E2E0028-38-95 This version: Sep. 1998 MSM64152A/64152AL Previous version: Mar. 1996 ¡ Semiconductor MSM64152A/64152AL ¡ Semiconductor 4-Bit Microcontroller with Built-in LCD Driver and Melody Circuit GENERAL DESCRIPTION The MSM64152A (1.5 V)/64152AL (3.0 V) is a high-performance 4-bit microcontroller that incorporates Oki-original CPU core nX-4/20. The MSM64152A/64152AL has an LCD driver for up to 104 segments, an event counter, and a melody circuit. It is best suited for applications such as clocks and LCD games. FEATURES • Operating range Operating voltage Operating temperature Operating frequency : 1.5 V/3.0 V : –40 to +70 °C : 32.768 kHz crystal oscillation Approx. 32 kHz RC oscillation Supply current (Typ.) : 0.9 mA (3.0 V at HALT mode) • Minimum instruction execution time : 91 ms • General memory space : 1504 bytes • Local memory space : 128 nibbles • LCD driver : 30 Common driver ¥ 4 Segment driver ¥ 26 1/4 duty, 1/3 bias; 104 segments (26 ¥ 4) 1/3 duty, 1/3 bias; 78 segments (26 ¥ 3) • I/O port Input-output port : 1 port ¥ 4 bits (open-drain output/CMOS output selectable; pull-down resistor input/high-impedance input selectable) Input port : 1 port ¥ 4 bits (pull-down resistor input/high-impedance input selectable) Output port : 1 port ¥ 4 bits (CMOS output) • Event counter : 1 channel • Melody output :1 • Interrupts : 7 sources External 2, time base 4, melody 1 • Package: 60-pin plastic QFP (QFP60-P-1519-1.00-K) : (Product name : MSM64152A-¥¥¥GS-K, MSM64152AL-¥¥¥GS-K) Chip : MSM64152A-¥¥¥, MSM64152AL-¥¥¥ ¥¥¥ indicates a code number. • OTP version (for program evaluation) : MSM64P155/64P155L (The package, power polarity, and operating voltage of the MSM64P155/64P155L are different from the MSM64152A/64152AL. For details, refer to the "MSM64P155 User's Manual".) 1/25 ¡ Semiconductor MSM64152A/64152AL C2 C1 VSS3 VSS2 VSS1 COM4 COM3 COM2 COM1 BLOCK DIAGRAM COM DRV TR2 TR0 TR1 HALT (4) C ROM 1504B PCH PCM PCL ALU A8 to A11 MIEF A7 to A0 B A (4) (4) H L X RESET RST TIMING CONTROLLER TBC SP LCD DRV SEG25 (8) ROMR IR OSC1 OSC IR DECODER OSC0 SEG0 LCD CNT RAM 128N Y DB7 to DB0 PORT ADDRESS BSR BIAS DSPR INTC (8) MD0 TST1 TST2 TST3 TST VSSL VR PORT ADDRESS MD0 MD0 PORT2 PORT4 PORT6 P6.0 P6.1 P6.2 P6.3 VDD CAPR P4.0 P4.1 P4.2 P4.3 BUP P2.0 P2.1 P2.2 P2.3 DB7 to DB0 is the CPU core (nX-4/20). 2/25 ¡ Semiconductor MSM64152A/64152AL P6.3 1 P6.2 2 P6.1 3 P6.0 4 MD0 5 MD0 6 VDD 7 SEG25 8 48 OSC1 47 OSC0 50 P2.2 49 P2.3 52 P2.0 51 P2.1 54 TST2 53 TST3 56 RESET 55 TST1 58 P4.2 57 P4.3 60 P4.0 59 P4.1 PIN CONFIGURATION (TOP VIEW) 46 VSSL 45 VSS1 44 VSS2 43 VSS3 42 C1 41 C2 40 COM1 39 COM2 SEG24 38 COM3 37 COM4 9 SEG23 10 SEG22 11 36 SEG0 35 SEG1 SEG21 12 SEG20 13 34 SEG2 33 SEG3 SEG19 14 SEG18 15 32 SEG4 31 (NC) SEG5 30 SEG7 28 SEG6 29 SEG9 26 SEG8 27 (NC) 23 