NEC PS7221A-2A-F4

DATA SHEET
Solid State Relay
OCMOS FET
PS7221A-2A
8-PIN SOP, 260 V BREAK DOWN VOLTAGE
2-ch Optical Coupled MOS FET
DESCRIPTION
The PS7221A-2A is a solid state relay containing GaAs LEDs on the light emitting side (input side) and MOS FETs
on the output side.
It is suitable for analog signal control because of its low offset and high linearity.
FEATURES
• 2 channel type (1 a + 1 a output)
• Low LED operating current (IF = 1 mA)
• Designed for AC/DC switching line changer
• Small and thin package (8-pin SOP, Height = 2.1 mm)
• Low offset voltage
• Ordering number of taping product: PS7221A-2A-F3, F4
APPLICATIONS
• Exchange equipment (FAX, MODEM, OCU + SLIC, etc.)
• Measurement equipment
• FA/OA equipment
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P14400EJ2V0DS00 (2nd edition)
Date Published June 2000 NS CP (K)
Printed in Japan
The mark • shows major revised points.
©
1999, 2000
PS7221A-2A
PACKAGE DIMENSIONS
0.4±0.3
(in millimeters)
9.08±0.5
TOP VIEW
8
7
6
5
1
2
3
4
7.0±0.3
0.05+0.08
–0.05
2.05+0.08
–0.05
0.15+0.10
–0.05
4.4
2
0.5±0.3
2.54
0.40+0.10
–0.05
0.25 M
Data Sheet P14400EJ2V0DS00
1. LED Anode
2. LED Cathode
3. LED Anode
4. LED Cathode
5. MOS FET
6. MOS FET
7. MOS FET
8. MOS FET
PS7221A-2A
ORDERING INFORMATION
Part Number
PS7221A-2A
Package
8-pin SOP
Packing Style
Magazine case 45 pcs
PS7221A-2A -F3
*1
Application Part Number
PS7221A-2A
Embossed Tape 1 500 pcs/reel
PS7221A-2A -F4
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Forward Current (DC)
IF
50
mA
Reverse Voltage
VR
5.0
V
PD
50
mW/ch
IFP
1
A
Break Down Voltage
VL
260
V
Continuous Load Current
IL
170
mA
ILP
300
mA
PD
180
mW/ch
BV
1 500
Vr.m.s.
Total Power Dissipation
PT
460
mW
Operating Ambient Temperature
TA
–40 to +80
°C
Storage Temperature
Tstg
–40 to +100
°C
Diode
Power Dissipation
Peak Forward Current
MOS FET
Pulse Load Current
*1
*2
(AC/DC Connection)
Power Dissipation
Isolation Voltage
*3
*1 PW = 100 µs, Duty Cycle = 1 %
*2 PW = 100 ms, 1 shot
*3 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
Data Sheet P14400EJ2V0DS00
3
PS7221A-2A
RECOMMENDED OPERATING CONDITIONS (TA = 25 °C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
LED Operating Current
IF
1
10
20
mA
LED Off Voltage
VF
0
0.5
V
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter
Diode
MOS FET
Coupled
Symbol
Conditions
MIN.
TYP.
MAX.
Unit
1.1
1.4
V
Forward Voltage
VF
IF = 5 mA
Reverse Current
IR
VR = 5 V
5.0
µA
Off-state Leakage Current
ILoff
VD = 260 V
1.0
µA
Output Capacitance
Cout
VD = 0 V, f = 1 MHz
LED On-state Current
IFon
IL = 170 mA
On-state Resistance
122
pF/ch
1.0
mA
Ron
IF = 10 mA, IL = 10 mA
3.4
10
Ω
Turn-on Time
*1
ton
IF = 10 mA, VO = 5 V, RL = 500 Ω,
0.4
1.0
ms
Turn-off Time
*1
toff
PW ≥ 10 ms
0.03
0.2
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
Ω
9
10
0.4
pF/ch
*1 Test Circuit for Switching Time
IF
Pulse Input
VL
50 %
Input
0
VO = 5 V
Input monitor
90 %
VO monitor
Output
Rin
RL
10 %
ton
4
Data Sheet P14400EJ2V0DS00
toff
PS7221A-2A
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
300
Maximum Load Current IL (mA)
Maximum Forward Current IF (mA)
100
80
60
40
20
0
–25
0
25
50
7580
250
200
150
100
50
0
–25
100
0
25
7580
50
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
OUTPUT CAPACITANCE vs.
