AMSCO AS1109-BSOT

A S 11 0 9
D a ta S he e t
C o n s ta n t - C u r r e n t , 8 - B i t L E D D r i v e r w i t h D i a g n o s t i c s
1 General Description
2 Key Features
The AS1109 is designed to drive up to 8 LEDs through a
fast serial interface and features 8 output constant current drivers and an on-chip diagnostic read-back function.
The high clock-frequency (up to 50MHz), adjustable output current, and flexible serial interface makes the
device perfectly suited for high-volume transmission
applications.
!
!
8 Constant-Current Output Channels
Excellent Output Current Accuracy
- Between Channels: ±2%
- Between AS1109 Devices: ±2%
!
Output Current Per Channel: 0.5 to 100mA
!
Controlled In-Rush Current
Output current is adjustable (up to 100mA/channel)
using an external resistor (REXT).
!
Over-Temperature, Open-LED, Shorted-LED
Diagnostics Functions
The serial interface with Schmitt trigger inputs includes
an integrated shift register. Additionally, an internal data
register stores the currently displayed data.
!
Low-Current Test Mode
!
Global Fault Monitoring
The device features integrated diagnostics for overtemperature, open-LED, and shorted-LED conditions.
Integrated registers store global fault status information
during load as well as the detailed temperature/openLED/shorted-LED diagnostics results.
!
Low Shutdown Mode Current: 3µA
!
Fast Serial Interface: up to 50MHz
!
Cascaded Configuration
!
Fast Output Drivers Suitable for PWM
!
16-pin SOIC-150, 16-pin QFN (4x4mm) and 16-pin
SSOP-150 Package
The AS1109 also features a low-current diagnostic
mode to minimize display flicker during fault testing.
With an operating temperature range from -40 to
+125°C the AS1109 is also ideal for industrial applications.
The AS1109 is available in a 16-pin SOIC-150, a 16-pin
QFN (4x4mm) and the 16-pin SSOP-150 package.
Figure 1. Main Diagram and Pin Assignments
3 Applications
The device is ideal for fixed- or slow-rolling displays
using static or multiplexed LED matrix and dimming
functions, large LED matrix displays, mixed LED display
and switch monitoring, displays in elevators, public
transports (underground, trains, buses, taxis, airplanes,
etc.), large displays in stadiums and public areas, price
indicators in retail stores, promotional panels, bar-graph
displays, industrial controller displays, white good panels, emergency light indicators, and traffic signs.
+VLED
16 VDD
GND 1
OUTN0 OUTN1 OUTN2 OUTN3 OUTN4 OUTN5 OUTN6 OUTN7
CLK
LD
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OEN
15 REXT
14 SDO
LD 4
AS1109
SDI
SDI 2
CLK 3
SDO
REXT
GND
Revision 1.18
VDD
OUTN0 5
AS1109
13 OEN
12 OUTN7
OUTN1 6
11 OUTN6
OUTN2 7
10 OUTN5
OUTN3 8
9 OUTN4
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AS1109
Data Sheet
Contents
1 General Description
............................................................................................................................. 1
2 Key Features
........................................................................................................................................ 1
3 Applications
.......................................................................................................................................... 1
4 Pinout
................................................................................................................................................... 3
Pin Assignments
................................................................................................................................................. 3
Pin Descriptions
................................................................................................................................................... 3
5 Absolute Maximum Ratings
................................................................................................................. 4
6 Electrical Characteristics
...................................................................................................................... 5
Switching Characteristics
..................................................................................................................................... 6
7 Typical Operating Characteristics
8 Detailed Description
Serial Interface
........................................................................................................ 7
............................................................................................................................. 8
..................................................................................................................................................... 9
Timing Diagrams
.................................................................................................................................................. 9
Error-Detection Mode
Global Error Mode
........................................................................................................................................ 11
............................................................................................................................................. 11
Error Detection Functions
.................................................................................................................................. 12
Open-LED Detection ..................................................................................................................................... 12
Shorted-LED ................................................................................................................................................. 12
Overtemperature ........................................................................................................................................... 12
Detailed Error Reports
....................................................................................................................................... 13
Detailed Temperature Warning Report .........................................................................................................
Detailed Open-LED Error Report ..................................................................................................................
Detailed Shorted-LED Error Report ..............................................................................................................
Low-Current Diagnostic Mode.......................................................................................................................
Shutdown Mode
................................................................................................................................................. 16
9 Application Information
Error Detection
13
14
15
15
...................................................................................................................... 17
................................................................................................................................................... 17
Error Detection On-The-Fly ........................................................................................................................... 17
Error Detection with Low-Current Diagnosis Mode ....................................................................................... 17
Cascading Devices
Constant Current
............................................................................................................................................ 18
................................................................................................................................................ 19
Adjusting Output Current
................................................................................................................................... 19
Package Power Dissipation
Delayed Outputs
............................................................................................................................... 19
................................................................................................................................................ 19
Switching-Noise Reduction
Load Supply Voltage
................................................................................................................................ 19
.......................................................................................................................................... 19
10 Package Drawings and Markings
11 Ordering Information
.................................................................................................... 21
........................................................................................................................ 25
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AS1109
Data Sheet - P i n o u t
4 Pinout
Pin Assignments
Figure 2. Pin Assignments (Top View)
SDI
16
16 VDD
CLK 3
14 SDO
LD 4
13 OEN
AS1109
OUTN0 5
CLK 1
12 OUTN7
11 OUTN6
OUTN2 7
10 OUTN5
OUTN3 8
9 OUTN4
LD 2
AS1109
11 OEN
OUTN0 3
16-pin QFN
(4x4mm)
10 OUTN7
OUTN1 4
9 OUTN6
5
OUTN2
OUTN1 6
12 SDO
16-pin SSOP-150
16-pin SOIC-150
6
7
8
OUTN5
15 REXT
OUTN4
SDI 2
GND VDD REXT
15
14
13
OUTN3
GND 1
Pin Descriptions
Table 1. Pin Descriptions
Pin Number
Pin Name
Description
16-pin SSOP-150
16-pin SOIC-150
16-pin QFN
(4x4mm)
1
15
GND
Ground
2
16
SDI
Serial Data Input
3
1
CLK
Serial Data Clock. The rising edge of the CLK signal is used to clock
data into and at the falling edge out of the AS1109 shift register. In error
mode, the rising edge of the CLK signal is used to switch error modes.
