STAR STAR STAR Surface Mount Tape-and-Reel Specification Literature Number: SNOSBW3A STAR TM Surface Mount Tape-and-Reel Specification December 1992 General Description Tape-and-Reel is a new method for shipment of surface mount devices. This approach simplifies the handling of semiconductors for automated circuit board assembly systems. A Tape-and-Reel holds hundreds-to-thousands of surface mount devices (as compared with less than 100 devices in a rail), so that pick-and-place machines have to be reloaded less frequently. This savings in labor will further reduce manufacturing costs for automated circuit board assembly. Features Y Y Y Y Y Y Y Conductive PVC material redeuces static charge buildup Fully meets proposed EIA standard RS-481A (taping of surface-mounted components for automatic placing) Y Fully compatible with National’s surface mount package types Variable code density code 39 bar code label for Automated Inventory Management availability Mechanical samples of surface mount packages available in Tape-and-Reel for automated assembly process development Single Tape-and-Reel holds hundreds-to-thousands of surface mount semiconductors for additional labor savings Conductive cover Tape-and-Reel availability Reels individually packed Tape-and-Reel Diagram TL/HH/8352 – 1 STARTM is a trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/HH/8352 RRD-B30M115/Printed in U. S. A. STAR Surface Mount Tape-and-Reel Specification PRELIMINARY Tape-and-Reel Overview TAPE FORMAT AND DEVICE ORIENTATION TL/HH/8352 – 2 Page Small Outline Transistor Small Outline IC (SO-IC) Page SOT-23 (High Profile) 3 SOT-23 (Low Profile) 3 PLCC-28 12 SO-8 (Narrow) 4 PLCC-44 13 Plastic Chip Carrier IC (PLCC-IC) PLCC-20 11 SO-14 (Narrow) 5 PLCC-68 14 SO-14 (Wide) 6 PLCC-84 15 SO-16 (Narrow) 7 SO-16 (Wide) 8 SO-20 (Wide) 9 SO-24 (Wide) 10 MATERIALS # Cavity Tape: Conductive PVC (less than 105 X/Sq) # Cover Tape: Polyester 1. Conductive Cover available # Reel: 1. Solid 80 pt. Fibreboard (standard) 2. Conductive Fibreboard available 3. Conductive Plastic (PVC) available LABEL Human and machine readable label is provided on reel. A variable (C.P.I.) density code 39 is available. NSC STD Label (7.6 C.P.I.). Example: Field Lot Number Date Code Revision Level National Part No. I.D. Quantity Fields are separated by at least one blank space. Future Tape-and-Reel packs will also include a smaller-size bar code label (high-density code 39) at the beginning of the TL/HH/8352 – 3 tape. (This tape label is not available on current production.) National Semiconductor will also offer additional labels containing information per your specific specification. 2 SOT-23 (High Profile), SOT-23 (Low Profile) TAPE FORMAT Tape Section Leader (Start End) Direction of u Feed Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed ² *2500 (High) Filled Sealed ² *3000 (Low) Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed *These quantities represent 7× Reel Quantity availability. ² 10,000 For 13× Reel. TAPE DIMENSIONS TL/HH/8352 – 4 REEL DIMENSIONS TL/HH/8352 – 5 3 SO-8 (Narrow) TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 2500 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 6 REEL DIMENSIONS TL/HH/8352 – 7 4 SO-14 (Narrow) TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 2500 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 8 REEL DIMENSIONS TL/HH/8352 – 9 5 SO-14 (Wide) TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 1000 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 10 REEL DIMENSIONS TL/HH/8352 – 11 6 SO-16 (Narrow) TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 2500 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 12 REEL DIMENSIONS TL/HH/8352 – 13 7 SO-16 (Wide) TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 1000 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 14 REEL DIMENSIONS TL/HH/8352 – 15 8 SO-20 (Wide) TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 1000 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 16 REEL DIMENSIONS TL/HH/8352 – 17 9 SO-24 (Wide) TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 1000 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 18 REEL DIMENSIONS TL/HH/8352 – 19 10 PLCC-20 TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 1000 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 20 REEL DIMENSIONS TL/HH/8352 – 21 11 PLCC-28 TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 750 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 22 REEL DIMENSIONS TL/HH/8352 – 23 12 PLCC-44 Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status Unsealed 5 (min) Empty 5 (min) Empty Sealed 500 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 24 REEL DIMENSIONS TL/HH/8352 – 25 13 PLCC-68 TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 250 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 26 REEL DIMENSIONS TL/HH/8352 – 27 14 PLCC-84 TAPE FORMAT Tape Section Direction of u Feed Leader (Start End) Carrier Trailer (Hub End) Ý Cavities Cavity Status Cover Tape Status 5 (min) Empty Unsealed 5 (min) Empty Sealed 250 Filled Sealed 2 (min) Empty Sealed 2 (min) Empty Unsealed TAPE DIMENSIONS TL/HH/8352 – 28 REEL DIMENSIONS TL/HH/8352 – 29 15 ApplicationÐTotal System Saving TL/HH/8352 – 32 Automated manufacturers can improve their cost savings by using Tape-and-Reel for surface mount devices. Simplified handling results because hundreds-to-thousands of semiconductors are carried on a single Tape-and-Reel pack (see the ‘‘Ordering Information’’ section for the exact quantities). With this higher device count per reel (when compared with less than 100 devices per rail), pick-and-place machines have to be re-loaded less frequently and lower labor costs result. With Tape-and-Reel, manufacturers save twiceÐonce from using surface mount technology for automated PC board assembly and again from less device handling during shipment and machine set-up. Cost pressures today are forcing many electronics manufacturers to automate their production lines. Surface mount technology plays a key role in this cost-savings trend because: 1. The mounting of devices on the PC board surface eliminates the expense of drilling holes; 2. The use of pick-and-place machines to assemble the PC boards greatly reduces labor costs; 3. The lighter and more compact assembled products resulting from the smaller dimensions of surface mount packages mean lower material costs. Production processes now permit both surface mount and insertion mount components to be assembled on the same PC board. 16 Ordering Information mount packages). Specifying the Tape-and-Reel method of shipment (Note 1) means that you will receive your devices in the following quantities per Tape-and-Reel pack: When you order a surface mount semiconductor, it will be in one of the 15 available surface mount package types (see Appendix II for the physical dimensions of the surface Device Quantity Small Outline Transistor Small Outline IC Plastic Chip Carrier IC SOT-23 (High Profile) (Note 2) 10000 2500* SOT-23 (Low Profile) (Note 2) 10000 3000* SO-8 (Narrow) 2500 SO-14 (Narrow) 2500 SO-14 (Wide) 1000 SO-16 (Narrow) 2500 SO-16 (Wide) 1000 SO-20 (Wide) 1000 SO-24 (Wide) 1000 PLCC-20 1000 PLCC-28 750 PLCC-44 500 PLCC-68 250 PLCC-84 250 *This denotes 7× reel quantity availability. Note 1: For small outline transistors, your order will automatically be shipped in Tape-and-Reel unless you indicate otherwise. For surface mount integrated circuits, your order will automatically be shipped in conductive rails unless you indicate ‘‘Tape-and-Reel’’ after the device description on your purchase order. Note 2: Your SOT-23 devices will automatically have Option 1 orientation unless you indicate ‘‘Option 2 Orientation’’ after the device description on your purchase order (see ‘‘Tape-and-Reel Overview’’ for definition of SOT-23 orientations). In addition, your SOT-23 devices will automatically have the high-profile outline unless you indicate ‘‘Low-Profile Outline’’ after the device description on your purchase order (see ‘‘Appendix IIÐPhysical Dimensions of Surface Mount Package’’ for definition of SOT-23 outlines). Example: You order 5,000 LM324M ICs shipped in Tapeand-Reel. # All 5,000 devices have the same date code # You receive 2 SO-14 (Narrow) Tape-and-Reel packs, each having 2500 LM324M ICs 17 Appendix IÐShort-Form Procurement Specification TAPE FORMAT x Direction of Feed Trailer (Hub End) Empty Cavities, min (Unsealed Cover Tape) Carrier Empty Cavities, min (Sealed Cover Tape) Filled Cavities (Sealed Cover Tape) Leader (Start End) Empty Cavities, min Sealed Cover Tape) Empty Cavities, min (Unsealed Cover Tape) SMALL OUTLINE TRANSISTOR SOT-23 (High Profile) 2 2 10000 2500* 5 5 SOT-23 (Low Profile) 2 2 10000 3000* 5 5 SO-8 (Narrow) 2 2 2500 5 5 SO-14 (Narrow) 2 2 2500 5 5 SO-14 (Wide) 2 2 1000 5 5 SO-16 (Narrow) 2 2 2500 5 5 SO-16 (Wide) 2 2 1000 5 5 SO-20 (Wide) 2 2 1000 5 5 SO-24 (Wide) 2 2 1000 5 5 SMALL OUTLINE IC PLASTIC CHIP CARRIER IC PLCC-20 2 2 1000 5 5 PLCC-28 2 2 750 5 5 PLCC-44 2 2 500 5 5 PLCC-68 2 2 250 5 5 PLCC-84 2 2 250 5 5 *This denotes 7× reel quantity availability. 18 Appendix IÐShort-Form Procurement Specification (Continued) TAPE DIMENSIONS (24 Millimeter Tape or Less) TL/HH/8352 – 33 W P F E P2 P0 D T A0 B0 K0 D1 R SMALL OUTLINE TRANSISTOR SOT-23 8 g .30 4.0 g .10 3.5 g .05 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 3.15 g .05 2.55 g .05 1.20 g .05 1.05 g .05 25 (High Profile) SOT-23 8 g .30 4.0 g .10 3.5 g .05 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 3.15 g .05 2.55 g .05 1.20 g .05 1.05 g .05 25 (Low Profile) SMALL OUTLINE IC SO-8 (Narrow) 12 g .30 8.0 g .10 5.5 g .05 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 6.4 g .10 5.2 g .10 2.1 g .10 1.55 g .05 30 SO-14 (Narrow) 16 g .30 8.0 g .10 7.5 g .10 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 6.5 g .10 9.0 g .10 2.1 g .10 1.55 g .05 40 SO-14 (Wide) 16 g .30 12.0 g .10 7.5 g .10 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 10.9 g .10 9.5 g .10 3.0 g .10 1.55 g .05 40 SO-16 (Narrow) 16 g .30 8.0 g .10 7.5 g .10 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 6.5 g .10 10.3 g .10 2.1 g .10 1.55 g .05 40 SO-16 (Wide) 16 g .30 12.0 g .10 5.5 g .10 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 10.9 g .10 10.76 g .10 3.0 g .10 1.55 g .05 40 SO-20 (Wide) 24 g .30 12.0 g .10 11.5 g .10 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 10.9 g .10 13.3 g .10 3.0 g .10 2.05 g .05 50 SO-24 (Wide) 24 g .30 12.0 g .10 11.5 g .10 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 10.9 g .10 15.85 g .10 3.0 g .10 2.05 g .05 50 PLASTIC CHIP CARRIER IC PLCC-20 16 g .30 