SEG11 24 SEG10 25 SEG13 21 SEG12 22 SEG15 19 SEG14 20 SEG17 17 SEG16 18 (NC) 16 60-Pin Plastic QFP Note: Pins marked as (NC) are no-connection pins which are left open. 3/25 ¡ Semiconductor MSM64152A/64152AL PAD CONFIGURATION Pad Layout 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 44 45 46 47 48 49 50 51 52 53 54 55 56 57 28 27 26 25 24 23 22 21 20 19 18 17 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Chip Size Chip Thickness Coordinate Origin Pad Hole Size Pad Size Minimum Pad Pitch : : : : : : Y X 3.90 mm ¥ 3.48 mm 350 mm (typ.) Chip center 110 mm ¥ 110 mm 120 mm ¥ 120 mm 180 mm Note: The chip substrate voltage is VDD. 4/25 ¡ Semiconductor MSM64152A/64152AL Pad Coordinates Pad No. Pad Name X (µm) Y (µm) Pad No. Pad Name X (µm) Y (µm) 1 P6.3 –1529 –1589 41 VSS2 –1085 1589 2 P6.2 –1307 –1589 42 VSS1 –1307 1589 3 P6.1 –1085 –1589 43 VSSL –1529 1589 4 P6.0 –863 –1589 44 OSC0 –1749 1340 5 MD0 –640 –1589 45 OSC1 –1749 1132 6 MD0 –418 –1589 46 P2.3 –1749 924 7 VDD –196 –1589 47 P2.2 –1749 715 8 SEG25 26 –1589 48 P2.1 –1749 507 9 SEG24 242 –1589 49 P2.0 –1749 299 10 SEG23 459 –1589 50 TST3 –1749 91 11 SEG22 675 –1589 51 TST2 –1749 –117 12 SEG21 892 –1589 52 TST1 –1749 –326 13 SEG20 1108 –1589 53 RESET –1749 –534 14 SEG19 1324 –1589 54 P4.3 –1749 –743 15 SEG18 1541 –1589 55 P4.2 –1749 –952 16 SEG17 1749 –1357 56 P4.1 –1749 –1160 17 SEG16 1749 –1140 57 P4.0 –1749 –1369 18 SEG15 1749 –923 19 SEG14 1749 –706 20 SEG13 1749 –490 21 SEG12 1749 –273 22 SEG11 1749 38 23 SEG10 1749 254 24 SEG9 1749 471 25 SEG8 1749 687 26 SEG7 1749 904 27 SEG6 1749 1120 28 SEG5 1749 1336 29 SEG4 1541 1589 30 SEG3 1324 1589 31 SEG2 1108 1589 32 SEG1 892 1589 33 SEG0 675 1589 34 COM4 459 1589 35 COM3 242 1589 36 COM2 26 1589 37 COM1 –196 1589 38 C2 –418 1589 39 C1 –640 1589 40 VSS3 –863 1589 5/25 ¡ Semiconductor MSM64152A/64152AL PIN DESCRIPTIONS Basic Functions Function Power Supply Oscillation Test RESET Pin 7 Pad Symbol Type 7 VDD — Digital supply voltage(0 V) Description 45 42 VSS1 — Digital negative power supply (1.5 V spec.) Bias output for LCD driver (3.0 V spec.) 44 41 VSS2 — Digital negative power supply (3.0 V spec.) Bias output for LCD driver (1.5 V spec.) 43 42 40 VSS3 C1 — — Bias output for LCD driver (–4.5 V) 39 41 46 38 43 C2 VSSL — — 47 44 OSCO I 48 45 OSC1 O 55 54 52 51 TST1 TST2 I I 53 50 TST3 I 56 53 RESET I For connection to capacitors that generate bias for the LCD driver Negative power supply voltage pin for internal logic (An internally generated constant voltage is present at this pin.) Clock oscillation pins: Either a crystal (32.768 kHz) and a capacitor (10 to 30 pF) are connected to these pins or a resistor (1 MW) is. Input pins for test System reset input pin : Setting this pin to "H" level puts this device into a reset state. Then, setting this pin to "L" level starts executing an instruction from address 000H. This pin is internally connected to VSS1 or VSS2 through a pull-down resistor. 