4
2
LD
5:12
3:10
OUTN0:7
13
11
Serial Data Load. Data is transferred to the data register at the rising
edge of this pin.
Output Current Drivers. These pins are used as LED drivers or for
input sense for diagnostic modes.
OEN
Output Enable. The active-low pin OEN signal can always enable
output drivers to sink current independent of the AS1109 mode.
0 = Output drivers are enabled.
1 = Output drivers are disabled.
14
12
SDO
Serial Data Output. In normal mode SDO is clocked out 8.5 clock cycles
after SDI is clocked in.
In global error detection mode this pin indicates the occurrence of a
global error.
0 = Global error mode returned an error.
1 = No errors.
15
13
REXT
External Resistor Connection. This pin connects through the external
resistor (REXT) to GND, to setup the load current.
16
14
VDD
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Positive Supply Voltage
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AS1109
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
VDD to GND
0
7
V
Input Voltage
-0.4
VDD
+0.4
V
Output Voltage
-0.4
GND Pin Current
Thermal Resistance ΘJA
15
V
1000
mA
83
ºC/W
on PCB, 16-pin SOIC-150 package
113
ºC/W
on PCB, 16-pin SSOP-150 package
32
ºC/W
Operating Temperature Range
-40
+85
ºC
Storage Temperature
-55
150
ºC
Humidity
5
86
%
Electrostatic
Discharge
Digital Outputs
2000
All Other Pins
2000
Latch-Up Immunity
Package Body Temperature
-100 (INOM x 0.5)
Comments
+100 +
INOM
+260
V
on PCB, 16-pin QFN (4x4mm) package
Device fully functional up to 125°C
Non-condensing
Norm: MIL 833 E method 3015
mA
EIA/JESD78
ºC
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD020C “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
* Min/max values are load dependent.
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AS1109
Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
VDD = +3.0 to +5.5V, TAMB = -40 to +85°C (unless otherwise specified).
Typical values measured at VDD = 5V, TAMB = 25°C.
Table 3. Electrical Characteristics
Symbol
Parameter
VDD
Supply Voltage
VDS
Output Voltage
IOUT
IOH
Condition
5.5
V
15.0
V
OUTN0:7, VDD = 5V (see Figure 8)
0.5
100
SDO
-1.0
SDO
1.0
CLK, OEN, LD, SDI
Low Level
IDS(OFF)
VOL
Output Leakage Current
Output
Voltage
VOH
SDO
Unit
0
High Level
Input Voltage
Max
3.0
IOL
VIL
Typ
OUTN0:7
Output Current
VIH
Min
mA
0.7 x
VDD
VDD +
0.3
-0.3
0.3 x
VDD
OEN = 1, VDS = 15.0V
0.5
IOL = +1.0mA
0.4
IOH = -1.0mA
V
µA
V
VDD 0.4V
IAV(LC1)
Device-to-Device Average Output
Current from OUTN0 to OUTN7
VDS = 0.5V, VDD = Const.,
REXT = 744Ω
24.5 25.26
26
mA
ΔIAV(LC1)
Current Skew
(Between Channels)
VDS ≥ 0.5V, VDD = Const.,
REXT = 744Ω
±0.9
±3
%
IAV(LC2)
Device-to-Device Average Output
Current from OUTN0 to OUTN7
VDS = 0.6V, VDD > 3.3V,
REXT = 372Ω
49.50 50.52 51.55
mA
ΔIAV(LC2)
Current Skew
(Between Channels)
VDS ≥ 0.6V, VDD = Const.,
REXT = 372Ω
±0.8
±2
%
IAV(LC3)
Device-to-Device Average Output
Current from OUTN0 to OUTN7
VDS = 0.8V, VDD = 5.0V,
REXT = 186Ω
101
104
mA
ΔIAV(LC3)
Current Skew
(Between Channels)
VDS ≥ 0.8V, VDD = Const.,
REXT = 186Ω
±0.5
±2
%
ILC
Low-Current Diagnosis Mode
VDS = 0.8V, VDD = 5.0V
0.6
0.8
mA
IPD
Power Down Supply Current
VDS = 0.8V, VDD = 5.0V,
REXT = 372Ω, OUTN0:7 = On
3
20
µA
%/ΔVDS
Output Current vs.
Output Voltage Regulation
VDS within 1.0 and 3.0V
±0.1
%/V
%/ΔVDD
Output Current vs.
Supply Voltage Regulation
VDD within 3.0 and 5.0V
±1
%/V
RIN(UP)
Pullup Resistance
OEN
250
500
800
kΩ
RIN(DOWN)
Pulldown Resistance
LD
250
500
800
kΩ
*
Open Error Detection Threshold
Voltage
No load
0.25
0.35
0.45
V
*
Short Error Detection Threshold
Voltage
VDD = 3.0V, no load
1.2
1.3
1.4
VDD = 5.0V, no load
2.0
2.2
2.4
VTHL
VTHH
TOV1
Overtemperature Threshold Flag
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98
0.4
150
Revision 1.18
V
ºC
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AS1109
Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s
Table 3. Electrical Characteristics (Continued)
Symbol
Parameter
Condition
IDD(OFF)0
IDD(OFF)1
Off
IDD(OFF)2
IDD(OFF)3
Supply
Current
IDD(ON)1
IDD(ON)2
On
IDD(ON)3
Min
Typ
Max
REXT = Open‚ OUTN0:7 = Off
1.3
2
REXT = 744Ω‚ OUTN0:7 = Off
3.0
3.68
REXT = 372Ω‚ OUTN0:7 = Off
4.7
5.37
REXT = 186Ω, OUTN0:7 = Off
8.1
8.73
REXT = 744Ω‚ OUTN0:7 = On
4.5
5
REXT = 372Ω‚ OUTN0:7 = On
7.5
8
REXT = 186Ω‚ OUTN0:7 = On
13.7
15
Unit
mA
Switching Characteristics
VDD = 3.0 to 5.5V, VDS = 0.8V, VIH = VDD, VIL = GND, REXT = 372Ω, VLOAD = 4.0V, RLOAD = 64Ω, CLOAD = 10pF; guaranteed by design.
