SONY CXD3503R

CXD3503R
Color Shading Correction IC for Liquid Crystal Projectors
Description
The CXD3503R is a color shading correction IC for
Sony data projectors. Used together with the Sony
LCD driver CXA2111R or CXA2112R, this IC corrects
color shading caused by the LCD panel structure or
the optical system. This IC has a built-in SRAM and
D/A converter, and 16 horizontal and 13 vertical
correction points can be set via a serial interface.
Functions
• Generates the color shading correction signals for
the high-temperature polysilicon TFT LCD panels
used in Sony projectors
• Supports various SVGA, XGA and SXGA signals
using 1/2 dot clock input
• Vertical output signal interpolation using an internal
arithmetic circuit
• Automatic determination of eliminated lines during
pulse eliminator display when used together with
the Sony timing generator ICs CXD2464R or
CXD3500R
• Supports up/down and/or right/left inversion
• Supports LCD panel display area switching
conversion functions
• Standby and correction OFF functions
64 pin LQFP (Plastic)
Absolute Maximum Ratings (VSS = 0V)
• Supply voltage VDD
VSS – 0.3 to +7.0
• Input voltage
VI
VSS – 0.3 to VDD + 0.3
• Output voltage VO VSS – 0.3 to VDD + 0.3
• Storage temperature
Tstg
–55 to +125
• Operating temperature
Topr
–40 to +85
V
V
V
°C
°C
Recommended Operating Conditions
(Ta = –20 to +75°C, VSS = 0V)
Supply voltage
VDD
4.5 to 5.5
V
Applications
Liquid crystal projectors, etc.
Structure
Silicon gate CMOS IC
Note) Company names and product names, etc. contained in these materials are trademarks or registered trademarks of the
respective companies.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E99432-PS
CXD3503R
DACKO
DACKI
VRH
OLIM
Block Diagram
31
32
44
33
6bit
HSYNC 60
VST
3
Buff.
Memory
controller
H, V
detector
DAC
Buff.
Memory
(SRAM)
36 DACO2
37 BFIN2
Buff.
HST
4
Operation
block
Eliminator
38 AOUT2
6bit
DAC
41 DACO1
42 BFIN1
Main
controller
V up/down
counter
Buff.
43 AOUT1
6bit
H up/down
counter
Master clock
DAC
Main
Memory
(SRAM)
46 DACO0
47 BFIN0
CKI 63
Buff.
System clear
XCLR 61
Data
SCTR 57
SCLK 58
Serial I/F Block
11 to 16,
18 to 23,
25 to 30
–2–
40
VRL
7
DOUT
5
DWN
RGT
6
CTRL
SDAT 59
48 AOUT0
CXD3503R
Pin Description
Pin
No.
Symbol
I/O
Description
Processing for
internal input
1
NC
—
Not connected
—
2
NC
—
Not connected
—
3
VST
I
VST pulse input
—
4
HST
I
HST pulse input
—
5
DWN
I
Up/down inversion control input (H: down scan, L: up scan)
—
6
RGT
I
Right/left inversion control input (H: normal scan, L: reverse scan)
—
7
CTRL
I
Up/down and/or right/left inversion control signal (Serial settings
selected when L.)
—
8
TEST0
I
Test (Leave open.)
L
9
TEST1
I
Test (Leave open.)
L
10
TEST2
I
Test (Leave open.)
L
11
DOUT00
O
Digital data output 00
—
12
DOUT01
O
Digital data output 01
—
13
DOUT02
O
Digital data output 02
—
14
DOUT03
O
Digital data output 03
—
15
DOUT04
O
Digital data output 04
—
16
DOUT05
O
Digital data output 05
—
17
DVSS0
—
Digital GND
—
18
DOUT10
O
Digital data output 10
—
19
DOUT11
O
Digital data output 11
—
20
DOUT12
O
Digital data output 12
—
21
DOUT13
O
Digital data output 13
—
22
DOUT14
O
Digital data output 14
—
23
DOUT15
O
Digital data output 15
—
24
DVDD0
—
Digital VDD (5V)
—
25
DOUT20
O
Digital data output 20
—
26
DOUT21
O
Digital data output 21
—
27
DOUT22
O
Digital data output 22
—
28
DOUT23
O
Digital data output 23
—
29
DOUT24
O
Digital data output 24
—
30
DOUT25
O
Digital data output 25
—
31
DACKO
O
DAC clock output (Connect to DACKI.)
