SOURCE FTM-83X0C-X03G

Nov. 27, 2006
10G 850nm XFP Transceiver
(Up to 300m transmission)
Members of FlexonTM Family
‹
Compatible with FDA 21 CFR 1040.10 and
1040.11, Class I
‹
RoHS compliance
Description
FTM-83X0C-X03G is a high performance, cost
effective module, which is optimized for 10G
Ethernet, supporting data-rate of 10.3125Gbps
(10GBASE-SR) or 9.953Gbps (10GBASE-SW), and
transmission distance up to 300m on 50μm MMF
Features
(2000MHz.km).
Support 10GE application at the data-rate of
The transceiver consists of two sections: The
9.953Gbps and 10.3125Gbps
transmitter section incorporates an 850nm VCSEL,
Up to 300m transmission distance on 50μm
driver and re-timer. The receiver section consists of
MMF (2000MHz.km)
a PIN photodiode integrated with a transimpedance
‹
850nm VCSEL and PIN receiver
preamplifier (TIA) and CDR.
‹
XFI electrical interface
‹
2-wire interface for integrated Digital Diagnostic
The module is hot pluggable into the 30-pin XFI
monitoring
connector. The high-speed electrical interface is
‹
XFP MSA package with duplex LC connector
base on low voltage logic, with nominal 100 Ohms
‹
Hot pluggable
differential impedance and AC coupled in the
‹
Very low EMI and excellent ESD protection
module. The optical output can be disabled by
‹
‹
‹
+5V, +3.3V power supply
LVTTL logic high-level input of TX_DIS. Loss of
‹
Power consumption less than 1.5 W
signal (RX_LOS) output is provided to indicate the
‹
Operating case temperature: 0~+70°C
loss of an input optical signal of receiver.
Applications
The user can access transceiver monitoring and
configuration data via the 2-wire XFP Management
‹
10GBASE-SR at 10.3125Gbps
Interface. This interface uses a single address, A0h,
‹
10GBASE-SW at 9.953Gbps
with a memory map divided into a lower and upper
‹
Other optical links
area. Basic digital diagnostic (DD) data is held in the
lower area while specific data is held in a series of
Standard
‹
Compatible with XFP MSA
‹
Compatible with IEEE 802.3ae-2002
‹
Compatible with FCC 47 CFR Part 15, Class B
tables in the high memory area.
Fiberxon Proprietary and Confidential, Do Not Copy or Distribute
Controlled Electronic Version. 24hrs Obsolete when printed out without authorization.
Page 1 of 11
Last printed 2/26/2007 10:45:00 AM
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
Regulatory Compliance
The transceivers are tested according to American and European product safety and electromagnetic
compatibility regulations (See Table 1). For further information regarding regulatory certification, please refer
to Fiberxon regulatory specification and safety guidelines, or contact with Fiberxon, Inc. America sales office
listed at the end of the documentation.
Table 1- Regulatory Compliance
Feature
Standard
Electrostatic Discharge
MIL-STD-883E
(ESD) to the Electrical Pins
Method 3015.7
Electrostatic Discharge (ESD)
IEC 61000-4-2
to the Duplex LC Receptacle
GR-1089-CORE
Electromagnetic
Interference (EMI)
Immunity
Laser Eye Safety
Component Recognition
Performance
Class 1(>500 V)
Compatible with standards
FCC Part 15 Class B
EN55022 Class B (CISPR 22B)
Compatible with standards
VCCI Class B
IEC 61000-4-3
Compatible with standards
FDA 21CFR 1040.10 and 1040.11
Compatible with Class 1 laser
EN60950, EN (IEC) 60825-1,2
product.
UL and CSA
UL file E223705
Absolute Maximum Ratings
Stress in excess of the maximum absolute ratings can cause permanent damage to the module.
Table 2 - Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Unit
TS
-40
+85
°C
VCC5
-0.5
6.0
V
VCC3
-0.5
4.0
V
85
%
Storage Temperature
Supply Voltage
Operating Relative Humidity
RH
Recommended Operating Conditions
Table 3 - Recommended Operating Conditions
Parameter
Operating Case Temperature
Power Supply Voltage
Power Supply Current
Power Dissipation
Symbol
Min.
TC
0
VCC5
4.75
VCC3
3.13
Max.
Unit
+70
°C
5.0
5.25
V
3.3
3.47
ICC5
20
mA
ICC3
400
mA
PD
1.5
W
Data Rate
Transmission Distance
Typical
9.953/10.3125
2
Notes
Gbps
300
m
Note 1: The transmission distance depends on the fiber type. PLS see “Table 52-6” in IEEE 802.3ae.
