MICROCHIP MCP1640_13

MCP1640/B/C/D
0.65V Start-up Synchronous Boost Regulator with True
Output Disconnect or Input/Output Bypass Option
Features
General Description
• Up to 96% Typical Efficiency
• 800 mA Typical Peak Input Current Limit:
- IOUT > 100 mA @ 1.2V VIN, 3.3V VOUT
- IOUT > 350 mA @ 2.4V VIN, 3.3V VOUT
- IOUT > 350 mA @ 3.3V VIN, 5.0V VOUT
• Low Start-up Voltage: 0.65V, typical 3.3V VOUT
@ 1 mA
• Low Operating Input Voltage: 0.35V, typical
3.3VOUT @ 1 mA
• Adjustable Output Voltage Range: 2.0V to 5.5V
• Maximum Input Voltage  VOUT < 5.5V
• Automatic PFM/PWM Operation (MCP1640C):
- PFM Operation Disabled (MCP1640B/D)
- PWM Operation: 500 kHz
• Low Device Quiescent Current: 19 µA, typical
PFM Mode
• Internal Synchronous Rectifier
• Internal Compensation
• Inrush Current Limiting and Internal Soft-Start
• Selectable, Logic Controlled, Shutdown States:
- True Load Disconnect Option (MCP1640B)
- Input to Output Bypass Option (MCP1640C/D)
• Shutdown Current (All States): < 1 µA
• Low Noise, Anti-Ringing Control
• Overtemperature Protection
• Available Packages:
- 6-Lead SOT23
- 8-Lead 2x3 DFN
The MCP1640/B/C/D is a compact, high-efficiency,
fixed frequency, synchronous step-up DC-DC converter. It provides an easy-to-use power supply solution
for applications powered by either one-cell, two-cell, or
three-cell alkaline, NiCd, NiMH, one-cell Li-Ion or
Li-Polymer batteries.
Low-voltage technology allows the regulator to start up
without high inrush current or output voltage overshoot
from a low 0.65V input. High efficiency is accomplished
by integrating the low resistance N-Channel Boost
switch and synchronous P-Channel switch. All
compensation and protection circuitry are integrated to
minimize external components. For standby
applications, the MCP1640 operates and consumes
only 19 µA while operating at no load, and provides a
true disconnect from input to output while shut down
(EN = GND). Additional device options are available
that operate in PWM-only mode and connect input to
output bypass while shut down.
A “true” load disconnect mode provides input to output
isolation while disabled by removing the normal boost
regulator diode path from input to output. A Bypass
mode option connects the input to the output using the
integrated low resistance P-Channel MOSFET, which
provides a low bias keep-alive voltage for circuits
operating in Deep Sleep mode. Both options consume
less than 1 µA of input current.
Output voltage is set by a small external resistor
divider. Two package options are available, 6-Lead
SOT23 and 8-Lead 2x3 DFN.
Package Types
Applications
• One, Two and Three Cell Alkaline and NiMH/NiCd
Portable Products
• Single Cell Li-Ion to 5V Converters
• Li Coin Cell Powered Devices
• Personal Medical Products
• Wireless Sensors
• Handheld Instruments
• GPS Receivers
• Bluetooth Headsets
• +3.3V to +5.0V Distributed Power Supply
 2011 Microchip Technology Inc.
MCP1640
6-Lead SOT23
SW 1
GND 2
EN 3
6 VIN
5 VOUT
4 VFB
MCP1640
8-Lead 2x3 DFN*
8 VIN
VFB 1
SGND 2
PGND 3
EN 4
EP
9
7 VOUTS
6 VOUTP
5 SW
* Includes Exposed Thermal Pad (EP); see Table 3-1.
DS22234B-page 1
MCP1640/B/C/D
L1
4.7 µH
VIN
0.9V to 1.7V
VOUT
3.3V @ 100 mA
SW V
OUT
VIN
ALKALINE
+
CIN
4.7 µF
976 K
COUT
10 µF
VFB
EN
562 K
-
GND
L1
4.7 µH
VIN
3.0V to 4.2V
LI-ION
+
VOUT
5.0V @ 300 mA
SW V
OUTS
CIN
4.7 µF
VIN
VOUTP
EN
VFB
976 K
COUT
10 µF
309 K
-
PGND SGND
Efficiency vs. IOUT for 3.3VOUT
100.0
Efficiency (%)
V IN = 2.5V
80.0
V IN = 0.8V
V IN = 1.2V
60.0
40.0
0.1
1.0
10.0
100.0
1000.0
Output Current (mA)
DS22234B-page 2
 2011 Microchip Technology Inc.
MCP1640/B/C/D
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational sections of this
specification is not intended. Exposure to maximum
rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings †
EN, FB, VIN, VSW, VOUT - GND ........................... +6.5V
EN, FB ...........<greater of VOUT or VIN > (GND - 0.3V)
Output Short Circuit Current....................... Continuous
Output Current Bypass Mode........................... 400 mA
Power Dissipation ............................ Internally Limited
Storage Temperature .........................-65oC to +150oC
Ambient Temp. with Power Applied......-40oC to +85oC
Operating Junction Temperature........-40oC to +125oC
ESD Protection On All Pins:
HBM........................................................ 3 kV
MM........................................................ 300 V
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA,
TA = +25°C.
