TI TLC2543-EP

TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
(1)
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of –40°C
to 125°C (TLC2543Q) and –55°C to 125°C
(TLC2543M)
Enhanced Diminishing Manufacturing Sources
(DMS) Support
Enhanced Product Change Notification
Qualification Pedigree (1)
12-Bit-Resolution Analog-to-Digital Converter
(ADC)
10-µs Conversion Time Over Operating
Temperature
11 Analog Input Channels
Three Built-In Self-Test Modes
Inherent Sample-and-Hold Function
Linearity Error . . . ±1 LSB Max
On-Chip System Clock
End-of-Conversion (EOC) Output
Unipolar or Bipolar Output Operation (Signed
Binary With Respect to 1/2 the Applied
Voltage Reference)
Programmable Most Significant Bit (MSB) or
Least Significant Bit (LSB) First
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
•
•
•
•
Programmable Power Down
Programmable Output Data Length
CMOS Technology
Application Report Available (2)
DW PACKAGE
(TOP VIEW)
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
AIN8
GND
(2)
1
20
2
3
19
4
5
17
16
6
15
14
7
18
8
9
13
10
11
12
VCC
EOC
I/O CLOCK
DATA INPUT
DATA OUT
CS
REF +
REF −
AIN10
AIN9
Microcontroller Based Data Acquisition Using the TLC2543
12-bit Serial-Out ADC (SLAA012)
DESCRIPTION/ORDERING INFORMATION
The TLC2543 is a 12-bit, switched-capacitor, successive-approximation, analog-to-digital converter (ADC). This
device, with three control inputs [chip select (CS), input-output clock (I/O CLOCK), and address input (DATA
INPUT)], is designed for communication with the serial port of a host processor or peripheral through a serial
3-state output. The device allows high-speed data transfers from the host.
In addition to the high-speed converter and versatile control capability, the device has an on-chip 14-channel
multiplexer that can select any 1 of 11 inputs or any 1 of 3 internal self-test voltages. The sample-and-hold
function is automatic. At the end of conversion, the end-of-conversion (EOC) output goes high to indicate that
conversion is complete. The converter incorporated in the device features differential high-impedance reference
inputs that facilitate ratiometric conversion, scaling, and isolation of analog circuitry from logic and supply noise.
A switched-capacitor design allows low-error conversion over the full operating temperature range.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2006, Texas Instruments Incorporated
TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
ORDERING INFORMATION
PACKAGE (1)
TA
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 125°C
SOP – DW
Tape and reel
TLC2543QDWREP
TLC2543QEP
-55°C to 125°C
SSOP - DB
Tape and Reel
TLC2543MDBREP
TLC2543MEP
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTIONAL BLOCK DIAGRAM
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
AIN8
AIN9
AIN10
1
2
3
4
5
6
7
8
9
11
12
Sample-andHold
Function
REF +
REF −
14
13
12-Bit
Analog-to-Digital
Converter
(Switched Capacitors)
14-Channel
Analog
Multiplexer
12
4
Input Address
Register
Output
Data
Register
12
12-to-1 Data
Selector and
Driver
16
DATA
OUT
4
3
Self-Test
Reference
Control Logic
and I/O
Counters
19
DATA
INPUT
I/O CLOCK
CS
2
17
18
15
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EOC
TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
I/O
DESCRIPTION
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
AIN8
AIN9
AIN10
1
2
3
4
5
6
7
8
9
11
12
I
Analog input. These 11 analog-signal inputs are internally multiplexed. The driving source
impedance should be less than or equal to 50 Ω for 4.1-MHz I/O CLOCK operation, and be capable
of slewing the analog input voltage into a capacitance of 60 pF.
CS
15
I
Chip select. A high-to-low transition on CS resets the internal counters and controls and enables
DATA OUT, DATA INPUT, and I/O CLOCK. A low-to-high transition disables DATA INPUT and I/O
CLOCK within a setup time.
I
Serial-data input. A 4-bit serial address selects the desired analog input or test voltage to be
converted next. The serial data is presented with the most significant bit (MSB) first and is shifted in
on the first four rising edges of I/O CLOCK. After the four address bits are read into the address
register, I/O CLOCK clocks the remaining bits in order.
DATA INPUT
17
DATA OUT
16
O
The 3-state serial output for the A/D conversion result. DATA OUT is in the high-impedance state
when CS is high and active when CS is low. With a valid CS, DATA OUT is removed from the
high-impedance state and is driven to the logic level corresponding to the most significant bit/least
significant bit (MSB/LSB) value of the previous conversion result. The next falling edge of I/O
CLOCK drives DATA OUT to the logic level corresponding to the next MSB/LSB, and the remaining
bits are shifted out in order.
EOC
19
O
End of conversion. EOC goes from a high to a low logic level after the falling edge of the last I/O
CLOCK and remains low until the conversion is complete and the data is ready for transfer.
GND
10
Ground. GND is the ground return terminal for the internal circuitry. Unless otherwise noted, all
voltage measurements are with respect to GND.
I/O CLOCK
18
I
Input/output clock. I/O CLOCK receives the serial input and performs the following four functions:
• It clocks the eight input data bits into the input data register on the first eight rising edges of I/O
CLOCK with the multiplexer address available after the fourth rising edge.
• On the fourth falling edge of I/O CLOCK, the analog input voltage on the selected multiplexer input
begins charging the capacitor array and continues to do so until the last falling edge of the I/O
CLOCK.
