Typical Size 6,4 mm X 9,7 mm www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 ! " FEATURES D Power Up/Down Tracking For Sequencing D 15-mΩ MOSFET Switches for High Efficiency D D D D DESCRIPTION at 9-A Continuous Output Source or Sink Current Wide PWM Frequency: Fixed 350 kHz or Adjustable 280 kHz to 700 kHz Power Good and Enable Load Protected by Peak Current Limit and Thermal Shutdown Integrated Solution Reduces Board Area and Component Count APPLICATIONS D Low-Voltage, High-Density Distributed Power D D Systems Point of Load Regulation for High Performance DSPs, FPGAs, ASICs and Microprocessors Requiring Sequencing Broadband, Networking and Optical Communications Infrastructure As a member of the SWIFT family of dc/dc regulators, the TPS54980 low-input voltage high-output current synchronous buck PWM converter integrates all required active components. Using the TRACKIN pin with other regulators, simultaneous power up and down are easily implemented. Included on the substrate with the listed features are a true, high performance, voltage error amplifier that enables maximum performance and flexibility in choosing the output filter L and C components; an under-voltage-lockout circuit to prevent start-up until the input voltage reaches 3 V; an internally or externally set slow-start circuit to limit inrush currents; and a power good output useful for processor/logic reset. The TPS54980 is available in a thermally enhanced 28-pin TSSOP (PWP) PowerPAD package, which eliminates bulky heatsinks. TI provides evaluation modules and the SWIFT designer software tool to aid in quickly achieving high-performance power supply designs to meet aggressive equipment development cycles. SIMPLIFIED SCHEMATIC START-UP WAVEFORM I/O Supply Input RL = 1 Ω Core Supply VI/O = 3.3 V PH TPS54980 BOOT TRACKIN PGND VBIAS VSENSE AGND COMP 500 mv/div VIN V(core) = 1.8 V t − Time − 1 ms/div Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD and SWIFT are trademarks of Texas Instruments. #$%&'()*#&$ # +,''-$* ) &% .,/0#+)*#&$ 1)*-2 '&1,+* +&$%&'( *& .-+#%#+)*#&$ .-' *3- *-'( &% -4) $*',(-$* *)$1)'1 5)'')$*62 '&1,+*#&$ .'&+-#$7 1&- $&* $-+-)'#06 #$+0,1- *-*#$7 &% )00 .)')(-*-'2 Copyright 2003 − 2005, Texas Instruments Incorporated www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA −40°C to 85°C OUTPUT VOLTAGE PACKAGE PART NUMBER 0.9 V to 2.5 V Plastic HTSSOP (PWP)(1) TPS54980PWP (1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54980PWPR). See the application section of the data sheet for PowerPAD drawing and layout information. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) TPS54980 Input voltage range, VI Output voltage range, VO VIN −0.3 V to 4.5 V ENA −0.3 V to 7 V RT −0.3 V to 6 V VSENSE, TRACKIN −0.3 V to 4V BOOT −0.3 V to 10 V VBIAS, COMP, PWRGD −0.3 V to 7 V PH −0.6 V to 6 V PH Source current, IO Sink current, IS UNIT V V Internally Limited COMP, VBIAS 6 mA PH 16 A COMP 6 ENA, PWRGD 10 mA ±0.3 V Operating virtual junction temperature range, TJ −40 to 125 °C Storage temperature, Tstg −65 to 150 °C Voltage differential AGND to PGND Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN Input voltage, VI Operating junction temperature, TJ NOM MAX UNIT 3 4 V −40 125 °C DISSIPATION RATINGS(1)(2) PACKAGE THERMAL IMPEDANCE JUNCTION-TO-AMBIENT TA = 25°C POWER RATING TA = 70°C POWER RATING TA = 85°C POWER RATING 28 Pin PWP with solder 14.4 °C/W 6.94 W(3) 3.81 W 2.77 W 28 Pin PWP without solder 27.9 °C/W 3.58 W 1.97 W 1.43 W (1) For more information on the PWP package, refer to TI technical brief, literature number SLMA002. (2) Test board conditions: 1. 3” x 3”, 4 layers, thickness: 0.062” 2. 1.5 oz. copper traces located on the top of the PCB 3. 1.5 oz. copper ground plane on the bottom of the PCB 4. 