AUSTIN AS5C2568

SRAM
AS5C2568
Austin Semiconductor, Inc.
32K x 8 SRAM
PIN ASSIGNMENT
(Top View)
SRAM MEMORY ARRAY
28-PIN PSOJ (DJ)
FEATURES
•
•
•
•
•
•
•
•
•
Access Times: 12, 15, & 20ns
Fast output enable (tDOE) for cache applications
Low active power: 400 mW (TYP)
Low power standby
Fully static operation, no clock or refresh required
High-performance, low-power CMOS double-metal process
Single +5V (+10%) Power Supply
Easy memory expansion with CE\
All inputs and outputs are TTL compatible
OPTIONS
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
MARKING
• Timing
12ns access*
15ns access
20ns access
-12
-15
-20
• Package(s)**
Plastic SOJ
DJ
• Operating Temperature Ranges
Military -55oC to +125oC
Industrial -40oC to +85oC
XT
IT
28 VCC
27 WE\
26 A13
25 A8
24 A9
23 A11
22 OE\
21 A10
20 CE\
19 I/O7
18 I/O6
17 I/O5
16 I/O4
15 I/O3
No. 906
GENERAL DESCRIPTION
* -12 available in IT only.
** For ceramic version of this product, see the MT5C2568
data sheet.
The Austin Semiconductor SRAM family employs
high-speed, low power CMOS designs using a four-transistor
memory cell. These SRAMs are fabricated using double-layer
metal, double-layer polysilicon technology.
For flexibility in high-speed memory applications, Austin Semiconductor offers chip enable (CE\) and output enable
(OE\) capability. These enhancements can place the outputs in
High-Z for additional flexibility in system design.
Writing to these devices is accomplished when write
enable (WE\) and CE\ inputs are both LOW. Reading is accomplished when WE\ remains HIGH and CE\ and OE\ go LOW.
The device offers a reduced power standby mode when disabled. This allows system designs to achieve low standby
power requirements.
All devices operate from a single +5V power supply
and all inputs and outputs are fully TTL compatible.
For more products and information
please visit our web site at
www.austinsemiconductor.com
AS5C2568
Rev. 2.6 06/05
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Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1
SRAM
AS5C2568
Austin Semiconductor, Inc.
FUNCTIONAL BLOCK DIAGRAM
A0
Vcc
256 x 1024
MEMORY ARRAY
DECODER
GND
A14
I/O0
I/O
DATA
CIRCUIT
COLUMN I/O
I/O7
9A128-1
CE\
CONTROL
CIRCUIT
OE\
WE\
TRUTH TABLE
MODE
STANDBY
READ
READ
WRITE
AS5C2568
Rev. 2.6 06/05
OE\
X
L
H
X
CE\
H
L
L
L
WE\
X
H
H
L
DQ
HIGH-Z
Q
HIGH-Z
D
POWER
STANDBY
ACTIVE
ACTIVE
ACTIVE
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
2
SRAM
AS5C2568
Austin Semiconductor, Inc.
*Stresses greater than those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the
operation section of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods
may affect reliability.
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Input or DQ Relative
to Vss..................................................................-0.5V to Vcc +0.5V
Voltage on Vcc Supply Relative to Vss.......................-1V to +7V
Storage Temperature..............................................-65oC to +150oC
Power Dissipation.......................................................................1W
Short Circuit Output Current............................................20mA
Lead Temperature (soldering 10 seconds)........................+260oC
Max. Junction Temperature.................................................+175oC
ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS
(-55oC < TC < 125oC or -40oC to +85oC; VCC = 5.0V +10%)
DESCRIPTION
Input High (Logic 1) Voltage
CONDITIONS
SYM
Input Low (Logic 0) Voltage
VIH
MIN
2.2
VCC+0.5
VIL
-0.5
0V<VIN<VCC
ILI
-10
Output(s) disabled
0V<VOUT<VCC
ILo
-10
Output High Voltage
IOH = -4.0mA
VOH
2.4
Output Low Voltage
IOL = 8.0mA
VOL
Input Leakage Current
Output Leakage Current
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V
1
0.8
V
1,2
10
µA
10
µA
0.4
V
1
V
1
( ' ) *+
, ) *+ ) -
UNITS NOTES
( ' ) *+
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MAX
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CAPACITANCE
PARAMETER
Input Capacitance
Output Capacitance
AS5C2568
Rev. 2.6 06/05
CONDITIONS
o
TA = 25 C, f = 1MHz
Vcc = 5V
SYM
MAX
UNITS
NOTES
CIN
11
pF
4
CIO
11
pF
4
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
3
SRAM
AS5C2568
Austin Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS
(Note 5) (-55oC < TC < 125oC or -40oC to +85oC; VCC = 5.0V +10%)
DESCRIPTION
SYM
-12
MIN
MAX
-15
MIN MAX
-20
MIN
MAX
UNITS NOTES
READ CYCLE
READ cycle time
tRC
12
15
Address access time
tAA
12
15
20
ns
Chip enable access time
tACE
12
15
20
ns
Output hold from address change
tOH
2
2
2
ns
Chip enable to output in Low-Z
tLZCE
2
2
2
ns
7
Chip disable to output in High-Z
tHZCE
ns
6, 7
ns
4
4
7
0
20
8
0
ns
9
0
Chip enable to power-up time
tPU
Chip disable to power-down time
tPD
12
15
20
ns
Output enable to access time
tAOE
6
7
8
ns
Output enable to output in Low-Z
tLZOE
Output disable to output in High-Z
tHZOE
0
0
6
0
7
ns
8
ns
6
WRITE CYCLE
WRITE cycle time
tWC
12
15
20
ns
Chip enable to end of write
tCW
9
10
12
ns
Address valid to end of write
tAW
9
10
12
ns
Address setup time
tAS
0
0
0
ns
Address hold from end of write
tAH
0
0
0
ns
WRITE pulse width
tWP
10
12
15
ns
Data setup time
tDS
7
8
10
ns
Data hold time
tDH
0
0
0
ns
Write disable to output in Low-Z
tLZWE
2
2
2
ns
7
Write enable to output in High-Z
tHZWE
0
ns
6, 7
AS5C2568
Rev. 2.6 06/05
7
0
7
0
9
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
4
SRAM
AS5C2568
Austin Semiconductor, Inc.
