HMC643 v01.0707 PHASE SHIFTERS - DIGITAL - CHIP 3 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz Typical Applications Features The HMC643 is ideal for: Low RMS Phase Error: 3.5° • EW Receivers Low Insertion Loss: 6.5 dB • Weather & Military Radar High Linearity: +38 dBm • Satellite Communications 360° Coverage, LSB = 5.625° • Beamforming Modules Die Size: 2.75 x 0.99 x 0.1 mm • Phase Cancellation Functional Diagram General Description The HMC643 is a 6-bit digital phase shifter die which is rated from 9 to 12 GHz, providing 360 degrees of phase coverage, with a LSB of 5.625 degrees. The HMC643 features very low RMS phase error of 3.5 degrees and extremely low insertion loss variation of ±0.6 dB across all phase states. This high accuracy phase shifter is controlled with complementary logic of 0/-3V, and requires no fixed bias voltage and is internally matched to 50 Ohms with no external components. Simple external level shifting circuitry can be used to convert a positive CMOS control voltage into complementary negative control signals. Electrical Specifi cations, TA = +25° C, 50 Ohm System, Control Voltage = 0/-3V Parameter Frequency Range Insertion Loss* Min. Typ. Max. Units 12 GHz 6.5 10.0 dB 9 Input Return Loss* 15 Output Return Loss* 12 Phase Error* ±7 dB dB -10 / +15 RMS Phase Error 3.5 deg Insertion Loss Variation* ±0.6 dB Input Power for 1 dB Compression 22 dBm Input Third Order Intercept 38 dBm Control Voltage Current <1 μA *Note: Major States Shown 3 - 20 deg For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC643 v01.0707 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz Insertion Loss, Major States Only Normalized Loss, Major States Only 0 4 3 -4 -6 -8 -10 2 3 1 0 -1 -2 -3 -12 -4 8 9 10 11 12 13 8 9 FREQUENCY (GHz) Input Return Loss, Major States Only 12 13 12 13 12 13 20 15 PHASE ERROR (degrees) -5 RETURN LOSS (dB) 11 Phase Error, Major States Only 0 -10 -15 -20 -25 10 5 0 -5 -10 -15 -30 -20 8 9 10 11 12 13 8 9 FREQUENCY (GHz) 10 11 FREQUENCY (GHz) Output Return Loss, Major States Only Relative Phase Shift Major States, Including All Bits 0 RELATIVE PHASE SHIFT (degrees) 400 -5 RETURN LOSS (dB) 10 FREQUENCY (GHz) PHASE SHIFTERS - DIGITAL - CHIP NORMALIZED LOSS (dB) INSERTION LOSS (dB) -2 -10 -15 -20 -25 -30 350 300 250 200 150 100 50 0 8 9 10 11 FREQUENCY (GHz) 12 13 8 9 10 11 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 21 HMC643 v01.0707 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz Relative Phase Shift, RMS, Average, Max, All States Input IP3, Major States Only 55 25 50 20 RMS AVERAGE MAX 45 IP3 (dBm) 15 10 5 35 30 -5 25 9 9.5 10 10.5 11 11.5 9 12 9.5 FREQUENCY (GHz) Input IP2, Major States Only 10.5 11 11.5 12 11.5 12 11.5 12 Input P1dB, Major States Only 100 40 35 P1dB (dBm) 90 80 70 60 30 25 20 15 50 10 9 9.5 10 10.5 11 11.5 12 9 9.5 FREQUENCY (GHz) 10 10.5 11 FREQUENCY (GHz) Insertion Loss vs. Temperature, Major States Only 0 20 15 INSERTION LOSS (dB) RELATIVE PHASE SHIFT (degrees) 10 FREQUENCY (GHz) RMS Phase Error vs. Temperature +25C +85C -55C 10 5 0 -5 -10 -2 -4 -6 -8 -10 9 9.5 10 10.5 11 FREQUENCY (GHz) 3 - 22 40 0 -10 IP2 (dBm) PHASE SHIFTERS - DIGITAL - CHIP 3 RELATIVE PHASE SHIFT (degrees) 30 11.5 12 9 9.5 10 10.5 11 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC643 v01.0707 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz Absolute Maximum Ratings 20 9.5, 10, 10.5, 11, 11.5, 12 GHz PHASE ERROR (degrees) 15 10 Input Power (RFIN) 27 dBm (T= +85 °C) Channel Temperature (Tc) 150 °C Thermal Resistance (channel to die bottom) 130 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C 5 0 -5 Control Voltage -10 9 GHz -15 -20 0 45 90 135 180 225 270 315 360 State Bias Condition Low (0) -2.5 to -3.5V @ 0.4 μA Typ. High (1) 0 to +0.3V @ 0.4 μA Typ. STATE (degrees) ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Truth Table Control Voltage Input Bit 1 Bit 2 Bit 3 Bit 3 Bit 4 Bit 4 Bit 5 Bit 5 Bit 6 Bit 6 Phase Shift (Degrees) RFIN - RFOUT 0 0 0 1 0 1 0 1 0 1 Reference* 1 0 0 1 0 1 0 1 0 1 5.625 0 1 0 1 0 1 0 1 0 1 11.25 0 0 1 0 0 1 0 1 0 1 22.5 0 0 0 1 1 0 0 1 0 1 45.0 0 0 0 1 0 1 1 0 0 1 90.0 0 0 0 1 0 1 0 1 1 0 180.0 1 1 1 0 1 0 1 0 1 0 354.375 Any combination of the above states will provide a phase shift approximately equal to the sum of the bits selected. *Reference corresponds to monotonic setting 3 PHASE SHIFTERS - DIGITAL - CHIP Phase Error vs. State Pad Descriptions Pad Number Function Description 1, 3, 4, 6 GND These pads and die bottom must be connected to RF/DC ground. 2 RFIN This port is DC coupled and matched to 50 Ohms. 5 RFOUT This port is DC coupled and matched to 50 Ohms. 7, 9, 11, 15 BIT6, BIT4 BIT3, BIT5 Inverted Control Input. See truth table and control voltage tables. 8, 10, 12, 13, 14, 16 BIT6, BIT4, BIT3, BIT2, BIT1, BIT5 Interface Schematic Non-Inverted Control Input. See truth table and control voltage tables. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 23 HMC643 v01.0707 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz Outline Drawing PHASE SHIFTERS - DIGITAL - CHIP 3 Die Packaging Information [1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. NOTES: 1. ALL DIMENSIONS IN INCHES (MILLIMETERS) 2. DIE THICKNESS IS 0.004 3. BACKSIDE METALLIZATION: GOLD 4. BACKSIDE METAL IS GROUND 5. BOND PADS METALLIZATION: GOLD 6. OVERALL DIE SIZE ±0.002 Application Circuit Note: This circuit converts a single line positive (0/+5V) control signal to complementary negative (0/-3V) control signals. 3 - 24 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC643 v01.0707 GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 9 - 12 GHz Assembly Diagram Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and fl at. PHASE SHIFTERS - DIGITAL - CHIP 3 Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 25