Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 1. Document Status Revision 0.5 0.9 0.92 Date September 6, 2002 September 23, 2002 October 11, 2002 0.94 1.0 December 6, 2002 December 10, 2002 Comments First draft Modified Table 1. Modified Table 1, mechanical drawing, HCI stack features. Modified Table 1 and mechanical drawing. First formal release version. To make a request for change, correction, additions or information on references, please contact: Product Management Communication Products Division Smart Modular Technologies, 4305 Cushing Parkway, Fremont, CA 94538.USA +1 (510)-623-1231 2. Reference [1] Specification of the Bluetooth System, Version 1.1, February 22, 2001. 3. Scope The intention of this specification is to provide a general guideline on the integration of a Bluetooth Mini module. The product specification complies with Bluetooth Specification 1.1 [1]. 4. Module General Features and Chipset Description 4.1 Module General Features The Smart Modular Technologies’ Bluetooth Mini module is based on a Bluetooth single chip reference design. It is a complete Bluetooth module. The module has the following general main features: • Small footprint 52-pin BGA package with 0.8mm ball and1.27mm pitch (14.43mm x 21.47mm x 3.0mm). • Highly integrated small, thin module built with high-density mounting technology. • Class II device. • On board pin out for direct 50Ω RF trace connection. • Fully compliant with Bluetooth specification v1.1. • Full speed HCI UART. • USB v1.1 compliant and USB2.0 compatible. • Pulse Code Modulation (PCM) interface. • Programmable Parallel Input Output (PIO) ports. • Serial Peripheral Interface (SPI). • Low power 1.8V operation. • Full speed Bluetooth TM operation. • Full speed USB interface supports OHCI and UHCI host interface. 2 Smart Modular Technologies Smart Modular Technologies • • • • • • • • Specification ASY90147-1&2 December 10, 2002 Full piconet support. On board 4Mbit or 8Mbit external Flash. Very low power consumption in active and standby modes. Support for low power sleep modes. Firmware upgradeable via UART, USB or SPI interface. RF Shielding Can. Conforms to FCC Part 15, ICAN RSS-210, ETSI, ARIB ST-T66, CE and (per customers request for other countries’ EMI standards). Temperature range: -20°C to +95°C. 5. Mechanical Drawing: Figure 1. Mechanical drawing of Bluetooth Mini module. 3 Smart Modular Technologies Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 6. Interface Definitions: Table 1. Bluetooth Mini module interface definitions Pin# Name Type Note A2 GND GND Ground A8 VIN_3.3V I 3.3V input A9 VIN_3.3V I 3.3V input B1 N/C No Connection B2 N/C No Connection B8 GND GND Ground B9 GND GND Ground C1 PCM_IN I PCM synchronous data input C2 N/C No Connection C8 N/C No Connection C9 N/C No Connection D1 PCM_OUT O PCM synchronous data output D2 PCM_SYNC I/O PCM synchronous data SYNC D8 PIO[10] I/O Programmable I/O terminal D9 PIO[2] I/O USB_PULL_UP E1 PCM_CLK I/O PCM synchronous data clock E2 RXD I UART data input active high E8 PIO[5] I USB_DETACH E9 PIO[11] I/O Programmable I/O terminal F1 CTS I UART clear to send active low F2 TXD O UART data output active high F8 PIO[9] I/O Programmable I/O terminal F9 PIO[8] I/O Programmable I/O terminal G1 SPI_MOSI I Serial Peripheral interface data input G2 RTS O UART request to send active low G8 PIO[7] I/O Programmable I/O terminal G9 PIO[6] I/O CLK_REQ H1 USB D+ I/O USB data plus H2 SPI_CLK I Serial Peripheral interface clock H8 PIO[1] I/O Control output for external PA Class I application only H9 RST I Hardware reset, 3.3V±10% for > 5ms J1 USB DI/O USB data minus J2 SPI_CSB I Select for Synchronous Serial Interface active low J8 NC No Connection J9 NC No Connection K1 SPI_MISO O Serial Peripheral interface data output K2 PIO[0] I/O Control output for external LNA (if fitted) K8 N/C No Connection K9 N/C No Connection 4 Smart Modular Technologies Smart Modular Technologies