—
32
DACKI
I
DAC clock input (Connect to DACKO.)
—
33
OLIM
I
Digital data output limiter (H: Hi-Z, L: digital data output)
—
34
DVDD1
—
Digital VDD (5V)
—
–3–
CXD3503R
Pin
No.
Symbol
I/O
Description
Processing for
internal input
35
DVSS1
—
Digital GND
—
36
DACO2
O
DAC output 2
—
37
BFIN2
I
Buffer input 2
—
38
AOUT2
O
Correction signal output 2
—
39
AVSS
—
Analog GND
—
40
VRL
I
DAC output low reference voltage input
—
41
DACO1
O
DAC output 1
—
42
BFIN1
I
Buffer input 1
—
43
AOUT1
O
Correction signal output 1
—
44
VRH
I
DAC output high reference voltage input
—
45
AVDD
—
Analog power supply
—
46
DACO0
O
DAC output 0
—
47
BFIN0
I
Buffer input 0
—
48
AOUT0
O
Correction signal output 0
—
49
DVSS2
—
Digital GND
—
50
NC
—
Not connected
—
51
NC
—
Not connected
—
52
NC
—
Not connected
—
53
NC
—
Not connected
—
54
NC
—
Not connected
—
55
NC
—
Not connected
—
56
DVDD2
—
Digital VDD (5V)
—
57
SCTR
I
Serial chip select input (serial transfer block)
—
58
SCLK
I
Serial clock input (serial transfer block)
—
59
SDAT
I
Serial data input (serial transfer block)
—
60
HSYNC
I
HSYNC input
—
61
XCLR
I
Clear (L: system clear)
H
62
DVSS3
—
Digital GND
—
63
CKI
I
Master clock input
—
64
SLCK
I
Clock switching (H: Internal 1/2 frequency divider used.)
—
–4–
CXD3503R
Electrical Characteristics
(VDD = 5.0 ± 0.5V, VSS = 0V, Topr = –40 to +85°C)
DC Characteristics
Item
Symbol
Conditions
Typ.
Max.
5.0
5.5
V
VDD
V
Supply voltage
VDD
4.5
Input, output voltage
VI, VO
VSS
VIH
Input voltage 1
Input voltage 2
Input voltage 3
Input voltage 4
Input voltage 5
VIL
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
Unit Applicable pins
Min.
0.7VDD
CMOS input
0.3VDD
CMOS input
With pull-up resistor
0.7VDD
CMOS input
With pull-down resistor
0.7VDD
0.3VDD
0.3VDD
V
∗1
V
∗4
V
∗2
V
∗5
V
∗3
V
∗6, ∗7
2.2
TTL input
0.8
2.5
TTL Schmitt input
0.6
VDD – 2.1
VOH
IOH = –4mA
VOL
IOL = 4mA
Input leak current
IIL
VI = VDD, VSS
–10
10
µA
∗1, ∗3, ∗5
Output leak
current
IOZ
During high impedance
output
–10
10
µA
∗7
Pull-up resistor
RUP
60
120
240
kΩ
∗4
Pull-down resistor RDN
45
90
180
kΩ
∗2
Output voltage 1
Current consumption
IDD
0.4
During 41MHz operation
60
mA
(INPUT)
∗1 CTRL, DACKI, DWN, HST, OLIM, RGT, SLCK, VST
∗2 TEST0, 1, 2
∗3 HSYNC, SCLK, SCTR, SDAT
∗4 XCLR
∗5 CKI
(OUTPUT)
∗6 DACKO
∗7 DOUT00 to 05, DOUT10 to 15, DOUT20 to 25
Note) AOUT0, 1 and 2, DACO0, 1 and 2, BFIN0, 1 and 2, VRH and VRL are not included in the DC characteristics.
–5–
CXD3503R
AC Characteristics
External Clock Input AC Characteristics
(VDD = 5.0 ± 0.5V, VSS = 0V, Topr = –40 to +85°C)
Symbol
Item
Min.
Typ.
Max.
ts0
th0
tWL/tWH
HSYNC setup time, activated by the rising edge of CKI
12
—
—
HSYNC hold time, activated by the rising edge of CKI
0.5
—
—
CKI L/H level pulse width
—
50
—
Serial Transfer AC Characteristics
Unit
ns
%
(VDD = 5.0 ± 0.5V, VSS = 0V, Topr = –40 to +85°C)
Symbol
Item
Min.