Table 4. Switching Characteristics
Symbol
tP1
tP2
tP3
tP4
tW(CLK)
tW(L)
tW(OE)
tR
Parameter
Propagation Delay Time
Propagation Delay Time (Without
Staggered Output Delay)
Conditions
CLK - SDO
LD - OUTNn
OEN - OUTNn
Min
CLK
LD
OEN (@IOUT < 60mA)
15
15
200
Typ
5
100
100
Propagation Delay Time
Pulse Width
Max
10
200
200
10
Unit
ns
ns
ns
*
Maximum CLK Rise Time
500
ns
*
Maximum CLK Fall Time
500
ns
100
100
200
300
20
40
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tF
tOR
tOF
tSU(D)
tH(D)
tSU(L)
tH(L)
tTESTING
tSTAG
tSU(OE)
tGSW(ERROR)
tSU(ERROR)
tP(I/O)
tSW(ERROR)
fCLK
tP3,ON
Output Rise Time of VOUT (Turn Off)
Output Fall Time of VOUT (Turn On)
Setup Time for SDI
Hold Time for SDI
Setup Time for LD
Hold Time for LD
Minimum OEN Time for Error Detection
Staggered Output Delay
Output Enable Setup Time
Global Error Switching Setup Time
Global Error Detection Setup Time
Propagation Delay Global Error Flag
Switching Time Global Error Flag
Maximum Clock Frequency
(Cascade Operation)
tTP3,OFF
Low-Current Test Mode
Propagation Delay Time
tREXT2,1
External Resistor Reaction Time
tREXT2,1
External Resistor Reaction Time
5
5
5
5
2000
20
10
10
5
10
30
Turn ON
Turn OFF
Change from REXT1 = 372Ω,
IOUT1 = 50.52mA to REXT2 =
37.2kΩ, IOUT2 < 1mA
Change from REXT1 = 37.2kΩ,
IOUT1 = 0.5mA to REXT2 =
372Ω, IOUT2 > 25mA
50
MHz
3
0.05
5
0.1
µs
µs
0.5
1
µs
0.5
1
µs
*
If multiple AS1109 devices are cascaded and tr or tf is large, it may be critical to achieve the timing required for data
transfer between two cascaded LED drivers.
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Revision 1.18
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AS1109
Data Sheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
Figure 3. Output Current vs. REXT,
VDD = 5V; VOUT = 0.8V, TAMB = 25°C
Figure 4. Relative Output Current Error vs. VDD,
[email protected] = 5V - 1, TAMB = 25°C
2
Relative Output Current Error (%)
.
100
IOUT (mA) .
1.5
1
0.5
10
REXT = 744Ω;
VDS = 0.5V
0
-0.5
REXT = 186Ω;
VDS = 0.8V
REXT = 372Ω;
VDS = 0.6V
-1
-1.5
1
100
1000
REXT (Ohm)
3
3.5
5
5.5
160
120
100
REXT = 127Ω
140
REXT = 127Ω
REXT = 150Ω
120
REXT = 150Ω
REXT = 186Ω
80
REXT = 251Ω
60
IOUT (mA) .
140
REXT = 372Ω
40
20
REXT = 744Ω
0
100
REXT = 186Ω
80
REXT = 251Ω
60
40
REXT = 372Ω
20
REXT = 744Ω
0
0
2
4
6
8
10
12
14
0
0.2
0.4
VDS (V)
0.6
0.8
1
1.2
1.4
VDS (V)
Figure 7. Relative IOUT Error vs. Temperature
VDD = 5V, [email protected]°C - 1, TAMB = 25°C
Figure 8. Output Current vs. VDD
1
Relative Output Current Error (%)
.
4.5
Figure 6. Output Current vs. VDS;
VDD = 5V, TAMB = 25°C
160
160
VDS = 1V
140
REXT = 372Ω;
VDS = 0.6V
IOUT (mA) .
0.5
0
4
VDD (V)
Figure 5. Output Current vs. VDS;
VDD = 5V, TAMB = 25°C
IOUT (mA) .
-2
10000
REXT = 186Ω;
VDS = 0.8V
REXT = 744Ω;
VDS = 0.5V
-0.5
120
VDS = 0.9V
100
VDS = 0.8V
80
VDS = 0.7V
60
VDS = 0.6V
40
20
-1
-50
VDS = 0.5V
0
-25
0
25
50
75
100
3
Temperature (°C)
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3.5
4
4.5
5
5.5
VDD (V)
Revision 1.18
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
8 Detailed Description
The AS1109 is designed to drive up to 8 LEDs through a fast serial interface and 8 constant-current output drivers. Furthermore, the AS1109 provides diagnostics for detecting open- or shorted-LEDs, as well as over-temperature conditions for LED display systems, especially LED traffic sign applications.
The AS1109 contains an 8-bit shift register and an 8-bit data register, which convert serial input data into parallel output
format. At AS1109 output stages, eight regulated current sinks are designed to provide uniform and constant current
with excellent matching between ports for driving LEDs within a wide range of forward voltage variations. External output current is adjustable from 0.5 to 100mA using an external resistor for flexibility in controlling the brightness intensity
of LEDs. The AS1109 guarantees to endure 15V maximum at the outputs.
The serial interface is capable of operating at a minimum of 30 MHz, satisfying the requirements of high-volume data
transmission.
Using a multiplexed input/output technique, the AS1109 adds additional functionality to pins SDO, LD and OEN. These
pins provide highly useful functions (open- and shorted-LED detection, over-temperature detection), thus reducing pin
count. Over-temperature detection will work on-the-run, whereas the open- and shorted-LED detection can be used
on-the-run or in low-current diagnostic mode (see page 15).