• It shifts the 11 remaining bits of the previous conversion data out on DATA OUT. Data changes on
the falling edge of I/O CLOCK.
• It transfers control of the conversion to the internal state controller on the falling edge of the last
I/O CLOCK.
REF+
14
I
Positive reference voltage. The upper reference voltage value (nominally VCC) is applied to REF+.
The maximum input voltage range is determined by the difference between the voltage applied to
this terminal and the voltage applied to the REF– terminal.
REF–
13
I
Negative reference voltage. The lower reference voltage value (nominally ground) is applied to
REF–.
VCC
20
Positive supply voltage
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TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
Supply voltage range (2)
VCC
MIN
MAX
–0.5
6.5
UNIT
V
V
VI
Input voltage range (any input)
–0.3
VCC +
0.3
VO
Output voltage range
–0.3
VCC +
0.3
V
Vref+
Positive reference voltage
VCC +
0.1
V
Vref–
Negative reference voltage
–0.1
V
II
Peak input current (any input)
±20
mA
II
Peak total input current (all inputs)
±30
mA
TA
Operating free-air temperature range
Tstg
Storage temperature range
TLC2543Q
–40
125
TLC2543M
-55
125
–65
150
°C
260
°C
Lead temperature 1,6 mm (1/16 in) from the case for 10 s
(1)
(2)
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to the GND terminal with REF– and GND wired together (unless otherwise noted).
Recommended Operating Conditions
MIN
VCC
Supply voltage
Vref+
Positive reference voltage (1)
Vref–
Negative reference voltage (1)
Vref+ – Vref–
Differential reference
4.5
voltage (1)
2.5
Analog input voltage (1)
0
VIH
High-level control input voltage
VCC = 4.5 V to 5.5 V
VIL
Low-level control input voltage
VCC = 4.5 V to 5.5 V
Clock frequency at I/O CLOCK
Setup time, address bits at DATA INPUT before I/O CLOCK↑ (see Figure 4)
th(A)
Hold time, address bits after I/O CLOCK↑ (see Figure 4)
th(CS)
Hold time, CS low after last I/O CLOCK↓ (see Figure 5)
tsu(CS)
Setup time, CS low before clocking in first address bit (2) (see Figure 5)
twH(I/O)
5
5.5
UNIT
V
VCC
V
0
V
VCC
VCC + 0.1
V
VCC
V
V
0.8
V
4.1
MHz
100
ns
0
ns
0
ns
1.425
µs
Pulse duration, I/O CLOCK high
120
ns
twL(I/O)
Pulse duration, I/O CLOCK low
120
tt(I/O)
Transition time, I/O CLOCK high to low (3) (see Figure 6)
tt(CS)
Transition time, DATA INPUT and CS
TA
Operating free-air temperature
(1)
(2)
(3)
4
MAX
2
0
tsu(A)
NOM
ns
1
µs
10
µs
TLC2543Q
–40
125
TLC2543M
-55
125
°C
Analog input voltages greater than that applied to REF+ convert as all ones (111111111111), while input voltages less than that applied
to REF– convert as all zeros (000000000000).
To minimize errors caused by noise at the CS input, the internal circuitry waits for a setup time after CS↓ before responding to control
input signals. No attempt should be made to clock in an address until the minimum CS setup time has elapsed.
This is the time required for the clock input signal to fall from VIHmin to VILmax or to rise from VILmax to VIHmin. In the vicinity of normal
room temperature, the devices function with input clock transition time as slow as 1 µs for remote data acquisition applications where
the sensor and the ADC are placed several feet away from the controlling microprocessor.
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TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
Electrical Characteristics
over recommended operating free-air temperature range, VCC = Vref+ = 4.5 V to 5.5 V, f(I/O
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
CLOCK)
= 4.1 MHz
MIN
TYP (1)
MAX
VCC = 4.5 V,
IOH = –1.6 mA
2.4
VCC = 4.5 V to 5.5 V,
IOH = –20 µA
VCC = 4.5 V,
IOL = 1.6 mA
0.4
VCC = 4.5 V to 5.5 V,
IOL = 20 µA
0.1
UNIT
VOH
High-level output voltage
VOL
Low-level output voltage
IOZ
High-impedance off-state
output current
VO = VCC,
CS at VCC
1
2.5
VO = 0,
CS at VCC
1
–2.5
IIH
High-level input current
VI = VCC
1
10
IIL
Low-level input current
VI = 0
1
–10
µA
ICC
Operating supply current
CS at 0 V
1
2.5
mA
ICC(PD)
Power-down current
For all digital inputs,
0 ≤ VI ≤ 0.5 V or VI ≥ VCC – 0.5 V
4
25
µA
Selected channel
leakage current
Maximum static analog
reference current into REF+
Ci
(1)
Input
capacitance
V
VCC – 0.1
Selected channel at VCC, Unselected channel at 0 V
Selected channel at 0 V,
Unselected channel at VCC
Vref+ = VCC,
Vref– = GND
10
–10
1
2.5
Analog inputs
30
60
Control inputs
5
15
V
µA
µA
µA
µA
pF
All typical values are at VCC = 5 V, TA = 25°C.
