POINN BUPD1520

BUPD1520
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
Copyright © 1999, Power Innovations Limited, UK
●
Designed for Self Oscillating Inverter
Applications
●
Rugged 1500 V Planar Construction
●
Integral Free-Wheeling Anti-Parallel Diode
MAY 1999 - REVISED SEPTEMBER 1999
TO-220 PACKAGE
(TOP VIEW)
B
1
C
2
E
3
Pin 2 is in electrical contact with the mounting base.
MDTRACA
device symbol
C
B
E
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
SYMBOL
VALUE
UNIT
Collector-emitter voltage (IB = 0)
RATING
VCEO
700
V
Collector-emitter voltage (VBE = 0)
VCES
1500
V
Emitter-base voltage (IC = 0)
VEBO
11
V
A
IC
2
ICM
2.5
A
IB
2
A
Peak base current (see Note 1)
IBM
2.5
A
Continuous device dissipation at (or below) 25°C case temperature
Ptot
50
W
°C
Continuous collector current
Peak collector current (see Note 1)
Continuous base current
Operating junction temperature range
Storage temperature range
Lead temperature 3.2 mm from case for 10 seconds
NOTE
Tj
-55 to +125
Tstg
-55 to +150
°C
TL
300
°C
1: This value applies for tp = 10 ms, duty cycle ≤ 2%.
PRODUCT
INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
BUPD1520
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
MAY 1999 - REVISED SEPTEMBER 1999
electrical characteristics at 25°C case temperature
PARAMETER
VCEO
VCBO
VEBO
ICEO
ICES
IEBO
VBE(sat)
VCE(sat)
hFE
TEST CONDITIONS
Collector-emitter
voltage
Collector-base
voltage
Emitter-base
Collector cut-off
current
Collector-emitter
cut-off current
Emitter cut-off
current
Base-emitter
saturation voltage
TYP
MAX
UNIT
IC =
1 mA
700
V
IC =
100 µA
1500
V
11
V
IEB =
voltage
MIN
1 mA
VCE = 700 V
IB = 0
100
µA
VCE = 1500 V
VBE = 0
100
µA
VEB = 11 V
IC = 0
1
mA
IB = 100 mA
IC = 500 mA
IB = 100 mA
IC = 1 A
IB = 400 mA
IC = 2 A
1.0
(see Notes 2 and 3)
1.1
V
1.2
Collector-emitter
IB =
50 mA
IC = 250 mA
saturation voltage
IB = 100 mA
IC = 500 mA
VCE = 5 V
IC =
10 mA
10
21
Forward current
VCE = 5 V
IC = 100 mA
10
25
transfer ratio
VCE = 5 V
IC = 250 mA
10
25
VCE = 5 V
IC = 500 mA
7
18
(see Notes 2 and 3)
(see Notes 2 and 3)
0.3
1.2
0.7
3.0
V
NOTES: 2. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2%.
3. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts, and located
within 3.2 mm from the device body.
thermal characteristics
PARAMETER
RθJA
Junction to free air thermal resistance
RθJC
Junction to case thermal resistance
MIN
TYP
MAX
UNIT
62.5
°C/W
2
°C/W
MAX
UNIT
resistive switching characteristics at 25°C case temperature
PARAMETER
Delay time
tr
Rise time
IC = 500 mA
IB(on) = 50 mA
ts
Storage time
VCC = 125 V
IB(off) = 250 mA
tf
Fall time
PRODUCT
2
TEST CONDITIONS
td
INFORMATION
MIN
TYP
0.1
µs
tp = 300 µs
0.6
µs
Duty cycle = 2%
1.0
µs
0.2
µs
BUPD1520
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
MAY 1999 - REVISED SEPTEMBER 1999
TYPICAL CHARACTERISTICS
FORWARD CURRENT TRANSFER RATIO
vs
COLLECTOR CURRENT
R3636CHF
100
hFE - Forward Current Transfer Ratio
VCE = 5 V
TC = 125°C
TC = 25°C
TC = 0°C
10
1·0
0·01
0·1
1·0
10
IC - Collector Current - A
Figure 1.
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
SAFE OPERATING AREA
10
MAXIMUM REVERSE-BIAS
SAFE OPERATING AREA
R3636CFB
3
1·0
0·1
R3636CRB
IB(on) = IC / 10
VBE(off) = -5 V
TC
= 25°C
IC - Collector Current - A
IC - Collector Current - A
TC = 25°C
2
1
tp = 100 µs
tp = 1 ms
tp = 10 ms
DC Operation
0·01
1·0
10
100
1000
VCE - Collector-Emitter Voltage - V
Figure 2.
PRODUCT
0
0
200
400
600
800
1000 1200 1400 1600
VCE - Collector-Emitter Voltage - V
Figure 3.
INFORMATION
3
BUPD1520
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
MAY 1999 - REVISED SEPTEMBER 1999
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO-220
4,70
4,20
ø
10,4
10,0
3,96
3,71
1,32
1,23
2,95
2,54
6,6
6,0
15,32
14,55
18,0 TYP.
6,1
5,6
1,47
1,07
0,97
0,66
1
2
14,1
12,7
3
2,74
2,34
5,28
4,68
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE
A: The centre pin is in electrical contact with the mounting tab.
PRODUCT
4
INFORMATION
0,64
0,41
2,90
2,40
BUPD1520
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
MAY 1999 - REVISED SEPTEMBER 1999
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright © 1999, Power Innovations Limited
PRODUCT
INFORMATION
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