6/25 ¡ Semiconductor MSM64152A/64152AL Basic Functions (continued) Function Pin Pad Symbol Type Description Ports 52 49 P2.0 I 51 50 48 47 P2.1 49 46 P2.3 4-bit input port (port 2) : Select between pull-down resistor input and high impedance input for each bit with the port 2 control register (P2CON). When configured for secondary functions, an external interrupt and capture circuit trigger input are allocated. If P2.0 to P2.3 are set to "H" level, the IC enters system reset mode. 60 57 P4.0 O 59 58 56 55 P4.1 4-bit output port (port 4) : 4-bit CMOS output port. 57 54 P4.3 4 4 P6.0 I/O 3 2 3 2 P6.1 1 1 P6.2 P6.3 4-bit input-output port (port 6) : Select between input and output, between pull-down resistor input and high impedance input, and between open-drain output and CMOS output with the port 6 control register (P6CON). When configured for a secondary function, an external interrupt is allocated. Melody Drivers 5 6 5 6 MD0 MD0 O O Output pin of melody driver 0 Inverted output pin of MD0 output LCD Drivers 40 37 COM1 36 35 COM2 O O LCD common signal output pins 39 38 37 34 P2.2 P4.2 COM3 COM4 O O 7/25 ¡ Semiconductor MSM64152A/64152AL Basic Functions (continued) Function Pin Pad Symbol Type LCD Drivers 36 33 SEG0 O 35 32 SEG1 O 34 31 SEG2 O 33 32 30 29 SEG3 SEG4 O O 30 29 28 27 SEG5 SEG6 O O 28 26 SEG7 O 27 25 SEG8 O 26 24 SEG9 O 25 23 SEG10 O 24 22 22 21 SEG11 SEG12 O O 21 20 SEG13 O 20 19 SEG14 O 19 18 18 17 SEG15 SEG16 O O 17 16 SEG17 O 15 15 O 14 14 SEG18 SEG19 13 12 13 12 SEG20 SEG21 O O 11 11 SEG22 O 10 10 SEG23 O 9 8 9 8 SEG24 SEG25 O O Description LCD segment signal output pins O 8/25 ¡ Semiconductor MSM64152A/64152AL Secondary Functions Function Pin Pad Symbol Type External Interrupts 52 49 P2.0 I 51 50 48 47 P2.1 P2.2 49 46 P2.3 P2.0 to P2.3 secondary functions : These are level-triggered external interrupt input pins. Select interrupt enable/disable for each bit with the P2 interrupt enable register (P2IE). If P2.0 to P2.3 pins are set to "H" level for a minimum of 2 seconds, the device enters system reset mode. P2.0, P2.1 secondary functions : trigger input pins for capture circuit. 4 4 P6.0 I 3 2 3 2 P6.1 P6.2 P6.0 to P6.3 secondary functions : These are level-triggered external interrupt input pins. 1 1 P6.3 Description 9/25 ¡ Semiconductor MSM64152A/64152AL Handling When Specific Pins Are Not Used Recommended Pin Connection Symbol TST1 to TST3 Open P2.0 to P2.3 "L" level or open P4.0 to P4.3 Open P6.0 to P6.3 In input mode : "L" level or open (Initial setting: input mode) In output mode : Open Open MD0, MD0 COM1 to COM4 Open SEG0 to SEG25 Open 10/25 ¡ Semiconductor MSM64152A/64152AL ABSOLUTE