TCA9509 SCPS225 – JUNE 2011 www.ti.com 2 LEVEL-TRANSLATING I C/SMBUS BUS REPEATER Check for Samples: TCA9509 FEATURES 1 • • • • • • • • • • • • Lockup-Free Operation Accommodates Standard Mode and Fast Mode I2C Devices and Multiple Masters Supports Arbitration and Clock Stretching Across Repeater Powered-Off High-Impedance I2C bus pins Supports 400-kHz Fast I2C Bus operating speeds Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101) VCCA 8 VCCB • • • • Two-Channel Bidirectional Buffer I2C Bus and SMBus Compatible Operating Supply Voltage Range of 0.9 V to 5.5 V on B side Operating Voltage Range of 2.7 V to VCCB - 1V on A Side Voltage-Level Translation From 0.9 V to (VCCB - 1V) and 2.7 V to 5.5 V Active-High Repeater-Enable Input Requires no external pull-up resistors on lower-voltage port-A Open-Drain I2C I/O 5.5-V Tolerant I2C and Enable Input Support Mixed-Mode Signal Operation 1 6 7 SCLB TCA9509 2 6 SDAB SDAA 3 5 EN GND 4 SCLA DESCRIPTION/ORDERING INFORMATION This TCA9509 integrated circuit is an I2C bus/SMBus Repeater for use in I2C/SMBus systems. It can also provide bidirectional voltage-level translation (up-translation/down-translation) between low voltages (down to 1.0 V) and higher voltages (2.7 V to 5.5 V) in mixed-mode applications. This device enables I2C and similar bus systems to be extended, without degradation of performance even during level shifting. The TCA9509 buffers both the serial data (SDA) and the serial clock (SCL) signals on the I2C bus, thus allowing 400-pF bus capacitance on the B-side. This device can also be used to isolate two halves of a bus for voltage and capacitance. The TCA9509 has two types of drivers – A-side drivers and B-side drivers. All inputs and B-side I/O’s are overvoltage tolerant to 5.5V. The A-side I/O’s are overvoltage tolerant to 5.5V when the device is unpowered (VCCB and/or VCCA=0V. ). ORDERING INFORMATION PACKAGES (1) TA –40°C to 85°C (1) (2) RVH - QFN (2) Tape and reel TOP-SIDE MARKING 7k Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TCA9509 SCPS225 – JUNE 2011 www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) The bus port B drivers are compliant with SMBus I/O levels, while the A side uses a current sensing mechanism to detect the input or output LOW signal which prevents bus lock-up. The A side uses a 1 mA current source for pull-up and a 200 Ω pull-down driver. This results in a LOW on the A side accommodating smaller voltage swings. The output pull-down on the A side internal buffer LOW is set for approximately 0.2 V, while the input threshold of the internal buffer is set about 50 mV lower than that of the output voltage LOW. When the A side I/O is driven LOW internally, the LOW is not recognized as a LOW by the input. This prevents a lock-up condition from occurring. The output pull-down on the B side drives a hard LOW and the input level is set at 0.3 of SMBus or I2C-bus voltage level which enables B side to connect to any other I2C-bus devices or buffer. The TCA9509 drivers are not enabled unless VCCA is above 0.8 V and VCCB is above 2.5 V. The enable (EN) pin can also be used to turn the drivers on and off under system control. Caution should be observed to only change the state of the EN pin when the bus is idle. 2 Copyright © 2011, Texas Instruments Incorporated TCA9509 SCPS225 – JUNE 2011 www.ti.com TERMINAL FUNCTIONS NO. NAME DESCRIPTION 1 VCCA A-side supply voltage (1.0V to VCCB - 1V) 2 SCLA Serial clock bus, A side. 3 SDAA Serial data bus, A side. 4 GND Supply ground 5 EN 6 SDAB Serial data bus, B side. Connect to VCCB through a pullup resistor. 7 SCLB Serial clock bus, B side. Connect to VCCB through a pullup resistor. 8 VCCB B-side and device supply voltage (2.7 V to 5.5 V) Active-high repeater enable input Table 1. FUNCTION TABLE INPUT EN FUNCTION L Outputs disabled H SDAA = SDAB SCLA = SCLB Figure 1. FUNCTIONAL BLOCK DIAGRAM VCCA VCCB 1 8 VCCA 1 mA 6 3 SDAA SDAB VCCA 1 mA 7 2 SCLA SCLB 5 EN 4 GND Copyright © 2011, Texas Instruments Incorporated 3 TCA9509 SCPS225 – JUNE 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCCB Supply voltage range –0.5 6 V VCCA Supply voltage range –0.5 6 V VI Enable input voltage range (2) –0.5 6 V VI/O I2C bus voltage range (2) –0.5 6 V IIK Input clamp current VI < 0 –20 IOK Output clamp current VO < 0 –20 Pd Max power dissipation Tstg Storage temperature range (1) (2) –65 mA 100 mW 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. THERMAL IMPEDANCE over operating free-air temperature range (unless otherwise noted) UNIT θJA (1) Package thermal impedance (1) uQFN package 208.99 °C/W UNIT The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS MIN MAX VCCA Supply voltage, A-side bus 1.0 (1) VCCB - 1 V VCCB Supply voltage, B-side bus 2.7 5.5 V SDAA, SCLA 0.7 × VCCA VCCA VIH High-level input voltage SDAB, SCLB 0.7 × VCCB 5.5 EN 0.7 × VCCA 5.5 VIL Low-level input voltage IOL Low-level output current TA Operating free-air temperature (1) 4 SDAA, SCLA –0.5 0.3 SDAB, SCLB –0.5 0.3 × VCCB EN –0.5 0.3 × VCCA SDAA, SCLA SDAB, SCLB –40 V V 10 µA 6 mA 85 °C Low-level supply voltage Copyright © 2011, Texas Instruments Incorporated TCA9509 SCPS225 – JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS VCCB = 2.7 V to 5.5 V, GND = 0 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER VIK TEST CONDITIONS II = –18 mA Input clamp voltage SDAA, SCLA IOL = 10 μA, VILA = VILB = 0 V, VCCA = 0.9 to 1.2V SDAA, SCLA IOL = 20 μA, VILA = VILB = 0 V, 1.2V < VCCA <= (VCCB - 1V) Low-level output voltage VOL VCCB MIN 2.7 V to 5.5 V –1.5 0.18 SDAA, SCLA 2.7 V to 5.5 V VILc SDA and SCL low-level SDAA, SCLA input voltage contention 2.7 V to 5.5 V VOLB Low-level output voltage ICC Quiescent supply current for VCCA ICC Quiescent supply current for VCCB II Input leakage current SDAA, SCLA EN SDAB, SCLB –0.5 V 0.25 0.3 50 –0.5 2.7 V to 5.5 V mV 0.15 V 0.1 0.2 All port A Static high 0.25 0.45 0.9 All port A Static low 1.25 3 5 0.5 0.9 1.1 All port A Static high SDAB, SCLB UNIT V 0.2 Low-level input voltage below low-level output voltage IOL = 6 mA MAX 2.7 V to 5.5 V VOL – VILc SDAB, SCLB TYP 5.5 V VI = VCCB ±1 VI = 0.2 V 10 VI = VCCA VI = 0.2 V ±1 2.7 V to 5.5 V 10 VI = VCCB ±1 VI = 0.2 V –10 10 V mA mA μA IOH High-level output leakage current CIOA I/O capacitance of A-side SCLA, SDAA VI = 0 V 6 6.5 7 pF CIOB I/O capacitance of B-side SCLB, SDAB VI = 0 V 5.5 6 6.2 pF SDAA, SCLA VO = 3.6 V 2.7 V to 5.5 V 10 μA TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) MIN tsu th (1) Setup time, EN high before Start condition (1) Hold time, EN high after Stop condition (1) MAX UNIT 100 ns 100 ns EN should change state only when the global bus and the repeater port are in an idle state. Copyright © 2011, Texas Instruments Incorporated 5 TCA9509 SCPS225 – JUNE 2011 www.ti.com I2C INTERFACE TIMING REQUIREMENTS TA = –40°C to 85°C (unless otherwise noted) PARAMETER Propagation delay tPHL Propagation delay tPLH trise Transition time tfall Transition time tPLH2 Propagation delay 50% of initial low on Port A to 1.5 V on Port B fMAX Maximum switching frequency (1) VCCA (INPUT) VCCB (OUTPUT) 1.9 V 5.0 V TEST CONDITIONS MIN TYP (1) MAX UNIT 123.1 127.2 132. 8 port B to port A 88.1 88.8 89.8 port A to port B 122.6 125.7 131. 7 123.0 124.1 126. 9 40.1 40.9 41.9 57.3 57.5 58.4 14.5 16.4 17.9 18.7 19.4 20.2 176.0 177.3 178. 0 port A to port B 1.9 V EN High 5.0 V EN High port B to port A port A port B port A port B port A to port B 1.9 V 5.0 V EN High 1.9 V 5.0 V EN High 1.9 V 5.0 V 400 ns ns ns ns ns KHz Typical values were measured with VCCA = VCCB = 2.7 V at TA = 25°C, unless otherwise noted. PARAMETER MEASUREMENT INFORMATION VCCI VCCO 1.35 kW DUT IN OUT Input 6 CL PIN CL SCLA, SDAA (A side) 50 pF SDAB, SCLB (B side) 50 pF 1 MW Copyright © 2011, Texas Instruments Incorporated TCA9509 SCPS225 – JUNE 2011 www.ti.com VCC Input 50% 50% 0V Output 70% 30% 70% 30% tf VCC VOL tr A. RT termination resistance should be equal to ZOUT of pulse generators. B. CL includes probe and jig capacitance. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLH and tPHL are the same as tpd. Figure 2. Test Circuit and Voltage Waveforms Copyright © 2011, Texas Instruments Incorporated 7 TCA9509 SCPS225 – JUNE 2011 www.ti.com APPLICATION INFORMATION A typical application is shown in Figure 3. In this example, the system master is running on a 1.1-V I2C bus, and the slave is connected to a 3.3-V bus. Both buses run at 400 kHz. Master devices can be placed on either bus. The TCA9509 is 5-V tolerant, so it does not require any additional circuitry to translate between 0.9-V to 5.5-V bus voltages and 2.7-V to 5.5-V bus voltages. When the B side of the TCA9509 is pulled low by a driver on the I2C bus and the falling edge goes below 0.3 VCCB, it causes the internal driver on the A side to turn on, causing the A side to pull down to about 0.2 V. When the A side of the TCA9509 falls, first a comparator detects the falling edge and causes the internal driver on the B side to turn on and pull the B-side pin down to ground. In order to illustrate what would be seen in a typical application, refer to Figure 4 and Figure 5. If the bus master in Figure 3 were to write to the slave through the TCA9509, waveforms shown in Figure 4 would be observed on the B bus. This looks like a normal I2C bus transmission, except that the high level may be as low as 0.9 V, and the turn on and turn off of the acknowledge signals are slightly delayed. On the A-side bus of the TCA9509, the clock and data lines would have a positive offset from ground equal to the VOL of the TCA9509. After the eighth clock pulse, the data line is pulled to the VOL of the master device, which is very close to ground in this example. At the end of the acknowledge, the level rises only to the low level set by the driver in the TCA9509 for a short delay, while the B-bus side rises above 0.3 VCCB and then continues high. It is important to note that any arbitration or clock stretching events require that the low level on the A-bus side at the input of the TCA9509 (VIL) be at or below 0.15 V to be recognized by the TCA9509 and then transmitted to the B-bus side. 3.3 V 1.1 V VCCA SDA BUS MASTER 400 kHz SCL 1.1 V 10 kW VCCB 10 kW SDAA SDAB SDA SCLA SCLB TCA9509 SCL SLAVE 400 kHz 10 kW EN BUS A BUS B Figure 3. Typical Application 0.5 V/DIV 9th CLOCK PULSE — ACKNOWLEDGE SCL SDA Figure 4. Bus A (0.9-V to 5.5-V Bus) Waveform 8 Copyright © 2011, Texas Instruments Incorporated TCA9509 SCPS225 – JUNE 2011 www.ti.com 9th CLOCK PULSE — ACKNOWLEDGE 2 V/DIV SCL SDA VOL OF TCA9509 VOL OF SLAVE Figure 5. Bus B (2.7-V to 5.5-V Bus) Waveform Copyright © 2011, Texas Instruments Incorporated 9 PACKAGE OPTION ADDENDUM www.ti.com 2-Jul-2011 PACKAGING INFORMATION Orderable Device TCA9509RVHR Status (1) ACTIVE Package Type Package Drawing X2QFN RVH Pins Package Qty 8 5000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jun-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device TCA9509RVHR Package Package Pins Type Drawing X2QFN RVH 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 5000 180.0 8.4 Pack Materials-Page 1 1.8 B0 (mm) K0 (mm) P1 (mm) 1.8 0.5 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jun-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TCA9509RVHR X2QFN RVH 8 5000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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