Typ.
Max.
ts0
ts1
th0
th1
tW1L
tW1H
SCTR setup time, activated by the rising edge of SCLK
8Tns
—
—
SDAT setup time, activated by the rising edge of SCLK
4Tns
—
—
SCTR hold time, activated by the rising edge of SCLK
8Tns
—
—
SDAT hold time, activated by the rising edge of SCLK
4Tns
—
—
SCLK L level pulse width
4Tns
—
—
SCLK H level pulse width
4Tns
—
—
T: Input clock cycle
Timing Definition
External Clock Input AC Characteristics
th0
HSYNC
(negative
polarity)
th0
ts0
50%
50%
twL
CKI1, 2
ts0
50%
twH
50%
50%
50%
Serial Transfer AC Characteristics
th0
ts0
SCTR
SCLK
SDAT
50%
tw1L
tw1H
ts1
th1
50%
50%
–6–
CXD3503R
Electrical Characteristics (Analog Block)
6-bit D/A Converter part
(Ta = 25°C, VDD = 5.0V, VSS = 0V, VRH – VRL = 1.0V)
Item
Symbol
Min.
Typ.
Max.
Unit
Resolution
RES
—
—
6
Bits
Conversion rate
FS
—
—
30
MPS
Linearity error
EL
—
—
±0.5
LSB
Differential linearity error
ED
—
—
±0.5
LSB
Output resistance
RO
140
213
286
Ω
Operational Amplifier part (Operating Temperature variation)
Item
Symbol
(VDD = 5.0V, VSS = 0V)
Min.
Typ.
Max.
Unit
Operating temperature
Ta
–40
25
85
°C
Input offset voltage
VIO
5
5
5
mV
Current consumption
ICC
2.4
1.8
1.6
mA
Maximum output saturation
voltage
Vopp
0 to 4.95
0 to 4.95
0 to 4.95
V
Input voltage range
VIN
1.5 to 5.0
1.7 to 5.0
1.8 to 5.0
V
Slew rate
SR
39
31
28
V/µs
Operational Amplifier part (Supply Voltage variation)
Item
Symbol
(Ta = 25°C, VSS = 0V)
Min.
Typ.
Max.
Unit
Operating voltage
VIO
4.5
5.0
5.5
V
Input offset voltage
VIO
5
5
5
mV
Current consumption
ICC
1.4
1.8
2.4
mA
Maximum output saturation
voltage
Vopp
0 to 4.45
0 to 4.95
0 to 5.43
V
Input voltage range
VIN
1.7 to 4.5
1.7 to 5.0
1.9 to 5.5
V
Slew rate
SR
24
31
40
V/µs
–7–
CXD3503R
AC Characteristics
External Clock Input AC Characteristics
6-Bit D/A Converter
(Ta = 25°C, VDD = 5.0V, VSS = 0V, VRH – VRL = 1.0V, CL = 30pF)
Item
Symbol
Min.
Typ.
Max.
Clock H level width
Twh
17
—
—
Clock L level width
Twl
17
—
—
Data setup time
Ts
10
—
—
Data hold time
Th
10
—
—
Output delay time
Tdl
—
35
—
Timing Definition
Ts
DOUT
Th
DATA N
Twh
Twl
DACKI
Tdl
DACO
Output N – 1
Output N
Internal Structure
6-Bit D/A Converter
VRH
VRL
DACKI
DOUTn5
DOUTn4
DOUTn3
DOUTn2
DOUTn1
DOUTn0
VRH
VRL
CLK
D5
D4
D3
D2
D1
D0
AOUT
DACOn
Operational Amplifier
AOUTn
BFINn
STBB
STBB : Internal pin
n
: 0, 1, 2
–8–
Unit
ns
CXD3503R
I/O Pin Description
Pin No.
Symbol
Description
3
VST
This pin is a reference of vertical output timing.
Inputs the VST pulse from the timing generator IC.
4
HST
Inputs the HST pulse from the timing generator IC.
When not rising pulse eliminator, connect to DVDD and use it.
5
DWN
6
RGT
Up/down and/or right/left inversion control external input
(H: normal scan, L: reverse scan)
This setting is invalid when the internal register is used.
CTRL
Up/down and/or right/left inversion control signal selection setting.