Boldface specifications apply over the TA range of -40oC to +85oC.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Characteristics
Minimum Startup Voltage
VIN
—
0.65
0.8
V
Note 1
Minimum Input Voltage After
Start-Up
VIN
—
0.35
—
V
Note 1
Output Voltage Adjust Range
VOUT
2.0
5.5
V
VOUT  VIN; Note 2
Maximum Output Current
IOUT
150
—
mA
1.2V VIN, 2.0V VOUT
150
—
mA
1.5V VIN, 3.3V VOUT
350
—
mA
3.3V VIN, 5.0V VOUT
100
Feedback Voltage
VFB
1.175
1.21
1.245
V
—
Feedback Input Bias Current
IVFB
—
10
—
pA
—
Quiescent Current – PFM
Mode
IQPFM
—
19
30
µA
Measured at VOUT = 4.0V;
EN = VIN, IOUT = 0 mA;
Note 3
Quiescent Current – PWM
Mode
IQPWM
—
220
—
µA
Measured at VOUT; EN = VIN
IOUT = 0 mA; Note 3
Quiescent Current – Shutdown
IQSHDN
—
0.7
2.3
µA
VOUT = EN = GND;
Includes N-Channel and
P-Channel Switch Leakage
NMOS Switch Leakage
INLK
—
0.3
1
µA
VIN = VSW = 5V;
VOUT = 5.5V
VEN = VFB = GND
PMOS Switch Leakage
IPLK
—
0.05
0.2
µA
VIN = VSW = GND;
VOUT = 5.5V
RDS(ON)N
—
0.6
—

VIN = 3.3V, ISW = 100 mA
NMOS Switch ON Resistance
Note 1:
2:
3:
4:
5:
3.3 K resistive load, 3.3VOUT (1 mA).
For VIN > VOUT, VOUT will not remain in regulation.
IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be
estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)).
220 resistive load, 3.3VOUT (15 mA).
Peak current limit determined by characterization, not production tested.
 2011 Microchip Technology Inc.
DS22234B-page 3
MCP1640/B/C/D
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA,
TA = +25°C.
Boldface specifications apply over the TA range of -40oC to +85oC.
Parameters
Sym
Min
Typ
Max
Units
RDS(ON)P
—
0.9
—

NMOS Peak Switch Current
Limit
IN(MAX)
600
850
—
mA
VOUT Accuracy
VOUT%
-3
—
+3
%
Line Regulation
VOUT/
VOUT) /
VIN|
-1
0.01
1
%/V
Load Regulation
VOUT /
VOUT|
-1
0.01
1
%
Maximum Duty Cycle
DCMAX
88
90
—
%
Switching Frequency
fSW
425
EN Input Logic High
VIH
500
—
575
—
PMOS Switch ON Resistance
Conditions
VIN = 3.3V, ISW = 100 mA
Note 5
Includes Line and Load
Regulation; VIN = 1.5V
VIN = 1.5V to 3V
IOUT = 25 mA
IOUT = 25 mA to 100 mA;
VIN = 1.5V
kHz
%of VIN IOUT = 1 mA
%of VIN IOUT = 1 mA
VIL
90
—
—
20
IENLK
—
0.005
µA
VEN = 5V
Soft-start Time
tSS
—
750
—
—
µS
EN Low to High, 90% of
VOUT; Note 4
Thermal Shutdown Die
Temperature
TSD
—
150
—
C
TSDHYS
—
10
—
C
EN Input Logic Low
EN Input Leakage Current
Die Temperature Hysteresis
Note 1:
2:
3:
4:
5:
3.3 K resistive load, 3.3VOUT (1 mA).
For VIN > VOUT, VOUT will not remain in regulation.
IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be
estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)).
220 resistive load, 3.3VOUT (15 mA).
Peak current limit determined by characterization, not production tested.
TEMPERATURE SPECIFICATIONS
Electrical Specifications:
Parameters
Sym
Min
Typ
Max
Units
Operating Junction Temperature
Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
TJ
—
—
+150
°C
Thermal Resistance, 5L-TSOT23
JA
—
192
—
°C/W
Thermal Resistance, 8L-2x3 DFN
JA
—
93
—
°C/W
Conditions
Temperature Ranges
Maximum Junction Temperature
Steady State
Transient
Package Thermal Resistances
DS22234B-page 4
EIA/JESD51-3 Standard
 2011 Microchip Technology Inc.
MCP1640/B/C/D
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C.
Efficiency (%)
80
22.5
VOUT = 3.3V
20.0
17.5
15.0
VOUT = 2.0V
70
VIN = 0.8V
60
VIN = 1.2V
50
40
30
PWM / PFM
20
12.5
PWM ONLY
10
0
0.01
10.0
-40
-25
-10
5
20
35
50
65
80
0.1
1
100
300
1000
V OUT = 3.3V
V IN = 2.5V
90
VOUT = 5.0V
V IN = 1.2V
80
Efficiency (%)
IQ PWM Mode (µA)
100
FIGURE 2-4:
2.0V VOUT PFM / PWM
Mode Efficiency vs. IOUT.
FIGURE 2-1:
VOUT IQ vs. Ambient
Temperature in PFM Mode.
250
225
VOUT = 3.3V
200
70
VIN = 0.8V
60
VIN = 1.2V
50
40
30
PWM / PFM
20
175
PWM ONLY
10
0
0.01
150
-40
-25
-10
5
20
35
50
65
80
0.1
1
FIGURE 2-2:
VOUT IQ vs. Ambient
Temperature in PWM Mode.
100
VOUT = 5.0V
VOUT = 3.3V
VOUT = 5.0V
VIN = 2.5V
Efficiency (%)
80
VOUT = 2.0V
200
VIN = 1.2V
70
50
40
30
PWM / PFM
PWM ONLY
10
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
VIN (V)
FIGURE 2-3:
Maximum IOUT vs. VIN.