12.0 g .10 7.5 g .10 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 9.3 g .10 PLCC-28 24 g .30 16.0 g .10 11.5 g .10 1.75 g .10 2.0 g .05 4.0 g .10 1.55 g .05 .30 g .10 13.0 g .10 13.0 g .10 4.9 g .10 2.05 g .05 50 Note 1: A0, B0 and K0 dimensions are measured 0.3 mm above the inside wall of the cavity bottom. Note 2: Tape with components shall pass around a mandril radius R without damage. Note 3: Cavity tape material shall be PVC conductive (less than 105 X/Sq). Note 4: Cover tape material shall be polyester (30–65 grams peel-back force). Note 5: D1 Dimension is centered within cavity. Note 6: All dimensions are in millimeters. 19 9.3 g .10 4.9 g .10 1.55 g .05 40 Appendix IÐShort-Form Procurement Specification (Continued) TAPE DIMENSIONS (32 Millimeter Tape or Greater) TL/HH/8352 – 34 W P F2 E P2 P0 D T A0 B0 K0 D1 R PLASTIC CHIP CARRIER IC PLCC-44 32 g .3 24.0 g .1 14.25 g .1 1.75 g .1 2.0 g .05 4.0 g .1 1.55 g .05 .30 g .1 18.0 g .1 18.0 g .1 5.0 g .1 2.05 g .05 50 PLCC-68 44.3 g .3 32.0 g .1 20.25 g .1 1.75 g .1 2.0 g .05 4.0 g .1 1.55 g .05 .30 g .1 25.6 g .1 25.6 g .1 5.0 g .1 2.05 g .05 50 PLCC-84 44.3 g .3 36.0 g .1 20.25 g .1 1.75 g .1 2.0 g .05 4.0 g .1 1.55 g .05 .30 g .1 30.7 g .1 30.7 g .1 5.0 g .1 2.05 g .05 50 Note 1: A0, B0 and K0 dimensions are measured 0.3 mm above the inside wall of the cavity bottom. Note 2: Tape with components shall pass around a mandril radius R without damage. Note 3: Cavity tape material shall be PVC conductive (less than 105 X/Sq). Note 4: Cover tape material shall be polyester (30–65 grams peel-back force). Note 5: D1 Dimension is centered within cavity. Note 6: All dimensions are in millimeters. 20 Appendix IÐShort-Form Procurement Specification (Continued) REEL DIMENSIONS TL/HH/8352 – 35 8 mm Tape SOT-23 (High Profile) SOT-23 (Low Profile) A (Max) B (Min) C D (Min) N (Min) G T (Max) (13.00) (330) 0.059 1.5 0.512 g 0.002 13 g 0.05 0.795 20.2 1.969 50 0.331b0.000 a 1.5 8.4b (13.00) (330) 0.059 1.5 0.512 g 0.002 13 g 0.05 0.795 20.2 1.969 50 0.488b0.000 a2 12.4b a 0.059 0 a 0.078 12 mm Tape SO-8 (Narrow) 16 mm Tape SO-14 (Narrow) SO-14 (Wide) SO-16 (Narrow) SO-16 (Wide) PLCC-20 (13.00) (330) 0.059 1.5 0.512 g 0.002 13 g 0.05 0.795 20.2 1.969 50 0.646b0.000 a2 16.4b SO-20 (Wide) SO-24 (Wide) PLCC-28 (13.00) (330) 0.059 1.5 0.512 g 0.002 13 g 0.05 0.795 20.2 1.969 50 0.960b0.000 a2 24.4b (13.00) (330) 0.059 1.5 0.512 g 0.002 13 g 0.05 0.795 20.2 1.969 50 1.276b0.000 a2 32.4b (13.00) (330) 0.059 1.5 0.512 g 0.002 13 g 0.05 0.795 20.2 1.969 50 24 mm Tape 32 mm Tape 44 mm Tape PLCC-44 PLCC-68 PLCC-84 Units: Inches Millimeters Material: Paperboard (Non-Flaking) 21 0 a 0.078 0 a 0.078 0 a 0.078 0 a 0.078 1.748b0.000 a2 44.4b 0 0.567 14.4 0.724 18.4 0.882 22.4 1.197 30.4 1.512 38.4 1.984 50.4 Appendix IIÐPhysical Dimensions of Surface Mount Packages SOT-23 (High Profile) (Generally used for Top-of-Board Mounting) SOT-23 (Low Profile) (Generally used for Underside-of-Board Mounting) 22 Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) SO-8 (Narrow) SO-14 (Narrow) 23 Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) SO-14 (Wide) SO-16 (Narrow) 24 Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) SO-16 (Wide) SO-20 (Wide) 25 Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) SO-24 (Wide) PLCC-20 26 Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) PLCC-28 PLCC-44 27 STAR Surface Mount Tape-and-Reel Specification Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued) PLCC-68 PLCC-84 Lit. 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