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TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
Operating Characteristics
over recommended operating free-air temperature range, VCC = Vref+ = 4.5 V to 5.5 V, f(I/O
PARAMETER
TEST CONDITIONS
CLOCK)
MAX
UNIT
EL
Linearity
See Figure 2
±1
LSB
ED
Differential linearity error
See Figure 2
±1
LSB
2 (4)
±1.5
LSB
See Figure 2 (4)
±1
LSB
±1.75
LSB
EO
Offset
EG
Gain error (3)
ET
Total unadjusted error (5)
See Figure
DATA INPUT = 1011
Self-test output code (6) (see Table 3)
t(conv)
Conversion time
2048
DATA INPUT = 1100
0
DATA INPUT = 1101
4095
See Figure 9 through Figure 14
tc
Total cycle time
(access, sample, and conversion) (7)
See Figure 9 through Figure 14
tacq
Channel acquisition time (sample) (7)
See Figure 9 through Figure 14
tv
Valid time,
DATA OUT remains valid after I/O
CLOCK↓
See Figure 6
td(I/O-DATA)
Delay time,
I/O CLOCK↓ to DATA OUT valid
See Figure 6
td(I/O-EOC)
Delay time,
last I/O CLOCK↓ to EOC↓
See Figure 7
td(EOC-DATA)
Delay time,
EOC↑ to DATA OUT (MSB/LSB)
See Figure 8
tPZH, tPZL
Enable time,
CS↓ to DATA OUT (MSB/LSB driven)
See Figure 3
tPHZ, tPLZ
Disable time,
CS↑ to DATA OUT (high impedance)
tr(EOC)
8
4
10
µs
10 + total
I/O CLOCK
periods +
td(I/O-EOC)
µs
12
10
I/O
CLOCK
periods
ns
150
ns
2.2
µs
100
ns
0.7
1.3
µs
See Figure 3
70
150
ns
Rise time, EOC
See Figure 8
15
50
ns
tf(EOC)
Fall time, EOC
See Figure 7
15
50
ns
tr(bus)
Rise time, data bus
See Figure 6
15
50
ns
tf(bus)
Fall time, data bus
See Figure 6
15
50
ns
td(I/O-CS)
Delay time, last I/O CLOCK↓ to CS↓ to
abort conversion (8)
5
µs
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
6
TYP (1)
error (2)
error (3)
MIN
= 4.1 MHz
1.5
All typical values are at TA = 25°C.
Linearity error is the maximum deviation from the best straight line through the A/D transfer characteristics.
Gain error is the difference between the actual midstep value and the nominal midstep value in the transfer diagram at the specified gain
point after the offset error has been adjusted to zero. Offset error is the difference between the actual midstep value and the nominal
midstep value at the offset point.
Analog input voltages greater than that applied to REF+ convert as all ones (111111111111), while input voltages less than that applied
to REF– convert as all zeros (000000000000).
Total unadjusted error comprises linearity, zero-scale, and full-scale errors.
Both the input address and the output codes are expressed in positive logic.
I/O CLOCK period = 1 /(I/O CLOCK frequency) (see Figure 7)
Any transitions of CS are recognized as valid only when the level is maintained for a setup time. CS must be taken low at ≤5 µs of the
tenth I/O CLOCK falling edge to ensure a conversion is aborted. Between 5 µs and 10 µs, the result is uncertain as to whether the
conversion is aborted or the conversion results are valid.
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TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
PARAMETER MEASUREMENT INFORMATION
15 V
50 Ω
C1
10 µF
C2
0.1 µF
C3
470 pF
VI
C1
10 µF
TLC2543
10 Ω
_
U1
+
AIN0−AIN10
C3
470 pF
C2
0.1 µF
50 Ω
−15 V
LOCATION
DESCRIPTION
U1
C1
OP27
10-µF 35-V tantalum capacitor
C2
C3
0.1-µF ceramic NPO SMD capacitor
470-pF porcelain Hi-Q SMD capacitor
PART NUMBER
—
—
AVX 12105C104KA105 or equivalent
Johanson 201S420471JG4L or equivalent
Figure 1. Analog Input Buffer to Analog Inputs AIN0–AIN10
VCC
Test Point
VCC
Test Point
RL = 2.18 kΩ
RL = 2.18 kΩ
EOC
DATA OUT
12 kΩ
CL = 50 pF
12 kΩ
CL = 100 pF
Figure 2. Load Circuits
Data
Valid
2V
CS
0.8 V
tPZH, tPZL
DATA
OUT
tPHZ, tPLZ
2.4 V
90%
0.4 V
10%
2V
0.8 V
DATA INPUT
th(A)
tsu(A)
I/O CLOCK
0.8 V
Figure 3. DATA OUT to Hi-Z Voltage Waveforms
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Figure 4. DATA INPUT and I/O CLOCK
Voltage Waveforms
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TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
2V
CS
0.8 V
tsu(CS)
I/O CLOCK
A.
th(CS)
Last
Clock
0.8 V
0.8 V
To ensure full conversion accuracy, it is recommended that no input signal change occurs while a conversion is
ongoing.
Figure 5. CS and I/O CLOCK Voltage Waveforms
tt(I/O)
tt(I/O)
I/O CLOCK
2V
2V
0.8 V
0.8 V
0.8 V
I/O CLOCK Period
td(I/O-DATA)
tv
DATA OUT
2.4 V
0.4 V
2.4 V
0.4 V
tr(bus), tf(bus)
Figure 6. I/O CLOCK and DATA OUT Voltage Waveforms
I/O CLOCK
Last
Clock
0.8 V
td(I/O-EOC)
2.4 V
EOC
0.4 V
tf(EOC)
Figure 7. I/O CLOCK and EOC Voltage Waveforms
tr(EOC)
EOC
2.4 V
0.4 V
td(EOC-DATA)
DATA OUT
2.4 V
0.4 V
Valid MSB
Figure 8. EOC and DATA OUT Voltage Waveforms
8
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12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
Access Cycle B
7
8
11
Sample Cycle B
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DATA
OUT
A11
A10
A9
A8
A7
A6
A5
A4
A1
Previous Conversion Data
MSB
12
B7
B6
B5
B4
B3
B2
B1
1
Hi-Z State
A0
LSB
DATA
INPUT
MSB
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎ
B11
C7
B0
LSB
EOC
t(conv)
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
A/D Conversion
Interval
Initialize
A.