0.5 oz. copper ground planes on the two internal layers 5. 12 thermal vias (see “Recommended Land Pattern” in applications section of this data sheet) (3) Maximum power dissipation may be limited by over current protection. 2 www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 ELECTRICAL CHARACTERISTICS over operating free-air temperature range unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VOLTAGE, VIN Input voltage range, VIN 3.0 fs = 350 kHz, RT open, PH pin open I(Q) Quiescent current fs = 500 kHz, RT = 100 kΩ, PH pin open Shutdown, ENA = 0 V 4.0 9.8 17 14 23 1 1.4 2.95 3.0 V mA UNDER VOLTAGE LOCK OUT Start threshold voltage, UVLO V Stop threshold voltage, UVLO 2.70 2.80 Hysteresis voltage, UVLO 0.14 0.16 V 2.5 µs Rising and falling edge deglitch, UVLO(1) V BIAS VOLTAGE Output voltage, VBIAS I(VBIAS) = 0 2.70 2.80 Output current, VBIAS (2) 2.90 V 100 µA CUMULATIVE REFERENCE Vref Accuracy REGULATION Line regulation(1)(3) Load regulation(1)(3) 0.882 0.891 0.900 IL = 4.5 A,fs = 350 kHz, TJ = 85°C IL = 4.5 A,fs = 550 kHz, TJ = 85°C IL = 0 A to 9 A, fs = 350 kHz, TJ = 85°C 0.04 IL = 0 A to 9 A, fs = 550 kHz, TJ = 85°C 0.03 0.04 0.03 V %/V %/A OSCILLATOR Internally set—free running frequency RT open 280 350 420 RT = 180 kΩ (1% resistor to AGND) 252 280 308 Externally set—free running frequency range RT = 100 kΩ (1% resistor to AGND) 460 500 540 RT = 68 kΩ (1% resistor to AGND) 663 700 762 Ramp valley(1) 0.75 Ramp amplitude (peak-to-peak)(1) Minimum controllable on time(1) Maximum duty cycle kHz kHz V 1 V 200 ns 90% (1) Specified by design (2) Static resistive loads only (3) Specified by the circuit used in Figure 9 3 www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ERROR AMPLIFIER Error amplifier open loop voltage gain 1 kΩ COMP to AGND(1) 90 110 Error amplifier unity gain bandwidth Parallel 10 kΩ, 160 pF COMP to AGND(1) 3 5 Error amplifier common mode input voltage range Powered by internal LDO(1) 0 Input bias current, VSENSE VSENSE = Vref Output voltage slew rate (symmetric), COMP VBIAS 60 1.0 dB MHz 250 1.4 V nA V/µs PWM COMPARATOR PWM comparator propagation delay time, PWM comparator input to PH pin (excluding deadtime) 10-mV overdrive(1) 70 85 ns 1.20 1.40 V ENABLE Enable threshold voltage, ENA 0.82 Enable hysteresis voltage, ENA Falling edge deglitch, ENA(1) Leakage current, ENA 0.03 V 2.5 µs VI = 3.6 V 1 µA POWER GOOD Power good threshold voltage VSENSE falling 90 Power good hysteresis voltage(1) Power good falling edge deglitch(1) Output saturation voltage, PWRGD Leakage current, PWRGD I(sink) = 2.5 mA VI = 3.6 V 3 %Vref %Vref 35 µs 0.18 0.3 V 1 µA CURRENT LIMIT Current limit trip point VI = 3.6 V Output shorted(1) 15 A Current limit leading edge blanking time 11 100 ns Current limit total response time 200 ns THERMAL SHUTDOWN Thermal shutdown trip point(1) Thermal shutdown hysteresis(1) 135 150 165 °C °C 10 OUTPUT POWER MOSFETS rDS(on) Power MOSFET switches VI = 3.6 V(4) VI = 3 V(4) 14 28 15 30 mΩ TRACKIN Input offset, TRACKIN Input voltage range, TRACKIN VSENSE = TRACKIN = 1.25 V See Note 1 (1) Specified by design (2) Static resistive loads only (3) Specified by the circuit used in Figure 9 (4) Matched MOSFETs low-side rDS(on) production tested, high-side rDS(on) specified by design 4 −1.5 1.5 mV 0 Vref V www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 PWP PACKAGE (TOP VIEW) AGND VSENSE COMP PWRGD BOOT PH PH PH PH PH PH PH PH PH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 THERMAL 22 PAD 21 20 19 18 17 16 15 RT ENA TRACKIN VBIAS VIN VIN VIN VIN VIN PGND PGND PGND PGND PGND TERMINAL FUNCTIONS TERMINAL NAME NO. DESCRIPTION AGND 1 Analog ground. Return for compensation network/output divider, slow-start capacitor, VBIAS capacitor, RT resistor. Connect PowerPAD to AGND. BOOT 5 Bootstrap output. 