SN54HC574, SN74HC574 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS148F – DECEMBER 1982 – REVISED AUGUST 2003 D D D D D SN54HC574 . . . J OR W PACKAGE SN74HC574 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) Wide Operating Voltage Range of 2 V to 6 V High-Current 3-State Noninverting Outputs Drive Bus Lines Directly or Up To 15 LSTTL Loads Low Power Consumption, 80-µA Max ICC Typical tpd = 22 ns ±6-mA Output Drive at 5 V Low Input Current of 1 µA Max Bus-Structured Pinout OE 1D 2D 3D 4D 5D 6D 7D 8D GND description/ordering information These octal edge-triggered D-type flip-flops feature 3-state outputs designed specifically for bus driving. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q CLK 2D 1D SN54HC574 . . . FK PACKAGE (TOP VIEW) The eight flip-flops enter data on the low-to-high transition of the clock (CLK) input. 3D 4D 5D 6D 7D 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 2Q 3Q 4Q 5Q 6Q 8D GND CLK 8Q 7Q A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. OE VCC 1Q D D ORDERING INFORMATION PDIP – N SN74HC574N Tube of 25 SN74HC574DW Reel of 2000 SN74HC574DWR SSOP – DB Reel of 2000 SN74HC574DBR HC574 SOP – NS Reel of 2000 SN74HC574NSR HC574 Tube of 70 SN74HC574PW Reel of 2000 SN74HC574PWR Reel of 250 SN74HC574PWT CDIP – J Tube of 20 SNJ54HC574J SNJ54HC574J CFP – W Tube of 85 SNJ54HC574W SNJ54HC574W LCCC – FK Tube of 55 SNJ54HC574FK TSSOP – PW –55 C to 125 –55°C 125°C C TOP-SIDE MARKING Tube of 20 SOIC – DW C –40°C –40 C to 85 85°C ORDERABLE PART NUMBER PACKAGE† TA SN74HC574N HC574 HC574 SNJ54HC574FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54HC574, SN74HC574 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS148F – DECEMBER 1982 – REVISED AUGUST 2003 description/ordering information (continued) OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. FUNCTION TABLE (each flip-flop) INPUTS OE CLK D OUTPUT Q L ↑ H H L ↑ L L L H or L X Q0 H X X Z logic diagram (positive logic) OE CLK 1 11 C1 1D 2 19 1Q 1D To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54HC574, SN74HC574 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS148F – DECEMBER 1982 – REVISED AUGUST 2003 recommended operating conditions (see Note 3) SN54HC574 VCC VIH Supply voltage VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL VI VO ∆t/∆v t/ v Low-level input voltage NOM MAX 2 5 6 MAX 2 5 6 3.15 3.15 4.2 4.2 0 UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 VCC VCC VCC = 2 V VCC = 4.5 V Input transition rise/fall time NOM 1.5 0 Output voltage MIN 1.5 VCC = 4.5 V VCC = 6 V Input voltage SN74HC574 MIN 0 VCC VCC 0 1000 1000 500 500 V V V ns VCC = 6 V 400 400 TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL TEST CONDITIONS VI = VCC or 0, SN54HC574 MIN MAX SN74HC574 MIN MAX UNIT 2V 1.9 1.998 1.9 1.9 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = –6 mA IOH = –7.8 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 2V 0.002 0.1 0.1 0.1 IOL = 20 µA A 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA 6V ±0.01 ±0.5 ±10 ±5 µA 8 160 80 µA 10 10 10 pF IOL = 6 mA IOL = 7.8 mA ICC Ci TA = 25°C TYP MAX 4.5 V VI = VIH or VIL VI = VCC or 0 VO = VCC or 0 MIN IOH = –20 µA A VI = VIH or VIL II IOZ VCC IO = 0 6V 2 V to 6 V POST OFFICE BOX 655303 3 • DALLAS, TEXAS 75265 V V 3 SN54HC574, SN74HC574 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS148F – DECEMBER 1982 – REVISED AUGUST 2003 timing requirements over recommended operating free-air temperature range (unless otherwise noted) TA = 25°C MIN MAX VCC fclock Clock frequency tw Pulse duration, CLK high or low tsu Setup time, data before CLK↑ th Hold time, data after CLK↑ SN54HC574 MIN MAX SN74HC574 MIN MAX 2V 6 4 5 4.5 V 30 20 24 6V 38 24 28 2V 80 120 100 4.5 V 16 24 20 6V 14 20 17 2V 100 150 125 4.5 V 20 30 25 6V 17 26 21 2V 5 5 5 4.5 V 5 5 5 6V 5 5 5 UNIT MHz ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tpd