(For the DWN and RGT control signals, Pins 5 and 6 are selected when CTRL
is H, and the settings from the internal register made via the serial interface are
selected when CTRL is L.)
DOUT00
to DOUT25
Digital data outputs. The data input to the DAC is output as is when OLIM (Pin
33) is L. Normally, output is not performed. Set OLIM to H and leave these open.
31
DACKO
32
DACKI
Internal DAC clock input/output. DAC clock generated inside the IC is output
from DACKO. Normally, input this DACKO output to DACKI.
33
OLIM
Digital data output limiter. When OLIM is L, the data input to the DAC is output
from the DOUT00 to DOUT25 output pins. When OLIM is H, these output pins
go to high impedance state.
36, 41, 46
DACO2, 1, 0
Analog outputs from the internal DAC. The output impedance varies from
several ten to several thousand Ω depending on the output voltage level, so
connect these pins to BFIN2, 1 and 0 (buffer inputs), respectively.
37, 42, 47
BFIN2, 1, 0
Internal operational amplifier buffer inputs. Connect to DACO2, 1 and 0,
respectively.
38, 43, 48
AOUT2, 1, 0
Analog correction signal outputs
40
VRL
DAC L side reference voltage input (Input via buffer.)
44
VRH
DAC H side reference voltage input (Input via buffer.)
57
SCTR
58
SCLK
59
SDAT
60
HSYNC
This pin is a reference of horizontal output timing. Normally, input horizontal
sync signal.
61
XCLR
System clear. Internal register is initialized by setting to L. Input pins are pulled
up to H internally.
63
CKI
Master clock input. Input level is TTL.
64
SLCK
Clock switching (H: Clock obtained by 1/2 frequency-dividing CKI using the
internal frequency divider is selected. L: CKI input is selected. The selected
clock is an internal master clock.)
7
11 to 16,
18 to 23,
25 to 30
Serial control inputs. Timing control and correction point data are all set by
these pins. For details, see page 12 "Serial Transfer Operation".
17, 35, 49, 62 DVSS
24, 34, 56
DVDD
39
AVSS
45
AVDD
Power supply inputs. Do not raise either analog power supply or digital power
supply.
–9–
CXD3503R
Clock input (CKI: Pin 63)
The master clock input (CKI: Pin 63) of this IC supports TTL level input.
In addition, two modes can be set: a mode in which the CKI is used as is for the internal master clock (SLCK
(Pin 64): L) and a mode in which CKI is halved using the internal frequency divider (SLCK: H). In the latter
mode, all internal operation is at 1/2 clock, so "clock" in the description below refers to this 1/2 clock when
SLCK is H. Internal operation is at a frequency up to 41 MHz, so when inputting a clock faster than this to
CKI1, be sure to set SLCK to H.
selector
D
Q
b
XQ
a
Internal master clock
(41MHz or less)
s
CKI
SLCK
HSYNC, VST, HST
Input a standard horizontal sync signal to the input HSYNC (Pin 60).
At this time, the input polarity is not fixed and is set by the serial data setting HSYNCPOL. In addition, make
sure the VST and HST pulses satisfy the following phase relationship. However, when not using pulse
eliminator display, HST (Pin 4) can be fixed to H level.
Normally input the VST pulse to the LCD panel for the VST input.
HSYNC
toVst
VST
toHst
HST
toDisp
Blanking portion
Video signal
toVst: VST shall rise 20 clocks or more after the front edge of HSYNC, and after the HST pulse.
toHst: The front edge of HST shall follow the rear edge of HSYNC
toDisp: There shall be 1.5H or more from the rise of VST to the start of the video signal.
The Sony timing generator ICs (CXD2464R, CXD3500R) pulses of the same name satisfy the above
conditions.
System clear pin input
Set the system clear pin (XCLR: Pin 61) to L and apply a forced reset in order to initialize the internal circuits
during power-on.
– 10 –
CXD3503R
Description of Output Correction Signal Operation
Horizontal direction
The correction data set in the SRAM by serial transfer is arithmetically processed inside the IC to determine
the output position corresponding to the value set by serial register HP7 to 0 using the front edge of HSYNC as
the reference. Interpolation is not performed for the horizontal direction, and interpolated data is output at the
cycle set by serial register HINT7 to 0 for the vertical direction. In addition, the maximum amplitude of the
correction signal output voltage is determined by VRH (Pin 44) and VRL (Pin 40). The internal DAC outputs at
the resistive potential division (VRH to VRL: 213Ω typ.), so be sure to input to VRH and VRL via buffers having
current capacity.
