HT36B2 8-Bit Music Synthesizer MCU Features · Operating voltage: 3.6V~5.0V · Sampling rate of 44.1kHz as 11.059MHz for system frequency · Operating frequency: 3.58MHz~12MHz · Eight-level subroutine nesting (typ. 11.059MHz) · 32 bidirectional I/O lines · HALT function and wake-up feature to reduce power consumption · Two 16-bit programmable timer/event counters with · Bit manipulation instructions overflow interrupts · Watchdog Timer · 16-bit table read instructions · Built-in 8-bit MCU with 576´8 bits RAM · 63 powerful instructions · Built-in 128K´16-bit ROM for program/data shared · All instructions in 1 or 2 machine cycles · Two High D/A converter resolution: 16 bits · 28-pin SOP, 56-pin SSOP package · Polyphonic up to 16 notes · Independent pan and volume mix can be assigned to each sound component General Description The HT36B2 is an 8-bit high performance RISC-like microcontroller specifically designed for music applications. It provides an 8-bit MCU and a 16 channel wavetable synthesizer. The program ROM is composed of both program control codes and wavetable voice codes, and can be easily programmed. The HT36B2 has a built-in 8-bit microprocessor which programs the synthesizer to generate the melody by setting the special register from 20H~2AH. A HALT feature is provided to reduce power consumption. Block Diagram P A P B P C P D 0 ~ 0 ~ 0 ~ 0 ~ P A P B P C P D IN O S C O S C R E S Rev. 1.00 7 7 7 V D V S V D V S 1 2 8 K ´ 1 6 - b it R O M 7 8 - B it M C U T 1 2 5 7 6 ´ 8 R A M M u ltip lie r /P h a s e G e n e ra l 1 S te re o 1 6 - B it D A C D S D A S A R C H L C H July 3, 2003 HT36B2 Pin Assignment 1 5 6 V S S R E S 2 5 5 O S C 1 O S C 2 P C 7 3 5 4 P C 6 4 5 3 V S S A P C 5 5 5 2 V D D A L C H P C 4 6 5 1 P C 3 7 5 0 R C H P C 2 8 4 9 P D 0 N C 9 4 8 P D 1 N C 1 0 4 7 P D 2 N C 1 1 4 6 P D 3 N C 1 2 4 5 P D 4 N C 1 3 4 4 P D 5 N C 1 4 4 3 P D 6 V S S 1 2 8 O S C 1 N C 1 5 4 2 P D 7 V D D 2 2 7 O S C 2 N C 1 6 4 1 N C R E S 3 2 6 V S S A N C 1 7 4 0 N C N C 4 2 5 V D D A N C 1 8 3 9 N C N C 5 2 4 L C H N C 1 9 3 8 IN T N C 6 2 3 R C H P C 1 2 0 3 7 P A 0 N C 7 2 2 N C P C 0 2 1 3 6 P A 1 N C 8 2 1 N C P B 7 2 2 3 5 P A 2 N C 9 2 0 IN T P B 6 2 3 3 4 P A 3 N C 1 0 1 9 P A 0 P B 5 2 4 3 3 P A 4 N C 1 1 1 8 P A 1 P B 4 2 5 3 2 P A 5 P A 7 1 2 1 7 P A 2 P B 3 2 6 3 1 P A 6 P A 6 1 3 1 6 P A 3 P B 2 2 7 3 0 P A 7 P A 5 1 4 1 5 P A 4 P B 1 2 8 2 9 P B 0 H T 3 6 B 2 2 8 S O P -A Rev. 1.00 V D D H T 3 6 B 2 5 6 S S O P -A 2 July 3, 2003 HT36B2 Pad Assignment P C 2 P C 3 P C 4 P C 6 P C 5 P C 7 R E S V D D V S S O S C 1 O S C 2 V S S A V D D A L C H R C H 1 4 2 4 1 4 0 3 8 3 7 3 6 3 5 3 4 3 3 3 2 3 1 3 0 2 9 3 9 (0 , 0 ) 1 7 1 8 1 9 2 0 IN T 1 6 P A 1 P A 5 1 5 P A 0 1 4 P A 3 1 3 P A 2 1 2 P A 4 1 1 P A 7 1 0 P A 6 9 P B 1 8 P B 0 7 P B 2 P B 3 6 P B 5 5 P B 4 P C 1 P C 0 4 P B 7 3 P B 6 2 2 8 P D 0 2 7 P