 2011 Microchip Technology Inc.
5
VIN = 1.8V
60
20
100
0
1000
90
400
300
100
FIGURE 2-5:
3.3V VOUT PFM / PWM
Mode Efficiency vs. IOUT.
600
500
10
IOUT (mA)
Ambient Temperature (°C)
IOUT (mA)
10
IOUT (mA)
Ambient Temperature (°C)
275
VIN = 1.6V
90
VOUT = 5.0V
VIN = 1.2V
25.0
IQ PFM Mode (µA)
VOUT = 2.0V
100
27.5
0
0.01
0.1
1
10
100
1000
IOUT (mA)
FIGURE 2-6:
5.0V VOUT PFM / PWM
Mode Efficiency vs. IOUT.
DS22234B-page 5
MCP1640/B/C/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C.
3.33
1.00
VIN = 1.2V
IOUT = 15 mA
VOUT = 3.3V
3.325
3.32
0.85
VIN = 1.8V
Startup
VIN (V)
VOUT (V)
3.315
3.31
3.305
0.70
0.55
3.3
Shutdown
VIN = 0.8V
3.295
0.40
3.29
0.25
3.285
-40
-25
-10
5
20
35
50
65
0
80
20
40
Ambient Temperature (°C)
FIGURE 2-7:
Temperature.
525
Switching Frequency (kHz)
VIN = 1.5V
3.36
IOUT = 5 mA
VOUT (V)
3.34
3.32
3.30
IOUT = 15 mA
3.28
IOUT = 50 mA
3.26
100
VOUT = 3.3V
520
515
510
505
500
495
490
485
480
-40
-25
-10
5
20
35
50
65
80
-40
-25
-10
Ambient Temperature (°C)
FIGURE 2-8:
Temperature.
5
20
35
50
65
80
Ambient Temperature (°C)
3.3V VOUT vs. Ambient
FIGURE 2-11:
Temperature.
3.40
FOSC vs. Ambient
4.5
TA = 85°C
IOUT = 5 mA
4
3.36
VOUT = 5.0V
3.5
3
TA = 25°C
3.32
VIN (V)
VOUT (V)
80
FIGURE 2-10:
Minimum Start-up and
Shutdown VIN into Resistive Load vs. IOUT.
3.3V VOUT vs. Ambient
3.38
60
IOUT (mA)
3.28
TA = - 40°C
V OUT = 3.3V
2.5
2
VOUT = 2.0V
1.5
1
3.24
0.5
3.20
0
0.8
1.2
1.6
2
2.4
VIN (V)
FIGURE 2-9:
DS22234B-page 6
3.3V VOUT vs. VIN.
2.8
0
1
2
3
4
5
6
7
8
9
10
IOUT (mA)
FIGURE 2-12:
PWM Pulse Skipping Mode
Threshold vs. IOUT.
 2011 Microchip Technology Inc.
MCP1640/B/C/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C.
10000
PWM / PFM
PWM ONLY
VOUT = 5.0V
IIN (µA)
1000
VOUT = 3.3V
VOUT = 2.0V
100
VOUT = 2.0V
VOUT = 3.3V
VOUT = 5.0V
10
0.8
1.1
1.4
1.7
2
2.3
2.6
2.9
3.2
3.5
VIN (V)
FIGURE 2-13:
VIN.
Input No Load Current vs.
FIGURE 2-16:
MCP1640 3.3V VOUT PFM
Mode Waveforms.
Switch Resistance (Ohms)
5
4
P - Channel
3
2
1
N - Channel
0
1
1.5
2
2.5
3
3.5
4
4.5
5
> VIN or VOUT
FIGURE 2-14:
N-Channel and P-Channel
RDSON vs. > of VIN or VOUT.
FIGURE 2-17:
MCP1640B 3.3V VOUT
PWM Mode Waveforms.
16
VOUT = 5.0V
14
V OUT = 3.3V
VOUT = 2.0V
IOUT (mA)
12
10
8
6
4
2
0
0
0.5
1
1.5
2
2.5
3
3.5
4
VIN (V)
FIGURE 2-15:
Current vs. VIN.
PFM / PWM Threshold
 2011 Microchip Technology Inc.
FIGURE 2-18:
Waveforms.
MCP1640/B High Load
DS22234B-page 7
MCP1640/B/C/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C.
FIGURE 2-19:
3.3V Start-up After Enable.
FIGURE 2-22:
MCP1640B 3.3V VOUT Load
Transient Waveforms.
FIGURE 2-20:
VENABLE.
3.3V Start-up when VIN =
FIGURE 2-23:
MCP1640B 2.0V VOUT Load
Transient Waveforms.
FIGURE 2-21:
MCP1640 3.3V VOUT Load
Transient Waveforms.
DS22234B-page 8
FIGURE 2-24:
Waveforms.
3.3V VOUT Line Transient
 2011 Microchip Technology Inc.
MCP1640/B/C/D
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin
Name
PIN FUNCTION TABLE
MCP1640/B/C/D MCP1640/B/C/D
SOT23
2x3 DFN
Description
SW
1
5
Switch Node, Boost Inductor Input Pin
GND
2
—
Ground Pin
EN
3
4
Enable Control Input Pin
FB
4
1
Feedback Voltage Pin
VOUT
5
—
Output Voltage Pin
VIN
6
8
Input Voltage Pin
SGND
—
2
Signal Ground Pin
PGND
—
3
Power Ground Pin
VOUTS
—
7
Output Voltage Sense Pin
VOUTP
—
6
Output Voltage Power Pin
EP
—
9
Exposed Thermal Pad (EP); must be connected to VSS.