HSYNC
Set by HINT7 to 0
Set by HP7 to 0
DACKO/I
DOUT
VRH
DACO
VRL
The internally generated digital data DOUT is input to the internal D/A converter, latched by the D/A converter
clock input from DACKI, and output from DACO2, 1 and 0 as an analog signal.
Note) If edges remain, these level differences may appear as vertical stripes. Therefore, when using this as a
correction signal, be sure to eliminate the edges using an LPF, etc. before input to the CXA2111R or
CXA2112R.
Vertical direction
The vertical correction points set in the SRAM are arithmetically processed inside the IC to output interpolated
data for the lines other than correction points.
m
m+1
n
n+1
fm, n
fm + 1, n
1 (fm
fm, n + a
+ 1, n – fm, n)
2
fm, n + a (fm + 1, n – fm, n)
fm, n +
a–1
a (fm + 1, n – fm, n)
VINT line(s)
1
fm, n + 1 + a (fm + 1, n + 1 – fm, n + 1)
2
fm, n + 1 + a (fm + 1, n + 1 – fm, n + 1)
fm, n + 1 +
a' lines
a–1
a (fm + 1, n + 1 – fm, n + 1)
fm + 1, n
fm + 1, n + 1
fm, n: Correction data for point (m, n)
– 11 –
Vertical correction point interval
Set by VINT4 to 0 and ANM5 to 0
Assuming ANM5 to 0 = a,
a' = VINT × a
CXD3503R
Serial Transfer Operation
Control method
The operation timing of this IC is controlled by serial data.
The control data is divided into 8-bit units. The first 8 bits are the main address, the next 8 bits are the sub
address, and the subsequent data is 8-bit data blocks.
The main address specifies which of the blocks in the table below are to be set. Data is set in the blocks
indicated by "1", so if the main address is set to "0F", the subsequent data is set in all data blocks.
In addition, the value set in the sub address sets the initial write address in the block specified by the main
address. Thereafter, the write address is incremented by +1 while SCTR is L for each 8 bits of data from the
address set by the sub address.
This makes it possible to set only the necessary data from an optional address.
The data set by serial register INIT5 to 0 is output in place of the correction data during serial transfer.
SCTR
SCLK
SDAT
M7 M6 M5 M4 M3 M2 M1 M0 S7 S6 S5 S4 S3 S2 S1 S0 D7 D6 D5 D4 D3 D2 D1 D0 D7’ D6’ D5’ D4’ D3’ D2’ D1’ D0’ D7’ D6’ D5’ D4’ D3’ D2’ D1’ D0’
main addr.
sub addr.
data
data
data
Main address table
Main address
Setting block
01h
Correction point data 0 (SRAM0)
02h
Correction point data 1 (SRAM1)
04h
Correction point data 2 (SRAM2)
08h
Timing control data
The SRAM numbers 0, 1 and 2 correspond to the DAC output DACO numbers 0, 1 and 2. The correction point
data set in the SRAM is reflected to the outputs of the corresponding numbers.
Correction point data 0, 1 and 2
Correction point data is set in the 6-bit × 208 words (16 horizontal points, 13 vertical points) SRAM. The set
correction data undergoes vertical interpolation and other arithmetic processing, and is then reflected to the
DACO0, 1 and 2 outputs, respectively. The correction point data is 6 bits, and is set in D5, 4, 3, 2, 1 and 0.
Setting to D7 and 6 is invalid.
See the figure on page 13 for the relationship between the correction point data position and the SRAM
address.
Example) When the main address is set to 04 and the sub address is set to 08, data is written from address
08 of correction point data 2 (SRAM2), then the address is automatically incremented and written to
the SRAM.