Figure 9. Block Diagram
+VLED
OUTN0
OUTN1
OUTN2
OUTN3
Temperature
Detection
REXT
OUTN4
OUTN5
8-Bit Open
Detection &
Error Register
OUTN6
8-Bit Short
Detection &
Error Register
OUTN7
AS1109
Current
Generators
OEN
LD
8-Bit Data
Register
CLK
Detailed
Error
Detection
Global
Error
Detection
8-Bit Shift
Register
SDI
Control Logic
SDO
Indicates 8 Bit Path
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Revision 1.18
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Serial Interface
Data accesses are made serially via pins SDI and SDO. At each CLK rising edge, the signal present at pin SDI is
shifted into the first bit of the internal shift register and the other bits are shifted ahead of the first bit. The MSB is the
first bit to be clocked in. In error-detection mode the shift register will latch-in the corresponding error data of temperature-, open-, and short-error register with each falling edge of LD.
The 8-bit data register will latch the data of the shift register at each rising edge of LD. This data is then used to drive
the current generator output drivers to switch on the corresponding LEDs as OEN goes low.
Timing Diagrams
This section contains timing diagrams referenced in other sections of this data sheet.
Figure 10. Normal Mode Timing Diagram
tW(CLK)
50%
CLK
tSU(D)
SDI
50%
50%
50%
tH(D)
50%
SDO
50%
tP1
tW(L)
LD
50%
50%
tSU(L)
OEN
tH(L)
OEN Low = Output Enabled
OUTNx
OUTNx High = Output Off
50%
OUTNx Low = Output On
tP2
Figure 11. Output Delay Timing Diagram
tW(OE)
OEN
50%
50%
tP3
tP3
90%
90%
OUTN0
50%
tOR
tOF
tSTAG
tSTAG
50%
OUTN1
50%
7XtSTAG
50%
OUTN7
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50%
10%
10%
Revision 1.18
7XtSTAG
50%
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Figure 12. Data Input Timing Diagram
OEN
tW(OE)
tSU(L
LD
8 CLK Pulses
tSU(OE)
tW(L)
CLK
tSU(D)
Data Bit
7
SDI0
Data Bit
6
Data Bit
5
Data Bit
4
Data Bit
3
Data Bit
2
Data Bit
1
Data Bit
0
Don’t Care
tH(D)
Old Data Old Data Old Data Old Data Old Data Old Data Old Data Old Data
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SDO0
Don’t Care
tP1
Figure 13. Data Input Example Timing Diagram
Time = 0
1
2
3
4
5
6
7
D6
D5
D4
D3
D2
D1
D0
CLK
SDI
D7
LD
OEN
OUTN0
Off
On
OUTN1
Off
On
OUTN2
Off
On
OUTN3
Off
On
OUTN4
Off
On
OUTN5
Off
On
OUTN6
Off
On
OUTN7
Off
On
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Figure 14. Switching Global Error Mode Timing Diagram
OEN
tTESTING
tGSW(ERROR)
LD
tGSW(ERROR)
tSU(ERROR)
tP(I/O)
tP(I/O)
tP(I/O)
tGSW(ERROR)
CLK
TFLAG(IN)
SDI
Don’t
Care
SDO
Acquisition of
Error Status
tP4
OFLAG(IN)
TFLAG
Don’t
Care
OFLAG
tSW(ERROR)
SFLAG(IN)
Don’t
Care
SFLAG
tSW(ERROR)
Error-Detection Mode
Acquisition of the error status occurs at the rising edge of OEN. Error-detection mode is started on the rising edge of
LD when OEN is high. The CLK signal must be low when entering error detection mode. Error detection for open- and
shorted-LEDs can only be performed for LEDs that are switched on during test time. To switch between error-detection
modes clock pulses are needed (see Table 5).
Note: To test all LEDs, a test pattern that turns on all LEDs must be input to the AS1109.
Global Error Mode
Global error mode is entered when error-detection mode is started. Clock pulses during this period are used to select
between temperature, open-LED, and shorted-LED tests, as well as low-current diagnostic mode and shutdown mode
(see Table 5). In global error mode, an error flag (TFLAG, OFLAG, SFLAG) is delivered to pin SDO if any errors are
encountered.
Table 5. Global Error Mode Selections
Clock
Pulses Output Port
Error-Detection Mode
0
Don't Care
Over-Temperature
Detection
1
Enabled
Open-LED Detection
2
Enabled
Shorted-LED Detection
3
Don't Care
Low-Current Diagnostic
Mode
4
Don't Care
Shutdown Mode
Global Error Flag/Shutdown Condition
TFLAG = SDO = 1: No over-temperature warning.
TFLAG = SDO = 0: Over-temperature warning.
OFLAG = SDO = 1: No open-LED error.
OFLAG = SDO = 0: Open-LED error.
SFLAG = SDO = 1: No shorted-LED error.
SFLAG = SDO = 0: Shorted-LED error.
SDI = 1: Wakeup
SDI = 0: Shutdown
Note: For a valid result SDI must be 1 for the first device.
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Revision 1.18
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
If there are multiple AS1109s in a chain, the error flag will be gated through all devices. To get a valid result at the end
of the chain, a logic 1 must be applied to the SDI input of the first device of the chain. If one device produces an error
this error will show up after n*tP(I/O) + tSW(ERROR) at pin SDO of the last device in the chain. This means it is not possible to identify which device in the chain produced the error. Therefore, if a global error occurs, the detailed error report
can be run to identify which AS1109, or LED produced the error.
Note: When no error has occurred, the detailed error report can be skipped, setting LD and subsequently OEN low.
Error Detection Functions
Open-LED Detection
The AS1109 open-LED detection is based on the comparison between VDS and VTHL. The open LED status is aquired
at the rising edge of OEN and stored internally. While detecting open-LEDs the output port must be turned on. Open
LED detection can be started with 1 clock pulse during error detection mode while the output port is turned on.