3.1
Switch Node Pin (SW)
Connect the inductor from the input voltage to the SW
pin. The SW pin carries inductor current and can be as
high as 800 mA peak. The integrated N-Channel switch
drain and integrated P-Channel switch source are internally connected at the SW node.
3.2
Ground Pin (GND)
The ground or return pin is used for circuit ground connection. Length of trace from input cap return, output
cap return, and GND pin should be made as short as
possible to minimize noise on the GND pin. In the
SOT23-6 package, a single ground pin is used.
3.3
Enable Pin (EN)
3.6
Connect the input voltage source to VIN. The input
source should be decoupled to GND with a 4.7 µF
minimum capacitor.
3.7
3.8
3.4
3.10
3.5
Output Voltage Pin (VOUT)
The output voltage pin connects the integrated
P-Channel MOSFET to the output capacitor. The FB
voltage divider is also connected to the VOUT pin for
voltage regulation.
 2011 Microchip Technology Inc.
Power Ground Pin (PGND)
The power ground pin is used as a return for the highcurrent N-Channel switch. In the 2x3 DFN package, the
PGND and SGND pins are connected externally.
3.9
The FB pin is used to provide output voltage regulation
by using a resistor divider. The FB voltage will be 1.21V
typical with the output voltage in regulation.
Signal Ground Pin (SGND)
The signal ground pin is used as a return for the
integrated VREF and error amplifier. In the 2x3 DFN
package, the SGND and power ground (PGND) pins are
connected externally.
The EN pin is a logic-level input used to enable or
disable device switching, and lower quiescent current
while disabled. A logic high (>90% of VIN) will enable
the regulator output. A logic low (<20% of VIN) will
ensure that the regulator is disabled.
Feedback Voltage Pin (FB)
Power Supply Input Voltage Pin
(VIN)
Output Voltage Sense Pin (VOUTS)
The output voltage sense pin connects the regulated
output voltage to the internal bias circuits. In the 2x3
DFN package, the VOUTS and output voltage power
(VOUTP) pins are connected externally.
Output Voltage Power Pin (VOUTP)
The output voltage power pin connects the output voltage to the switch node. High current flows through the
integrated P-Channel and out of this pin to the output
capacitor and output. In the 2x3 DFN package, VOUTP
and VOUTS are connected externally.
3.11
Exposed Thermal Pad (EP)
There is no internal electrical connection between the
Exposed Thermal Pad (EP) and the SGND and PGND
pins. They must be connected to the same potential on
the Printed Circuit Board (PCB).
DS22234B-page 9
MCP1640/B/C/D
NOTES:
DS22234B-page 10
 2011 Microchip Technology Inc.
MCP1640/B/C/D
4.0
DETAILED DESCRIPTION
4.1
Device Option Overview
The MCP1640/B/C/D family of devices is capable of
low start-up voltage and delivers high efficiency over a
wide load range for single cell, two cell, three cell
alkaline, NiMH, NiCd and single cell Li-Ion battery
inputs. A high level of integration lowers total system
cost, eases implementation and reduces board area.
The devices feature low startup voltage, adjustable output voltage, PWM/PFM mode operation, low IQ, integrated synchronous switch, internal compensation, low
noise anti-ring control, inrush current limit, and soft
start.
There are two feature options for the MCP1640/B/C/D
family:
• PWM/PFM mode or PWM-Only mode
• “True Output Disconnect” mode or Input Bypass
mode
4.1.1
PWM/PFM MODE OPTION
The MCP1640C devices use an automatic switchover
from PWM to PFM mode for light load conditions to
maximize efficiency over a wide range of output
current. During PFM mode, higher peak current is used
to pump the output up to the threshold limit. While
operating in PFM or PWM mode, the P-Channel switch
is used as a synchronous rectifier, turning off when the
inductor current reaches 0 mA to maximize efficiency.
In PFM mode, a comparator is used to terminate
switching when the output voltage reaches the upper
threshold limit. Once switching has terminated, the
output voltage will decay or coast down. During this
period, very low IQ is consumed from the device and
input source, which keeps power efficiency high at light
load.
The disadvantages of PWM/PFM mode are higher output ripple voltage and variable PFM mode frequency.
The PFM mode frequency is a function of input voltage,
output voltage and load. While in PFM mode, the boost
converter pumps the output up at a switching frequency
of 500 kHz.
4.1.2
For noise immunity, the N-Channel MOSFET current
sense is blanked for approximately 100 ns. With a typical minimum duty cycle of 100 ns, the MCP1640B/D
continues to switch at a constant frequency under light
load conditions. Figure 2-12 represents the input voltage versus load current for the pulse skipping threshold
in PWM-Only mode. At lighter loads, the MCP1640B/D
devices begin to skip pulses.
4.1.3
TRUE OUTPUT DISCONNECT
MODE OPTION
The MCP1640B devices incorporate a true output
disconnect feature. With the EN pin pulled low, the
output of the MCP1640B is isolated or disconnected
from the input by turning off the integrated P-Channel
switch and removing the switch bulk diode connection.
This removes the DC path that is typical in boost converters, which allows the output to be disconnected
from the input. During this mode, less than 1 µA of current is consumed from the input (battery). True output
disconnect does not discharge the output, the output
voltage is held up by the external COUT capacitance.
4.1.4
INPUT BYPASS MODE OPTION
The MCP1640C/D devices incorporate the Input
Bypass shutdown option. With the EN input pulled low,
the output is connected to the input using the internal
P-Channel MOSFET. In this mode, the current draw
from the input (battery) is less than 1 µA with no load.