MAXIMUM RATINGS 1.5 V Spec. (MSM64152A) (VDD = 0 V) Parameter Symbol Condition Rating Unit Power Supply Voltage 1 VSS1 Ta = 25°C –2.0 to +0.3 V Power Supply Voltage 2 VSS2 Ta = 25°C –4.0 to +0.3 V Power Supply Voltage 3 VSS3 Ta = 25°C –5.5 to +0.3 V Power Supply Voltage 4 VSSL Ta = 25°C –2.0 to +0.3 V Input Voltage 1 VIN1 VSS1 input, Ta = 25°C VSS1 – 0.3 to +0.3 V VIN2 VSSL input,Ta = 25°C VSSL – 0.3 to +0.3 V Output Voltage 1 VOUT1 VSS1 output,Ta = 25°C VSS1 – 0.3 to +0.3 V Output Voltage 2 VOUT2 VSS2 output,Ta = 25°C VSS2 – 0.3 to +0.3 V Output Voltage 3 VOUT3 VSS3 output,Ta = 25°C VSS3 – 0.3 to +0.3 V Output Voltage 4 VOUT4 VSSL output,Ta = 25°C VSSL – 0.3 to +0.3 V Storage Temperature TSTG — –55 to +150 °C Input Voltage 2 RECOMMENDED OPERATING CONDITIONS 1.5 V Spec. (MSM64152A) (VDD = 0 V) Symbol Condition Range Unit Operating Temperature Parameter Top — –40 to +70 °C Operating Voltage VSS1 BUPF = "0" –1.7 to –1.25 BUPF = "1" –1.7 to –1.15 V Crystal Oscillation Frequency fXT — 30 to 35 kHz External RC Oscillator Resistance ROS — 1M ±10% W 11/25 ¡ Semiconductor MSM64152A/64152AL ELECTRICAL CHARACTERISTICS 1.5 V Spec. (MSM64152A) DC Characteristics (VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +70°C unless otherwise specified.) Parameter VSS2 Voltage VSS3 Voltage VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance RC Oscillation Frequency Symbol VSS2 VSS3 VSSL VSTA Condition Ca, Cb, C12 = 0.1 mF +100% –20% Ta = –40 to +60°C BUPF = "0" Ca, Cb, C12 = 0.1 mF +100% –20% Ta = –40 to +70°C BUPF = "0" Ca, Cb, C12 = 0.1 mF +100% –20% Ta = –40 to +60°C BUPF = "1" Ca, Cb, C12 = 0.2 mF +100% –20% Ta = –40 to +70°C BUPF = "1" Ca, Cb, C12 = 0.1 mF +100% –20% Ta = –40 to +60°C BUPF = "0" Ca, Cb, C12 = 0.1 mF +100% –20% Ta = –40 to +70°C BUPF = "0" Ca, Cb, C12 = 0.1 mF +100% Ta = –40 to +60°C –20% BUPF = "1" Ca, Cb, C12 = 0.2 mF +100% Ta = –40 to +70°C –20% BUPF = "1" Min. Typ. Max. Unit –3.2 –3.0 –2.7 V –3.2 –3.0 –2.5 –3.2 –3.0 –2.3 1 1' –4.7 –4.5 –4.2 –4.7 –4.5 –4.0 V –4.7 –4.5 –3.9 –4.7 –4.5 –3.7 –1.5 –1.3 –0.6 BUPF = "1" –1.9 –1.3 –0.6 within 5 seconds after reset — VHOLD Circuit –3.2 –3.0 –2.8 BUPF = "0" Oscillation start time: Measuring V — — –1.45 V — — –1.15 V 1 CG — 10 — 30 pF CD — 10 15 20 pF 15 40 75 kHz fCR ROS = 1 MW 1' 12/25 ¡ Semiconductor MSM64152A/64152AL DC Characteristics (continued) • 32.768 kHz crystal oscillation (VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +70°C unless otherwise specified.) Parameter Supply Current 1 Supply Current 1 Supply Current 2 Supply Current 2 Symbol IDD1 IDD1 IDD2 Condition CPU is in HALT state Ta = –40 to +40°C — BUPF = "0" Ta = +40 to +70°C — CPU is in HALT state Ta = –40 to +40°C — BUPF = "1" 6.0 mA 2.0 40 mA 3.0 10 mA 2.0 Ta = +40 to +70°C — 3.0 50 mA CPU is in operation state Ta = –40 