CLARE MX887DHTTR

MX887D
μPower Hall-Effect Switch
Features
Description
μPower Operation (15 μW typical at 25°C)
Omnipolar (switches with N or S pole)
2.5V to 5.5V Operation
Simple Digital Open-Drain Output
Ultra Low Offset Canceling Amplifiers Provide
Sensitive, Accurate, Stable Switching Points and
Immunity to Mechanical Stress
• Solid State Reliability
• Operating Temperature Range: -40°C to +85°C
• RoHS Compliant TSOT-23 3-Lead Package
The MX887D integrated Hall-Effect switch targets the
requirements of low-power portable devices with
battery operating voltages from 2.5V to 5.5V. On-chip
power management circuitry reduces the effective
average current to just 5μA at VSUPPLY = 3VDC .
•
•
•
•
•
The switch output will turn “on” when either a north or
south magnetic pole is applied. The absence of a
magnetic field will set the switch into the
high-impedance “off” state. Emulating the behavior of
a traditional reed switch, together with the advantages
of high integration and solid state reliability, makes the
MX887D an ideal replacement in low-power portable
device applications.
Applications
•
•
•
•
•
Handheld Portable Devices
White Goods
Automotive - Body Systems
Security Systems
High Reliability Reed Switch Replacement
Pb
RoHS
2002/95/EC
Ordering Information
e3
Part
Description
MX887DHTTR
TSOT-23 3L Tape & Reel (3000/Reel)
Figure 1. Functional Block Diagram
VSUPPLY
1
Offset Cancellation
Output 2
Output
Latch
Hall
Sensor
Switch
Power Management Logic
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DS-MX887D - August 10, 2009
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MX887D
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Magnetic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
3
4
4
2. Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
August 10, 2009
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5
6
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MX887D
1 Specifications
1.1 Package Pinout
1.2 Pin Description
3
1
Pin#
Name
1
VSUPPLY
2
OUT
3
2
Description
2.5V to 5.5V
Open-Drain, N-Channel FET
GROUND Ground
1.3 Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Units
Supply Voltage
VSUPPLY
-0.5
6
VDC
Output Voltage
VOUT
-0.5
6
V
B
-
Unlimited
G
IOUT
-
5
mA
TJ
-
150
TA
-40
85
TSTG
-40
150
Magnetic Flux Density
Output Current
Junction Temperature
Operating Ambient Temperature
Storage Temperature
°C
Absolute maximum electrical ratings are at 25°C.
Absolute maximum ratings are stress ratings.
Stresses in excess of these ratings can cause
permanent damage to the device. Functional
operation of the device at conditions beyond those
indicated in the operational sections of this data sheet
is not implied.
1.4 Electrical Characteristics
Over operating voltage and temperature range unless otherwise specified.
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Units
Operating
VSUPPLY
2.5
-
5.5
VDC
VOUT=5.5V, BRPN < B < BRPS
ILKG
-
-
1
μA
IOUT=1mA, VDD=3.0V
VOUT
-
100
300
mV
Awake Time
-
-
-
-
90
μs
Period
-
-
-
-
90
ms
-
-
-
0.1
-
%
-
-
2
mA
-
-
8
μA
-
5
15
μA
Supply Voltage Range
Output Leakage Current
Output On Voltage
Duty Cycle
Supply Current
Awake (enabled)
Asleep (disabled)
ISUPPLY
Average (Calculated)
Notes:
1. BOPX = operating point (output turns ON); BRPX = release point (output turns OFF).
2. Typical data is at 25°C and VSUPPLY = 3V.
August 10, 2009
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MX887D
1.5 ESD Rating
ESD Rating (Human Body Model)
2000V
1.6 Magnetic Characteristics
Over operating voltage and temperature range unless otherwise specified.
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Due to North Pole Applied
North Pole to Branded Side
BOPN
-60
-
-
Due to South Pole Applied
South Pole to Branded Side
BOPS
-
-
60
Due to North Pole Applied
North Pole to Branded Side
BRPN
-
-
-6
Due to South Pole Applied
South Pole to Branded Side
BRPS
6
-
-
| BOPX - BRPX |
BHYS
-
5
-
Units
Operating Points
G
Release Points
Hysteresis
Notes:
G
G
1. As used here, negative flux densities are defined as less than zero (algebraic convention); -50G<+10G.
2. BOPX = operating point (output turns ON); BRPX = release point (output turns OFF).
3. Typical data is at 25°C and VSUPPLY = 3V.
2 Circuit Description
The MX887D μPower Hall-Effect Switch consists of a
Hall element, small signal amplifier, latch, and
N-channel open-drain output. Offset cancellation
circuitry rejects errors in signal stages and the
influence of mechanical stress on the Hall element.
This technique, together with a precision threshold
generator and comparator, produces highly accurate
magnetic switch points. The Hall element is activated
for a small fraction of an operating cycle, then latched
in that sample state for the remainder of the period. By
using this technique, very low power consumption is
achieved.
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MX887D
3 Manufacturing Information
3.1 Mechanical Dimensions
3.1.1 TSOT23 3-Lead Package
Recommended PCB Land Pattern
0º / 8º
2.80 / 3.00
(0.110 / 0.118)
0.10 MIN
(0.004 MIN)
3
2.60 / 3.00
(0.102 / 0.118)
1
0.00 / 0.10
(0.000 / 0.004)
1.05
(0.041)
0.10 / 0.25
(0.004 / 0.010)
0.60 REF
(0.0236 REF)
0.25 BSC
(0.0098 BSC)
5º NOM
7º NOM
0.95 BSC
(0.037 BSC)
0.60
(0.024)
0.95
(0.037)
GAUGE PLANE
0.70 / 0.80
(0.028 / 0.031)
2.70
(0.106)
2
0.35 / 0.51
(0.014 / 0.020)
0.75 / 0.90
(0.030 / 0.035)
0.37 / 0.47
(0.015 / 0.019)
1.50 / 1.70
(0.059 / 0.067)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
1.90 BSC
(0.0748 BSC)
Notes: (Unless otherwise specified)
1. Dimension “D” does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm
(0.004 inches) per side.
2. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side.
3. Package top may be smaller than package bottom. Dimensions “D” and “E1” are determined at the outermost extreme of the plastic body
excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body.
3.1.2 Tape & Reel Packaging
178 DIA.
(7.01 DIA.)
0.25 ± 0.05
(0.001 ± 0.002)
ø1.5, +0.1, -0
(ø0.059, +0.004, -0)
P=4.0 ± 0.1
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
3.5 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.1
(0.069 ± 0.004)
Top Cover
Tape Thickness
0.066 MAX.
(0.003 MAX.)
BO=3.2 ± 0.1
(0.126 ± 0.004)
K0=1.1 ± 0.1
(0.043 ± 0.004)
Embossed Carrier
Embossment
August 10, 2009
P=4.0 ± 0.1
(0.157 ± 0.004)
AO=3.2 ± 0.1
(0.126 ± 0.004)
ø1.1 ± 0.1
(0.043 ± 0.004)
W=8.0 ± 0.2
(0.315 ± 0.008)
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
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MX887D
3.2 Soldering
3.3 Washing
For proper assembly, the component must be
processed in accordance with the current revision of
IPC/JEDEC standard J-STD-020. Failure to follow the
recommended guidelines may cause permanent
damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Clare does not recommend ultrasonic cleaning or the
use of chlorinated hydrocarbons.
Pb
RoHS
2002/95/EC
e3
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-MX887D-August 10, 2009
©Copyright 2009, Clare, Inc.
All rights reserved. Printed in USA.
8/10/09
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August 10, 2009