The Input Bypass mode is used when the input voltage
range is high enough for the load to operate in Sleep or
low IQ mode. When a higher regulated output voltage is
necessary to operate the application, the EN input is
pulled high, enabling the boost converter.
TABLE 4-1:
Part
Number
MCP1640
PART NUMBER SELECTION
PWM/ PWMTrue
PFM Only Disconnect
X
MCP1640B
MCP1640C
MCP1640D
Input
Bypass
X
X
X
X
X
X
X
PWM-ONLY MODE OPTION
The MCP1640B/D devices disable PFM mode
switching, and operate only in PWM mode over the
entire load range. During periods of light load operation, the MCP1640B/D continues to operate at a constant 500 kHz switching frequency, keeping the output
ripple voltage lower than PFM mode.
During PWM-Only mode, the MCP1640B/D P-Channel
switch acts as a synchronous rectifier by turning off (to
prevent reverse current flow from the output cap back
to the input) in order to keep efficiency high.
 2011 Microchip Technology Inc.
DS22234B-page 11
MCP1640/B/C/D
4.2
Functional Description
Figure 4-1 depicts the functional block diagram of the
MCP1640/B/C/D.
The MCP1640/B/C/D is a compact, high-efficiency,
fixed frequency, step-up DC-DC converter that
provides an easy-to-use power supply solution for
applications powered by either one-cell, two-cell, or
three-cell alkaline, NiCd, or NiMH, or one-cell Li-Ion or
Li-Polymer batteries.
VOUT
VIN
INTERNAL
BIAS
IZERO
DIRECTION
CONTROL
SW
SOFT-START
.3V
GATE DRIVE
AND
SHUTDOWN
CONTROL
LOGIC
EN
0V
ILIMIT
ISENSE
GND
OSCILLATOR
SLOPE
COMP.
S
PWM/PFM
LOGIC
1.21V
FB
EA
FIGURE 4-1:
4.2.1
MCP1640/B/C/D Block Diagram.
LOW-VOLTAGE START-UP
The MCP1640/B/C/D is capable of starting from a low
input voltage. Start-up voltage is typically 0.65V for a
3.3V output and 1 mA resistive load.
When enabled, the internal start-up logic turns the
rectifying P-Channel switch on until the output
capacitor is charged to a value close to the input
voltage. The rectifying switch is current-limited during
this time. After charging the output capacitor to the
input voltage, the device starts switching. If the input
voltage is below 1.6V, the device runs open-loop with a
fixed duty cycle of 70% until the output reaches 1.6V.
During this time, the boost switch current is limited to
DS22234B-page 12
50% of its nominal value. Once the output voltage
reaches 1.6V, normal closed-loop PWM operation is
initiated.
The MCP1640/B/C/D charges an internal capacitor
with a very weak current source. The voltage on this
capacitor, in turn, slowly ramps the current limit of the
boost switch to its nominal value. The soft-start
capacitor is completely discharged in the event of a
commanded shutdown or a thermal shutdown.
There is no undervoltage lockout feature for the
MCP1640/B/C/D. The device will start up at the lowest
possible voltage and run down to the lowest possible
voltage. For typical battery applications, this may result
in “motor-boating” (emitting a low-frequency tone) for
deeply discharged batteries.
 2011 Microchip Technology Inc.
MCP1640/B/C/D
4.2.2
PWM-ONLY MODE OPERATION
In normal PWM operation, the MCP1640/B/C/D
operates as a fixed frequency, synchronous boost
converter. The switching frequency is internally
maintained with a precision oscillator typically set to
500 kHz. The MCP1640B/D devices will operate in
PWM-Only mode even during periods of light load
operation. By operating in PWM-Only mode, the output
ripple remains low and the frequency is constant.
Operating in fixed PWM mode results in lower
efficiency during light load operation (when compared
to PFM mode (MCP1640C)).
Lossless current sensing converts the peak current signal to a voltage to sum with the internal slope compensation. This summed signal is compared to the voltage
error amplifier output to provide a peak current control
command for the PWM signal. The slope
compensation is adaptive to the input and output
voltage. Therefore, the converter provides the proper
amount of slope compensation to ensure stability, but is
not excessive, which causes a loss of phase margin.
The peak current limit is set to 800 mA typical.
4.2.3
PFM MODE OPERATION
The MCP1640C devices are capable of operating in
normal PWM mode and PFM mode to maintain high
efficiency at all loads. In PFM mode, the output ripple
has a variable frequency component that changes with
the input voltage and output current. With no load, the
quiescent current draw from the output is typically
19 µA. The PFM mode can be disabled in selected
device options.
PFM operation is initiated if the output load current falls
below an internally programmed threshold. The output
voltage is continuously monitored. When the output
voltage drops below its nominal value, PFM operation
pulses one or several times to bring the output back
into regulation. If the output load current rises above
the upper threshold, the MCP1640C transitions
smoothly into PWM mode.
4.2.4
ADJUSTABLE OUTPUT VOLTAGE
The MCP1640/B/C/D output voltage is adjustable with
a resistor divider over a 2.0V minimum to 5.5V
maximum range. High value resistors are
recommended to minimize quiescent current to keep
efficiency high at light loads.
4.2.5
ENABLE PIN
4.2.6
INTERNAL BIAS
The MCP1640/B/C/D gets its start-up bias from VIN.
Once the output exceeds the input, bias comes from
the output. Therefore, once started, operation is
completely independent of VIN. Operation is only
limited by the output power level and the input source
series resistance. When started, the output will remain
in regulation down to 0.35V typical with 1 mA output
current for low source impedance inputs.