to +40°C — 6.0 15 mA Ta = +40 to +70°C — 6.0 50 mA CPU is in operation state Ta = –40 to +40°C — 10 25 mA Ta = +40 to +70°C — 10 60 mA BUPF = "0" IDD2 Min. Typ. Max. Unit BUPF = "1" Measuring Circuit 1 • RC oscillation (VDD = 0 V, VSS1 = –1.5 V, ROS = 1 MW, Ta = –40 to +70°C unless otherwise specified.) Parameter Symbol Supply Current 1 IDD1 Supply Current 1 IDD1 Supply Current 2 Supply Current 2 IDD2 IDD2 Condition Min. Typ. Max. Unit CPU is in HALT state Ta = –40 to +40°C — 3.0 10 mA BUPF = "0" Ta = +40 to +70°C — 3.0 45 mA CPU is in HALT state Ta = –40 to +40°C — 6.0 15 mA BUPF = "1" Ta = +40 to +70°C — 6.0 50 mA CPU is in operation state Ta = –40 to +40°C — 7.0 20 mA Ta = +40 to +70°C — 7.0 50 mA CPU is in operation state Ta = –40 to +40°C — 15 30 mA Ta = +40 to +70°C — 15 70 mA BUPF = "0" BUPF = "1" Measuring Circuit 1' 13/25 ¡ Semiconductor MSM64152A/64152AL DC Characteristics (continued) (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +70°C unless otherwise specified.) Parameter (Pin Name) Symbol Condition Min. Typ. Max. Unit Output Current 1 (P4.0 to P4.3) (MD0, MD0) IOH1 VOH1 = –0.5 V –2.0 –0.6 –0.1 mA IOL1 VOL1 = VSS1 + 0.5 V 0.1 0.6 2.0 mA Output Current 2 (SEG0 to SEG25) (COM1 to COM4) IOH2 VOH2 = –0.2 V (VDD level) — — –4.0 mA IOMH2 VOMH2 = VSS1 + 0.2 V (VSS1 level) 4.0 — — mA IOMH2S VOMH2S = VSS1 – 0.2 V (VSS1 level) — — –4.0 mA IOML2 VOML2 = VSS2 + 0.2 V (VSS2 level) 4.0 — — mA IOML2S VOML2S = VSS2 – 0.2 V (VSS2 level) — — –4.0 mA IOL2 VOL2 = VSS3 + 0.2 V (VSS3 level) 4.0 — — mA Output Current 3 (P6.0 to P6.3) IOH3 VOH3 = –0.5 V –5.0 –2.1 –0.3 mA IOL3 VOL3 = VSS1 + 0.5 V 0.1 0.7 2.0 mA Output Leakage Current (P6.0 to P6.3) IOOH VOH = VDD — — 0.3 mA IOOL VOL = VSS1 –0.3 — — mA Input Current 1 (P2.0 to P2.3) (P6.0 to P6.3) IIH1 VIH1 = VDD (When pulled down) 1.0 20 100 mA IIH1Z VIH1 = VDD (In a high-impedance state) 0 — 1.0 mA IIL1 VIL1 = VSS1 –1.0 — 0 mA IIH2 VIH2 = VDD 0.3 0.75 1.5 mA IIL2 VIL2 = VSS1 –1.0 — 0 mA IIH3 VIH3 = VDD 15 40 100 mA IIL3 VIL3 = VSS1 –1.0 — 0 mA –0.3 — 0 V Input Current 2 (TST1, TST2, TST3) Input Current 3 (RESET) Input Voltage 1 (P2.0 to P2.3) (P6.0 to P6.3) (TST1, TST2, TST3) (RESET) VIH1 — Measuring Circuit 2 3 4 VIL1 — –1.5 — –1.2 V 14/25 ¡ Semiconductor MSM64152A/64152AL Measuring circuit 1 OSC1 Crystal 32.768 kHz VDD CG OSC0 MSM64152A C1 C12 C2 VSSL VDD CL VSS1 VSS2 VSS3 Ca V A Cb V : 0.1 to 0.2 mF : 0.1 mF : 15 pF Ca, Cb, C12 CL CG V Measuring circuit 1' OSC1 ROS OSC0 MSM64152A C1 C12 C2 VSSL VDD CL VSS1 VSS2 VSS3 Ca V A Cb V V Ca, Cb, C12 CL ROS : 0.1 to 0.2 mF : 0.1 mF : 1 MW 15/25 ¡ Semiconductor MSM64152A/64152AL Measuring circuit 2 (*2) VIH VIL OUTPUT (*1) INPUT A MSM64152A VDD VSS1 VSS2 VSS3 VSSL Measuring circuit 3 (*3) OUTPUT INPUT A MSM64152A VDD VSS1 VSS2 VSS3 VSSL 16/25 ¡ Semiconductor