0.022-µF to 0.1-µF low-ESR capacitor connected from BOOT to PH generates floating drive for the high-side FET driver. COMP 3 Error amplifier output. Connect frequency compensation network from COMP to VSENSE ENA 27 Enable input. Logic high enables oscillator, PWM control and MOSFET driver circuits. Logic low disables operation and places device in low quiescent current state. PGND 15−19 Power ground. High current return for the low-side driver and power MOSFET. Connect PGND with large copper areas to the input and output supply returns, and negative terminals of the input and output capacitors. A single point connection to AGND is recommended. PH 6−14 Phase output. Junction of the internal high-side and low-side power MOSFETs, and output inductor. PWRGD 4 Power good open drain output. High when VSENSE ≥ 90% Vref, otherwise PWRGD is low. RT 28 Frequency setting resistor input. Connect a resistor from RT to AGND to set the switching frequency. TRACKIN 26 External reference input. High impedance input to internal reference/multiplexer and error amplifier circuits. VBIAS 25 Internal bias regulator output. Supplies regulated voltage to internal circuitry. Bypass VBIAS pin to AGND pin with a high quality, low-ESR 0.1-µF to 1.0-µF ceramic capacitor. 20−24 Input supply for the power MOSFET switches and internal bias regulator. Bypass VIN pins to PGND pins close to device package with a high quality, low-ESR 10-µF ceramic capacitor. VIN VSENSE 2 Error amplifier inverting input. Connect to output voltage through compensation network/output divider. 5 www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 INTERNAL BLOCK DIAGRAM VBIAS AGND Enable Comparator Falling Edge Deglitch ENA 1.2 V Hysteresis: 0.03 V 2.5 µs VIN UVLO Comparator VIN 2.95 V Hysteresis: 0.16 V I/O REG VBIAS SHUTDOWN VIN ILIM Comparator Thermal Shutdown 150°C VIN Leading Edge Blanking Falling and Rising Edge Deglitch 100 ns BOOT Sense FET 15 mΩ 2.5 µs SS_DIS SHUTDOWN PH TRACKIN Multiplexer + − R Q Error Amplifier Reference S PWM Comparator LOUT CO Adaptive Dead-Time and Control Logic 25 ns Adaptive Dead Time VIN 15 mΩ PGND OSC Powergood Comparator PWRGD VSENSE Falling Edge Deglitch 0.90 Vref TPS54980 Hysteresis: 0.03 Vref VSENSE 6 COMP RT SHUTDOWN 35 µs Core www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 TYPICAL CHARACTERISTICS VIN = 3.0 V IO = 9 A 15 10 5 0 −40 0 25 85 TJ − Junction Temperature − °C 25 VIN = 3.6 V IO = 9 A 20 15 10 5 0 −40 125 0 25 85 125 750 650 550 450 350 250 −40 TJ − Junction Temperature − °C Figure 1 0 8 VI = 3.3 V TJ = 125°C 7 600 500 RT = 100 k 400 300 0.893 Device Power Losses − W V ref − Voltage Reference − V RT = 68 k 125 DEVICE POWER LOSSES vs LOAD CURRENT 0.895 700 85 Figure 3 VOLTAGE REFERENCE vs JUNCTION TEMPERATURE 800 25 TJ − Junction Temperature − °C Figure 2 EXTERNALLY SET OSCILLATOR FREQUENCY vs JUNCTION TEMPERATURE 0.891 0.889 0.887 6 5 4 3 2 1 RT = 180 k 25 85 125 0 −40 TJ − Junction Temperature − °C 0 25 85 TJ − Junction Temperature − °C Figure 4 0 125 2 4 6 8 10 12 14 16 IL − Load Current − A Figure 6 Figure 5 OUTPUT VOLTAGE REGULATION vs INPUT VOLTAGE ERROR AMPLIFIER OPEN LOOP RESPONSE 0.895 0 140 RL = 10 kΩ, CL = 160 pF, TA = 25°C 120 0.893 100 −20 −40 −60 0.891 0.889 80 Phase −80 −100 60 −120 40 Gain 20 0.887 −140 Phase − Degrees 0 Gain − dB 200 −40 0.885 VO − Output Voltage Regulation − V f − Externally Set Oscillator Frequency − kHz f − Internally Set Oscillator Frequency − kHz 25 20 INTERNALLY SET OSCILLATOR FREQUENCY vs JUNCTION TEMPERATURE DRAIN-SOURCE ON-STATE RESISTANCE vs JUNCTION TEMPERATURE Drain Source On-State Reststance − m Ω Drain Source On-State Reststance − m Ω DRAIN-SOURCE ON-STATE RESISTANCE vs JUNCTION TEMPERATURE −160 0 0.885 −180 −20 3 3.1 3.2 3.3 3.4 VI − Input Voltage − V Figure 7 3.5 