4.2.7
INTERNAL COMPENSATION
The error amplifier, with its associated compensation
network, completes the closed loop system by
comparing the output voltage to a reference at the
input of the error amplifier, and feeding the amplified
and inverted signal to the control input of the inner
current loop. The compensation network provides
phase leads and lags at appropriate frequencies to
cancel excessive phase lags and leads of the power
circuit. All necessary compensation components and
slope compensation are integrated.
4.2.8
SHORT CIRCUIT PROTECTION
Unlike most boost converters, the MCP1640/B/C/D
allows its output to be shorted during normal operation.
The internal current limit, and overtemperature
protection, limit excessive stress and protect the device
during periods of short circuit, overcurrent and overtemperature. While operating in Bypass mode, the
P-Channel current limit is inhibited to minimize
quiescent current.
4.2.9
LOW NOISE OPERATION
The MCP1640/B/C/D integrates a low noise anti-ring
switch that damps the oscillations typically observed at
the switch node of a boost converter when operating in
the Discontinuous Inductor Current mode. This
removes the high frequency radiated noise.
4.2.10
OVERTEMPERATURE
PROTECTION
Overtemperature protection circuitry is integrated into
the MCP1640/B/C/D. This circuitry monitors the device
junction temperature and shuts the device off if the
junction temperature exceeds the typical +150oC
threshold. If this threshold is exceeded, the device will
automatically restart when the junction temperature
drops by 10oC. The soft start is reset during an
overtemperature condition.
The enable pin is used to turn the boost converter on
and off. The enable threshold voltage varies with input
voltage. To enable the boost converter, the EN voltage
level must be greater than 90% of the VIN voltage. To
disable the boost converter, the EN voltage must be
less than 20% of the VIN voltage.
 2011 Microchip Technology Inc.
DS22234B-page 13
MCP1640/B/C/D
NOTES:
DS22234B-page 14
 2011 Microchip Technology Inc.
MCP1640/B/C/D
5.0
APPLICATION INFORMATION
5.1
Typical Applications
The MCP1640/B/C/D synchronous boost regulator
operates over a wide input and output voltage range.
The power efficiency is high for several decades of load
range. Output current capability increases with input
voltage and decreases with increasing output voltage.
The maximum output current is based on the N-Channel peak current limit. Typical characterization curves in
this data sheet are presented to display the typical output current capability.
5.2
Adjustable Output Voltage
Calculations
To calculate the resistor divider values for the
MCP1640/B/C/D, the following equation can be used.
Where RTOP is connected to VOUT, RBOT is connected
to GND and both are connected to the FB input pin.
EQUATION 5-1:
R
TOP
= R
 VOUT

  ---------------- – 1
BOT  V

FB
Example A:
VOUT = 3.3V
VFB = 1.21V
RBOT = 309 k
RTOP = 533.7 k (Standard Value = 536 k)
5.3
Input Capacitor Selection
The boost input current is smoothed by the boost
inductor reducing the amount of filtering necessary at
the input. Some capacitance is recommended to
provide decoupling from the source. Low ESR X5R or
X7R are well suited since they have a low temperature
coefficient and small size. For most applications,
4.7 µF of capacitance is sufficient at the input. For high
power applications that have high source impedance or
long leads, connecting the battery to the input 10 µF of
capacitance is recommended. Additional input
capacitance can be added to provide a stable input
voltage.
Table 5-1 contains the recommended range for the
input capacitor value.
5.4
Output Capacitor Selection
The output capacitor helps provide a stable output
voltage during sudden load transients and reduces the
output voltage ripple. As with the input capacitor, X5R
and X7R ceramic capacitors are well suited for this
application.
The MCP1640/B/C/D is internally compensated so
output capacitance range is limited. See Table 5-1 for
the recommended output capacitor range.
While the N-Channel switch is on, the output current is
supplied by the output capacitor COUT. The amount of
output capacitance and equivalent series resistance
will have a significant effect on the output ripple
voltage. While COUT provides load current, a voltage
drop also appears across its internal ESR that results
in ripple voltage.
Example B:
VOUT = 5.0V
EQUATION 5-2:
VFB = 1.21V
I
RBOT = 309 k
OUT
= C
OUT
dV
  -------
 dt 
RTOP = 967.9 k (Standard Value = 976 k)
There are some potential issues with higher value
resistors. For small surface mount resistors,
environment contamination can create leakage paths
that significantly change the resistor divider that effect
the output voltage. The FB input leakage current can
also impact the divider and change the output voltage
tolerance.
Where dV represents the ripple voltage and dt
represents the ON time of the N-Channel switch (D * 1/
FSW).
Table 5-1 contains the recommended range for the
input and output capacitor value.
TABLE 5-1:
CAPACITOR VALUE RANGE
CIN
 2011 Microchip Technology Inc.
COUT
Min
4.7 µF
10 µF
Max
none
100 µF
DS22234B-page 15
MCP1640/B/C/D
5.5
Inductor Selection
The MCP1640/B/C/D is designed to be used with small
surface mount inductors; the inductance value can
range from 2.2 µH to 10 µH. An inductance value of
4.7 µH is recommended to achieve a good balance
between inductor size, converter load transient
response and minimized noise.
