HMC247 v01.1007 PHASE SHIFTERS - CHIP 3 400° ANALOG PHASE SHIFTER 5 - 18 GHz Typical Applications Features The HMC247 is ideal for: Wide Bandwidth: 5 - 18 GHz • Fiber Optics Phase Shift: >400° • Military Single Positive Voltage Control • Test Equipment Small Size: 2.3 x 1.6 x 0.1 mm Functional Diagram General Description The HMC247 is an Analog Phase Shifter die which is controlled via an analog control voltage from 0 to +10V. The HMC247 provides a continuously variable phase shift of 0 to 300 degrees at 9 GHz, and 0 to 100 degrees at 18 GHz, with consistent insertion loss versus phase shift. The phase shift is monotonic with respect to the control voltage. The control port has a modulation bandwidth of 50 MHz. The low insertion loss and compact size enable this part to be used in a wide range of applications, including the phase adjustment of clocks in fiber optic systems and test equipment. All data is measured with the chip in a 50 ohm test fixture, connected via 0.076 mm (3 mil) ribbon bonds of minimal length <0.31 mm (<12 mils). Electrical Specifi cations, TA = +25° C, 50 Ohm System Parameter 3-2 Frequency (GHz) Min. Typ. Phase Shift Range: 5 - 10 GHz 10 - 13 GHz 13 - 18 GHz 180 135 45 400 200 120 Max. Units Insertion Loss 5 - 10 GHz 10 - 18 GHz 8 4 Return Loss (Input and Output) 5 - 18 GHz 8 Control Voltage Range 5 - 18 GHz 0 - 10 Volt Modulation Bandwidth 5 - 18 GHz 50 MHz degrees degrees degrees 12 7 dB dB dB Phase Voltage Sensitivity 5 - 18 GHz 40 deg /Volt Insertion Phase Temperature Sensitivity 5 - 18 GHz 0.5 deg /°C For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC247 v01.1007 400° ANALOG PHASE SHIFTER 5 - 18 GHz -2 -4 +25C +85C -55C -6 Phase Shift vs. Control Voltage NORMALIZED PHASE SHIFT (degrees) INSERTION LOSS (dB) 0 -8 -10 500 6 GHz 12 GHz 18 GHz 400 200 100 0 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 Vctl (V) 5 6 7 8 9 10 Insertion Loss vs. Frequency 600 0 +25C +85C -55C 500 -2 INSERTION LOSS (dB) NORMALIZED PHASE SHIFT (degrees) 4 Vctl (V) Phase Shift vs. Frequency @ Vctl = 10V (Relative to Vctl = 0V) 400 300 200 100 -4 -6 0V 2V 4V 6V 8V 10V -8 -10 -12 0 -14 5 6 7 8 9 10 11 12 13 14 15 16 17 18 5 6 7 8 9 FREQUENCY (GHz) 10 11 12 13 14 15 16 17 18 FREQUENCY (GHz) Input Return Loss vs. Frequency, Vctl = 0 to +10V Output Return Loss vs. Frequency, Vctl = 0 to +10V 0 0 -5 -5 RETURN LOSS (dB) RETURN LOSS (dB) 3 300 PHASE SHIFTERS - CHIP Insertion Loss vs. Control Voltage @ 12 GHz -10 -15 -20 -10 -15 -20 5 6 7 8 9 10 11 12 13 14 15 FREQUENCY (GHz) 16 17 18 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3-3 HMC247 v01.1007 400° ANALOG PHASE SHIFTER 5 - 18 GHz Second Harmonics vs. Control Voltage, Pin = -10 dBm Input IP3 vs. Control Voltage 35 100 25 60 IP3 (dBm) 6 GHz 12 GHz 18 GHz 40 20 15 6 GHz 12 GHz 18 GHz 10 20 5 0 0 0 1 2 3 4 5 6 7 8 9 0 10 4 Insertion Loss vs. Pin @ 7 GHz INSERTION LOSS (dB) 0V 5V 10V -4 -6 -2 -4 0V 5V 10V -6 -8 -10 -5 0 5 10 15 20 -10 -15 25 INPUT POWER (dBm) NORMALIZED PHASE SHIFT (degrees) -2 -4 0V 5V 10V -8 -10 -5 0 5 10 INPUT POWER (dBm) -5 0 5 10 15 20 25 Phase Shift vs. Pin @ 7 GHz 0 -6 -10 INPUT POWER (dBm) Insertion Loss vs. Pin @ 18 GHz INSERTION LOSS (dB) 10 0 -2 -10 -15 8 Insertion Loss vs. Pin @ 12 GHz 0 -10 -15 6 Vctl (V) -8 3-4 2 Vctl (V) INSERTION LOSS (dB) PHASE SHIFTERS - CHIP 3 2nd HARMONICS (dBc) 30 80 15 20 25 5 0V 5V 10V 3 1 -1 -3 -5 -10 -5 0 INPUT POWER (dBm) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 5 HMC247 v01.1007 400° ANALOG PHASE SHIFTER 5 - 18 GHz Phase Shift vs. Pin @ 18 GHz 0V 5V 10V 0.3 0.1 -0.1 -0.3 -0.5 -10 -5 0 INPUT POWER (dBm) 5 0.5 0V 5V 10V 0.3 3 0.1 -0.1 -0.3 -0.5 -10 -5 0 INPUT POWER (dBm) Absolute Maximum Ratings Control Voltage (Vctl) +11 Vdc Reverse Current 5 mA Input Power (RFin) +30 dBm Channel Temperature (Tc) 150 °C Continuous Pdiss (T = 85 °C) (derate 28 mW/°C above 85 °C) 1.83 W Thermal Resistance (junction to die bottom) 35.6 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 5 PHASE SHIFTERS - CHIP 0.5 NORMALIZED PHASE SHIFT (degrees) NORMALIZED PHASE SHIFT (degrees) Phase Shift vs. Pin @ 12 GHz 3-5 HMC247 v01.1007 400° ANALOG PHASE SHIFTER 5 - 18 GHz Assembly Diagram PHASE SHIFTERS - CHIP 3 Pad Descriptions 3-6 Pad Number Function Description 1, 2 RFIN Port is DC blocked. 3 Vctl Phase shift control pin. Application of voltage between 0 and 10 volts causes the transmission phase to change. The DC equivalent circuit is a series connected diode resistor 4, 5 RFOUT Port is DC blocked. GND The backside of the die must be connected to RF / DC ground. Interface Schematic For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC247 v01.1007 400° ANALOG PHASE SHIFTER 5 - 18 GHz Outline Drawing 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. TIE ALL UNLABLED BOND PADS TO GROUND. 3. DIE THICKNESS IS .004” 4. TYPICAL BOND PAD IS .004” SQUARE. 5. BACKSIDE METALIZATION: GOLD. 6. BOND PAD METALIZATION: GOLD. PHASE SHIFTERS - CHIP 3 Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and fl at. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3-7