APPLIED VOLTAGE
100
250
1.6
1.4
IF = 50 mA
30 mA
20 mA
10 mA
5 mA
1.2
1.0
1 mA
0.8
–25
0
25
50
75
Output Capacitance Cout (pF)
Forward Voltage VF (V)
f = 1 MHz
200
150
100
50
0
100
10
20
30
60
Ambient Temperature TA (˚C)
Applied Voltage VD (V)
OFF-STATE LEAKAGE CURRENT vs.
AMBIENT TEMPERATURE
LOAD CURRENT vs. LOAD VOLTAGE
10–6
VD = 260 V
IF = 10 mA
200
10–7
Load Current IL (mA)
Off-state Leakage Current ILoff (A)
50
40
10–8
10–9
10–10
100
–1.0
–0.5
0
0.5
1.0
–100
–200
10
–11
0
20
40
60
80
Load Voltage VL (V)
Ambient Temperature TA (˚C)
Data Sheet P14400EJ2V0DS00
5
PS7221A-2A
NORMALIZED ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
ON-STATE RESISTANCE DISTRIBUTION
30
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
IL = 10 mA
2.5
2.0
1.5
1.0
n = 50 pcs,
IF = 10 mA,
IL = 10 mA
25
Number (pcs)
Normalized On-state Resistance Ron
3.0
0.5
20
15
10
5
0.0
–25
0
25
50
0
100
75
3.0
3.2
3.4
3.6
Ambient Temperature TA (˚C)
On-state Resistance Ron (Ω)
TURN-ON TIME vs. FORWARD CURRENT
TURN-OFF TIME vs. FORWARD CURRENT
2.5
0.25
VO = 5 V,
RL = 500 Ω
2.0
Turn-off Time toff (ms)
Turn-on Time ton (ms)
VO = 5 V,
RL = 500 Ω
1.5
1.0
0.5
0
5
10
15
20
0.15
0.10
0.05
0
30
25
0.20
15
n = 50 pcs,
IF = 10 mA,
VO = 5 V,
RL = 500 Ω
15
10
5
20
15
10
5
0.4
30
n = 50 pcs,
IF = 10 mA,
VO = 5 V,
RL = 500 Ω
25
Number (pcs)
20
0.3
25
20
30
25
Number (pcs)
10
TURN-OFF TIME DISTRIBUTION
TURN-ON TIME DISTRIBUTION
30
0
5
Forward Current IF (mA)
Forward Current IF (mA)
0.5
0
Turn-on Time ton (ms)
6
3.8
0.02
0.04
Turn-off Time toff (ms)
Data Sheet P14400EJ2V0DS00
PS7221A-2A
NORMALIZED TURN-OFF TIME vs.
AMBIENT TEMPERATURE
NORMALIZED TURN-ON TIME vs.
AMBIENT TEMPERATURE
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V,
RL = 500 Ω
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
100
3.0
Normalized Turn-off Time toff
Normalized Turn-on Time ton
3.0
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V,
RL = 500 Ω
2.5
2.0
1.5
1.0
0.5
0.0
–25
Ambient Temperature TA (˚C)
0
25
50
75
100
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
Data Sheet P14400EJ2V0DS00
7
PS7221A-2A
TAPING SPECIFICATIONS (in millimeters)
1.55±0.1
2.8±0.1
10.45±0.1
7.5±0.1
1.55±0.1
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
0.3
7.6±0.1
12.0±0.1
Tape Direction
PS7221A-2A-F3
PS7221A-2A-F4
Outline and Dimensions (Reel)
100±5.0
330
2.0±0.5
13.0±1.0
21.0±0.8
2.5
16.4 +2.0
–0.0
Packing: 1 500 pcs/reel
8
Data Sheet P14400EJ2V0DS00
PS7221A-2A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
235 °C or below (package surface temperature)
• Time of temperature higher than 210 °C
30 seconds or less
• Number of reflows
Two
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
100 to 160 ˚C
60 to 120 s
(preheating)
Time (s)
(2) Dip soldering
• Temperature
260 °C or below (molten solder temperature)
• Time
10 seconds or less
• Number of times
One
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
• Avoid shorting between portion of frame and leads.
∗
∗
∗ : Portion of frame
Data Sheet P14400EJ2V0DS00
9
PS7221A-2A
[MEMO]
10
Data Sheet P14400EJ2V0DS00
PS7221A-2A
[MEMO]
Data Sheet P14400EJ2V0DS00
11
PS7221A-2A
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
• The information in this document is current as of June, 2000. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
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patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
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semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
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Customers must check the quality grade of each semiconductor product before using it in a particular
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
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The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
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(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
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M8E 00. 4