TABLE 5-2:
Part Number
MCP1640/B/C/D
RECOMMENDED INDUCTORS
Value DCR
(µH)  (typ)
ISAT
(A)
Size
WxLxH
(mm)
Coilcraft®
EPL2014-472
4.7
0.23
1.06
2.0x2.0x1.4
EPL3012-472
4.7
0.165
1.1
3.0x3.0x1.3
MSS4020-472
4.7
0.115
1.5
4.0x4.0x2.0
LPS6225-472
4.7
0.065
3.2
6.0x6.0x2.4
SD3110
4.7
0.285
0.68
3.1x3.1x1.0
SD3112
4.7
0.246
0.80
3.1x3.1x1.2
SD3114
4.7
0.251
1.14
3.1x3.1x1.4
SD3118
4.7
0.162
1.31
3.8x3.8x1.2
SD3812
4.7
0.256
1.13
3.8x3.8x1.2
SD25
4.7
0.0467
1.83
5.0x5.0x2.5
Value
(µH)
DCR

(max)
ISAT
(A)
Size
WxLxH
(mm)
Coiltronics®
Part Number
Several parameters are used to select the correct
inductor: maximum rated current, saturation current
and copper resistance (ESR). For boost converters, the
inductor current can be much higher than the output
current. The lower the inductor ESR, the higher the
efficiency of the converter, a common trade-off in size
versus efficiency.
Peak current is the maximum or limit, and saturation
current typically specifies a point at which the inductance has rolled off a percentage of the rated value.
This can range from a 20% to 40% reduction in inductance. As inductance rolls off, the inductor ripple current increases as does the peak switch current. It is
important to keep the inductance from rolling off too
much, causing switch current to reach the peak limit.
5.6
The MCP1640/B/C/D is available in two different
packages, 6-Lead SOT23 and 8-Lead 2x3 DFN. By calculating the power dissipation and applying the package thermal resistance, (JA), the junction temperature
is estimated. The maximum continuous junction
temperature rating for the MCP1640/B/C/D is +125oC.
To quickly estimate the internal power dissipation for
the switching boost regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency, the internal power dissipation is
estimated by Equation 5-3.
EQUATION 5-3:
Wurth Elektronik®
WE-TPC Type
TH
4.7
0.200
0.8
2.8x2.8x1.35
WE-TPC Type
S
4.7
0.105
0.90
3.8x3.8x1.65
WE-TPC Type
M
4.7
0.082
1.65
4.8x4.8x1.8
WE-TPC Type
X
4.7
0.046
2.00
6.8x6.8x2.3
Value
(µH)
DCR

(max)
ISAT
(A)
Size
WxLxH
(mm)
CMH23
4.7
0.537
0.70
2.3x2.3x1.0
CMD4D06
4.7
0.216
0.75
3.5x4.3x0.8
CDRH4D
4.7
0.09
0.800
4.6x4.6x1.5
B82462A2472
M000
4.7
0.084
2.00
6.0x6.0x2.5
B82462G4472
M
4.7
0.04
1.8
6.3x6.3x3.0
Part Number
Sumida®
EPCOS®
DS22234B-page 16
Thermal Calculations
V
I
OUT OUT
 ------------------------------------– V
I
 = P
 Efficiency 
OUT OUT
Dis
The difference between the first term – input power,
and the second term – power delivered, is the internal
MCP1640/B/C/D power dissipation. This is an estimate, assuming that most of the power lost is internal
to the MCP1640/B/C/D and not CIN, COUT and the
inductor. There is some percentage of power lost in the
boost inductor, with very little loss in the input and output capacitors. For a more accurate estimation of internal power dissipation, subtract the IINRMS2*LESR power
dissipation.
5.7
PCB Layout Information
Good printed circuit board layout techniques are
important to any switching circuitry; and, switching
power supplies are no different. When wiring the
switching high current paths, short and wide traces
should be used. Therefore it is important that the input
and output capacitors be placed as close as possible to
the MCP1640/B/C/D to minimize the loop area.
 2011 Microchip Technology Inc.
MCP1640/B/C/D
The feedback resistors and feedback signal should be
routed away from the switching node and the switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.
Via to GND Plane
RBOT RTOP
+VIN
+VOUT
CIN
L
MCP1640
1
GND
GND
FIGURE 5-1:
COUT
Via for Enable
MCP1640/B/C/D SOT23-6 Recommended Layout.
Wired on Bottom
Plane
L
+VIN
+VOUT
COUT
CIN
GND
MCP1640
RTOP
1
RBOT
Enable
GND
FIGURE 5-2:
MCP1640/B/C/D DFN-8 Recommended Layout.
 2011 Microchip Technology Inc.
DS22234B-page 17
MCP1640/B/C/D
NOTES:
DS22234B-page 18
 2011 Microchip Technology Inc.
MCP1640/B/C/D
6.0
TYPICAL APPLICATION CIRCUITS
L1
4.7 µH
MANGANESE LITHIUM
DIOXIDE BUTTON CELL
+
2.0V TO 3.2V
-
VOUT
5.0V @ 5 mA
SW V
OUT
VIN
CIN
4.7 µF
976 K
VFB
EN
COUT
10 µF
309 K
®
FROM PIC MCU I/O
Note:
FIGURE 6-1:
GND
For applications that can operate directly from the battery input voltage during Sleep mode and
require a higher voltage during Normal Run mode, the MCP1640C device provides input to output bypass when disabled. The PIC® microcontroller is powered by the output of the MCP1640C.
One of its I/O pins is used to enable and disable the MCP1640C to control its bias voltage. While
operating in Sleep mode, the MCP1640C input quiescent current is typically less than 1 uA.
Manganese Lithium Coin Cell Application Using Bypass Mode.
L1
10 µH
VIN
3.3V To 4.2V
LI-ION
+
-
FIGURE 6-2:
CIN
10 µF
SW V
VOUT
5.0V @ 350 mA
OUTS
VIN
VOUTP
EN
VFB
976 K
COUT
10 µF
309 K
PGND SGND
USB On-The-Go Powered by Li-Ion.