ten tdis tt 4 CLK OE OE Any Q Any Q Any Q Any Q VCC TA = 25°C MIN TYP MAX SN54HC574 MIN MAX SN74HC574 MIN 2V 6 11 4 5 4.5 V 30 36 20 24 6V 36 40 24 MAX MHz 28 2V 90 180 270 225 4.5 V 28 36 54 45 6V 24 31 46 38 2V 77 150 225 190 4.5 V 26 30 45 38 6V 23 26 38 32 2V 52 150 225 190 4.5 V 24 30 45 38 6V 22 26 38 32 2V 28 60 90 75 4.5 V 8 12 18 15 6V 6 10 15 13 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT ns ns ns ns SN54HC574, SN74HC574 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS148F – DECEMBER 1982 – REVISED AUGUST 2003 switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tpd ten tt CLK OE Any Q Any Q Any Q VCC MIN TA = 25°C TYP MAX SN54HC574 MIN MAX SN74HC574 MIN 2V 6 5 4.5 V 30 24 6V 36 28 MAX UNIT MHz 2V 105 265 400 330 4.5 V 36 53 80 66 6V 31 46 68 57 2V 95 235 355 295 4.5 V 32 47 71 59 6V 28 41 60 51 2V 60 210 315 265 4.5 V 17 42 63 53 6V 14 36 53 45 ns ns ns operating characteristics, TA = 25°C PARAMETER Cpd Power dissipation capacitance per flip-flop POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TEST CONDITIONS TYP UNIT No load 100 pF 5 SN54HC574, SN74HC574 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS SCLS148F – DECEMBER 1982 – REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION VCC From Output Under Test CL (see Note A) PARAMETER S1 Test Point tPZH ten RL 1 kΩ tPZL tPHZ tdis S2 RL tPLZ tpd or tt 1 kΩ Data Input VCC 50% 10% 50% 50% 0V In-Phase Output 50% 10% tPHL 90% 90% tr tPHL Out-ofPhase Output 90% tf Open Closed Closed Open Open Open VCC th 90% 90% VCC 50% 10% 0 V tf 50% 10% Output Control (Low-Level Enabling) VCC 50% 50% 0V tPZL VOH 50% 10% V OL tf tPLH 50% 10% Open VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES VCC tPLH Closed tr VOLTAGE WAVEFORMS PULSE DURATIONS 50% Closed 0V 0V Input Open tsu 0V 50% 50 pF or 150 pF 50% 50% tw Low-Level Pulse S2 50 pF or 150 pF –– Reference Input VCC 50% S1 50 pF LOAD CIRCUIT High-Level Pulse CL 90% VOH VOL Output Waveform 1 (See Note B) tPLZ 10% tPZH Output Waveform 2 (See Note B) ≈VCC ≈VCC 50% VOL tPHZ 50% 90% VOH ≈0 V tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. For clock inputs, fmax is measured when the input duty cycle is 50%. E. The outputs are measured one at a time with one input transition per measurement. F. tPLZ and tPHZ are the same as tdis. G. tPZL and tPZH are the same as ten. H. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty JM38510/65604BRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SN54HC574J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SN74HC574DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574N ACTIVE PDIP N 20 CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) 20 Pb-Free (RoHS) TBD Call TI 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC574N3 OBSOLETE PDIP N 20 SN74HC574NE4 ACTIVE PDIP N 20 SN74HC574NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC574PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC574FK ACTIVE LCCC FK 20 1 TBD SNJ54HC574J ACTIVE CDIP J 20 1 TBD Addendum-Page 1 Call TI POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing SNJ54HC574W ACTIVE CFP W Pins Package Eco Plan (2) Qty 20 1 TBD Lead/Ball Finish A42 MSL Peak Temp (3) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jan-2008 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC574DBR DB 20 SITE 41 330 16 8.2 7.5 2.5 12 16 Q1 SN74HC574DWR DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 SN74HC574DWR DW 20 SITE 60 330 24 10.8 13.1 2.65 12 24 Q1 SN74HC574PWR PW 20 SITE 41 330 16 6.95 7.1 1.6 8 16 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 4-Jan-2008 Package Pins Site Length (mm) Width (mm) Height (mm) SN74HC574DBR DB 20 SITE 41 346.0 346.0 33.0 SN74HC574DWR DW 20 SITE 41 346.0 346.0 41.0 SN74HC574DWR DW 20 SITE 60 346.0 346.0 41.0 SN74HC574PWR PW 20 SITE 41 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265