Note: LEDs which are turned off at test time cannot be tested.
Table 6. Open LED Detection Modes
Output Port State
On
On
Effective Output
Point Conditions
VDS < VTHL
VDS > VTHL
Detected Open-LED
Error Status Code
0
1
Meaning
Open Circuit
Normal
Shorted-LED
The AS1109 shorted-LED detection is based on the comparison between VDS and VTHH. The shortened LED status is
aquired at the rising edge of OEN and stored internally. While detecting shorted-LEDs the output port must be turned
on. Shorted-LED detection can be started with 2 clock pulses during error detection mode while the output port is
turned on.
For valid results, the voltage at OUTN0:OUTN7 must be lower then VTHH under low-current diagnostic mode operating
conditions. This can be achieved by reducing the VLED voltage or by adding additional diodes, resistors or LED’s.
Note: LEDs which are turned off at test time cannot be tested.
Table 7. Shorted LED Detection Modes
Output Port State
On
On
Effective Output
Point Conditions
VDS > VTHH
VDS < VTHH
Detected Shorted-LED
Error Status Code
0
1
Meaning
Short Circuit
Normal
Overtemperature
Thermal protection for the AS1109 is provided by continuously monitoring the device’s core temperature. The overtemperature status is aquired at the rising edge of OEN and stored internally.
Table 8. Overtemperature Modes
Output Port State
Effective Output
Point Conditions
Detected Overtemperature
Status Code
Meaning
Don’t Care
Temperature > TOV1
0
Don’t Care
Temperature < TOV1
1
Overtemperature
Condition
Normal
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Revision 1.18
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Detailed Error Reports
The detailed error report can be read out after global error mode has been run. On the falling edge of LD, the detailed
error report of the selected test is latched into the shift register and can be clocked out with n*8 clock cycles (n is the
number of AS1109s in a chain) via pin SDO. At the same time new data can be written into the shift register, which will
load on the next rising edge of pin LD. This data will show at the output drivers, at the falling edge of OEN.
Detailed Temperature Warning Report
The detailed temperature warning report can be read out immediately after global error mode has been run. Bit0 of the
8bit data word represents the temperature flag of the chip.
Figure 15. Detailed Temperature Warning Report Timing Diagram
Global Flag Readout
Detailed Error Report Readout
OEN
tH(L)
tGSW(ERROR)
LD
t(SU)ERROR
tP4
CLK
DBit7
SDI
DBit6
DBit5
DBit4
DBit3
DBit2
DBit1
DBit0
Don’t
Care
New Data Input
SDO
TFLAG
Undefined
tP4
For detailed timing information see Timing Diagrams on page 9.
TBit0
Temperature Error Report Output
Don’t
Care
tP1
Detailed Temperature Warning Report Example
Consider a case where five AS1109s are cascaded in one chain. The detailed error report lists the temperatures for
each device in the chain:
IC1:[70°] IC2:[85°] IC3:[66°] IC4:[160°] IC5:[76°]
In this case, IC4 is overheated and will generate a global error, and therefore 5*8 clock cycles are needed to write out
the detailed temperature warning report, and optionally read in new data. The detailed temperature warning report
would look like this:
XXXXXXX1 XXXXXXX1 XXXXXXX1 XXXXXXX0 XXXXXXX1
The 0 in the detailed temperature warning report indicates that IC4 is the device with the over-temperature condition.
Note: In an actual report there are no spaces in the output.
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Detailed Open-LED Error Report
The detailed open-LED error report can be read out immediately after global error mode has been run.
Figure 16. Detailed Open-LED Error Report Timing Diagram
Global Flag Readout
Detailed Error Report Readout
OEN
tTESTING
LD
tH(L)
tSU(ERROR)
tGSW(ERROR)
tP4
tGSW(ERROR)
CLK
SDI
SDO
Acquisition of
Error Status
tGSW(ERROR)
DBit7
tSW(ERROR)
DBit6
DBit5
DBit4
DBit3
DBit2
DBit1
Don’t
Care
DBit0
New Data Input
TFlag
OFlag
OBit7
tP4
OBit6
OBit5
OBit4
OBit3
OBit2
OBit1
OBit0
Open Error Report Output
Don’t
Care
tP1
For detailed timing information see Timing Diagrams on page 9.
Detailed Open-LED Error Report Example
Consider a case where five AS1109s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off,
and an X indicates an open LED. The open-LED test is only applied to LEDs that are turned on. This test is used with
a test pattern where all LEDs are on at test time.
IC1:[11111111] IC2:[111XX111] IC3:[11111111] IC4:[1X111111] IC5:[11111111]
IC2 has two open LEDs and IC4 has one open LED switched on due to input. 5*8 clock cycles are needed to write the
entire error code out. The detailed error report would look like this:
Input Data: 1 1 1 1 1 1 1 1
11111111
11111111
11111111
11111111
LED Status: 1 1 1 1 1 1 1 1
1 1 1 XX1 1 1
11111111
1 X1 1 1 1 1 1
11111111
Failure Code: 1 1 1 1 1 1 1 1
11100111
11111111
10111111
11111111
Comparing this report with the input data indicates that IC2 is the device with two open LEDs at position 4 and 5 and
IC4 with an open LED at second position. For such a test it is recommended to enter low-current diagnostic mode first
(see Low-Current Diagnostic Mode on page 15) to reduce onscreen flickering.
Note: In an actual report there are no spaces in the output.
LEDs turned off during test time cannot be tested.
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Detailed Shorted-LED Error Report
The detailed shorted-LED error report can be read out immediately after global error mode has been run (see Global
Error Mode on page 11).
Figure 17. Detailed Shorted-LED Error Report Timing Diagram
Global Flag Readout
Detailed Error Report Readout
OEN
tTESTING
LD
tSU(ERROR)
tH(L)
tGSW(ERROR)
tP4
tGSW(ERROR)
CLK
SDI
SDO
Acquisition of
Error Status
tGSW(ERROR)
DBit7
DBit6
DBit5
tSW(ERROR)
TTFLAG
FLAG OFLAG
DBit4
DBit3
DBit2
DBit1
Don’t
Care
DBit0
New Data Input
SFLAG
SBit7
SBit6
SBit5
SBit4
SBit3
SBit2
SBit1
Shorted-LED Error Report Output
tP4
SBit0
Don’t
Care
tP1
For detailed timing information see Timing Diagrams on page 9.