 2011 Microchip Technology Inc.
DS22234B-page 19
MCP1640/B/C/D
NOTES:
DS22234B-page 20
 2011 Microchip Technology Inc.
MCP1640/B/C/D
7.0
PACKAGING INFORMATION
7.1
Package Marking Information (Not to Scale)
6-Lead SOT-23
Example
XXNN
BZNN
Package Marking
MCP1640
BZNN
MCP1640C
BXNN
MCP1640B
BWNN
MCP1640D
BYNN
8-Lead DFN
Example
XXX
YWW
NN
AHM
945
25
Package Marking
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
MCP1640
AHM
MCP1640C
AHQ
MCP1640C
AHP
MCP1640D
AHR
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2011 Microchip Technology Inc.
DS22234B-page 21
MCP1640/B/C/D
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DS22234B-page 22
 2011 Microchip Technology Inc.
MCP1640/B/C/D
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011 Microchip Technology Inc.
DS22234B-page 23
MCP1640/B/C/D
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DS22234B-page 24
 2011 Microchip Technology Inc.
MCP1640/B/C/D
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011 Microchip Technology Inc.
DS22234B-page 25
MCP1640/B/C/D
NOTES:
DS22234B-page 26
 2011 Microchip Technology Inc.
MCP1640/B/C/D
APPENDIX A:
REVISION HISTORY
Revision B (March 2011)
The following is the list of modifications:
1.
2.
Updated Table 5-2.
Added the package markings tables
Section 7.0 “Packaging Information”.
in
Revision A (February 2010)
Original release of this document.
 2011 Microchip Technology Inc.
DS22234B-page 27
MCP1640/B/C/D
NOTES:
DS22234B-page 28
 2011 Microchip Technology Inc.
MCP1640/B/C/D
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
X
X
/XX
Device
Tape
and Reel
Temperature
Range
Package
Device
MCP1640:
MCP1640T:
MCP1640B:
MCP1640BT:
MCP1640C:
MCP1640CT:
MCP1640D:
MCP1640DT:
0.65V, PWM/PFM True Disconnect,
Sync Boost Regulator
0.65V, PWM/PFM True Disconnect,
Sync Boost Regulator (Tape and Reel)
0.65V, PWM Only True Disconnect,
Sync Boost Regulator
0.65V, PWM Only True Disconnect,
Sync Boost Regulator (Tape and Reel)
0.65V, PWM/PFM Input to Output Bypass,
Sync Boost Regulator
0.65V, PWM/PFM Input to Output Bypass,
Sync Boost Regulator (Tape and Reel)
0.65V, PWM Only Input to Output Bypass,
Sync Boost Regulator
0.65V, PWM Only Input to Output Bypass,
Sync Boost Regulator (Tape and Reel)
Temperature Range
I
= -40C to
+85C
(Industrial)
Package
CH = Plastic Small Outline Transistor (SOT-23), 6-lead
MC = Plastic Dual Flat, No Lead (2x3 DFN), 8-lead
Examples:
a)
MCP1640-I/MC:
b)
MCP1640T-I/MC:
c)
MCP1640B-I/MC:
d)
MCP1640BT-I/MC:
e)
MCP1640C-I/MC:
f)
MCP1640CT-I/MC:
g)
MCP1640D-I/MC:
h)
MCP1640DT-I/MC:
i)
MCP1640T-I/CHY:
j)
k)
l)
 2011 Microchip Technology Inc.
0.65V, Sync Reg.,
8LD-DFN pkg.
Tape and Reel,
0.65V, Sync Reg.,
8LD-DFN pkg.
0.65V, Sync Reg.,
8LD-DFN pkg.
Tape and Reel,
0.65V, Sync Reg.,
8LD-DFN pkg.
0.65V, Sync Reg.,
8LD-DFN pkg.
Tape and Reel,
0.65V, Sync Reg.,
8LD-DFN pkg.
0.65V, Sync Reg.,
8LD-DFN pkg.
Tape and Reel,
0.65V, Sync Reg.,
8LD-DFN pkg.
Tape and Reel,
0.65V, Sync Reg.,
6LD SOT-23 pkg.
MCP1640BT-I/CHY: Tape and Reel,
0.65V, Sync Reg.,
6LD SOT-23 pkg.
MCP1640CT-I/CHY: Tape and Reel,
0.65V, Sync Reg.,
6LD SOT-23 pkg.
MCP1640DT-I/CHY: Tape and Reel,
0.65V, Sync Reg.,
6LD SOT-23 pkg.
DS22234B-page 29
MCP1640/B/C/D
NOTES:
DS22234B-page 30
 2011 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2011, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-829-0
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2011 Microchip Technology Inc.
DS22234B-page 31
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
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Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
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Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
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Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
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Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
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Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
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Tel: 81-45-471- 6166
Fax: 81-45-471-6122
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Tel: 49-89-627-144-0
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Tel: 678-957-9614
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Tel: 774-760-0087
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Canada
Tel: 905-673-0699
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Tel: 61-2-9868-6733
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Tel: 86-10-8528-2100
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Tel: 86-28-8665-5511
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Tel: 82-53-744-4301
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Tel: 886-7-213-7830
Fax: 886-7-330-9305
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Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
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Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
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Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
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Fax: 31-416-690340
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Fax: 34-91-708-08-91
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Tel: 44-118-921-5869
Fax: 44-118-921-5820
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Tel: 86-592-2388138
Fax: 86-592-2388130
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Tel: 86-756-3210040
Fax: 86-756-3210049
02/18/11
DS22234B-page 32
 2011 Microchip Technology Inc.