to - p a r a lle l C o n v e r s io n D V S S + + o p L C H o p 3 0 k W 2 0 k W B IA S A V D D 1 L O U T L IN R O U T R IN A V S S Rev. 1.00 O u t D A C 3 0 k W 2 0 k W P D o p November 26, 2003 HT82V737 Pin Assignment W S 1 1 6 B C K D IN 2 1 5 P D D V D D 3 1 4 D V S S B IA S 4 1 3 N C L C H 5 1 2 R C H L IN 6 1 1 R IN L O U T 7 1 0 R O U T A V S S 8 9 A V D D H T 8 2 V 7 3 7 1 6 N S O P -A Pin Description Pin No. Pin Name I/O Description 1 WS I Word select input 2 DIN I Data input 3 DVDD ¾ Digital positive power supply 4 BIAS ¾ Connect a capacitor to ground to increase half-supply stability 5 LCH O Left DAC analog output 6 LIN I Left inverting output 7 LOUT O Left earphone driver analog output 8 AVSS ¾ Analog negative power supply, ground 9 AVDD ¾ Analog positive power supply 10 ROUT O Right earphone driver analog output 11 RIN I Right inverting input 12 RCH O Right DAC analog output 13 NC ¾ No connection 14 DVSS ¾ 15 PD I When low, the HT82V737 is powered down 16 BCK I Bit serial clock input Digital negative power supply, ground Absolute Maximum Ratings Supply Voltage ..........................VSS-0.3V to VSS+5.5V Storage Temperature ...........................-50°C to 125°C Input Voltage .............................VSS-0.3V to VDD+0.3V Operating Temperature ..........................-20°C to 70°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Rev. 1.00 2 November 26, 2003 HT82V737 Electrical Characteristics Symbol VSS=0V; fi=1kHz; RL=32W; Ta=25°C Test Conditions Parameter VDD Conditions Min. Typ. Max. Unit Supplies DVDD Digital Supply Voltage ¾ ¾ 2.4 ¾ 5.5 V AVDD Analog Supply Voltage ¾ ¾ 2.4 ¾ 5.5 V IDD Supply Current 3.3V No load ¾ 5 7 mA IPD Power-down Current 3.3V Power-down; PD=0V ¾ 1 ¾ mA Ptot Total Power dissipation 3.3V No load ¾ 17 ¾ mW 3.3V (THD+N)/S<0.1% ¾ 20 ¾ mA RL=32W 0.35 ¾ 3 V 3.3V RL=16W 0.17 ¾ 3.15 V RL=5kW 0.5 ¾ 3.29 V 3.3V PO=200mW, RL=8W, 32W ¾ 85 ¾ V D.C. Characteristics IO Maximum Output Current VO Output Voltage Swing XTALK Channel Separation A.C. Characteristics (THD+N)/S Total Harmonic Distortion 3.3V PO=30mW, 32W, 1kHz, 0dB ¾ 0.1 ¾ % S/N Signal to Noise Ratio 3.3V Weighed at code =0000H ¾ 95 ¾ dB ATT Power-down Attenuation 3.3V 1kHz, 0dB ¾ 110 ¾ dB Timing Diagrams W S R ig h t L e ft B C K D A T A L S B M S B M S B -1 S a m p le O u t Timing and Input Signals Rev. 1.00 3 November 26, 2003 HT82V737 Application Circuits V D D + 1 0 m F + 1 0 0 n F 3 1 5 1 6 1 2 4 1 m F Rev. 1.00 P D 9 A V D D B C K W S D IN 1 3 D V D D H T 8 2 V 7 3 7 D V S S 1 4 1 0 R O U T 2 .2 m F + 5 L C H L IN L O U T A V S S 2 .2 m F + 1 1 R IN B IA S N C 1 2 R C H 1 0 0 m F + 7 6 1 0 0 m F + 8 4 November 26, 2003 HT82V737 Package Information 16-pin NSOP (150mil) Outline Dimensions 1 6 A 9 B 8 1 C C ' G H D E Symbol Rev. 1.00 a F Dimensions in mil Min. Nom. Max. A 228 ¾ 244 B 149 ¾ 157 C 14 ¾ 20 C¢ 386 ¾ 394 D 53 ¾ 69 E ¾ 50 ¾ F 4 ¾ 10 G 22 ¾ 28 H 4 ¾ 12 a 0° ¾ 10° 5 November 26, 2003 HT82V737 Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 16N (150mil) Symbol Description Dimensions in mm A Reel Outer Diameter 330±1.0 B Reel Inner Diameter 62±1.5 C Spindle Hole Diameter 13.0+0.5 -0.2 D Key Slit Width 2.0±0.5 T1 Space Between Flange 16.8+0.3 -0.2 T2 Reel Thickness 22.2±0.2 Rev. 1.00 6 November 26, 2003 HT82V737 Carrier Tape Dimensions P 0 D P 1 t E F W C D 1 B 0 P K 0 A 0 SOP 16N (150mil) Symbol Description Dimensions in mm W Carrier Tape Width P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 7.5±0.1 D Perforation Diameter 1.55+0.1 D1 Cavity Hole Diameter 1.5+0.25 16.0±0.3 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.5±0.1 B0 Cavity Width 10.3±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness 0.3±0.05 C Cover Tape Width Rev. 1.00 13.3 7 November 26, 2003 HT82V737 Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031 Tel: 0755-8346-5589 Fax: 0755-8346-5590 ISDN: 0755-8346-5591 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holmate Semiconductor, Inc. (North America Sales Office) 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright Ó 2003 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 8 November 26, 2003