Detailed Shorted-LED Error Report Example
Consider a case where five AS1109s are cascaded in one chain. A 1 indicates a LED is on, a 0 indicates a LED is off,
and an X indicates a shorted LED. This test is used with a test pattern where all LEDs are on at test time. Additionally,
this test should be run after starting low-current diagnostic mode (see Low-Current Diagnostic Mode on page 15).
IC1:[11111XX1] IC2:[11111111] IC3:[11111111] IC4:[111X1111] IC5:[11111111]
IC2 has two shorted LEDs and IC4 has one shorted LED switched on due to input. 5*8 clock cycles are needed to write
the entire error code out. The detailed error report would look like this:
Input Data: 1 1 1 1 1 1 1 1
11111111
11111111
11111111
11111111
LED Status: 1 1 1 1 1 X X 1
11111111
11111111
1 1 1 X1 1 1 1
11111111
Failure Code: 1 1 1 1 1 0 0 1
11111111
11111111
11101111
11111111
Showing IC1 as the device with two shorted LEDs at position 6 and 7, and IC4 with one shorted LED at position 4.
Note: In an actual report there are no spaces in the output. LEDs turned off during test time cannot be tested.
Low-Current Diagnostic Mode
To run the open- or shorted-LED test, a test pattern must be used that will turn on each LED to be tested. This test pattern will cause a short flicker on the screen while the test is being performed. The low-current diagnostic mode can be
initiated prior to running a detailed error report to reduce this on-screen flickering.
Note: Normally, displays using such a diagnosis mode require additional cables, resistors, and other components to
reduce the current. The AS1109 has this current-reduction capability built-in, thereby minimizing the number of
external components required.
Low-current diagnostic mode can be initiated via 3 clock pulses during error-detection mode. After the falling edge of
LD, a test pattern displaying all 1s can be written to the shift register which will be used for the next error-detection test.
On the next falling edge of OEN, current is reduced to ILC. With the next rising edge of OEN the current will immediately increase to normal levels and the detailed error report can be read out entering error-detection mode.
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Revision 1.18
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AS1109
Data Sheet - D e t a i l e d D e s c r i p t i o n
Figure 18. Switching into Low-Current Diagnostic Mode Timing Diagram
2µs Low-Current
Diagnosis Mode
Global Flag Readout
Load Internal all 1s
Test Pattern
(optional)
OEN
LD
tSU(ERROR)
tH(L)
tGSW(ERROR)
tP4
tTESTING
tH(L)
CLK
tGSW(ERROR)
tGSW(ERROR)
tSW(ERROR)
SDI
SDO
Re-entering Error
Detection Mode
TFLAG OFLAG SFLAG
Don’t
Care
tP1
For detailed timing information see Timing Diagrams on page 9.
Normal Operation Current
Shutdown Mode
The AS1109 features a shutdown mode which can be entered via 4 clock pulses during error-detection mode. To
enable the shutdown mode a 0 must be placed at SDI after the rising edge of the 3rd clock pulse.
To disable shutdown mode a 1 must be placed at SDI after the 3rd clock pulse. The shutdown/wakeup information will
be latched through if multiple AS1109 devices are in a chain. At the rising edge of the 4th clock pulse the shutdown bit
will be read out and the AS1109 will shutdown or wakeup.
Note: In shutdown mode the supply current drops down to typically 3µA.
Figure 19. Shutdown Mode Timing Diagram
OEN
LD
tSU(ERROR)
CLK
1 = Wakeup
SDI
0 = Shutdown
1 = Wakeup
SDO
TFLAG
OFLAG
SFLAG
tP4
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0 = Shutdown
tSU(D)
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AS1109
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
9 Application Information
Error Detection
The AS1109 features two types of error detection. The error detection can be used on-the-fly, for active LEDs, without
any delay, or by entering into low-current diagnosis mode.
Error Detection On-The-Fly
Error detection on-the-fly will output the status of active LEDs during operation. Without choosing an error mode this
will output the temperature flag at every input/output cycle. Triggering one clock pulse for open or two clock pulses for
short detection during error detection mode outputs the detailed open- or short-error report with the next input/output
cycle (see Figure 20). LEDs that are turned off cannot be tested and their digits at the error output must be ignored.
Figure 20. Normal Operation with Error Detection During Operation – 128 Cascaded AS1109s
Display
SDI
SDO
CLK
OEN
Data1
Data2
Data2
Data3
Data4
Data3
T/O or S Error Code
Data0
T/O or S Error Code
Data1
GEF
Clock for Error
Mode 0x/1x/2x
T/O or S Error Code
Data2
GEF
Clock for Error
Mode 0x/1x/2x
1024x
1024x
1024x
Rising Edge of OEN
Acquisition of Error Status
Rising Edge of OEN
Acquisition of Error Status
Falling Edge of LD; Error Register is
copied into Shift Register
LD
Falling Edge of LD; Error Register is
copied into Shift Register
≤ 100mA
Current
GEF = Global Error Flag
Error Detection with Low-Current Diagnosis Mode
This unique feature of the AS1109 uses an internal all 1s test pattern for a flicker free diagnosis of all LEDs. This error
detection mode can be started anytime, and does not require any SDI input (see Figure 21).
