NEC PS710AL-1A-E4

DATA SHEET
Solid State Relay
OCMOS FET
PS710A-1A,PS710AL-1A
6-PIN DIP, 0.1 Ω LOW ON-STATE RESISTANCE
1.8 A CONTINUOUS LOAD CURRENT
1-ch Optical Coupled MOS FET
DESCRIPTION
The PS710A-1A and PS710AL-1A are solid state relays containing GaAs LEDs on the light emitting side (input
side) and MOS FETs on the output side.
It is suitable for PLC, etc. because of its large continuous load current and low on-state resistance.
The PS710AL-1A has a surface mount type lead.
FEATURES
• Low on-state resistance (Ron = 0.1 Ω TYP.)
• Large continuous load current (IL = 1.8 A)
• 1 channel type (1 a output)
• Low LED operating current (IF = 2 mA)
• Designed for AC/DC switching line changer
• Small package (6-pin DIP)
• Low offset voltage
• PS710AL-1A: Surface mount type
APPLICATIONS
• Measurement equipment
• FA equipment
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P14574EJ4V0DS00 (4th edition)
Date Published June 2000 NS CP(K)
Printed in Japan
The mark • shows major revised points.
©
1999, 2000
PS710A-1A,PS710AL-1A
PACKAGE DIMENSIONS (in millimeters)
PS710A-1A
9.25±0.5
TOP VIEW
6
5
4
1
2
3
1. LED Anode
2. LED Cathode
3. NC
4. MOS FET Drain
5. MOS FET Source
6. MOS FET Drain
7.62
3.5±0.3
3.3±0.3 4.15±0.3
6.5±0.5
0.5±0.1
1.34±0.1
0.25 M
0 to 15˚
2.54
PS710AL-1A
9.25±0.5
TOP VIEW
6
5
4
1
2
3
1. LED Anode
2. LED Cathode
3. NC
4. MOS FET Drain
5. MOS FET Source
6. MOS FET Drain
3.5±0.3
0.10+0.10
–0.05
6.5±0.5
1.34±0.1
0.25 M
2
0.9±0.25
2.54
9.60±0.4
Data Sheet P14574EJ4V0DS00
PS710A-1A,PS710AL-1A
ORDERING INFORMATION
Part Number
PS710A-1A
Package
6-pin DIP
Packing Style
Magazine case 50 pcs
PS710AL-1A
PS710AL-1A-E3
Application Part Number
*1
PS710A-1A
PS710AL-1A
Embossed Tape 1 000 pcs/reel
PS710AL-1A-E4
*1 For the application of the Safety Standard, following part number should be used.
Data Sheet P14574EJ4V0DS00
3
PS710A-1A,PS710AL-1A
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
Diode
Parameter
Symbol
Ratings
Unit
Forward Current (DC)
IF
50
mA
Reverse Voltage
VR
5.0
V
PD
50
mW
IFP
1
A
VL
60
V
IL
1.8
A
Power Dissipation
Peak Forward Current
MOS FET
*1
Break Down Voltage
Continuous
Load Current
Connection A
*2
Pulse Load Current
Connection B
2.0
Connection C
3.6
*3
ILP
3.6
A
PD
560
mW
BV
1 500
Vr.m.s.
Total Power Dissipation
PT
610
mW
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−40 to +100
°C
(AC/DC Connection)
Power Dissipation
Isolation Voltage
*4
*1 PW = 100 µs, Duty Cycle = 1 %
*2 Conditions: IF ≥ 2 mA. The following types of load connections are available.
Connection A
Connection B
Connection C
1
2
3
1
2
3
1
2
3
1
2
3
6
5
4
6
5
IL
IL
VL (AC/DC)
L
L
+
VL (DC)
–
4
6
5
4
6
5
IL
4
IL
IL
L
L
IL + IL
–
+ VL (DC)
+
VL (DC)
–
*3 PW = 100 ms, 1 shot
*4 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
4
Data Sheet P14574EJ4V0DS00
PS710A-1A,PS710AL-1A
RECOMMENDED OPERATING CONDITIONS (TA = 25 °C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
LED Operating Current
IF
2
10
20
mA
LED Off Voltage
VF
0
0.5
V
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter
Diode
MOS FET
Coupled
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
1.2
1.4
V
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
5.0
µA
Off-state Leakage Current
ILoff
VD = 60 V
1.0
µA
Output Capacitance
Cout
VD = 0 V, f = 1 MHz
LED On-state Current
IFon
IL = 1.8 A
On-state Resistance
320
pF
2.0
mA
Ron
IF = 10 mA, IL = 1.8 A, t ≤ 10 ms
0.1
0.2
Ω
Turn-on Time
*1
ton
IF = 10 mA, VO = 5 V, RL = 500 Ω,
1.0
3.0
ms
Turn-off Time
*1
toff
PW ≥ 10 ms
0.05
1.0
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
Ω
9
10
0.5
pF
*1 Test Circuit for Switching Time
IF
Pulse Input
VL
50 %
Input
0
VO = 5 V
Input monitor
90 %
VO monitor
Output
Rin
RL
10 %
ton
Data Sheet P14574EJ4V0DS00
toff
5
PS710A-1A,PS710AL-1A
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
3.0
Maximum Load Current IL (A)
Maximum Forward Current IF (mA)
100
80
60
40
20
0
–25
0
25
50
75
85
2.5
2.0
1.5
1.0
0.5
0.0
–25
100
0
25
50
75
85
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
OUTPUT CAPACITANCE vs.