– 12 –
CXD3503R
Timing control data
Main address 08h
Sub address
D7
D6
D5
D4
D3
D2
D1
D0
00h
HB3
HB2
HB1
HB0
HE3
HE2
HE1
HE0
01h
VB3
VB2
VB1
VB0
VE3
VE2
VE1
VE0
02h
HP7
HP6
HP5
HP4
HP3
HP2
HP1
HP0
03h
HINT7
HINT6
HINT5
HINT4
HINT3
HINT2
HINT1
HINT0
04h
—
—
—
—
VP3
VP2
VP1
VP0
05h
—
—
—
VINT4
VINT3
VINT2
VINT1
VINT0
06h
—
—
ANM5
ANM4
ANM3
ANM2
ANM1
ANM0
07h
—
1/A6
1/A5
1/A4
1/A3
1/A2
1/A1
1/A0
08h
HSOFF
HPOL
VSPOL
DWN
RGT
09h
STBY1
STBY0
INIT5
INIT4
INIT3
DACKP2 DACKP1 DACKP0
INIT2
INIT1
INIT0
—: Setting invalid
Data settings
HB3 to 0, HE3 to 0, VB3 to 0, VE3 to 0
These set the range of the correction point data to be used.
Expressed in model format, the correction points appear as shown in the figure below. To use only the shaded
area, set HB: 2, HE: D, VB: 1 and VE: B.
Normally set HB: 0, HE: F, VB: 0 and VE: D (16 × 13).
Horizontal direction
Address 00
Specified by HB
Specified by HE
0F
Vertical direction
Specified
by VB
Specified
by VE
C0
CF
Dots in the lattice above represent correction points, and the white circles are the data settings.
– 13 –
CXD3503R
HP7 to 0
This sets the correction signal output start position in the horizontal direction. The timing until the start of
correction signal output is set using the front edge of HSYNC as the reference. However, do not set HP7 to 0
to a value of 54 or less, as the arithmetically processed correction signal may not be output correctly in this
case. In addition, the waveform may be disturbed by the HP and HINT values and the VST phase. In these
cases, eliminate the disturbance by adjusting the HP and DACKO phase.
Set by HP7 to 0
HSYNC
DACO
HINT7 to 0
This sets the correction point interval in the horizontal direction. Normally, when using 16 points in the
horizontal direction, calculate the number of clocks at which the horizontal period can be divided into 16
sections taking into account the input clock and the system clock speed, and then set this value – 1. However,
do not input a value of 11 or less to HINT7 to 0, as the internal arithmetic processing may not be able to keep
up and the correct value may not be output in this case.
Example 1) Inputting a dot clock 40MHz signal to a SVGA panel (800 × 600)
If 1/2 the dot clock is input as the master clock and the mode without internal 1/2 frequency
division (SLCK: L) is used:
HINT = (800 ÷ 16 ÷ 2) – 1 = 24
Example 2) Inputting a dot clock 65MHz signal to a XGA panel (1024 × 768)
If 1/2 the dot clock is input as the master clock and the mode with internal 1/2 frequency division
(SLCK: H) is used:
HINT = (1024 ÷ 16 ÷ 4) – 1 = 15
Set by HINT
Internal clock
DACO
fm, n
fm, n + 1
HINT = 15
– 14 –
CXD3503R
VP3 to 0
This sets the correction signal output start position in the vertical direction. The number of line counted from
the front edge of the VST pulse at which vertical arithmetic processing of the correction signal starts is set. The
correction data for the initial line is output continuously only for the number of lines set by VP.
VINT4 to 0
This sets the arithmetic processing interval for vertical correction. Vertical correction arithmetic processing is
performed every number of lines set by VINT. Normally set arithmetic processing for each line (VINT = 1).
ANM5 to 0
This sets the correction point interval in the vertical direction. There are 13 vertical correction points with
respect to the actual panel display area switching, so this sets the number of lines at which correction points
are spaced for the internal arithmetic processing.
Example) To use the full correction point data in the vertical direction, set the correction point interval ANM as
follows.
SVGA panels:
ANM = 600 ÷ 12 = 50 (110010)
XGA panels:
ANM = 76 ÷ 12 = 64 (000000)
1/A6 to 0
This sets the inverse of ANM. Set the 6th to 12th digits below the decimal point in binary format with 7 bits.
Linear interpolation with an accuracy of 1 bit is performed using this setting value.
Example) ANM = 50:
1/50 (decimal) = 0.000001010010 (binary)
Set the 6th to 12th digits.
Example) ANM = 64:
1/64 (decimal) = 0.000001000000 (binary)
Set the 6th to 12th digits.
VST
HSYNC
DACO
0
0
0
0
1
1
2
2
ANM – 1 ANM – 1
VP
VINT
VINT
VINT
ANM
– 15 –
VINT
0’
0’
CXD3503R
HSOFF
This is the correction ON/OFF setting. When H, correction is on; when L, correction is off and the INIT5 to 0
data is output constantly. Normally set HSOFF to H.