Pin# L1 L2 L8 L9 M1 M2 M8 M9 N1 N2 N3 N8 N9 Name PIO[4] N/C N/C N/C PIO[3] N/C N/C N/C ANT GND N/C GND GND Specification ASY90147-1&2 December 10, 2002 Type I/O I/O RF I/O GND GND GND Note USB_ON No Connection No connection No connection USB_WAKE_UP No connection No connection No connection 50 Ω RX/TX connection to antenna Ground No connection Ground Ground 7. General Specifications Table 2. General Specifications Item Carrier Frequency Modulation Channel Intervals Number of Channels Frequency Hopping Receive Sensitivity Transmission Power Maximum Data Throughput SPECIFICATION 2400MHz to 2483.5MHz GFSK, 1Mbps, 0.5BT Gaussian 1MHz 79 1600 hops/sec, 1MHz channel space -82 dBm typ. @0.1% BER +4dBm max. Asnchronous : 721kbps/57.6kbps Synchronous : 432.6kbps/432.6kbps Full speed UART (921.6kbps), USB (12Mbits/s), PCM, SPI and PIO. Hardware and Software 3.3V±10% 1.8V -20°C to 95°C -40°C to 150°C 14.43 mm x 21.47mm x 3.0mm Direct 50 Ω RF trace contact Output Interface Reset Power Supply Operating Voltage Operating Temperature Range Storage Temperature Range Dimensions Antenna Interface 5 Smart Modular Technologies Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 8. Bluetooth Mini Module Block Diagram To RF Output Pin Crystal RAM Clock Generator BPF Memory Mapped Control/ Status UART PCM SPI Balun RF Receiver Baseband and Logic Memory Management RF Transmitter USB PCM_IN PCM_OUT PCM_SYNC PCM_CLK SPI_CLK SPI_MISO SPI_MOSI SPI_CSB USB_D+ USB_D- Memory Driver RF Synthesizer 4 or 8Mbit Flash Memory RISC Mico-Controller REG Programmable I/O 3.3V Figure 2. Bluetooth Mini Module Block Diagram 6 Smart Modular Technologies UART_TX UART_RX UART_RTS UART_CTS PIO[0]/RXEN PIO[1]/TXEN PIO[2]/USB_PULL_UP PIO[3]/USB_WAKE_UP PIO[4]/USB_ON PIO[5]/USB_DETACH PIO[6]/CLK_REQ PIO[7]/Programmable I/O PIO[8]/Programmable I/O PIO[9]/Programmable I/O PIO[10]/Programmable I/O PIO[11]/Programmable I/O Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 9. Electrical Characteristics Absolute maximum Ratings • Storage Temperature ---------- -40°C to 150°C (ambient) • Supply Voltage ---------------- -0.4V to 3.6V (MAX) Operating Conditions • Temperature Range ----------- -20°C< TA<95°C • Supply Voltage Range --------- 3.3V±10% Table 3. Radio Characteristics VDD = 1.8V Frequency (GHz) 2.402 Temperature = -20°C Min Typ Max - -83 -80 2.441 - -85 -80 2.480 - -85 -80 0 - - Min Typ Max 0 3 4 2.441 0 3 4 2.480 0 3 4 RF power control range - 35 - RF power range control resolution 20 dB bandwidth for modulated carrier - 1.8 - Initial carrier frequency tolerance Receiver Sensitivity at 0.1% BER Maximum received signal at 0.1% BER Frequency Transmitter (GHz) 2.402 RF transmit power Bluetooth Specification Unit dBm ≤-70 dBm dBm ≥ -20 Bluetooth Specification dBm Unit dBm -6 to +4 dBm dBm - ≥16 - dB 800 - 1000 kHz - ±25 - ≤ ±75 kHz Drift - ±15 - kHz Drift Rate ∆f1avg "Maximum Modulation" - - - ±20 165 ≤ ±25 400 - 140<∆f1avg <175 Hz/µs kHz ∆f2avg "Minimum Modulation" - 150 - 115 kHz Bluetooth Specification Unit Receiver VDD = 1.8V Frequency (GHz) 2.402 Sensitivity at 0.1% BER Temperature = +20°C Min Typ Max - -82 -80 2.441 - -84 -80 2.480 - -84 -80 7 Smart Modular Technologies dB dBm ≤-70 dBm dBm Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 Maximum received signal at 0.1% BER Frequency Transmitter (GHz) 2.402 0 - - Min Typ Max 0 2.5 4 2.441 0 2.5 4 2.480 0 2.5 4 RF power control range - 35 - RF power range control resolution 20 dB bandwidth for modulated carrier - 1.8 - Initial carrier frequency tolerance RF transmit power ≥ -20 Bluetooth Specification dBm Unit dBm -6 to +4 dBm dBm - ≥16 - dB 800 - 1000 kHz - ±25 - ≤ ±75 kHz Drift - ±15 - kHz Drift Rate ∆f1avg "Maximum Modulation" - - - ±20 165 ≤ ±25 400 - 140<∆f1avg <175 Hz/µs kHz ∆f2avg "Minimum Modulation" C/I co-channel - 150 - 115 kHz - 10 11 ≤ 11 dB Adjacent channel selectivity C/I f=f0 ± 1MHz - -4 0 ≤0 dB Adjacent channel selectivity C/I f=f0 ± 2MHz - -35 -30 ≤ -30 dB Adjacent channel selectivity C/I f ≥ f0+3MHz - -45 - ≤ -40 dB Adjacent channel selectivity C/I f ≤ f0-3MHz - -45 - ≤ -40 dB Adjacent channel selectivity C/I f=fimage - -18 -9 ≤ -9 dB Adjacent channel Transmit power f=f0±2MHz - -35 -20 ≤ -20 dBc Adjacent channel Transmit power f=f0±3MHz - -35 -40 ≤ -40 dBc Bluetooth Specification Unit Receiver VDD = 1.8V Frequency (GHz) 2.402 Sensitivity at 0.1% BER RF transmit power RF power control range Temperature = +95°C Min Typ Max - -81 -80 2.441 - -82 -80 2.480 - -82 -80 0 - - Min Typ Max 0 1 4 2.441 0 1 4 2.480 0 1 4 - 35 - Maximum received signal at 0.1% BER Frequency Transmitter (GHz) 2.402 8 Smart Modular Technologies dB dBm ≤-70 dBm dBm ≥ -20 Bluetooth Specification dBm Unit dBm -6 to +4 dBm dBm ≥16 dB Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 RF power range control resolution 20 dB bandwidth for modulated carrier - 1.8 - - dB - 800 - 1000 kHz Initial carrier frequency tolerance - ±25 - ≤ ±75 kHz Drift - ±15 - kHz Drift Rate ∆f1avg "Maximum Modulation" - ±20 - ≤ ±25 400 Hz/µs - 165 - 140<∆f1avg <175 kHz ∆f2avg "Minimum Modulation" - 150 - 115 kHz Note 1. Power at antenna port. Note 2. Measured according to the Bluetooth specification v1.1 and Bluetooth RF test specification 0.91. Table 4. Module Current Consumption Average Current Consumption VDD = 1.8V Temperature = +20°C Mode Avg Peak Unit SCO connection HV3 (40 ms interval Sniff Mode) (Slave) 26.0 - mA SCO connection HV3 (40 ms interval Sniff Mode) (Master) 26.0 - mA SCO connection HV1 (Slave) 53.0 - mA SCO connection HV1 (Master) 53.0 - mA ACL data transfer 115.2kbps UART (Master) 15.0 - mA ACL connection, Sniff Mode 40ms interval, 38.4kpbs UART 4 - mA ACL connection, Sniff Mode 1.28s interval, 38.4kpbs UART 8 - mA Parked Slave, 1.28s beacon interval, 38.4kpbs UART 6 - mA ACL data transfer 720kbps USB (Slave) 53.0 - mA ACL data transfer 720kbps USB (Master) 53.0 - mA 7 - mΑ Mode Typ Max Unit Deep Sleep Mode 300 500 Peak current during TX burst (+4 dBm) Peak current during TX burst (0dBm) 70.0 80 µA mA 60.0 70 mA Peak current during RX burst (-85 dBm) 50.0 70 mA Standby mode (Connected to host, no RF activity) Peak Current Consumption VDD = 1.8V Temperature = +20°C Notes: Current consumption is based on BC0212015A and includes current supplied to external 3V Flash. 9 Smart Modular Technologies Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 10. UART Interface The Universal Asynchronous Receiver Transmitter (UART) interface provides a mechanism for communicating with other serial devices using the RS232 standard. When the module is connected to another digital device, UART_RX and UART_TX transfer data between the two devices. The other two signals, UART_CTS and UART_RTS, can be used to implement RS232 hardware flow control where both are active low indicators. Table 5. Possible UART Settings Parameter Possible Values Minimum Baud Rate Maximum Flow Control Parity Number of Stop Bits Bits per channel 1200 Baud (≤2% Error) 9600 Baud (≤1% Error) 1.5MBaud (≤1% Error) RTS/CTS or None None, Odd or Even 1 or 2 8 11. USB Interface The Universal Serial Bus (USB) interface on the module provides a full-speed (12Mbits/s) data throughput, capable of driving a USB cable directly. No external USB transceiver is required. The device operates as a USB peripheral, responding to requests from a master host controller such as a PC. Both the OHCI and the UHCI standards are supported. Only the USB slave operation is supported. Table 6. USB Data Connections USB Connections Function DD+ “Differential” 0 “Differential” 1 12. PCM Pulse Code Modulation (PCM) is the standard method used to digitize human voice patterns for transmission over digital communication channels. The module has hardware support for continual transmission and reception of PCM data, thus reducing processor overhead for wireless headset applications. The module offers a bi-directional digital audio