MSM64152A/64152AL Measuring circuit 4 OUTPUT (*3) VIL INPUT VIH MSM64152A VDD VSS1 VSS2 VSS3 Waveform Monitoring VSSL *1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins. 17/25 ¡ Semiconductor MSM64152A/64152AL ABSOLUTE MAXIMUM RATINGS 3.0 V Spec. (MSM64152AL) (VDD = 0 V) Parameter Symbol Condition Rating Unit Power Supply Voltage 1 VSS1 Ta = 25°C –2.0 to +0.3 V Power Supply Voltage 2 VSS2 Ta = 25°C –4.0 to +0.3 V Power Supply Voltage 3 VSS3 Ta = 25°C –5.5 to +0.3 V Power Supply Voltage 4 VSSL Ta = 25°C –4.0 to +0.3 V Input Voltage 1 VIN1 VSS2 input, Ta = 25°C VSS2 – 0.3 to +0.3 V VIN2 VSSL input,Ta = 25°C VSSL – 0.3 to +0.3 V Output Voltage 1 VOUT1 VSS2 output,Ta = 25°C VSS2 – 0.3 to +0.3 V Output Voltage 2 VOUT2 VSS3 output,Ta = 25°C VSS3 – 0.3 to +0.3 V Output Voltage 3 VOUT3 VSSL output,Ta = 25°C VSSL – 0.3 to +0.3 V Storage Temperature TSTG — –55 to +150 °C Input Voltage 2 RECOMMENDED OPERATING CONDITIONS 3.0 V Spec. (MSM64152AL) (VDD = 0 V) Symbol Condition Range Unit Operating Temperature Parameter Top — –40 to +70 °C Operating Voltage VSS2 BUPF = "0" –3.5 to –2.5 BUPF = "1" –3.5 to –2.0 V Crystal Oscillation Frequency fXT — 30 to 66 kHz External RC Oscillator Resistance ROS — 1 M ±10% W 18/25 ¡ Semiconductor MSM64152A/64152AL ELECTRICAL CHARACTERISTICS 3.0 V Spec. (MSM64152AL) DC Characteristics (VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +70°C unless otherwise specified.) Parameter Symbol Condition Min. Typ. Max. Unit VSS1 Voltage VSS1 Ca, Cb, C12 = 0.1 mF +100% –20% –1.7 –1.5 –1.3 V VSS3 Voltage VSS3 Ca, Cb, C12 = 0.1 mF +100% –20% –4.7 –4.5 –4.2 V BUPF = "0" –1.5 –1.3 –0.6 BUPF = "1" –1.9 –1.3 –0.6 VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance RC Oscillation Frequency VSSL VSTA Oscillation start time: within 5 seconds after reset Measuring Circuit 1 1' V — — –2.5 V VHOLD — — — –2.0 V CG — 10 — 30 pF CD — 10 15 20 pF 15 40 75 kHz 1 fCR ROS = 1 MW 1' 19/25 ¡ Semiconductor MSM64152A/64152AL DC Characteristics (continued) • 32.768 kHz crystal oscillation (VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +70°C unless otherwise specified.) Parameter Symbol Supply Current 1 IDD1 Supply Current 1 IDD1 Supply Current 2 Supply Current 2 IDD2 Condition CPU is in HALT state Ta = –40 to +40°C — 0.9 4.5 mA BUPF = "0" Ta = +40 to +70°C — 0.9 30 mA CPU is in HALT state Ta = –40 to +40°C — 1.5 6.0 mA BUPF = "1" Ta = +40 to +70°C — 1.5 40 mA CPU is in operation state Ta = –40 to +40°C — 3.0 10 mA Ta = +40 to +70°C — 3.0 40 mA CPU is in operation state Ta = –40 to +40°C — 5.0 15 mA Ta = +40 to +70°C — 5.0 50 mA BUPF = "0" IDD2 Min. Typ. Max. Unit BUPF = "1" Measuring Circuit 1 • RC oscillation (VDD = 0 V, VSS2 = –3.0 V, ROS = 1 MW, Ta = –40 to +70°C unless otherwise specified.) Parameter Symbol Supply Current 1 IDD1 Supply Current 