TI TRS208INT

TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810 – JULY 2007
FEATURES
•
•
•
•
•
•
•
ESD Protection for RS-232 I/O Pins
– ±15-kV Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates at 5-V VCC Supply
Four Drivers and Four Receivers
Operates up to 120 kbit/s
External Capacitors . . . 4 × 0.1 μF
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DB, DW, OR NT PACKAGE
(TOP VIEW)
DOUT2
DOUT1
RIN2
ROUT2
DIN1
ROUT1
RIN1
GND
VCC
C1+
V+
C1-
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
DOUT3
RIN3
ROUT3
DIN4
DOUT4
DIN3
DIN2
ROUT4
RIN4
VC2C2+
DESCRIPTION/ORDERING INFORMATION
The TRS208 device consists of four line drivers, four line receivers, and a dual charge-pump circuit with ±15-kV
HBM ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/μs driver output
slew rate.
ORDERING INFORMATION
TA
PACKAGE
PDIP – NT
0°C to 70°C
SOIC – DW
SSOP – DB
PDIP – NT
–40°C to 85°C
SOIC – DW
SSOP – DB
(1)
(2)
(1) (2)
ORDERABLE PART NUMBER
Tube of 15
TRS208CNT
Tube of 25
TRS208CDW
Reel of 2000
TRS208CDWR
Tube of 60
TRS208CDB
Reel of 2000
TRS208CDBR
Tube of 15
TRS208INT
Tube of 25
TRS208IDW
Reel of 2000
TRS208IDWR
Tube of 60
TRS208IDB
Reel of 2000
TRS208IDBR
TOP-SIDE MARKING
PREVIEW
TRS208C
RU08C
PREVIEW
TRS208I
RU08I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810 – JULY 2007
FUNCTION TABLES
XXX
Each Driver (1)
(1)
INPUT
DIN
OUTPUT
DOUT
L
H
H
L
H = high level, L = low level
Each Receiver (1)
(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
5
2
DIN1
DOUT1
18
TTL/CMOS
Inputs
1
DIN2
DOUT2
19
24
DIN3
DOUT3
21
20
DIN4
DOUT4
6
7
ROUT1
RIN1
4
3
ROUT2
TTL/CMOS
Outputs
RIN2
22
RS-232
Inputs
23
ROUT3
RIN3
17
16
ROUT4
2
RS-232
Outputs
RIN4
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810 – JULY 2007
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage range (2)
V+
Positive charge pump voltage range (2)
V–
Negative charge pump voltage range
V+ – V–
Supply voltage difference (2)
VI
Input voltage range
VO
Output voltage range
Operating virtual junction temperature
Tstg
Storage temperature range
(2)
(3)
(4)
(5)
6
V
VCC – 0.3
14
V
–14
0.3
V
13
V
Drivers
–0.3
V+ + 0.3
±30
Receivers
Drivers
V– – 0.3
V+ + 0.3
–0.3
VCC + 0.3
Receivers
DOUT
Package thermal impedance
TJ
(1)
MAX
(2)
Short-circuit duration
θJA
MIN
–0.3
UNIT
V
V
Continuous
DB package (3) (4)
63
DW package (3) (4)
46
NT package (3) (5)
67
–65
°C/W
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-3.
Recommended Operating Conditions (1)
See Figure 4
Supply voltage
VIH
Driver high-level input voltage
DIN
VIL
Driver low-level input voltage
DIN
Driver input voltage
DIN
VI
TA
(1)
NOM
MAX
4.5
5
5.5
UNIT
V
2
V
0.8
Receiver input voltage
TRS208C
Operating free-air temperature
MIN
TRS208I
0
5.5
–30
30
0
70
–40
85
V
V
°C
Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
ICC
(1)
Supply current
TEST CONDITIONS
No load,
VCC = 5 V,
TA = 25°C
MIN
TYP
MAX
11
20
UNIT
mA
Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810 – JULY 2007
DRIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
9
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–9
IIH
High-level input current
VI = VCC
IIL
Low-level input current
VI at 0 V
IOS (3)
Short-circuit output current
VCC = 5.5 V,
VO = 0 V
ro
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
(1)
(2)
(3)
MAX
UNIT
V
V
μA
15
200
–15
–200
μA
±10
±60
mA
Ω
300
Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V, and TA = 25°C
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
MAX
UNIT
Maximum data rate
CL = 50 pF to 1000 pF,
One DOUT switching,
RL = 3 kΩ to 7 kΩ,
See Figure 1
tPLH(D)
Propagation delay time,
low- to high-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
2
μs
tPHL(D)
Propagation delay time,
high- to low-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
2
μs
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
See Figure 2
300
ns
SR(tr)
Slew rate, transition region
(see Figure 1)
CL = 50 pF to 1000 pF,
VCC = 5 V
(1)
(2)
(3)
RL = 3 kΩ to 7 kΩ,
120
3
kbit/s
6
30
V/μs
Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PIN
DOUT, RIN
4
TEST CONDITIONS
Human-Body Model (HBM)
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TYP
UNIT
±15
kV
TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810 – JULY 2007
RECEIVER SECTION
Electrical Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
VIT+
Positive-going input threshold voltage
VCC = 5 V,
TA = 25°C
VIT–
Negative-going input threshold voltage
VCC = 5 V,
TA = 25°C
Vhys
Input hysteresis (VIT+ – VIT–)
VCC = 5 V
ri
Input resistance
VI = ±3 V to ±25 V, VCC = 5 V,
(1)
MIN
TYP
MAX
UNIT
3.5
V
1.7
0.4
V
2.4
V
0.8
1.2
0.2
0.5
1
V
3
5
7
kΩ
TA = 25°C
V
Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
MAX
UNIT
tPLH(R)
Propagation delay time, low- to high-level output
CL = 150 pF
0.5
10
μs
tPHL(R)
Propagation delay time, high- to low-level output
CL = 150 pF
0.5
10
μs
tsk(p)
Pulse skew (3)
(1)
(2)
(3)
300
ns
Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810 – JULY 2007
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 W
RL
1.5 V
0V
tPHL (D)
CL
(see Note A)
Output
tPLH (D)
3V
3V
–3 V
–3 V
TEST CIRCUIT
SR(tf) =
6V
tPHL (D) or tPLH (D)
VOH
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 W
RL
1.5 V
Input
1.5 V
0V
CL
(see Note A)
tPHL (D)
tPLH (D)
VOH
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 2. Driver Pulse Skew
Input
Generator
(see Note B)
3V
1.5 V
1.5 V
-3 V
Output
50 W
CL
(see Note A)
tPHL (R)
tPLH (R)
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810 – JULY 2007
APPLICATION INFORMATION
DOUT2
DOUT1
1
24
2
23
DOUT3
RIN3
5 kW
RIN2
3
22
5 kW
ROUT2
ROUT3
5V
4
400 kW
21
DIN4
5V
20
400 kW
DIN1
ROUT1
DOUT4
5V
5
400 kW
6
19
DIN3
5V
400 kW
RIN1
18
7
DIN2
5 kW
GND
17
8
+
16
0.1 mF
–
RIN4
5 kW
9
0.1 mF
6.3 V
V–
10
11
0.1 mF
6.3 V
0.1 mF
16 V
VCC
–
+
+
–
ROUT4
C1+
C2–
15
–
+
14
V+
–
+
12
C2+
C1–
0.1 mF
16 V
13
NOTES: A. Resistor values shown are nominal.
B. Non-polarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810 – JULY 2007
APPLICATION INFORMATION (continued)
Capacitor Selection
The capacitor type used for C1–C4 is not critical for proper operation. The TRS208 requires 0.1-μF capacitors,
although capacitors up to 10 μF can be used without harm. Ceramic dielectrics are suggested for the 0.1-μF
capacitors. When using the minimum recommended capacitor values, ensure that the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V–.
Use larger capacitors (up to 10 μF) to reduce the output impedance at V+ and V–.
Bypass VCC to ground with at least 0.1 μF. In applications sensitive to power-supply noise generated by the
charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump
capacitors (C1–C4).
Electrostatic Discharge (ESD) Protection
TI TRS208 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS-232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15 kV when powered down.
ESD Test Conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated
during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage
of concern and subsequently discharged into the DUT through a 1.5-kΩ resistor.
RD
1.5 kW
VHBM
+
-
CS
100 pF
Figure 5. HBM ESD Test Circuit
8
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DUT
TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810 – JULY 2007
APPLICATION INFORMATION (continued)
1.5
VHBM = 2 kV
DUT = 10-V, 1-W Zener Diode
|
IDUT - A
1.0
0.5
0.0
0
50
100
150
200
Time - ns
Figure 6. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test no longer is as pertinent to the RS-232 pins.
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TRS208CDB
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TRS208CDBG4
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TRS208CDBR
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TRS208CDBRG4
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TRS208CDW
ACTIVE
SOIC
DW
24
TRS208CDWG4
ACTIVE
SOIC
DW
24
TRS208CDWR
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
TRS208CDWRG4
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TRS208IDB
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TRS208IDBG4
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TRS208IDBR
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TRS208IDBRG4
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TRS208IDW
ACTIVE
SOIC
DW
24
TRS208IDWG4
ACTIVE
SOIC
DW
24
TRS208IDWR
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
TRS208IDWRG4
ACTIVE
SOIC
DW
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TBD
TBD
TBD
TBD
(1)
Call TI
Call TI
Call TI
Call TI
Purchase Samples
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Call TI
Call TI
Call TI
Call TI
Purchase Samples
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
Purchase Samples
Purchase Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TRS208CDBR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
TRS208CDWR
SOIC
DW
24
2000
330.0
24.4
10.75
15.7
2.7
12.0
24.0
Q1
TRS208IDBR
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
TRS208IDWR
SOIC
DW
24
2000
330.0
24.4
10.75
15.7
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TRS208CDBR
SSOP
DB
24
2000
346.0
346.0
33.0
TRS208CDWR
SOIC
DW
24
2000
346.0
346.0
41.0
TRS208IDBR
SSOP
DB
24
2000
346.0
346.0
33.0
TRS208IDWR
SOIC
DW
24
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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