interface routes directly into the basedband layer of the on-chip firmware. Up to three SCO connections can be supported by the PCM interface at any one time. The PCM interface can be configured as Master or Slave. When it operates as the PCM interface Master, it generates an output clock of 128, 256 or 521kHz. When configured as 10 Smart Modular Technologies Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 PCM interface Slave, it can operate with an input clock up to 2048kHz. It is compatible with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI timing. The module supports 13 or 16-bit linear, 8-bit µ-law or A-law sample formats at 8ksamples/s and can receive and transmit on any selection of the three of the first four slots following PCM_SYNC. The PCM interface on the module can interfaces directly to PCM audio devices includes the following: • Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices. • OKI MSM7705 four-channel A-lay and µ-law CODEC. • Motorola MC145481 8-bit A-law and µ-law CODEC. • Motorola MC145483 13-bit linear CODEC. 13. The Parallel Input Output (PIO) Port The PIO is a general-purpose I/O interface to the module. The module has ports with twelve programmable, bi-directional I/O lines, PIO[11:0]. Programmable I/O lines can be accessed either via an embedded application running on the module or via private channel or manufacture-specific HCI commands. Six PIO ports, PIO[5:0], are implemented on the module. PIO[0]/RXEN This is a multifunction terminal. Its function is selected by setting the Persistent Store Key PSKEY_TX/RX_PIO_CONTROL (0x209). It can be used as a programmable I/O, however it will normally be used to control the radio front-end receive switch. PIO[1]/TXEN This is a multifunction terminal. Its function is selected by setting the Persistent Store Key PSKEY_TX/RX_PIO_CONTROL (0x209). It can be used as a programmable I/O, however it will normally be used to control the radio front-end transmit switch. PIO[2]/USB_PULL_UP This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB versions, it can drive a pull-up resistor on USB_D+. For application using external RAM this terminal may be programmed for chip select. PIO[3]/USB_WAKE_UP This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB versions, its function is selected by setting the Persistent Store Key PSKEY_USB_PIO_WAKEUP (0x2cf) either as a programmable I/O or as a USB_WAKE_UP function. PIO[4]/USN_ON This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB versions, the USB_ON function is also selectable. 11 Smart Modular Technologies Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 PIO[5]/USB_DETACH This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB versions, the USB_DETACH function is also selectable. PIO[6]/CLK_REQ This is a multifunction terminal, its function is determined by Persistent Store Keys. Using PSKEY_CLOCK_REQUEST_ENABLE (0x246), it can be configured to be low when the module is in deep sleep and high when a clock is required. The clock must be supplied within 4ms of the rising edge of PIO[6] to avoid losing timing accuracy in certain Bluetooth operation modes. PIO[7] Programmable I/O terminal. PIO[8] Programmable I/O terminal. PIO[9] Programmable I/O terminal. PIO[10] Programmable I/O terminal. PIO[11] Programmable I/O terminal. Note: USB functions can be software mapped to any PIO terminal, the present module support PIOs [0 - 5]. 