1 IDD1 Supply Current 2 Supply Current 2 IDD2 IDD2 Condition Min. Typ. Max. Unit CPU is in HALT state Ta = –40 to +40°C — 1.5 6.0 mA BUPF = "0" Ta = +40 to +70°C — 1.5 40 mA CPU is in HALT state Ta = –40 to +40°C — 3.0 10 mA BUPF = "1" Ta = +40 to +70°C — 3.0 50 mA CPU is in operation state Ta = –40 to +40°C — 4.0 12 mA BUPF = "0" Ta = +40 to +70°C — 4.0 50 mA CPU is in operation state Ta = –40 to +40°C — 8.0 25 mA BUPF = "1" 8.0 60 mA Ta = +40 to +70°C — Measuring Circuit 1' 20/25 ¡ Semiconductor MSM64152A/64152AL DC Characteristics (continued) (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +70°C unless otherwise specified.) Parameter (Pin Name) Output Current 1 (P4.0 to P4.3) (MD0, MD0) Output Current 2 (SEG0 to SEG25) (COM1 to COM4) Symbol Condition Min. Typ. Max. Unit IOH1 VOH1 = –0.5 V –6.0 –1.8 –0.7 mA IOL1 VOL1 = VSS2 + 0.5 V 0.7 IOH2 1.8 6.0 mA VOH2 = –0.2 V (VDD level) — — –4.0 mA IOMH2 VOMH2 = VSS1 + 0.2 V (VSS1 level) 4.0 — — mA IOMH2S VOMH2S = VSS1 – 0.2 V (VSS1 level) — — –4.0 mA IOML2 VOML2 = VSS2 + 0.2 V (VSS2 level) 4.0 — — mA IOML2S VOML2S = VSS2 – 0.2 V (VSS2 level) — — –4.0 mA (VSS3 level) — — VOL2 = VSS3 + 0.2 V IOH3 VOH3 = –0.5 V –18 –6.0 –2.0 mA IOL3 VOL3 = VSS2 + 0.5 V 0.7 1.6 6.0 mA Output Leakage Current (P6.0 to P6.3) IOOH VOH = VDD — — 0.3 mA IOOL VOL = VSS2 –0.3 — — mA Input Current 1 (P2.0 to P2.3) (P6.0 to P6.3) IIH1 VIH1 = VDD (When pulled down) 50 100 300 mA IIH1Z VIH1 = VDD (In a high-impedance state) 0 — 1.0 mA IIL1 VIL1 = VSS2 –1.0 — 0 mA Input Current 2 IIH2 VIH2 = VDD 0.75 1.5 3.0 mA (TST1, TST2, TST3) Input Current 3 (RESET) Input Voltage 3 (P2.0 to P2.3) (P6.0 to P6.3) (TST1, TST2, TST3) (RESET) IIL2 VIL2 = VSS2 –1.0 — 0 mA IIH3 VIH3 = VDD 40 80 200 mA IIL3 VIL3 = VSS2 –1.0 — 0 mA –0.6 — 0 V VIH1 — Circuit 2 mA IOL2 Output Current 3 (P6.0 to P6.3) 4.0 Measuring 3 4 VIL1 — –3.0 — –2.4 V 21/25 ¡ Semiconductor MSM64152A/64152AL Measuring circuit 1 OSC1 Crystal 32.768 kHz VDD CG OSC0 MSM64152AL C1 C12 C2 VSSL VDD CL VSS2 VSS1 VSS3 Ca V A Cb V : 0.1 mF : 15 pF Ca, Cb, C12, CL CG V Measuring circuit 1' OSC1 ROS OSC0 MSM64152AL C1 C12 C2 VSSL VDD CL VSS2 VSS1 VSS3 Ca V A Ca, Cb, C12, CL ROS Cb V : 0.1 mF : 1 MW V 22/25 ¡ Semiconductor MSM64152A/64152AL Measuring circuit 2 (*2) VIH OUTPUT (*1) VIL INPUT A MSM64152AL VDD VSS1 VSS2 VSS3 VSSL Measuring circuit 3 (*3) OUTPUT INPUT A MSM64152AL VDD VSS1 VSS2 VSS3 VSSL 23/25 ¡ Semiconductor MSM64152A/64152AL Measuring circuit 4 OUTPUT (*3) VIL INPUT VIH MSM64152AL VDD VSS1 VSS2 VSS3 Waveform Monitoring VSSL *1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins. 24/25 ¡ Semiconductor MSM64152A/64152AL PACKAGE DIMENSIONS (Unit : mm) QFP60-P-1519-1.00-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.50 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 25/25