3.6 1 10 100 1 k 10 k 100 k 1 M −200 10 M f − Frequency − Hz Figure 8 7 www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 APPLICATION INFORMATION Figure 9 shows the schematic diagram for a typical TPS54980 application. The TPS54980 (U1) can provide greater than 9 A of output current at a nominal output voltage of 1.8 V. For proper thermal performance, the exposed thermal PowerPAD underneath the integrated circuit package must be soldered to the printed-circuit board. To provide power up tracking, the enable of the I/O supply should be used. If the I/O enable is not used to power up, then devices with similar undervoltage lockout thresholds need to be implemented to ensure power up tracking. To ensure power down tracking, the enable pin should be used. TPS54910 I/O Power Supply R2 R4 10 kΩ 71.5 kΩ R6 9.76 kΩ C2 1 µF VIN C6 10 µF C7 10 µF 28 27 VOUT_I/O R1 10 kΩ TPS54980 U1 RT AGND ENA VSENSE TRACKIN COMP VBIAS PWRGD BOOT VIN VIN PH 26 25 24 23 22 VIN 21 VIN 20 VIN 19 PGND 18 PGND 17 PGND 16 PGND 15 PGND PwrPad 1 2 3 4 5 6 7 R3 R5 C1 470 pF C4 C5 PH 8 PH 9 PH 10 PH 11 PH 12 PH 13 PH 14 PH 10 kΩ C3 301 Ω 470 pF R8 12 pF 0.047 µF 10 kΩ R7 9.76 kΩ L1 R9 0.65 µH 2.2 Ω VOUT_CORE C8 22 µF C9 22 µF C10 22 µF C11 3300 pF Analog and Power Grounds are Tied at the Power Pad Under the Package of IC Figure 9. Application Circuit COMPONENT SELECTION The values for the components used in this design example were selected for low output ripple voltage and small PCB area. Additional design information is available at www.ti.com. INPUT FILTER The input voltage is a nominal 3.3 Vdc. The input filter C6 is a 10-µF ceramic capacitor (Taiyo Yuden). C7 also a 10-µF ceramic capacitor (Taiyo Yuden) provides high frequency decoupling of the TPS54980 from the input supply and must be located as close as possible to the device. Ripple current is carried in both C6 and C7, and the return path to PGND must avoid the current circulating in the output capacitors C8, C9, and C10. FEEDBACK CIRCUIT The values for these components have been selected to provide low output ripple voltage. The resistor divider network of R3 and R8 sets the output voltage for the circuit 8 at 1.8 V. R3, along with R7, R5, C1, C3, and C4, forms the loop compensation network for the circuit. For this design, a Type 3 topology is used. OPERATING FREQUENCY In the application circuit, the 350 kHz operation is selected by leaving RT open. Connecting a 180 kΩ to 68 kΩ resistor between RT (pin 28) and analog ground can be used to set the switching frequency to 280 kHz to 700 kHz. To calculate the RT resistor, use the equation below: R+ 500 kHz Switching Frequency 100 [kW] (1) OUTPUT FILTER The output filter is composed of a 0.65-µH inductor and 3 x 22-µF capacitor. The inductor is a low dc resistance (0.017 Ω) type, Pulse Engineering PA0227. The capacitors used are 22-µF, 6.3 V ceramic types with X5R dielectric. The feedback loop is compensated so that the unity gain frequency is approximately 75 kHz. www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 PCB LAYOUT Figure 10 shows a generalized PCB layout guide for the TPS54980. The PVIN pins should be connected together on the printed circuit board (PCB) and bypassed with a low ESR ceramic bypass capacitor. Care should be taken to minimize the loop area formed by the bypass capacitor connections, the VIN pins, and the TPS54980 ground pins. The minimum recommended bypass capacitance is 10 µF ceramic with a X5R or X7R dielectric and the optimum placement is closest to the VIN pins and the PGND pins. The TPS54980 has two internal grounds (analog and power). The analog ground ties to all of the noise sensitive signals, while the power ground ties to the noisier power signals. Noise injected between the two grounds can degrade