Figure 21. Low-Current Diagnosis Mode with Internal All 1s Test Pattern – 128 Cascaded AS1109s
2µs Low-Current Diagnosis Mode
Display
Data0
Data1
SDI
Data1
SDO
O or S Error Code of
All 1s Test Patern
GEF
3x Clocks LowCurrent Mode
Data2
GEF
Temperature Error Code
Clock for Error
Mode 1x/2x
1024x
CLK
1024x
Rising Edge of OEN
Acquisition of Error Status
OEN
Falling Edge of LD; Error Register
is copied into Shift Register
LD
Load Internal All 1s Test Pattern
Current
≤ 100mA
≤ 100mA
≤ 0.8mA
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GEF = Global Error Flag
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AS1109
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
Low-current diagnosis mode is started with 3 clock pulses during error detection mode. After the three pulses of CLK,
a pulse of LD loads the internal all 1s test pattern. Then OEN should be enabled for 2µs for testing. With the rising
edge of OEN the test of the LEDs is stopped and while LD is high the desired error mode can be selected with the corresponding clock pulses.
With the next data input the detailed error code will be clocked out at SDO.
Note: See Figure 22 for the use of an external test pattern.
Figure 22. Low-Current Diagnosis Mode with External Test Pattern – 128 Cascaded AS1109s
2µs Low-Current Diagnosis Mode
Display
SDI
SDO
Data1
Data2
Data2
External all 1s Test Pattern
T/O or S Error Code
Data0
CLK
O or S Error Code
from Test Pattern
GEF
3x Clocks
Low-Current
Mode
Data3
GEF
Temperature Error Code
Clock for Error
Mode 1x/2x
1024x
1024x
1024x
Rising Edge of OEN
Acquisition of Error Status
OEN
Falling Edge of LD; Error Register
is copied into Shift Register
LD
Current
≤ 100mA
≤ 100mA
≤ 0.8mA
GEF = Global Error Flag
Cascading Devices
To cascade multiple AS1109 devices, pin SDO must be connected to pin SDI of the next AS1109 (see Figure 23). At
each rising edge of CLK the LSB of the shift register will be written into the shift register SDI of the next AS1109 in the
chain. Data at the SDI pin is clocked in at the rising edge of the CLK pulse and is clocked out at the SDO pin 8.5 clock
cycles later at the falling edge of the CLK pulse.
Note: When n*AS1109 devices are in one chain, n*8 clock pulses are needed to latch-in the input data.
Figure 23. Cascading AS1109 Devices
SDI
SDI
AS1109 #1
CLK
LD
SDO
OEN
SDI
AS1109 #2
CLK
LD
SDO
OEN
SDI
AS1109 #n-1
CLK
LD
SDO
OEN
CLK
LD
OEN
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AS1109
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
Constant Current
In LED display applications, the AS1109 provides virtually no current variations from channel-to-channel and from
AS1109-to-AS1109. This is mostly due to 2 factors:
!
While IOUT ≥ 50mA, the maximum current skew is less than ±2% between channels and less than ±2% between
AS1109 devices.
!
In the saturation region, the characteristics curve of the output stage is flat (see Figure 5 on page 7). Thus, the output current can be kept constant regardless of the variations of LED forward voltages (VF).
Adjusting Output Current
The AS1109 scales up the reference current (IREF) set by external resistor (REXT) to sink a current (IOUT) at each output port. As shown in Figure 3 on page 7 the output current in the saturation region is extremely flat so that it is possible to define it as target current (IOUT TARGET). IOUT TARGET can be calculated by:
VREXT = 1.253V
IREF = VREXT/REXT (if the other end of REXT is connected to ground)
IOUT TARGET = IREF*15 = (1.253V/REXT)*15
(EQ 1)
(EQ 2)
(EQ 3)
Where:
REXT is the resistance of the external resistor connected to pin REXT.
VREXT is the voltage on pin REXT.
The magnitude of current (as a function of REXT) is around 100mA at 186Ω, 50.52mA at 372Ω and 25.26mA at 744Ω.
Figure 3 on page 7 shows the relationship curve between the IOUT TARGET of each channel and the corresponding
external resistor (REXT).
Package Power Dissipation
The maximum allowable package power dissipation (PD) is determined as:
PD(MAX) = (TJ-TAMB)/RTH(J-A)
When 8 output channels are turned on simultaneously, the actual package power dissipation is:
PD(ACT) = (IDD*VDD) + (IOUT*Duty*VDS*8)
(EQ 4)
(EQ 5)
Therefore, to keep PD(ACT) ≤ PD(MAX), the allowable maximum output current as a function of duty cycle is:
IOUT = {[(TJ-TAMB)/RTH(J-A)]-(IDD*VDD)}/VDS/Duty/8
(EQ 6)
Where:
TJ = 150ºC
Delayed Outputs
The AS1109 has graduated delay circuits between outputs. These delay circuits can be found between OUTNn and
constant current block.
The fixed delay time is 20 ns (typ) where OUTN0 has no delay, OUTN1 has 20ns delay, OUTN2 has 40ns delay ...
OUTN7 has 140ns delay. This delay prevents large inrush currents, which reduce power supply bypass capacitor
requirements when the outputs turn on (see Figure 12 on page 10)
Switching-Noise Reduction
LED drivers are frequently used in switch-mode applications which normally exhibit switching noise due to parasitic
inductance on the PCB.
Load Supply Voltage
Considering the package power dissipation limits (see EQ 4:6), the AS1109 should be operated within the range of
VDS = 0.4 to 1.0V.
For example, if VLED is higher than 5V, VDS may be so high that PD(ACT) > PD(MAX) where VDS = VLED - VF. In this case,
the lowest possible supply voltage or a voltage reducer (VDROP) should be used. The voltage reducer allows
VDS = (VLED -VF) - VDROP.
Note: Resistors or zener diodes can be used as a voltage reducer as shown in Figure 24.
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Revision 1.18
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AS1109
Data Sheet - A p p l i c a t i o n I n f o r m a t i o n
Figure 24. Voltage Reducer using Resistor (Left) and Zener Diode (Right)
Voltage Supply
Voltage Supply
}
VLED
VDROP
VDROP
{
VF
VF
VLED
VDS
VDS
AS1109
AS1109
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AS1109
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
10 Package Drawings and Markings
The device is available in an 16-pin SOIC-150 package.