D 1 2 6 P D 2 2 5 P D 3 2 4 P D 4 2 3 P D 5 2 2 P D 6 2 1 P D 7 Chip size: 117.1 ´ 139.8 (mil) * The IC substrate should be connected to VSS in the PCB layout artwork. Rev. 1.00 3 July 3, 2003 HT36B2 Pad Coordinates Unit: mm Pad No. X Y Pad No. X Y 1 2 -1327.608 1607.250 22 1320.992 -146.680 -1321.808 -1607.630 23 1320.992 -46.680 3 -1221.808 -1607.630 24 1320.992 63.920 4 -1111.208 -1607.630 25 1320.992 163.920 5 -1011.208 -1607.630 26 1320.992 274.520 6 -900.608 -1607.630 27 1320.992 374.520 7 -800.608 -1607.630 28 1320.992 485.120 8 -690.008 -1607.630 29 1324.492 1571.300 9 -590.008 -1607.630 30 1211.492 1571.300 10 -479.408 -1607.630 31 1099.052 1571.300 11 -379.408 -1607.630 32 950.392 1571.300 12 -268.808 -1607.630 33 833.168 1571.200 13 -168.808 -1607.630 34 155.316 1571.200 14 -1607.630 35 34.192 1604.750 15 -58.208 41.792 -1607.630 36 -572.908 1604.750 16 152.392 -1607.630 37 -694.032 1607.250 17 252.392 -1607.630 38 -795.808 1607.250 18 362.992 -1607.630 39 -906.408 1607.250 19 462.992 -1607.630 40 -1006.408 1607.250 20 571.392 -1607.630 41 -1117.008 1607.250 21 1320.992 -257.280 42 -1217.008 1607.250 Pad Description I/O Internal Connection PA0~PA7 I/O Pull-High or None Bidirectional 8-bit Input/Output port, wake-up by mask option PB0~PB7 I/O Pull-High or None Bidirectional 8-bit Input/Output port PC0~PC7 I/O Pull-High or None Bidirectional 8-bit Input/Output port PD0~PD7 I/O Pull-High or None Bidirectional 8-bit Input/Output port INT I Pull-High External interrupt RCH O ¾ R channel audio output LCH O ¾ L channel audio output VDDA ¾ ¾ DAC power supply VSSA ¾ ¾ Negative power supply of DAC, ground OSC1 OSC2 I O ¾ OSC1 and OSC2 are connected to an RC network or a crystal (by mask option) for the internal system clock. In the case of RC operation, OSC2 is the output terminal for 1/8 system clock. The system clock may come from the crystal, the two pins cannot be floating. VSS ¾ ¾ Negative power supply, ground VDD ¾ ¾ Positive power supply RES I ¾ Reset input, active low Pad Name Rev. 1.00 Function 4 July 3, 2003 HT36B2 Absolute Maximum Ratings Supply Voltage .............................VSS-0.3V to VSS+6V Storage Temperature ...........................-50°C to 125°C Input Voltage .............................VSS-0.3V to VDD+0.3V Operating Temperature ..........................-25°C to 70°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C. Characteristics Symbol Ta=25°C Test Conditions Parameter VDD Conditions Min. Typ. Max. Unit VDD Operating Voltage ¾ ¾ 3.6 4.5 5.5 V IDD Operating Current 4.5V No load, fOSC=11.0592MHz ¾ 16 32 mA ISTB Standby Current (WDT Disabled) 4.5V No load, System HALT ¾ 1 3 mA IOH I/O Ports Source Current 4.5V VOH=4.5V 5 ¾ ¾ mA IOL I/O Ports Sink Current 4.5V VOL=0.5V 5 ¾ ¾ mA VIH Input High Voltage for I/O Ports 4.5V ¾ 0.8VDD ¾ VDD V VIL Input Low Voltage for I/O Ports 4.5V ¾ 0 ¾ 0.2VDD V RPH Pull-High Resistance of I/O Ports (INT) 4.5V VIL=0V ¾ 30 ¾ kW Min. Typ. Max. Unit ¾ 11.059 ¾ MHz A.C. Characteristics Symbol Parameter Test Conditions VDD Conditions 11.059MHz crystal MCU interface fOSC System Frequency 5V fSYS System Clock 5V ¾ 8 ¾ 12 MHz tWDT Watchdog Time-Out Period (RC) ¾ Without WDT prescaler 9 17 35 ms tRES External Reset Low Pulse Width ¾ ¾ 1 ¾ ¾ ms Rev. 1.00 5 July 3, 2003 HT36B2 Application Circuit V D D V 1 0 W 4 7 m F 0 .1 m F V D D A 4 7 m F V D D L C H 0 .1 m F 2 2 0 k W IN V re f 3 1 0 m F P A 0 ~ P A 7 O S C 1 8 V D D O U T N 1 H T 8 2 V 7 3 3 C E V S S 4 5 S P K 8 W 7 O U T P P B 0 ~ P B 7 1 1 .0 5 9 M H z V P C 0 ~ P C 7 O S C 2 V D D D D P D 0 ~ P D 7 4 7 m F D D R C H 0 .1 m F 2 0 k W 1 0 0 k W R E S IN V re f 3 1 0 m F V S S A 0 .1 m F 2 V S S 8 V D D O U T N 1 H T 8 2 V 7 3 3 C E 5 V S S 4 S P K 8 W 7 O U T P H T 3 6 B 2 V D D 1 0 W 4 7 m F 0 .1 m F V D D A V D D V D D S P K 8 W 1 k W L C H 7 5 0 W O S C 1 P A 0 ~ P A 7 P B 0 ~ P B 7 V P C 0 ~ P C 7 V P D 0 ~ P D 7 D D 1 0 0 k W R E S 7 5 0 W V S S A 0 .1 m F S P K 8 W 1 k W R C H D D V S S H T 3 6 B 2 Rev. 1.00 6 July 3, 2003 HT36B2 Package Information 28-pin SOP (300mil) Outline Dimensions 2 8 1 5 A B 1 1 4 C C ' G H D E Symbol Rev. 1.00 a F Dimensions in mil Min. Nom. Max. A 394 ¾ 419 B 290 ¾ 300 C 14 ¾ 20 C¢ 697 ¾ 713 D 92 ¾ 104 E ¾ 50 ¾ F 4 ¾ ¾ G 32 ¾ 38 H 4 ¾ 12 a 0° ¾ 10° 7 July 3, 2003 HT36B2 56-pin SSOP (300mil) Outline Dimensions 2 9 5 6 B A 2 8 1 C C ' G H D F E Symbol Rev. 1.00 a Dimensions in mil Min. Nom. Max. A 395 ¾ 420 B 291 ¾ 299 C 8 ¾ 12 C¢ 720 ¾ 730 D 89 ¾ 99 E ¾ 25 ¾ F 4 ¾ 10 G 25 ¾ 35 H 4 ¾ 12 a 0° ¾ 8° 8 July 3, 2003 HT36B2 Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 28W (300mil) Symbol Description Dimensions in mm A Reel Outer Diameter 330±1.0 B Reel Inner Diameter 62±1.5 C Spindle Hole Diameter 13.0+0.5 -0.2 D Key Slit Width 2.0±0.5 T1 Space Between Flange 24.8+0.3 -0.2 T2 Reel Thickness 30.2±0.2 Rev. 1.00 9 July 3, 2003 HT36B2 Carrier Tape Dimensions P 0 D P 1 t E F W C D 1 B 0 P K 0 A 0 SOP 28W (300mil) Symbol Description Dimensions in mm W Carrier Tape Width 24.0±0.3 P Cavity Pitch 12.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 11.5±0.1 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.25 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 10.85±0.1 B0 Cavity Width 18.34±0.1 K0 Cavity Depth 2.97±0.1 t Carrier Tape Thickness 0.35±0.01 C Cover Tape Width Rev. 1.00 21.3 10 July 3, 2003 HT36B2 Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031 Tel: 0755-8346-5589 Fax: 0755-8346-5590 ISDN: 0755-8346-5591 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holmate Semiconductor, Inc. (North America Sales Office) 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright Ó 2003 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 11 July 3, 2003