Initialize
To minimize errors caused by noise at CS, the internal circuitry waits for a setup time after CS↓ before responding to
control input signals. Therefore, no attempt should be made to clock in an address until the minimum CS setup time
has elapsed.
Figure 9. Timing for 12-Clock Transfer Using CS With MSB First
CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
Access Cycle B
DATA
OUT
7
8
11
A10
A9
A8
A7
A6
A5
A4
Previous Conversion Data
MSB
1
Sample Cycle B
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
A11
12
A1
A0
Low Level
LSB
DATA
INPUT
B7
MSB
B6
B5
B4
B3
B2
B1
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎÎ
B11
C7
B0
LSB
EOC
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
Initialize
A.
t(conv)
A/D Conversion
Interval
Initialize
To minimize errors caused by noise at CS, the internal circuitry waits for a setup time after CS↓ before responding to
control input signals. Therefore, no attempt should be made to clock in an address until the minimum CS setup time
has elapsed.
Figure 10. Timing for 12-Clock Transfer Not Using CS With MSB First
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TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
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SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
CS
(see Note A)
1
I/O CLOCK
2
3
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ
ÎÎ
4
5
Access Cycle B
DATA OUT
ÎÎ
ÎÎ
ÎÎ
ÎÎ
A7
MSB
DATA INPUT
B7
MSB
Î
Î
Î
Î
A6
Î
Î
Î
Î
A5
6
7
8
Sample Cycle B
A4
A3
A2
A1
B5
B3
B4
Hi-Z
A0
Previous Conversion Data
B6
1
B7
LSB
B2
B1
B0
C7
LSB
EOC
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
t(conv)
A/D Conversion
Interval
Initialize
A.
Initialize
To minimize errors caused by noise at CS, the internal circuitry waits for a setup time after CS↓ before responding to
control input signals. Therefore, no attempt should be made to clock in an address until the minimum CS setup time
has elapsed.
Figure 11. Timing for 8-Clock Transfer Using CS With MSB First
CS
(see Note A)
1
I/O CLOCK
2
3
4
5
Access Cycle B
DATA OUT
7
8
1
Sample Cycle B
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
Î
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
Î
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
A7
A6
A5
B7
MSB
A4
A3
A2
A1
Previous Conversion Data
MSB
DATA INPUT
6
B6
B5
B4
B3
B2
A0
Low Level
LSB
B1
B0
ÎÎÎ
ÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎÎ
B7
C7
LSB
EOC
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
Initialize
A.
t(conv)
A/D Conversion
Interval
To minimize errors caused by noise at CS, the internal circuitry waits for a setup time after CS↓ before responding to
control input signals. Therefore, no attempt should be made to clock in an address until the minimum CS setup time
has elapsed.
Figure 12. Timing for 8-Clock Transfer Not Using CS With MSB First
10
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CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
Access Cycle B
7
A15
A14
A13
A12
A11
A10
A9
Previous Conversion Data
MSB
DATA
INPUT
B7
B6
B5
B3
B4
MSB
15
16
Sample Cycle B
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DATA
OUT
8
B2
B1
Î
Î
Î
Î
A8
B0
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎ
ÎÎ
ÎÎÎÎ
ÎÎ
ÎÎ
ÎÎÎÎ
1
Hi-Z State
A1
A0
LSB
B15
C7
LSB
EOC
t(conv)
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
A/D Conversion
Interval
Initialize
A.
Initialize
To minimize errors caused by noise at CS, the internal circuitry waits for a setup time after CS↓ before responding to
control input signals. Therefore, no attempt should be made to clock in an address until the minimum CS setup time
has elapsed.
Figure 13. Timing for 16-Clock Transfer Using CS With MSB First
CS
(see Note A)
I/O
CLOCK
1
2
3
4
5
6
Access Cycle B
7
8
15
16
Sample Cycle B
ÎÎÎ
ÎÎ
Î
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
Î
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
Î
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DATA
OUT
A15
A14
A13
A12
A11
A10
A9
A8
A1
Previous Conversion Data
MSB
1
A0
Low Level
LSB
DATA
INPUT
B7
MSB
B6
B5
B4
B3
B2
B1
B0
ÎÎÎÎ
ÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎ
B15
C7
LSB
EOC
Shift in New Multiplexer Address,
Simultaneously Shift Out Previous
Conversion Value
Initialize
A.
t(conv)
A/D Conversion
Interval
To minimize errors caused by noise at CS, the internal circuitry waits for a setup time after CS↓ before responding to
control input signals. Therefore, no attempt should be made to clock in an address until the minimum CS setup time
has elapsed.
Figure 14. Timing for 16-Clock Transfer Not Using CS With MSB First
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PRINCIPLES OF OPERATION
Initially, with chip select (CS) high, I/O CLOCK and DATA INPUT are disabled and DATA OUT is in the
high-impedance state. CS going low begins the conversion sequence by enabling I/O CLOCK and DATA INPUT
and removes DATA OUT from the high-impedance state.