HPOL
This sets the HSYNC input signal polarity. Set HPOL to H for positive polarity, and to L for negative polarity. Be
sure to set the polarity correctly in accordance with the input signal.
VSPOL
This sets the VST input signal polarity. Set VSPOL to H for positive polarity, and to L for negative polarity. Be
sure to set the polarity correctly in accordance with the input signal. The Sony timing generator ICs CXD2464R
and CXD3500R output an inverse polarity VST pulse for up/down inverse drive of a SVGA panel. Therefore,
take special care for the VST polarity when using this IC with a SVGA panel.
DWN, RGT
DWN and RGT set up/down and right/left inversion, respectively. Normal scan is supported when DWN is H
and RGT is H, and up/down and/or right/left inversion of the panel is supported by reading the correction data
set in the RAM in the reverse order when these are set to L, respectively. These settings can be controlled
from the external pins of the same name DWN (Pin 5) and RGT (Pin 6) by setting CTRL (Pin 7) to H. In this
case these serial settings are invalid.
DACKP2 to 0
This sets the DAC clock phase. Normally set to "2" to satisfy the internal DAC clock and data setup/hold
specifications.
STBY1 and 0
This is the standby setting. Standby mode results when STBY1, 0 are set to H, L. At this time, the internal
clock is supplied only to the serial interface block, and operation of all other blocks is stopped. Buffer outputs
AOUT2, 1 and 0 and digital outputs DOUT25 to 20, 15 to 10 and 05 to 00 are all high impedance at this time.
INIT5 to 0
This sets the DACO output level when correction is off. When serial data HSOFF is set to L, the data for this
setting is output regardless of the correction data set in the RAM.
– 16 –
70
80
90
D20
100
110
HINT
120
D21
130
140
– 17 –
DACO2
DACO2
DACO2
VRL
VRH
VRL
VRH
VRL
VRH
D00
D10
D01
D11
D01
D00
HP
60
DOUT05 to 00
50
D11
40
D10
30
DOUT15 to 10
20
D21
10
D20
0
DOUT25 to 20
DACKO (I)
(BLK)
HSYNC
MCK
Timing Chart
160
170
180
D02
D12
D02
D12
D22
D03
D13
D23
Effective video signal
D22
150
D03
D13
D23
190
210
D04
D14
D24
200
D04
D14
D24
220
230
CXD3503R
CXD3503R
Application Circuit
To CXA2111R Bright pins (Pins 30, 31 and 32)
LPF
LPF
LPF
Analog 5V
Digital 5V
OLIM
DVSS1
DVDD1
DACO2
BFIN2
AVSS
AOUT2
VRL
BFIN1
DACO1
VRH
AOUT1
AVDD
BFIN0
DACO0
AOUT0
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
49 DVSS2
DACKI 32
50 NC
DACKO 31
51 NC
DOUT25 30
52 NC
DOUT24 29
53 NC
DOUT23 28
54 NC
DOUT22 27
55 NC
DOUT21 26
56 DVDD2
DOUT20 25
CXD3503R
57 SCTR
DOUT14 22
60 HSYNC
DOUT13 21
61 XCLR
DOUT12 20
62 DVSS3
DOUT11 19
63 CKI1
DOUT10 18
64 SLCK
DOUT05
DOUT04
TEST1
DOUT03
TEST0
DOUT02
CTRL
DOUT01
RGT
DOUT00
DWN
TEST2
DVSS0 17
HST
From PLL
CXA3106(A)Q
59 SDAT
VST
1µ/16V
DOUT15 23
NC
10k
DVDD0 24
58 SCLK
NC
Serial I/F
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16
From TG CXD3500R
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
– 18 –
CXD3503R
Package Outline
Unit: mm
64PIN LQFP (PLASTIC)
12.0 ± 0.2
10.0 ± 0.2
0.15 ± 0.05
48
0.1
33
49
32
A
64
17
1
1.25
16
+ 0.08
0.18 – 0.03
0.5
1.7 MAX
0.1
M
0° to 10°
0.5 ± 0.2
(0.5)
0.1 ± 0.1
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
LQFP-64P-L061
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
LQFP064-P-1010-AY
LEAD MATERIAL
42 ALLOY
PACKAGE WEIGHT
0.3g
JEDEC CODE
– 19 –