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Controlled Electronic Version. 24hrs Obsolete when printed out without authorization.
Page 2 of 11
Last printed 2/26/2007 10:45:00 AM
1
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
Optical Characteristics
Table 4 - Optical Characteristics
Parameter
Symbol
Min.
Typical
Max.
Unit
Notes
Transmitter
9.953/
Operating Data Rate
Centre Wavelength
Gbps
10.3125
λC
840
860
nm
Average Output Power
P0UT
-7.3
-1.0
dBm
1
Extinction Ratio
ER
3.0
dB
2
Optical Modulation Amplitude
OMA
See Note 3
dBm
3
Spectral Width
Δλ
See Note 3
nm
3
Dispersion Penalty
DP
Optical Eye Mask
3.9
dB
Compatible with IEEE 802.3ae
Receiver
9.953/
Operating Data Rate
Gbps
10.3125
Centre Wavelength
λC
Receiver Sensitivity
860
nm
PIN
-9.9
dBm
4
Receiver Sensitivity in OMA
PIN
-11.1
dBm
4
Receiver Overload
PIN
-1.0
dBm
4
LOS Assert
LOSA
-25
LOS Deassert
LOSD
LOS Hysteresis
840
-15
dBm
1
Receiver Reflectance
-12
dBm
4
dB
-12
dB
Notes:
1.
The optical power is launched into MMF.
2.
Measured with a PRBS 231-1 test pattern @10.3125Gbps.
3.
Reference to Table 52-8 of IEEE P802.3ae.
4.
Measured with a PRBS 231-1 test pattern @10.3125Gbps, BER≤10-12.
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Controlled Electronic Version. 24hrs Obsolete when printed out without authorization.
Page 3 of 11
Last printed 2/26/2007 10:45:00 AM
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
Electrical Characteristics
Table 5 - Electrical Characteristics
Parameter
Symbol
Min.
Typical
Max.
Unit
Notes
High-speed Signal (CML) Interface Specification
9.953/
Input Data Rate
Gbps
10.3125
Differential Data Input Amplitude
120
Input Differential Impedance
1200
100
Gbps
10.3125
Differential Date Output Amplitude
500
Output Differential Impedance
800
100
mVpp
Ω
Low-speed Signal (LVTTL) Interface Specification
Input High Voltage
2.0
Vdd1=3.3
V
Input Low Voltage
GND
0.8
V
Output High Voltage
2.4
Vdd1=3.3
V
Output Low Voltage
GND
0.4
V
400
kHz
2 Wire Serial Interface (LVTTL) Specification
Clock Frequency
fSCL
Reference Clock (PECL) Interface Specification
No reference clock needed
Notes:
1.
Internally AC coupled
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Controlled Electronic Version. 24hrs Obsolete when printed out without authorization.
1
Ω
9.953/
Output Data Rate
mVpp
Page 4 of 11
Last printed 2/26/2007 10:45:00 AM
1
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
Management Interface
The structure of the memory map is shown in Figure 1, which is accessible over a 2 wire serial interface at the
8-bit address 1010000X (A0h). The normal 256 Byte I2C address space is divided into lower and upper
blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for the diagnostics
and control function. The monitoring specification is shown in Table 6. Multiple blocks of memories are
available in the upper 128 Bytes of the address space. These are individually addressed through a table
select Byte which the user enters into a location in the lower address space. Thus, there is a total available
address space of 128 * 256 = 32Kbytes in this upper memory space. The contents of Table 01h are list in table
7 below. PLS refer INF-8077i (Revision 4.0) for detailed information.
Figure 1, 2-wire Serial Digital Diagnostic Memory Map
Table 6 - Monitoring Specification
Data Address
Parameter
Range
Accuracy
96-97
Temperature
-10 to +80°C
±3°C
100-101
Bias Current
0 to 15mA
±10%
102-103
TX Power
-9 to 0dBm
±2dB
104-105
RX Power
-15 to 0dBm
±2dB
106-107
VCC5 Voltage
+4.5V to +5.5V
±3%
108-109
VCC3 Voltage
+3.0V to +3.7V
±3%
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Controlled Electronic Version. 24hrs Obsolete when printed out without authorization.
Page 5 of 11
Last printed 2/26/2007 10:45:00 AM
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
Table 7 - Serial ID Memory Contents (Table 01h)
Field
Addr.