Figure 25. 16-pin SOIC-150 Package
Notes:
1. Lead coplanarity should be 0 to 0.10mm (.004”) max.
2. Package surfacing:
a. Top: matte (charmilles #18- 30).
b. All sides: matte (charmilles #18- 30).
c. Bottom: smooth or matte (charmilles #18- 30).
3. All dimensions excluding mold flashes and end flash from the
package body shall not exceed 0.25mm (.010”) per side (D).
4. Detail of pin #1 identifier are optional but must be located
within the zone indicated.
5. Dimensions are in millimeters.
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Revision 1.18
Symbol
A1
B
C
D
E
e
H
h
L
A
α
ZD
A2
Min
Max
0.10
0.25
0.36
0.46
0.19
0.25
9.80
9.98
3.81
3.99
1.27 BSC
5.80
6.20
0.25
0.50
0.41
1.27
1.52
1.72
0º
8º
0.51 REF
1.37
1.57
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AS1109
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Figure 26. 16-pin SSOP-150 Package
Symbol
A
A1
A2
b
C
D
E
E1
e
h
L
θ
ZD
N
Min
Max
1.35
1.75
0.10
0.25
1.37
1.57
0.20
0.30
0.19
0.25
4.80
4.98
5.79
6.20
3.81
3.99
0.635 BSC
0.22
0.49
0.40
1.27
0º
8º
0.230 REF
16 pins
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Notes:
1. Lead coplanarity should be 0 to 0.10mm (.004”) max.
2. Package surfacing:
a. Top: matte (charmilles #18- 30).
b. All sides: matte (charmilles #18- 30).
c. Bottom: smooth or matte (charmilles #18- 30).
3. All dimensions excluding mold flashes and end flash from the
package body shall not exceed 0.25mm (.010”) per side (D).
4. Dimensions “b” does not include dambar protrusion/intrusion
but solder coverage.
5. Dimensions are in millimeters.
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AS1109
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Figure 27. 16-pin QFN 4x4mm Packages
D2
-A-
D
D2/2
D/2
Index Area
(D/2 xE/2)
-B-
-B-
aaa C 2x
E
See
Detail B
E2
E2/2
e
E/2
NXL
4
2
1
Pin 1
Marker
aaa C 2x
4
SEE
Detail B
NXb
-A-
N N-1
6
Index Area
(D/2 xE/2)
5
bbb
ddd
C A B
C
Bottom View
Top View
0.08 C
NX
Seating
Plane
Side View
A1
11
Datum A or B
16-pin QFN 4x4mm
Dimensions
Datum A
or B
Nom
Max
Notes
aaa
0.15
bbb
0.10
12
1, 2
ccc
0.10
1, 2
ddd
0.05
b
0.25
e
12
1, 2
0.35
1, 2
0.65
A
0.70
A1
0.00
A3
0.30
1, 2
L1
Min
L1
Symbol
-C-
A3
9
A
ccc C
8
e
0.75
e/2
0.02
0.80
0.05
L1 Even Terminal
0.03 Side
1, 2
Detail
B
1,
2, 10
4.00
Odd Terminal Side
1, 2, 10
D2
2.00
2.15
2.25
1, 2, 10
E2
2.00
2.15
2.25
1, 2, 10
L
0.45
0.55
0.65
1, 2, 10
N
16
1, 2, 10
ND
4
1, 2, 10
NE
4
1, 2, 10
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Terminal Tip
5
0.15
4.00
E BSC
e
5
1, 2
0.20
REF
D BSC
1, 2
Terminal
1, 2 Tip
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AS1109
Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s
Notes:
1.
2.
3.
4.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
All dimensions are in millimeters; angles in degrees.
N is the total number of terminals.
The terminal #1 identifier and terminal numbering convention shall conform to JEDEC 95 SPP-012. Details of terminal #1 identifier are optional but must be located within the zone indicated. The terminal #1 identifier may be either
a mold or marked feature.
5. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip. If one end
of the terminal has the optional radius, the b dimension should not be measured in that radius area.
6. Dimensions ND and NE refer to the number of terminals on each D and E side, respectively.
7. Depopulation is possible in a symmetrical fashion.
8. Figure 27 is shown for illustration only and does not represent any specific variation.
9. All variations may be constructed per Figure 27, however variations may alternately be constructed between square
or rectangle shape per dimensions D and E.
10. Refer to the Dimensions Table for a complete set of dimensions.
11. Bilateral coplanarity zone applies to the exposed heat sink slug as well as the terminals.
12. Depending on the method of lead termination at the edge of the package, pullback (L1) may be present. L minus
L1 to be ≥ 0.33mm.
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AS1109
Data Sheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The device is available as the standard products shown in Table 9.
Table 9. Ordering Information
Type
Description
Delivery Form
Package
AS1109-BSOU
AS1109-BSOT
Constant-Current, 8-Bit LED Driver with Diagnostics
Tubes
16-pin SOIC-150
Constant-Current, 8-Bit LED Driver with Diagnostics
Tape and Reel
AS1109-BSSU
16-pin SOIC-150
Constant-Current, 8-Bit LED Driver with Diagnostics
Tubes
16-pin SSOP-150
AS1109-BSST
Constant-Current, 8-Bit LED Driver with Diagnostics
Tape and Reel
16-pin SSOP-150
AS1109-BQFR
Constant-Current, 8-Bit LED Driver with Diagnostics
Tray
16-pin QFN (4x4mm)
AS1109-BQFT
Constant-Current, 8-Bit LED Driver with Diagnostics
Tape and Reel
16-pin QFN (4x4mm)
All devices are RoHS compliant and free of halogene substances.
www.austriamicrosystems.com
Revision 1.18
25 - 26
AS1109
Data Sheet
Copyrights
Copyright © 1997-2009, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe.
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
Disclaimer
Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding
the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or lifesustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for
each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard
production flow, such as test flow or test location.
The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
austriamicrosystems AG rendering of technical or other services.
Contact Information
Headquarters
austriamicrosystems AG
A-8141 Schloss Premstaetten, Austria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.austriamicrosystems.com/contact-us
www.austriamicrosystems.com
Revision 1.18
26 - 26