HMC757 v00.0409 Amplifiers - Linear & Power - Chip 3 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Typical Applications Features The HMC757 is ideal for: Saturated Output Power: +30 dBm @ 30% PAE • Point-to-Point Radios High Output IP3: +37 dBm • Point-to-Multi-Point Radios High Gain: 22 dB • VSAT DC Supply: +7V @ 395mA • Military & Space 50 Ohm Matched Input/Output Die Size: 2.4 x 0.9 x 0.1 mm Functional Diagram General Description The HMC757 is a three stage GaAs pHEMT MMIC 1/2 Watt Power Amplifier which operates between 16 and 24 GHz. The HMC757 provides 22 dB of gain, and +30 dBm of saturated output power at 30% PAE from a +7V supply. The RF I/Os are DC blocked and matched to 50 Ohms for ease of integration into MultiChip-Modules (MCMs). All data is taken with the chip in a 50 Ohm test fixture connected via 0.025 mm (1 mil) diameter wire bonds of length 0.31 mm (12 mils). Electrical Specifications, TA = +25° C, Vdd = +7V, Idd = 395mA[1] Parameter Min. Frequency Range Max. Min. 16 - 20 Gain 19 Gain Variation Over Temperature Input Return Loss Output Return Loss 22 Saturated Output Power (Psat) (IP3)[2] Total Supply Current (Idd) 27 Typ. 20 - 24 21 Max. Units GHz 24 dB 0.028 0.032 dB/ °C 10 12 dB 15 Output Power for 1 dB Compression (P1dB) Output Third Order Intercept Typ. 13 dB 29.5 dBm 30 dBm 38 36 dBm 395 395 mA 29 30 27 [1] Adjust Vgg between -2 to 0V to achieve Idd= 395mA typical. [2] Measurement taken at +7V @ 395mA, Pout / Tone = +17 dBm 3-1 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Broadband Gain & Return Loss vs. Frequency Gain vs. Temperature 30 30 20 GAIN (dB) RESPONSE (dB) 0 22 -10 +25C +85C -55C 18 -20 -30 14 12 14 16 18 20 22 FREQUENCY (GHz) 24 26 28 16 22 24 Output Return Loss vs. Temperature 0 0 +25C +85C -55C +25C +85C -55C -4 RETURN LOSS (dB) -4 -8 -12 -16 -8 -12 -16 -20 -20 -24 16 18 20 22 24 16 18 FREQUENCY (GHz) 22 24 22 24 Psat vs. Temperature 35 31 33 Psat (dBm) 33 29 27 +25C +85C -55C 25 20 FREQUENCY (GHz) P1dB vs. Temperature P1dB (dBm) 20 FREQUENCY (GHz) Input Return Loss vs. Temperature RETURN LOSS (dB) 18 31 29 +25C +85C -55C 27 23 Amplifiers - Linear & Power - Chip 3 26 S21 S11 S22 10 25 16 18 20 FREQUENCY (GHz) 22 24 16 18 20 FREQUENCY (GHz) For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 3-2 HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Psat vs. Current 33 31 31 Psat (dBm) 33 29 27 360mA 395mA 420mA 25 29 27 360mA 395mA 420mA 25 23 23 16 18 20 22 24 16 18 FREQUENCY (GHz) 22 24 Output IP3 vs. Supply Current, Pout/Tone = +17 dBm 45 40 40 IP3 (dBm) 45 35 +25C +85C -55C 30 20 FREQUENCY (GHz) Output IP3 vs. Temperature, Pout/Tone = +17 dBm IP3 (dBm) Amplifiers - Linear & Power - Chip 3 P1dB (dBm) P1dB vs. Current 35 360mA 395mA 420mA 30 25 25 16 18 20 22 24 16 18 FREQUENCY (GHz) 20 22 24 FREQUENCY (GHz) Output IP3 vs. Supply Voltage, Pout/Tone = +17 dBm Output IM3 45 80 70 60 IM3(dBc) IP3 (dBm) 40 35 6.5V 7.0V 7.5V 30 50 40 16GHz 18GHz 20GHz 22GHz 24GHz 30 20 10 0 25 16 18 20 FREQUENCY (GHz) 3-3 22 24 5 7 9 11 13 15 17 19 21 23 Pout/TONE (dBm) For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Reverse Isolation vs. Temperature Power Compression @ 20 GHz 0 25 20 15 10 5 0 -18 -10 -30 -40 -50 -60 -13 -8 -3 2 7 12 14 16 18 INPUT POWER (dBm) 22 24 26 Gain & Power vs. Supply Voltage @ 20 GHz 35 Gain(dB), P1dB(dBm), Psat(dBm) 35 30 25 20 Gain (dB) P1dB (dBm) Psat (dBm) 15 370 380 390 400 410 30 25 20 Gain (dB) P1dB (dBm) Psat (dBm) 15 10 5.5 420 6 6.5 Idd (V) 7 7.5 Vdd (V) Power Dissipation 3 POWER DISSIPATION (W) Gain(dB), P1dB(dBm), Psat(dBm) 20 FREQUENCY (GHz) Gain & Power vs. Supply Current @ 20 GHz 10 360 3 +25C +85C -55C -20 Amplifiers - Linear & Power - Chip Pout Gain PAE 30 REVERSE ISOLATION (dB) Pout (dBm), GAIN (dB), PAE (%) 35 2.8 2.6 2.4 16GHz 18GHz 20GHz 22GHz 24GHz 2.2 2 -18 -14 -10 -6 -2 2 6 10 INPUT POWER (dBm) For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 3-4 HMC757 v00.0409 Typical Supply Current vs. Vdd Absolute Maximum Ratings Amplifiers - Linear & Power - Chip 3 Drain Bias Voltage (Vdd) 8V Vdd (V) Idd (mA) RF Input Power (RFIN) +26 dBm +6.5 375 Junction Temperature 150 °C +7.0 395 +7.5 411 Continuous Pdiss (T= 85 °C) (derate 43 mW/°C above 85 °C) 2.8 W Thermal Resistance (junction to die bottom) 23.4 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C Note: Amplifier will operate over full voltage ranges shown above Vgg adjusted to achieve Idd = 395mA at +7V ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing Die Packaging Information [1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 3-5 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND PAD IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 8. Overall die size ± .002 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Pad Descriptions Function Description 1 RFIN This pad is AC coupled and matched to 50 Ohms. 2 Vgg Gate control for PA. Adjust Vgg to achieve recommended bias current. External bypass caps 100pF, 0.1uF and 4.7uF are required. 3 Vdd Drain bias for amplifier. External bypass caps 100pF, 0.1uF and 4.7uF are required 4 RFOUT This pad is AC coupled and matched to 50 Ohms. Interface Schematic For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 3 Amplifiers - Linear & Power - Chip Pad Number 3-6 HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Assembly Diagram Amplifiers - Linear & Power - Chip 3 3-7 For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC757 v00.0409 GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 16 - 24 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Microstrip substrates should be located as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pickup. 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 2. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. 3 Amplifiers - Linear & Power - Chip The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 3-8