the performance of the TPS54980, particularly at higher output currents. Ground noise on an analog ground plane can also cause problems with some of the control and bias signals. For these reasons, separate analog and power ground traces are recommended. There should be an area of ground on the top layer directly under the IC, with an exposed area for connection to the PowerPAD. Use vias to connect this ground area to any internal ground planes. Use additional vias at the ground side of the input and output filter capacitors as well. The AGND and PGND pins should be tied to the PCB ground by connecting them to the ground area under the device as shown. The only components that should tie directly to the power ground plane are the input capacitors, the output capacitors, the input voltage decoupling capacitor, and the PGND pins of the TPS54980. Use a separate wide trace for the analog ground signal path. This analog ground should be used for the voltage set point divider, timing resistor RT, and bias capacitor grounds. Connect this trace directly to AGND (Pin 1). The PH pins should be tied together and routed to the output inductor. Since the PH connection is the switching node, the inductor should be located very close to the PH pins and the area of the PCB conductor minimized to prevent excessive capacitive coupling. Connect the boot capacitor between the phase node and the BOOT pin as shown. Keep the boot capacitor close to the IC and minimize the conductor trace lengths. Connect the output filter capacitor(s) as shown between the VOUT trace and PGND. It is important to keep the loop formed by the PH pins, Lout, Cout, and PGND as small as practical. Place the compensation components from the VOUT trace to the VSENSE and COMP pins. Do not place these components too close to the PH trace. Due to the size of the IC package and the device pinout, the components will have to be routed somewhat close, but maintain as much separation as possible while still keeping the layout compact. Connect the bias capacitor from the VBIAS pin to analog ground using the isolated analog ground trace. If an RT resistor is used, connect it to this trace as well. 9 www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 ANALOG GROUND TRACE AGND RT COMPENSATION NETWORK COMP TRACKING VOLTAGE ENA VSENSE TRACKIN BIAS CAPACITOR PWRGD BOOT CAPACITOR BOOT PH VOUT PH OUTPUT INDUCTOR OUTPUT FILTER CAPACITOR VBIAS VIN EXPOSED POWERPAD AREA VIN PH VIN PH VIN PH VIN PH PGND PH PGND PH PGND PH PGND PH PGND VIN INPUT BYPASS CAPACITOR INPUT BULK FILTER TOPSIDE GROUND AREA VIA to Ground Plane Figure 10. TPS54980 PCB Layout 10 RESISTOR DIVIDER NETWORK www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 LAYOUT CONSIDERATIONS FOR THERMAL PERFORMANCE For operation at full rated load current, the analog ground plane must provide an adequate heat dissipating area. A 3-inch by 3-inch plane of 1 ounce copper is recommended, though not mandatory, depending on ambient temperature and airflow. Most applications have larger areas of internal ground plane available, and the PowerPAD must be connected to the largest area available. Additional areas on the top or bottom layers also help dissipate heat, and 8 PL Ø 0.0130 4 PL Ø 0.0180 any area available must be used when 9 A or greater operation is desired. Connection from the exposed area of the PowerPAD to the analog ground plane layer must be made using 0.013 inch diameter vias to avoid solder wicking through the vias. Eight vias must be in the PowerPAD area with four additional vias located under the device package. The size of the vias under the package, but not in the exposed thermal pad area, can be increased to 0.018. Additional vias beyond the twelve recommended that enhance thermal performance must be included in areas not under the device package. Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside Powerpad Area 4 x 0.018 Diameter Under Device as Shown. Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground Area Is Extended. Connect Pin 1 to Analog Ground Plane in This Area for Optimum Performance 0.06 0.0150 0.0339 0.0650 0.0500 0.3820 0.3478 0.0500 0.0500 0.2090 0.0256 0.0650 0.0339 0.1700 0.1340 Minimum Recommended Top Side Analog Ground Area Minimum Recommended Exposed Copper Area for Powerpad. 5mil Stencils May Require 10 Percent Larger Area 0.0630 0.0400 Figure 11. Recommended Land Pattern for 28-Pin PWP PowerPAD 11 www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 PERFORMANCE GRAPHS OUTPUT VOLTAGE vs OUTPUT CURRENT EFFICIENCY vs OUTPUT CURRENT 1.81 100 90 VI = 3.3 V 80 75 70 65 1.806 1.804 1.802 1.8 1.798 1.796 1.794 60 1.79 50 2 4 6 8 10 0 2 50 150 115 40 120 30 90 6 8 1.79 10 3 3.25 10 30 Gain 0 −30 −20 −60 −90 −120 VI = 5 V, IO = 0 A, fS = 700 kHz 1k 10 k 100 k f − Frequency − Hz 3.5 OUTPUT AND INPUT RIPPLE fs = 700 kHz, TJ = 125°C, VI = 3.3 V, VO = 1.8 V 105 95 85 75 65 55 45 25 −180 1M 0 2 4 6 8 10 12 14 16 t − Time − 1 µs/div IO − Output Current − A LOAD TRANSIENT RESPONSE Figure 16 Figure 17 START-UP TIMING POWER DOWN TIMING 20 mV/div 1 V/div VIO 1 V/div I = 2.25 A to 6.75 A PWRGD(I/O) PWRGD(CORE) 5 V/div PWRGD(CORE) 5 V/div 2 V/div 5 V/div 5 V/div PWRGD(I/O) t − Time −1 ms/div Figure 19 (1) Safe operating area is applicable to the test board conditions in the Dissipation Ratings 12 VIO V(core) V(core) Figure 18 4 Figure 14 35 −150 Figure 15 t − Time −100 µs/div 3.75 VI − Input Voltage − V 2 V/div 60 −60 100 4 10 mV/div Phase 20 Phase − Degrees 125 Ambient Temperature − ° C 180 −50 1.796 AMBIENT TEMPERATURE vs LOAD CURRENT(1) LOOP RESPONSE −40 1.8 Figure 13 60 IO = 4.5 A 1.798 IO − Output Current − A Figure 12 −30 IO = 0 A 1.802 1.792 IO − Output Current − A 0 −10 1.804 50 mV/div 0 IO = 9 A 1.806 1.794 1.792 55 Gain − dB 1.808 VO − Output Voltage − V VO − Output Voltage − V 95 Efficiency − % 1.81 VI = 3.3 V 1.808 85 OUTPUT VOLTAGE vs INPUT VOLTAGE t − Time −100 ms/div Figure 20 www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 DETAILED DESCRIPTION VOLTAGE REFERENCE UNDERVOLTAGE LOCKOUT (UVLO) The voltage reference system produces a precise Vref signal by scaling the output of a temperature stable bandgap circuit. During manufacture, the bandgap and scaling circuits are trimmed to produce 0.891 V at the output of the error amplifier, with the amplifier connected as a voltage follower. The trim procedure adds to the high precision regulation of the TPS54980, since it cancels offset errors in the scale and error amplifier circuits. The TPS54980 incorporates an undervoltage lockout circuit to keep the device disabled when the input voltage (VIN) is insufficient. During power up, internal circuits are held inactive until VIN exceeds the nominal UVLO threshold voltage of 2.95 V. Once the UVLO start threshold is reached, device start-up begins. The device operates until VIN falls below the nominal UVLO stop threshold of 2.8 V. Hysteresis in the UVLO comparator, and a 2.5-µs rising and falling edge deglitch circuit reduce the likelihood of shutting the device down due to noise on VIN. TRACKIN/INTERNAL SLOW-START The internal slow-start circuit provides start-up slope control of the output voltage. The nominal internal slow-start rate is 25 V/ms. When the voltage on TRACKIN rises faster than the internal slope or is present when device operation is enabled, the output rises at the internal rate. If the reference voltage on TRACKIN rises more slowly, then the output rises at about the same rate as TRACKIN. Once the voltage on the TRACKIN pin is greater than the internal reference of 0.891 