Size
Name of Field
Hex
Description
(Bytes)
128
1
Identifier
06
XFP
129
1
Ext. Identifier
10
TX Ref Clock Input not Required
130
1
Connector
07
LC Connector
131-138
8
Transceiver
88 00 00 00 00 00 00 00
139
1
Encoding
10
NRZ
140
1
BR-Min
63
9.953Gbps
141
1
BR-Max
6F
11.1Gbps
142
1
Length (9um)-km
00
143
1
Length (E-50um)
96
300m
144
1
Length (50um)
52
82m
145
1
Length (62.5um)
21
33m
146
1
Length (copper)
00
147
1
Device Tech
00
148-163
16
Vendor name
164
1
CDR Support
165-167
3
Vendor OUI
168-183
16
Vendor PN
184-185
2
Vendor rev
xx xx
ASCⅡ( “32 61” means 2a revision)
186-187
2
Wavelength
42 68
850nm
188-189
2
190
1
Max Case Temp
191
1
CC_BASE
192-195
4
Power Supply
196-211
16
Vendor SN
212-219
8
Vendor date code
220
1
Diagnostic type
08
No BER Support, Average Power
221
1
Enhanced option
60
Optional Soft Tx_Disable and P_Down
222
1
Aux Monitoring
67
+5.0V and +3.3V Supply Voltage
223
1
CC EXT
xx
Check sum of bytes 192 - 222
224-255
32
Vendor specific
46 49 42 45 52 58 4F 4E
20 49 4E 43 2E 20 20 20
F8
10GBASE-SR/SW
850nm VCSEL, PIN Detector
“FIBERXON INC. “(ASCⅡ)
CDR supports 9.953Gbps~11.1Gbps
00 00 00
46 54 4D 2D 38 33 58 30
43 2D 58 30 33 47 20 20
“FTM-83X0C-X03G” (ASCⅡ)
Wavelength Tolerance07 D0
+/- 10nm
46
70degC
Check sum of bytes 128 - 190
4B 96 14 00
1.5W (max), 1.5W (max, power down mode),
20mA(max, +5.0V), 400mA (max, +3.3V)
xx xx xx xx xx xx xx xx
ASCⅡ.
xx xx xx xx xx xx xx xx
xx xx xx xx xx xx 20 20 Year (2 bytes), Month (2 bytes), Day (2 bytes)
Fiberxon Proprietary and Confidential, Do Not Copy or Distribute
Controlled Electronic Version. 24hrs Obsolete when printed out without authorization.
Reserved By Vendor
Page 6 of 11
Last printed 2/26/2007 10:45:00 AM
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
Recommended Host Board Power Supply Circuit
Figure 2 shows the recommended host board power supply circuit.
Figure 2, Recommended Host Board Power Supply Circuit
Recommended Interface Circuit
Figure 3 shows the recommended interface circuit.
Host Board
XFP Module
Z=50 Ω
TD +
Z=50Ω
TD -
SerDat In +
Z=50Ω
RD +
SerDat In -
Z=50Ω
SerDat Out +
CML
SerDat Out -
100Ω
CML
100Ω
CML
CML
RD REFCLKP
100 Ω
Vcc (+3.3V)
4.7K to 10KΩ
REFCLKN
RX_LOS
INTERRUPT
SDA
SCL
Vcc (+3.3V)
MOD_NR
MOD_abs
TX_DIS
10K Ω
GND
MOD_DeSel
P_Down/RST
Figure 3, Recommended Interface Circuit
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Controlled Electronic Version. 24hrs Obsolete when printed out without authorization.
Page 7 of 11
Last printed 2/26/2007 10:45:00 AM
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
Pin Definitions
Figure 4 below shows the pin numbering of XFP electrical interface. The pin functions are described in Table 5
with some accompanying notes.
Figure 4, Pin View
Table 8 – Pin Function Definitions
Pin
Logic
Symbol
Name/Description
1
GND
Module Ground
2
VEE5
Optional -5.2V Power Supply (Not implemented)
Mod_Desel
Module De-select; When held low allows the module to respond to
3
LVTTL-I
Note
1
2-wire serial interface
4
LVTTL-O
Interrupt
Interrupt; Indicates presence of an important condition which can
be read over the 2-wire serial interface
5
6
LVTTL-I
TX_DIS
Transmitter Disable; Turns off transmitter laser output
VCC5
+5V Power Supply
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Page 8 of 11
Last printed 2/26/2007 10:45:00 AM
2
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
7
GND
Module Ground
8
VCC3
+3.3V Power Supply
9
VCC3
+3.3V Power Supply
1
10
LVTTL-I/O
SCL
2-Wire Serial Interface Clock
2
11
LVTTL-I/O
SDA
2-Wire Serial Interface Data Line
2
12
LVTTL-O
Mod_Abs
Indicates Module is not present. Grounded in the Module
2
13
LVTTL-O
Mod_NR
Module Not Ready; Indicating Module Operational Fault
2
14
LVTTL-O
RX_LOS
Receiver Loss Of Signal Indicator
2
15
GND
Module Ground
1
16
GND
Module Ground
1
17
CML-O
RD-
Receiver Inverted Data Output
18
CML-O
RD+
Receiver Non-Inverted Data Output
19
GND
Module Ground
1
20
VCC2
+1.8V Power Supply (Not implemented).