The input data is an 8-bit data stream consisting of a 4-bit analog channel address (D7–D4), a 2-bit data length
select (D3–D2), an output MSB or LSB first bit (D1), and a unipolar or bipolar output select bit (D0) that are
applied to DATA INPUT. The I/O CLOCK sequence applied to the I/O CLOCK terminal transfers this data to the
input data register.
During this transfer, the I/O CLOCK sequence also shifts the previous conversion result from the output data
register to DATA OUT. I/O CLOCK receives the input sequence of 8, 12, or 16 clock cycles long, depending on
the data-length selection in the input data register. Sampling of the analog input begins on the fourth falling edge
of the input I/O CLOCK sequence and is held after the last falling edge of the I/O CLOCK sequence. The last
falling edge of the I/O CLOCK sequence also takes EOC low and begins the conversion.
Converter Operation
The operation of the converter is organized as a succession of two distinct cycles: the I/O cycle and the actual
conversion cycle.
I/O Cycle
The I/O cycle is defined by the externally provided I/O CLOCK and lasts 8, 12, or 16 clock periods, depending
on the selected output data length.
During the I/O cycle, the following two operations take place simultaneously:
• An 8-bit data stream consisting of address and control information is provided to DATA INPUT. This data is
shifted into the device on the rising edge of the first eight I/O CLOCKs. DATA INPUT is ignored after the first
eight clocks during 12- or 16-clock I/O transfers.
• The data output, with a length of 8, 12, or 16 bits, is provided serially on DATA OUT. When CS is held low,
the first output data bit occurs on the rising edge of EOC. When CS is negated between conversions, the first
output data bit occurs on the falling edge of CS. This data is the result of the previous conversion period, and
after the first output data bit, each succeeding bit is clocked out on the falling edge of each succeeding I/O
CLOCK.
Conversion Cycle
The conversion cycle is transparent to the user, and it is controlled by an internal clock synchronized to I/O
CLOCK. During the conversion period, the device performs a successive-approximation conversion on the
analog input voltage. The EOC output goes low at the start of the conversion cycle and goes high when
conversion is complete and the output data register is latched. A conversion cycle is started only after the I/O
cycle is completed, which minimizes the influence of external digital noise on the accuracy of the conversion.
12
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PRINCIPLES OF OPERATION (continued)
Power Up and Initialization
After power up, CS must be taken from high to low to begin an I/O cycle. EOC is initially high, and the input data
register is set to all zeroes. The contents of the output data register are random, and the first conversion result
should be ignored. To initialize during operation, CS is taken high and is then returned low to begin the next I/O
cycle. The first conversion after the device has returned from the power-down state may not read accurately due
to internal device settling.
Table 1. Operational Terminology
Current (N) I/O cycle
Entire I/O CLOCK sequence that transfers address and control data into the data register and
clocks the digital result from the previous conversion from DATA OUT
Current (N) conversion cycle
The conversion cycle starts immediately after the current I/O cycle. The end of the current I/O
cycle is the last clock falling edge in the I/O CLOCK sequence. The current conversion result
is loaded into the output register when conversion is complete.
Current (N) conversion result
The current conversion result is serially shifted out on the next I/O cycle.
Previous (N – 1) conversion cycle
Conversion cycle just prior to the current I/O cycle
Next (N + 1) I/O cycle
I/O period that follows the current conversion cycle
Example: In the 12-bit mode, the result of the current conversion cycle is a 12-bit serial-data stream clocked out
during the next I/O cycle. The current I/O cycle must be exactly 12 bits long to maintain synchronization, even
when this corrupts the output data from the previous conversion. The current conversion is begun immediately
after the twelfth falling edge of the current I/O cycle.
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Data Input
The data input is internally connected to an 8-bit serial-input address and control register. The register defines
the operation of the converter and the output data length. The host provides the data word with the MSB first.
Each data bit is clocked in on the rising edge of the I/O CLOCK sequence (see Table 2 for the data
input-register format).
Table 2. Input-Register Format
INPUT DATA BYTE
ADDRESS BITS
L1
L0
LSBF
BIP
D3
D2
D1
D0
(LSB)
8 bits
0
1
12 bits
X (1)
0
16 bits
1
1
FUNCTION SELECT
D7
(MSB)
D6
D5
D4
AIN0
0
0
0
0
AIN1
0
0
0
1
AIN2
0
0
1
0
AIN3
0
0
1
1
AIN4
0
1
0
0
AIN5
0
1
0
1
AIN6
0
1
1
0
AIN7
0
1
1
1
AIN8
1
0
0
0
AIN9
1
0
0
1
AIN10
1
0
1
0
(Vref+ – Vref–)/2
1
0
1
1
Vref–
1
1
0
0
Vref+
1
1
0
1
1
1
1
0
Select input channel
Select test voltage
Software power down
Output data length
Output data format
MSB first
0
LSB first (LSBF)
1
Unipolar (binary)
0
Bipolar (BIP) 2s complement
1
(1)
The four MSBs (D7–D4) of the data register address one of the 11 input channels, a reference-test voltage, or the power-down mode.
The address bits affect the current conversion, which is the conversion that immediately follows the current I/O cycle. The reference
voltage is nominally equal to Vref+– Vref–.