APPLIED VOLTAGE
100
500
1.6
1.4
1.2
1.0
0.8
–25
0
25
50
75
Output Capacitance Cout (pF)
Forward Voltage VF (V)
f = 1 MHz
IF = 50 mA
30 mA
20 mA
10 mA
5 mA
1 mA
400
300
200
100
0
100
20
40
120
OFF-STATE LEAKAGE CURRENT vs.
AMBIENT TEMPERATURE
LOAD CURRENT vs. LOAD VOLTAGE
3.0
IF = 10 mA
VD = 60 V
2.0
10–7
10–8
10–9
10
100
Applied Voltage VD (V)
Load Current IL (A)
Off-state Leakage Current ILoff (A)
80
Ambient Temperature TA (˚C)
10–6
1.0
–0.45
–0.30
0
–0.15
0.15
–1.0
–10
10–11
0
–2.0
20
40
60
80
–3.0
Load Voltage VL (V)
Ambient Temperature TA (˚C)
6
60
Data Sheet P14574EJ4V0DS00
0.30
0.45
PS710A-1A,PS710AL-1A
NORMALIZED ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
ON-STATE RESISTANCE DISTRIBUTION
30
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
IL = 1.8 A
2.5
2.0
1.5
1.0
0
25
50
10
0.11
0.10
Ambient Temperature TA (˚C)
On-state Resistance Ron (Ω)
TURN-ON TIME vs. FORWARD CURRENT
TURN-OFF TIME vs. FORWARD CURRENT
8.0
0.5
6.0
4.0
2.0
0
0.4
0.3
0.2
0.1
10
30
20
40
0
10
30
20
Forward Current IF (mA)
Forward Current IF (mA)
TURN-ON TIME DISTRIBUTION
TURN-OFF TIME DISTRIBUTION
30
30
n = 50 pcs,
IF = 10 mA,
VO = 5 V,
RL = 500 Ω
25
15
10
40
n = 50 pcs,
IF = 10 mA,
VO = 5 V,
RL = 500 Ω
25
Number (pcs)
20
20
15
10
5
5
0
VO = 5 V,
RL = 500 Ω
Turn-off Time toff (ms)
Turn-on Time ton (ms)
15
0
100
75
VO = 5 V,
RL = 500 Ω
Number (pcs)
20
5
0.5
0.0
–25
n = 50 pcs,
IF = 10 mA,
IL = 1.8 A,
t 10 ms
25
Number (pcs)
Normalized On-state Resistance Ron
3.0
1.0
2.0
0
0.04
0.08
Turn-off Time toff (ms)
Turn-on Time ton (ms)
Data Sheet P14574EJ4V0DS00
7
PS710A-1A,PS710AL-1A
NORMALIZED TURN-OFF TIME vs.
AMBIENT TEMPERATURE
NORMALIZED TURN-ON TIME vs.
AMBIENT TEMPERATURE
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V,
RL = 500 Ω
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
100
3.0
Normalized Turn-off Time toff
Normalized Turn-on Time ton
3.0
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
8
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V,
RL = 500 Ω
Data Sheet P14574EJ4V0DS00
100
PS710A-1A,PS710AL-1A
TAPING SPECIFICATIONS (in millimeters)
4.3±0.2
10.3±0.1
7.5±0.1
1.55±0.1
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
0.3
10.4±0.1
1.55±0.1
12.0±0.1
Tape Direction
PS710AL-1A-E3
PS710AL-1A-E4
Outline and Dimensions (Reel)
1.5
R 1.0
φ 21.0±0.8
φ 80.0±5.0
φ 330
2.0±0.5
φ 13.0±0.5
16.4 +2.0
–0.0
Packing: 1 000 pcs/reel
Data Sheet P14574EJ4V0DS00
9
PS710A-1A,PS710AL-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
235 °C or below (package surface temperature)
• Time of temperature higher than 210 °C
30 seconds or less
• Number of reflows
Two
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
100 to 160 ˚C
60 to 120 s
(preheating)
Time (s)
(2) Dip soldering
• Temperature
260 °C or below (molten solder temperature)
• Time
10 seconds or less
• Number of times
One
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
10
Data Sheet P14574EJ4V0DS00
PS710A-1A,PS710AL-1A
[MEMO]
Data Sheet P14574EJ4V0DS00
11
PS710A-1A,PS710AL-1A
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
• The information in this document is current as of June, 2000. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
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third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
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"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
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and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
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M8E 00. 4