3
P_Down/RST
Power down; When high, requires the module to limit power
21
LVTTL-I
consumption to 1.5W or below. 2-Wire serial interface must be
functional in the low power mode.
Reset; The falling edge initiates a complete reset of the module
including the2-wire serial interface, equivalent to a power cycle.
22
VCC2
+1.8V Power Supply (Not implemented)
3
23
GND
Module Ground
1
24
PECL-I
RefCLK+
Not used, internally terminated to 50ohm (100ohm diff).
4
25
PECL-I
RefCLK-
Not used, internally terminated to 50ohm (100ohm diff).
4
26
GND
Module Ground
1
27
GND
Module Ground
1
28
CML-I
TD-
Transmitter Inverted Data Input
29
CML-I
TD+
Transmitter Non-Inverted Data Input
GND
Module Ground
30
1
1.
Module ground pins GND are isolated from the module case and chassis ground within the module.
2.
Shall be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.45V on the host board.
3.
The pins are open within module.
4.
Reference Clock is not required.
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Page 9 of 11
Last printed 2/26/2007 10:45:00 AM
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
Mechanical Design Diagram
Beige Lever
LABEL
Figure 5, Mechanical Design Diagram of XFP
Ordering information
FTM
8
3
X
0
C
X
0
3
Wavelength
8: 850nm
Distance
03: 300m
Function
3: With CDR
Package
X: XFP
Data rate
X0: Multi-rate (Optimized for 10GE)
Receptacle
C: LC
Part No.
FTM-83X0C-X03G
G
G: RoHS Compliance
Product Description
850nm VCSEL, multi-rate for 10GE, 300m, XFP, RoHS compliance
Fiberxon Proprietary and Confidential, Do Not Copy or Distribute
Controlled Electronic Version. 24hrs Obsolete when printed out without authorization.
Page 10 of 11
Last printed 2/26/2007 10:45:00 AM
10G 850nm XFP Transceiver
Up to 300m transmission
Nov. 27, 2006
Related Documents
■
INF-8077i (10 Gigabit Small Form Factor Pluggable Module), Revision 4.0
Obtaining Document
You can visit our website:
http://www.fiberxon.com
Or contact with Fiberxon, Inc. America Sales Office listed at the end of documentation to get the latest
documents.
Revision History
Revision
Initiate
Review
Approve
Subject
Release
Date
Rev. 1a
Andy.Xiao
Tonny Yin
Alain.Shang
Initial datasheet
Mar. 28, 2006
Rev. 1b
Andy.Xiao
Tonny Yin
Alain.Shang
1. Update the LOS Assert /
Nov.27, 2006
De-assert spec
2. Remove
the
minimum
transmission, and add a note.
© Copyright Fiberxon Inc. 2006
All Rights Reserved.
All information contained in this document is subject to change without notice. The products described in this
document are NOT intended for use in implantation or other life support applications where malfunction may
result in injury or death to persons.
The information contained in this document does not affect or change Fiberxon product specifications or
warranties. Nothing in this document shall operate as an express or implied license or indemnity under the
intellectual property rights of Fiberxon or third parties. All information contained in this document was obtained
in specific environments, and is presented as an illustration. The results obtained in other operating
environment may vary.
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN ”AS IS” BASIS. In no event
will Fiberxon be liable for damages arising directly from any use of the information contained in this document.
Contact
U.S.A. Headquarter:
5201 Great America Parkway, Suite 340
Santa Clara, CA 95054
U. S. A.
Tel: 408-562-6288
Fax: 408-562-6289
Or visit our website: http://www.fiberxon.com
Fiberxon Proprietary and Confidential, Do Not Copy or Distribute
Controlled Electronic Version. 24hrs Obsolete when printed out without authorization.
Page 11 of 11
Last printed 2/26/2007 10:45:00 AM