Data Input Address Bits
The four MSBs (D7–D4) of the data register address 1 of the 11 input channels, a reference-test voltage, or the
power-down mode. The address bits affect the current conversion, which is the conversion that immediately
follows the current I/O cycle. The reference voltage is nominally equal to Vref+– Vref–.
14
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Data Output Length
The next two bits (D3 and D2) of the data register select the output data length. The data-length selection is
valid for the current I/O cycle (the cycle in which the data is read). The data-length selection, being valid for the
current I/O cycle, allows device start-up without losing I/O synchronization. A data length of 8, 12, or 16 bits can
be selected. Since the converter has 12-bit resolution, a data length of 12 bits is suggested.
With D3 and D2 set to 00 or 10, the device is in the 12-bit data-length mode and the result of the current
conversion is output as a 12-bit serial data stream during the next I/O cycle. The current I/O cycle must be
exactly 12 bits long for proper synchronization, even when this means corrupting the output data from a previous
conversion. The current conversion is started immediately after the twelfth falling edge of the current I/O cycle.
With bits D3 and D2 set to 11, the 16-bit data-length mode is selected, which allows convenient communication
with 16-bit serial interfaces. In the 16-bit mode, the result of the current conversion is output as a 16-bit serial
data stream during the next I/O cycle with the four LSBs always reset to 0 (pad bits). The current I/O cycle must
be exactly 16 bits long to maintain synchronization even when this means corrupting the output data from the
previous conversion. The current conversion is started immediately after the sixteenth falling edge of the current
I/O cycle.
With bits D3 and D2 set to 01, the 8-bit data-length mode is selected, which allows fast communication with 8-bit
serial interfaces. In the 8-bit mode, the result of the current conversion is output as an 8-bit serial data stream
during the next I/O cycle. The current I/O cycle must be exactly eight bits long to maintain synchronization, even
when this means corrupting the output data from the previous conversion. The four LSBs of the conversion
result are truncated and discarded. The current conversion is started immediately after the eighth falling edge of
the current I/O cycle.
Since D3 and D2 take effect on the current I/O cycle when the data length is programmed, there can be a
conflict with the previous cycle when the data-word length is changed from one cycle to the next. This may occur
when the data format is selected to be LSB first, since at the time the data length change becomes effective (six
rising edges of I/O CLOCK), the previous conversion result has already started shifting out.
In actual operation, when different data lengths are required within an application and the data length is changed
between two conversions, no more than one conversion result can be corrupted and only when it is shifted out in
LSB-first format.
Sampling Period
During the sampling period, one of the analog inputs is internally connected to the capacitor array of the
converter to store the analog input signal. The converter starts sampling the selected input immediately after the
four address bits have been clocked into the input data register. Sampling starts on the fourth falling edge of I/O
CLOCK. The converter remains in the sampling mode until the eighth, twelfth, or sixteenth falling edge of the I/O
CLOCK depending on the data-length selection. After the EOC delay time from the last I/O CLOCK falling edge,
the EOC output goes low indicating that the sampling period is over and the conversion period has begun. After
EOC goes low, the analog input can be changed without affecting the conversion result. Since the delay from
the falling edge of the last I/O CLOCK to EOC low is fixed, time-varying analog input signals can be digitized at
a fixed rate without introducing systematic harmonic distortion or noise due to timing uncertainty.
After the 8-bit data stream has been clocked in, DATA INPUT should be held at a fixed digital level until EOC
goes high (indicating that the conversion is complete) to maximize the sampling accuracy and minimize the
influence of external digital noise.
Data Register, LSB First
D1 in the input data register (LSB first) controls the direction of the output binary data transfer. When D1 is reset
to 0, the conversion result is shifted out MSB first. When set to 1, the data is shifted out LSB first. Selection of
MSB first or LSB first always affects the next I/O cycle and not the current I/O cycle. When changing from one
data direction to another, the current I/O cycle is never disrupted.
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Data Register, Bipolar Format
D0 (BIP) in the input data register controls the binary data format used to represent the conversion result. When
D0 is cleared to 0, the conversion result is represented as unipolar (unsigned binary) data. Nominally, the
conversion result of an input voltage equal to Vref– is a code of all zeros (000 . . . 0), the conversion result of an
input voltage equal to Vref+ is a code of all ones (111 . . . 1), and the conversion result of (Vref+ + Vref–)/2 is a
code of a one followed by zeros (100 . . . 0).
When D0 is set to 1, the conversion result is represented as bipolar (signed binary) data. Nominally, conversion
of an input voltage equal to Vref– is a code of a one followed by zeros (100 . . . 0), conversion of an input voltage
equal to Vref+ is a code of a zero followed by all ones (011 . . . 1), and the conversion of (Vref+ + Vref–)/2 is a code
of all zeros (000 . . . 0). The MSB is interpreted as the sign bit. The bipolar data format is related to the unipolar
format in that the MSBs are always each other's complement.
Selection of the unipolar or bipolar format always affects the current conversion cycle, and the result is output
during the next I/O cycle. When changing between unipolar and bipolar formats, the data output during the
current I/O cycle is not affected.
End of Conversion (EOC) Output
The EOC signal indicates the beginning and the end of conversion. In the reset state, EOC is always high.
During the sampling period (beginning after the fourth falling edge of the I/O CLOCK sequence), EOC remains
high until the internal sampling switch of the converter is safely opened. The opening of the sampling switch
occurs after the eighth, twelfth, or sixteenth I/O CLOCK falling edge, depending on the data-length selection in
the input data register. After the EOC signal goes low, the analog input signal can be changed without affecting
the conversion result.