+5V
AC TEST CONDITIONS
Input pulse levels....................................................Vss to 3V
Input rise and fall times.....................................................5ns
Input timing reference level.............................................1.5V
Output reference level......................................................1.5V
Output load.................................................See figures 1 & 2
480
4.
5.
6.
480
Q
30 pF
255
Q
All voltages referenced to VSS (GND).
-3V for pulse width < 20ns
ICC is dependent on output loading and cycle rates. The
specified value applies with the outputs unloaded, and
f=
1
Hz.
t
RC (MIN)
This parameter is guaranteed but not tested.
Test conditions as specified with the output loading as
shown in Fig. 1 unless otherwise noted.
t
HZCE, tHZOE and tHZWE are specified with CL = 5pF
as in Fig. 2. Transition is measured ±500mV typical from
steady state voltage, allowing for actual tester RC time
constant.
5 pF
255
Fig. 2
OUTPUT LOAD
EQUIVALENT
Fig. 1
OUTPUT LOAD
EQUIVALENT
NOTES
1.
2.
3.
+5V
7.
At any given temperature and voltage condition, tHZCE
is less than tLZCE, and tHZWE is less than tLZWE.
8. WE\ is HIGH for READ cycle.
9. Device is continuously selected. Chip enables and
output enables are held in their active state.
10. Address valid prior to, or coincident with, latest
occurring chip enable.
11. tRC = Read Cycle Time.
12. Chip enable (CE\) and write enable (WE\) can initiate and
terminate a WRITE cycle.
DATA RETENTION ELECTRICAL CHARACTERISTICS (L Version Only)
DESCRIPTION
CONDITIONS
VCC for Retention Data
SYM
VDR
MIN
2
MAX
UNITS
V
NOTES
1
mA
--
ns
4
ns
4, 11
CE\ > (VCC-0.2V)
Data Retention Current
VIN > (VCC-0.2V)
or < 0.2V
Chip Deselect to Data
Retention Time
Operation Recovery Time
ICCDR
tCDR
0
tR
tRC
LOW Vcc DATA RETENTION WAVEFORM
DATA RETENTION MODE
VCC
4.5V
VDR > 2V
t
t
CDR
CE\
VIH
VIL
123
12345678
12
12345678
12
123
12345678
12
123
12345678
12
123
4.5V
R
V DR
12345678
1234
123
12345678
1234
123
12345678
1234
123
12345678
1234
123
123
123
123
123 DON’T CARE
1234
1234
1234
1234UNDEFINED
AS5C2568
Rev. 2.6 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
5
SRAM
AS5C2568
Austin Semiconductor, Inc.
READ CYCLE NO. 1
8, 9
tRC
VALID
ADDRESS
tAA
tOH
DQ
PREVIOUS DATA VALID
DATA VALID
READ CYCLE NO. 2
7, 8, 10, 12
tRC
CE\
tAOE
tHZOE
tLZOE
OE\
tLZCE
tACE
tHZCE
DATA VALID
DQ
tPU
tPD
Icc
123
123 DON’T CARE
123
1234
1234
1234
1234 UNDEFINED
AS5C2568
Rev. 2.6 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
6
SRAM
AS5C2568
Austin Semiconductor, Inc.
WRITE CYCLE NO. 1 12
(Chip Enabled Controlled)
tWC
ADDRESS
tAW
tAH
tAS
tCW
CE\
tWP1
WE\
tDS
tDH
DATA VAILD
D
Q
HIGH Z
WRITE CYCLE NO. 2 7, 12
(Write Enabled Controlled)
tWC
ADDRESS
tAW
tAH
tCW
CE\
tAS
tWP1
WE\
tDH
D
DATA VALID
HIGH-Z
Q
123
123
123DON’T CARE
1234
1234
1234
1234 UNDEFINED
NOTE: Output enable (OE\) is inactive (HIGH).
AS5C2568
Rev. 2.6 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
7
SRAM
AS5C2568
Austin Semiconductor, Inc.
MECHANICAL DEFINITIONS*
ASI Case #906 (Package Designator DJ)
E
E1
A
A1
R
E2
D
L
e
SYMBOL
A
A1
A2
B
b
C
D
E
E1
E2
e
b
ASI SPECIFICATIONS
MIN
MAX
0.128
0.148
0.025
--0.082
--0.015
0.020
0.026
0.032
0.007
0.013
0.820
0.830
0.435
0.445
0.395
0.405
0.370 BSC
0.050 BSC
* All measurements are in inches.
AS5C2568
Rev. 2.6 06/05
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
8
SRAM
Austin Semiconductor, Inc.
AS5C2568
ORDERING INFORMATION
EXAMPLE: AS5C2568DJ-15/IT
Device Number
AS5C2568
AS5C2568
AS5C2568
Package
Speed ns Process
Type
DJ
-12
/*
DJ
-15
/*
DJ
-20
/*
*AVAILABLE PROCESSES
IT = Industrial Temperature Range
XT = Extended Temperature Range
883C = Full Military Processing
12ns offered in IT only
AS5C2568
Rev. 2.6 06/05
-40oC to +85oC
-55oC to +125oC
-55oC to +125oC
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
9