V, the multiplexer switches the noninverting node to the high precision reference. ENABLE (ENA) The enable pin, ENA, provides a digital control enable or disable (shut down) for the TPS54980. An input voltage of 1.4 V or greater ensures that the TPS54980 is enabled. An input of 0.82 V or less ensures that device operation is disabled. These are not standard logic thresholds, even though they are compatible with TTL outputs. When ENA is low, the oscillator, slow-start, PWM control and MOSFET drivers are disabled and held in an initial state ready for device start-up. On an ENA transition from low to high, device start-up begins with the output starting from 0 V. VBIAS REGULATOR (VBIAS) The VBIAS regulator provides internal analog and digital blocks with a stable supply voltage over variations in junction temperature and input voltage. A high quality, low-ESR, ceramic bypass capacitor is required on the VBIAS pin. X7R or X5R grade dielectrics are recommended because their values are more stable over temperature. The bypass capacitor must be placed close to the VBIAS pin and returned to AGND. External loading on VBIAS is allowed, with the caution that internal circuits require a minimum VBIAS of 2.70 V, and external loads on VBIAS with ac or digital switching noise may degrade performance. The VBIAS pin may be useful as a reference voltage for external circuits. OSCILLATOR AND PWM RAMP The oscillator frequency is set internally to 350 kHz. If a different frequency of operation is required for the application, the oscillator frequency can be externally adjusted from 280 to 700 kHz by connecting a resistor between the RT pin and AGND. The switching frequency is approximated by the following equation, where R is the resistance from RT to AGND: (2) Switching Frequency + 100 kW 500 [kHz] R SWITCHING FREQUENCY RT PIN 350 kHz, internally set Float Externally set 280 kHz to 700 kHz R = 180 kΩ to 68 kΩ ERROR AMPLIFIER The high performance, wide bandwidth, voltage error amplifier sets the TPS54980 apart from most dc/dc converters. The user is given the flexibility to use a wide range of output L and C filter components to suit the particular application needs. Type 2 or type 3 compensation can be employed using external compensation components. PWM CONTROL Signals from the error amplifier output, oscillator, and current limit circuit are processed by the PWM control logic. Referring to the internal block diagram, the control logic includes the PWM comparator, OR gate, PWM latch, and portions of the adaptive dead-time and control logic block. During steady-state operation below the current limit threshold, the PWM comparator output and oscillator pulse train alternately reset and set the PWM latch. Once the PWM latch is reset, the low-side FET remains on for a minimum duration set by the oscillator pulse width. During this period, the PWM ramp discharges rapidly to its valley voltage. When the ramp begins to charge back up, the low-side FET turns off and high-side FET turns on. As the PWM ramp voltage exceeds the error amplifier output voltage, the PWM comparator resets the latch, thus turning off the high-side FET and turning on the low-side FET. The low-side FET remains on until the next oscillator pulse discharges the PWM ramp. During transient conditions, the error amplifier output could be below the PWM ramp valley voltage or above the PWM peak voltage. If the error amplifier is high, the PWM latch is never reset, and the high-side FET remains on until 13 www.ti.com SLVS452A − FEBRUARY 2003 − REVISED FEBRUARY 2005 the oscillator pulse signals the control logic to turn the high-side FET off and the low-side FET on. The device operates at its maximum duty cycle until the output voltage rises to the regulation set-point, setting VSENSE