The EOC signal goes high again after the conversion is completed and the conversion result is latched into the
output data register. The rising edge of EOC returns the converter to a reset state and a new I/O cycle begins.
On the rising edge of EOC, the first bit of the current conversion result is on DATA OUT when CS is low. When
CS is negated between conversions, the first bit of the current conversion result occurs at DATA OUT on the
falling edge of CS.
Data Format and Pad Bits
D3 and D2 of the input data register determine the number of significant bits in the digital output that represent
the conversion result. The LSB-first bit determines the direction of the data transfer while the BIP bit determines
the arithmetic conversion. The numerical data is always justified toward the MSB in any output format.
The internal conversion result is always 12 bits long. When an 8-bit data transfer is selected, the four LSBs of
the internal result are discarded to provide a faster 1-byte transfer. When a 12-bit transfer is used, all bits are
transferred. When a 16-bit transfer is used, four LSB pad bits are always appended to the internal conversion
result. In the LSB-first mode, four leading zeros are output. In the MSB-first mode, the last four bits output are
zeros.
When CS is held low continuously, the first data bit of the newly completed conversion occurs on DATA OUT on
the rising edge of EOC. When a new conversion is started after the last falling edge of I/O CLOCK, EOC goes
low and the serial output is forced to a setting of 0 until EOC goes high again.
When CS is negated between conversions, the first data bit occurs on DATA OUT on the falling edge of CS. On
each subsequent falling edge of I/O CLOCK after the first data bit appears, the data is changed to the next bit in
the serial conversion result until the required number of bits has been output.
16
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Chip-Select (CS) Input
CS enables and disables the device. During normal operation, CS should be low. Although the use of CS is not
necessary to synchronize a data transfer, it can be brought high between conversions to coordinate the data
transfer of several devices sharing the same bus.
When CS is brought high, the serial-data output is immediately brought to the high-impedance state, releasing
its output data line to other devices that may share it. After an internally generated debounce time, I/O CLOCK is
inhibited, thus preventing any further change in the internal state.
When CS is subsequently brought low again, the device is reset. CS must be held low for an internal debounce
time before the reset operation takes effect. After CS is debounced low, I/O CLOCK must remain inactive (low)
for a minimum time before a new I/O cycle can start.
CS can interrupt any ongoing data transfer or any ongoing conversion. When CS is debounced low long enough
before the end of the current conversion cycle, the previous conversion result is saved in the internal output
buffer and shifted out during the next I/O cycle.
Power-Down Features
When a binary address of 1110 is clocked into the input data register during the first four I/O CLOCK cycles, the
power-down mode is selected. Power down is activated on the falling edge of the fourth I/O CLOCK pulse.
During power down, all internal circuitry is put in a low-current standby mode. No conversions are performed,
and the internal output buffer keeps the previous conversion cycle data results provided that all digital inputs are
held above VCC – 0.5 V or below 0.5 V. The I/O logic remains active so the current I/O cycle must be completed,
even when the power-down mode is selected. Upon power-on reset and before the first I/O cycle, the converter
normally begins in the power-down mode. The device remains in the power-down mode until a valid input
address (other than 1110) is clocked in. Upon completion of that I/O cycle, a normal conversion is performed
with the results being shifted out during the next I/O cycle.
Analog Input, Test, and Power-Down Mode
The 11 analog inputs, 3 internal voltages, and power-down mode are selected by the input multiplexer according
to the input addresses shown in Table 3, Table 4, and Table 5. The input multiplexer is a break-before-make
type to reduce input-to-input noise rejection resulting from channel switching. Sampling of the analog input starts
on the falling edge of the fourth I/O CLOCK and continues for the remaining I/O CLOCK pulses. The sample is
held on the falling edge of the last I/O clock pulse. The three internal test inputs are applied to the multiplexer,
then sampled and converted in the same manner as the external analog inputs. The first conversion after the
device has returned from the power-down state may not read accurately due to internal device settling.
Table 3. Analog-Channel-Select Address
ANALOG INPUT
SELECTED
VALUE SHIFTED INTO DATA INPUT
BINARY
HEX
AIN0
0000
0
AIN1
0001
1
AIN2
0010
2
AIN3
0011
3
AIN4
0100
4
AIN5
0101
5
AIN6
0110
6
AIN7
0111
7
AIN8
1000
8
AIN9
1001
9
AIN10
1010
A
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Table 4. Test-Mode-Select Address
INTERNAL SELF-TEST
VOLTAGE SELECTED (1)
(1)
(2)
VALUE SHIFTED INTO DATA INPUT
BINARY
HEX
UNIPOLAR OUTPUT
RESULT (HEX) (2)
Vref + – Vref –
2
1011
B
800
Vref–
1100
C
000
Vref+
1101
D
FFF
Vref+ is the voltage applied to REF+, and Vref– is the voltage applied to REF–.
The output results shown are the ideal values and may vary with the reference stability and with
internal offsets.
Table 5. Power-Down-Select Address
INPUT COMMAND
Power down
VALUE SHIFTED INTO DATA INPUT
BINARY
HEX
1110
E
RESULT
ICC ≤25 µA
Converter and Analog Input
The CMOS threshold detector in the successive-approximation conversion system determines each bit by
examining the charge on a series of binary-weighted capacitors (see Figure 1). In the first phase of the
conversion process, the analog input is sampled by closing the SC switch and all ST switches simultaneously.
This action charges all the capacitors to the input voltage.
