THS6184 www.ti.com SLLS635 – JANUARY 2005 DUAL-PORT, LOW-POWER DIFFERENTIAL xDSL LINE DRIVER AMPLIFIERS • • • • • • • • DESCRIPTION Trimmed Low-Power Consumption – 4.2-mA/amp Full Bias Mode ; 4.8 mA Max – 3.2-mA/amp Mid Bias Mode ; 3.7 mA Max – 2.15-mA/amp Low Bias Mode ; 2.5 mA Max – Shutdown Mode and IADJ Pin for Variable Bias – Stable Down to 1.6-mA/amplifier Low Noise – 2.9-nV/√Hz Voltage Noise – 5.7-pA/√Hz Inverting Current Noise – 0.8-pA/√Hz Noninverting Current Noise Low MTPR Distortion – –74 dB with ADSL and ADSL2 – –71 dB with ADSL2+ and –70 dB with ADSL2++ –83 dBc THD (1 MHz, 100-Ω Differential) High Output Current: >410 mA (25-Ω Load) Wide Output Swing: 44 Vpp (±12-V, 200-Ω Differential) Wide Bandwidth: 45 MHz (Gain = +5) Wide Power Supply Range: ±2.25 V to ±16.5 V The THS6184 is a dual-port, low-power current feedback differential line driver amplifier system ideal for xDSL systems. Its extremely low-power dissipation is ideal for ADSL, ADSL2, ADSL2+, and ADSL2++ systems that must achieve high densities in ADSL central office rack applications by combining two ports, or four amplifiers, into one package. The unique architecture of the THS6184 allows the trimmed quiescent current to be much lower than existing line drivers while still achieving high linearity. Distortion at these low-power levels is good with –73 dBc THD at 1 MHz with the low bias mode of 4.3 mA/port. Fixed and variable multiple-bias settings of the amplifiers allows for enhanced power savings for line lengths where the full performance of the amplifier is not required. The wide output swing of 44-Vpp differentially with ±12-V power supplies coupled with over 410-mA current drive allow for wide dynamic headroom, keeping distortion minimized. The THS6184 output stage incorporates extra catch-diodes to the power supply to minimize the external protection required in CO systems. With a low 2.9-nV/√Hz voltage noise coupled with a low 5.7-pA/√Hz inverting current noise, the THS6184 increases the sensitivity of the receive signals allowing for better margins and reach. APPLICATIONS • Ideal For Power Sensitive, High Density ADSL, ADSL2, ADSL2+, and ADSL2++ Systems +12 V CODEC V IN + + 30.1 − 4.99 k 0.1 F Line Power = ADSL2: + 19.8 dBm ADSL2+: + 20.4 dBm ADSL2++: + 21.1 dBm 1: 1 1.15 k 1 F 0.1 F 4.99 k 33 nF Line: 100 0.1 F − CODEC V IN− + 30.1 −12 V Figure 1. Typical Line Driver Circuit Using One Port of THS6184 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2005, Texas Instruments Incorporated PRODUCT PREVIEW FEATURES THS6184 www.ti.com SLLS635 – JANUARY 2005 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGING/ORDERING INFORMATION (1) PACKAGED DEVICES (2) DEVICE MARKING PACKAGE TYPE 6184 Leadless MSOP THS6184RHFT THS6184RHFR (1) (2) TRANSPORT MEDIA, QUANTITY Tape and Reel, 250 Tape and Reel, 3000 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. The PowerPAD is electrically Isolated from all other pins. PIN CONFIGURATION PRODUCT PREVIEW 1 24 23 22 21 20 19 2 18 3 Power 4 PADTM 17 16 5 6 15 7 13 8 9 10 11 12 14 D1 IN− D2 IN− D2 OUT D3 OUT D3 IN− D4 IN− D4 OUT BIAS-2/D3D4 BIAS-1/D3D4 VS+ NC NC D1 IN+ D2 IN+ GND IADJ NC D3 IN+ D4 IN+ BIAS−1/D1D2 VS− NC D1 OUT RHF BIAS−2/D1D2 TOP VIEW NC − No internal connection See Notes A, B, and C A. The THS6184 defaults to the FULL BIAS state if no signal is present on the BIAS pins. B. The PowerPAD is electrically isolated from all other pins and can be connected to any potential voltage range from Vs– to Vs+. Typically, the PowerPAD is connected to the GND plane as this plane tends to be physically the largest and able to dissipate the most amount of heat. C. The GND pin range is from Vs- to (Vs+ – 2.5 V). Please contact Texas Instruments for full data sheet. 2 PACKAGE OPTION ADDENDUM www.ti.com 27-Feb-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty THS6184RHFR ACTIVE QFN RHF 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR THS6184RHFRG4 ACTIVE QFN RHF 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR THS6184RHFT ACTIVE QFN RHF 24 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR THS6184RHFTG4 ACTIVE QFN RHF 24 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Mailing Address: Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2006, Texas Instruments Incorporated