12 Smart Modular Technologies Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 14. Key Features of HCI Stack • Bluetooth components: Basedband (including LC), LM and HCI. • Standard USB v1.1 and UART (H4) HCI Transport Layers. • All standard radio packet types. • Full Bluetooth data rate, up to 721kbps asymmetric. • Operation with up to seven slaves. • Maximum number of simultaneous active ACL connections: 7 • Maximum number of simultaneous active SCO connections: 3 • Operation with up to 3 SCO links, routed to one or more slaves. • Role switch: can reverse Maser/Slave relationship. • All standard SCO voice codings, plus “transparent SCO”. • Standard operating modes: page, inquiry, page-scan and inquiry-scan. • All standard pairing, authentication, link key and encryption operations. • Standard Bluetooth power saving mechanisms: Hold, Sniff and Park modes, including “Forced Hold”. • Dynamic control of peers’ transmit power via LMP. • Master/Slave switch. • Broadcast. • Channel quality driven data rate. • All standard Bluetooth Test Modes. • Standard firmware upgrade via UART interface. • Standard firmware upgrade via USB interface. • Provides manufacture-specific HCI extension commands with the following features: Ø Access to the chip’s general-purpose PIO port. Ø Access to the chip’s Bluetooth clock. Ø The negotiated effective encryption length on established Bluetooth links. Ø Access to the firmware’s random number generator. Ø Controls to set the default and maximum transmit powers. Ø Dynamic UART configuration. Ø Radio transmitter enable/disable. • A UART “break” condition can be used in two ways: Ø Presenting a UART break condition on the module can force the chip to perform a hardware reboot. Ø Presenting a break condition at boot time can hold the chip in a low power state, thus preventing normal initialization while the condition exists. • Hardware low power modes: Shallow Sleep and Deep Sleep. • SCO channels are normally routed over HCI. However, up to three SCO channels can be routed over the chip’s single PCM port (at the same time as routing other SCO channels over HCI). 13 Smart Modular Technologies Smart Modular Technologies Specification ASY90147-1&2 December 10, 2002 15. Qualification Tests 15.1 15.2 Bluetooth Qualification Tests. USB Qualification Tests. 16. Agency and Regulatory Body Approvals 16.1 Safety Compliance • IEC 60 950:1999 (3rd Edition) “Safety of Information Technology” including all CB scheme country deviations. • EN 60950:2000 “Safety of Information Technology”, European Union. • UL 60950:2000 (3rd Edition) “Safety of Information Technology”, USA, Canada. 16.2 Electromagnetic Compatibility (EMC) • FCC Part 15, Class B “Radio Frequency Devices”, USA. • ICES-003, Issue 3 "Interference-causing equipment standard - digital apparatus", Canada. • EN 301 489-17:2000 “Electromagnetic Compatibility for Radio Equipment and Services”, European Union. • VCCI, “Interference By Information Technology Equipment”, Japan. 16.3 Radio Compliance • FCC Part 15 “Radio Frequency Devices”, USA. • ICAN RSS-210, Issue 5 “Low Power License-Exempt Radio Communication Devices”, Canada. • EN 300 328-2:2001 “Data Transmission Equipment Operating in 2.4GHz ISM Band Using Spread Spectrum Modulation Technique”, European Union. • ARIB STD-T66 “Second Generation Low Power Data Communication System and Wireless LAN System”, ARIB STD-33, “Low Power data Communication System of Wireless Equipment”, Japan. 16.4 CE Marking • EN 60950:2000 “Safety of Information Technology”, European Union. • EN 301 489-17:2000: “Electromagnetic Compatibility for Radio Equipment and Services”, European Union. • EN 300 328-2:2001 “Data Transmission Equipment Operating in 2.4GHz ISM Band Using Spread Spectrum Modulation Technique”, European Union. 17. Manufacture Procedure and Production Test 17.1 17.2 Manufacture Process Flow • Process and X-ray Manufacture Test • F/T 18. Product Design and Related Documentations • Hardware & SW Functional Test Reports 14 Smart Modular Technologies Smart Modular Technologies • • • • • • • • • • • • • Specification ASY90147-1&2 December 10, 2002 Hardware Compatibility Test Report Hardware/SW performance Test Report Hardware EMI Test Report Hardware Reliability Test Report Hardware Environmental Test Report Product Specifications Chipsets Specifications Schematics BOM Layout Drawings PCB artwork SW Process Control / Release process document 15 Smart Modular Technologies