In the next phase of the conversion process, all ST and SC switches are opened and the threshold detector
begins identifying bits by identifying the charge (voltage) on each capacitor relative to the reference (REF–)
voltage. In the switching sequence, 12 capacitors are examined separately until all 12 bits are identified and the
charge-convert sequence is repeated. In the first step of the conversion phase, the threshold detector looks at
the first capacitor (weight = 4096). Node 4096 of this capacitor is switched to the REF+ voltage, and the
equivalent nodes of all the other capacitors on the ladder are switched to REF–. When the voltage at the
summing node is greater than the trip point of the threshold detector (approximately one-half VCC), a bit 0 is
placed in the output register and the 4096-weight capacitor is switched to REF–. When the voltage at the
summing node is less than the trip point of the threshold detector, a bit 1 is placed in the register and this
4096-weight capacitor remains connected to REF+ through the remainder of the successive-approximation
process. The process is repeated for the 2048-weight capacitor, the 1024-weight capacitor, and so forth down
the line until all bits are determined. With each step of the successive-approximation process, the initial charge
is redistributed among the capacitors. The conversion process relies on charge redistribution to determine the
bits from MSB to LSB.
Reference Voltage Inputs
The two reference inputs used with the device are the voltages applied to the REF+ and REF– terminals. These
voltage values establish the upper and lower limits of the analog input to produce a full-scale and zero-scale
reading, respectively. These voltages and the analog input should not exceed the positive supply or be lower
than ground consistent with the specified absolute maximum ratings. The digital output is at full scale when the
input signal is equal to or higher than REF+ terminal voltage, and at zero when the input signal is equal to or
lower than REF– terminal voltage.
18
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SC
Threshold
Detector
4096
2048
Node 4096
REF −
1024
REF+
REF+
REF −
ST
16
REF −
ST
8
REF+
REF −
ST
4
REF+
REF −
ST
REF+
REF −
ST
2
1
REF+
REF+
REF −
ST
REF −
ST
To Output
Latches
1
REF −
ST
ST
VI
Figure 15. Simplified Model of the Successive-Approximation System
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APPLICATION INFORMATION
4095
111111111111
VFS
See Notes A and B
4094
111111111110
VFSnom
4093
VFT = VFS − 1/2 LSB
2049
100000000001
2048
100000000000
VZT = VZS + 1/2 LSB
2047
011111111111
VZS
000000000001
1
000000000000
0
0.0012
0.0024
2.4564
2.4576
2.4588
4.9128
4.9134
2
0.0006
000000000010
4.9140
0
4.9152
VI − Analog Input Voltage − V
A.
This curve is based on the assumption that Vref+ and Vref– have been adjusted so that the voltage at the transition
from digital 0 to 1 (VZT) is 0.0006 V and the transition to full scale (VFT) is 4.9134 V. 1 LSB = 1.2 mV.
B.
The full-scale value (VFS) is the step whose nominal midstep value has the highest absolute value. The zero-scale
value (VZS) is the step whose nominal midstep value equals zero.
Figure 16. Ideal Conversion Characteristics
TLC2543
1
2
3
4
5
Analog
Inputs
6
7
8
9
11
12
AIN0
AIN1
AIN2
15
CS
18
I/O CLOCK
17
DATA INPUT
Processor
AIN3
AIN4
DATA OUT
AIN5
EOC
16
19
AIN6
AIN7
AIN8
REF+
AIN9
AIN10
REF−
14
5-V DC Regulated
13
GND
10
To Source
Ground
Figure 17. Serial Interface
20
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Control
Circuit
Step
Digital Output Code
111111111101
TLC2543-EP
12-BIT ANALOG-TO-DIGITAL CONVERTER
WITH SERIAL CONTROL AND 11 ANALOG INPUTS
www.ti.com
SGLS125A – JULY 2002 – REVISED NOVEMBER 2006
APPLICATION INFORMATION (continued)
Simplified Analog Input Analysis
Using the equivalent circuit in Figure 18, the time required to charge the analog input capacitance from 0 V to VS
within one-half LSB can be derived as follows:
The capacitance charging voltage is given by:
ǒ
V C + VS 1 * e
*t cńRtC
Ǔ
i
(1)
Where:
Rt = Rs + ri
The final voltage to 1/2 LSB is given by:
VC (1/2 LSB) = VS − (VS /8192)
(2)
Equating equation 1 to equation 2 and solving for time tc gives
ǒ
Ǔ
ǒ
V S * V Sń8192 + VS 1 * e
*t cńRtC
Ǔ
i
(3)
and
tc (1/2 LSB) = Rt × Ci × ln(8192)
(4)
Therefore, with the values given, the time for the analog input signal to settle is:
tc (1/2 LSB) = (Rs + 1 kΩ) × 60 pF × ln(8192)
(5)
This time must be less than the converter sample time shown in the timing diagrams.
Driving Source(A)
TLC2543
Rs
VS
VI
ri
VC
1 kΩ Max
Ci
60 pF Max
VI = Input Voltage at AIN
VS = External Driving Source Voltage
Rs = Source Resistance
ri = Input Resistance
Ci = Input Capacitance
VC = Capacitance Charging Voltage
A.
Driving source requirements:
• Noise and distortion for the source must be equivalent to the resolution of the converter.
• Rs must be real at the input frequency.
Figure 18. Equivalent Input Circuit Including the Driving Source
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21
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLC2543MDBREP
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC2543QDWREP
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03614-01XE
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03614-02YE
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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