to approximately the same voltage as VREF. If the error amplifier output is low, the PWM latch is continually reset and the high-side FET does not turn on. The low-side FET remains on until the VSENSE voltage decreases to a range that allows the PWM comparator to change states. The TPS54980 is capable of sinking current continuously until the output reaches the regulation set-point. OVERCURRENT PROTECTION If the current limit comparator trips for longer than 100 ns, the PWM latch resets before the PWM ramp exceeds the error amplifier output. The high-side FET turns off and low-side FET turns on to decrease the energy in the output inductor and consequently the output current. This process is repeated each cycle in which the current limit comparator is tripped. THERMAL SHUTDOWN DEAD-TIME CONTROL AND MOSFET DRIVERS Thermal shutdown provides protection when an overload condition is sustained for several milliseconds. With a persistent fault condition, the device cycles continuously; starting up by control of the soft-start circuit, heating up due to the fault condition, and then shutting down upon reaching the thermal shutdown trip point. This sequence repeats until the fault condition is removed. Adaptive dead-time control prevents shoot-through current from flowing in both N-channel power MOSFETs during the switching transitions by actively controlling the turnon times of the MOSFET drivers. The high-side driver does not turn on until the voltage at the gate of the low-side FET is below 2 V. While the low-side driver does not turn on until the voltage at the gate of the high-side MOSFET is below 2 V. The high-side and low-side drivers are designed with 300-mA source and sink capability to quickly drive the power MOSFETs gates. The low-side driver is supplied from VIN, while the high-side drive is supplied from the BOOT pin. A bootstrap circuit uses an external BOOT capacitor and an internal 2.5-Ω bootstrap switch connected between the VIN and BOOT pins. The integrated bootstrap switch improves drive efficiency and reduces external component count. 14 The cycle-by-cycle current limiting is achieved by sensing the current flowing through the high-side MOSFET and comparing this signal to a preset overcurrent threshold. The high side MOSFET is turned off within 200 ns of reaching the current limit threshold. A 100-ns leading edge blanking circuit prevents the current limit from false tripping. Current limit detection occurs only when current flows from VIN to PH when sourcing current to the output filter. Load protection during current sink operation is provided by thermal shutdown. The device uses the thermal shutdown to turn off the power MOSFETs and disable the controller if the junction temperature exceeds 150°C. The device is released from shutdown automatically when the junction temperature decreases to 10°C below the thermal shutdown trip point, and starts up under control of the slow-start circuit. POWER-GOOD (PWRGD) The power good circuit monitors for undervoltage conditions on VSENSE. If the voltage on VSENSE is 10% below the reference voltage, the open-drain PWRGD output is pulled low. PWRGD is also pulled low if VIN is less than the UVLO threshold or ENA is low, or a thermal shutdown occurs. When VIN ≥ UVLO threshold, ENA ≥ enable threshold, and VSENSE > 90% of Vref, the open drain output of the PWRGD pin is high. A hysteresis voltage equal to 3% of Vref and a 35 µs falling edge deglitch circuit prevent tripping of the power good comparator due to high frequency noise. PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS54980PWP ACTIVE HTSSOP PWP 28 50 TBD CU NIPDAU Level-1-220C-UNLIM TPS54980PWPR ACTIVE HTSSOP PWP 28 2000 TBD CU NIPDAU Level-1-220C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated