Connector for CMOS Camera Module SCKA Series Compact size achieved from thin body-forming molding. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM Features ● ● ● ● ● Applications Camera module detaching function. Locking mechanism to prevent the camera module from falling. Shield cover included. Vibration resistant contact structure. Provided with an adsorption area allowing automatic mounting. ● For Memory Stick Micro™ For camera-equipped mobile phones For Memory Stick™ Combine Type For Compact Flash™ Typical Specifications Items Dimensions Structure Specifications 6 6mm module type 7×7×3.1mm Mounting system For Express Card™ Surface mounting type Operating temperature range –25℃ to ＋85℃ Voltage proof Performance For PC cards supporting CardBus For CMOS Camera Module 100V AC 1minute Insulation resistance（Initial） 1,000MΩ min. Contact resistance （Initial） 100mΩ max. Insertion and removal cycles 10cycles Product Line Items Product Minimum packing unit（pcs.） Packing system Product No. Drawing No. Connector 2,000 Taping SCKA2A0100 1 Cover 5,000 ― JSCKA0002A 2 6×6mm module type 61 Connector for CMOS Camera Module SCKA Series Dimensions Unit:mm 6G6mm module type No. Style Connector 1.75 1.85 0.8 For microSD™ Card 3.1 1.8 For SD Memory Card For SIM Card 8pins 6.98 6.15 0.325 For W-SIM 2.6 6.15 6.98 For Memory Stick Micro™ Pitch 0.65 For Memory Stick™ 0.2 1 Combine Type PC board mounting hole dimensions（Viewed from the mounting face side） For Compact Flash™ 6.8 1.4 0.7 For CMOS Camera Module 1.15 6.7 For Express Card™ 2.35 0.42 For PC cards supporting CardBus 0.325 0.45 0.65 2.6 Style Connector/Cover combination diagram（Reference） Cover 7.4 7.4 7.4 7.4 2 62 (3.85) 3.45 CMOS camera module Connector for CMOS Camera Module Soldering Conditions Example of Reflow Soldering Condition（Reference） 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）at soldering portion. 3. Temperature profile For SD Memory Card For microSD™ Card Temperature (˚C ) 250℃(max.) For SIM Card 8pins 220℃ 200 190%10℃ For W-SIM For Memory Stick Micro™ 100 Room temperature Time (s) Pre-heating 90±30 sec. Heating time 55 sec.(max.) sec. For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. When soldering, do not use water soluble flux because this may corrode the product. 3. Regarding the setting of reflow conditions, please confirm them with the actual mass production conditions. 4. As PC board warping may alter characteristics, please take this into consideration when designing pattern and layout. For Express Card™ For CMOS Camera Module 63