MICROCHIP TC115_13

TC115
PFM/PWM Step-Up DC/DC Converter
Features
Package Type
SOT-89-5
• High Efficiency at Low Output Load Currents via
PFM Mode
• Assured Start-up at 0.9V
• 80 µA (Typ) Supply Current
• 85% Typical Efficiency at 100 mA
• 140 mA Typical Output Current @ VIN  2.0V
• Low Power Shutdown Mode
• No External Switching Transistor Needed
• Space-Saving SOT-89 Package
PS
5
4
GND
LX
TC115
NC
PS
1
2
SHDN
3
Applications
General Description
•
•
•
•
•
•
The TC115 is a high-efficiency step-up DC/DC
converter for small, low input voltage or batterypowered systems. This device has a start-up voltage
of 0.9V and a typical supply current of 80 µA. Phase
compensation and soft-start circuitry are included onchip. Unlike conventional PWM step-up converters,
the TC115 automatically shifts to pulse frequency
modulation (PFM) at low loads, resulting in reduced
supply current and improved efficiency.
Pagers
Cellular Phones
Palmtops
1-Cell to 3-Cell Battery Powered Systems
Cameras, Video Recorders
Local +3V to +5V Supplies
The TC115 requires only an external diode, an inductor
and a capacitor, while supporting typical output currents of 140 mA. Supply current is reduced to less than
0.5 µA (max) when SHDN input is brought low.
Small size, low installed cost and low supply current
make the TC115 step-up converter ideal for use in a
wide range of battery-powered systems.
Functional Block Diagram
L1
100 µH
Sumida® CD-54
+
1.5V
+
C1
10 µF
D1
PS
5
4
GND
LX
+3V
OUT
IN5817 +
C2
47 µF
Tantalum
TC115
NC
PS
1
2
SHDN
3
1.5V to +3V, 50 mA Supply
 2002-2012 Microchip Technology Inc.
DS21361D-page 1
TC115
1.0
ELECTRICAL
CHARACTERISTICS
PIN FUNCTION TABLE
Symbol
Description
Absolute Maximum Ratings†
NC
Not connected
Power Supply Voltage (PS) ...............................................12V
PS
Power and voltage sense input
Power Dissipation ......................................................500 mW
SHDN
LX Sink Current......................................................400 mA pk
Shutdown input
LX
SHDN Input Voltage ..........................................................12V
Inductor switch output
GND
Operating Temperature Range........................-40°C to +85°C
Ground terminal
Storage Temperature Range .........................-40°C to +125°C
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VOUT = 5V, TA = +25°C. Circuit configuration is illustrated in Figure 5-1.
Parameters
Operating Supply Voltage
Sym
Min
Typ
Max
Units
Conditions
VIN
0.9
—
10.0
V
Note 5
VSTART
—
—
0.9
V
IOUT = 1 mA
ILXMAX
—
—
350
mA
fLIM
—
200
—
kHz
VLXLIM
0.7
—
1.3
V
Note 2
No Load Supply Current
IDD
—
13
26
µA
IOUT = 0, VIN = VOUT x 0.8 (Note 3)
Boost Mode Supply Current
ICC
—
80
135
µA
No external components,
VIN = (0.95 x VOUT) applied to PS (or
VDD) input
ISTBY
—
9
17
µA
No external components,
VIN = (1.1 x VOUT) applied to PS
(or VDD) input
Start-Up Supply Voltage
LX Maximum Sink Current
LX Limit Frequency
LX Limit Voltage
Standby Supply Current
Shutdown Supply Current
Oscillator Frequency
Output Voltage
LX Output ON Resistance
Duty Cycle
(PFM Operating Mode)
Maximum Duty Cycle
ISD
—
—
0.5
µA
SHDN = 0V
fOSC
85
100
115
kHz
Note 2, Note 4
VOUT
VR x 0.975
VR
VR x 1.025
V
VIN = 2.2V minimum (Note 1)
Rswon
—
1.4
2.4

VLX = 0.4V
PFMDUTY
10
17
25
%
No external components
MAXDUTY
80
87
92
%
Note 4
tSS
4
10
20
msec
h
—
85
—
%
SHDN Input Logic High
VIH
0.75
—
—
V
SHDN Input Logic Low
VIL
—
—
0.20
V
Soft Start Time
Efficiency
Note 1:
2:
3:
4:
5:
VLX = VLXLIM
VR is the nominal factory-programmed output voltage setting.
VLXLIM is the voltage on the LX pin (with internal switch ON) that will cause the oscillator to run at twice nominal
frequency in to limit the switch current through the internal N-channel switching transistor.
Measured with D1 = MA735 (reverse current < 1 µA at a reverse voltage of 10V).
With TC115 operating in PWM mode.
See Section 4.4, “Behavior When VIN is Greater Than the Factory-Programmed VOUT Setting”.
DS21361D-page 2
 2002-2012 Microchip Technology Inc.
TC115
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VOUT = 5V, TA = +25°C.
100
80
2.9
EFFICIENCY (%)
OUTPUT VOLTAGE VOUT (V)
3.1
2.0V
VIN = 1.0V
1.5V
2.7
20
1.5V
L1 = 100 µH
C2 = 47 µF (Tantalum)
0
2.5
0
40
80
120
160
0
200
FIGURE 2-1:
Current.
Output Voltage vs. Output
FIGURE 2-3:
Current.
200
80
120
160
200
Efficiency vs. Output
100
RIPPLE VOLTAGE Vr(mVp-p)
L1 = 100 µH
C2 = 47 µF (Tantalum)
150
100
50
0
1.0
40
OUTPUT CURRENT IOUT (mA)
OUTPUT CURRENT IOUT (mA)
INPUT CURRENT IIN (µA)
VIN = 1.0V
40
L1 = 100 µH
C2 = 47 µF (Tantalum)
L1 = 100 µH
C2 = 47 µF (Tantalum)
80
60
2.0V
1.5V
VIN = 1.0V
40
10
0
1.2
1.4
1.6
1.8
0
2.0
INPUT VOLTAGE VIN (V)
FIGURE 2-2:
Input Voltage.
2.0V
60
No Load Input Current vs.
 2002-2012 Microchip Technology Inc.
40
80
120
160
200
OUTPUT CURRENT IOUT (mA)
FIGURE 2-4:
Current.
Ripple Voltage vs. Output
DS21361D-page 3
TC115
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Symbol
1
NC
Not connected
2
PS
Power and voltage sense input
3
SHDN
4
LX
5
GND
3.2
Shutdown Input (SHDN)
A logic-low on SHDN suspends device operation and
supply current is reduced to less than 0.5 µA. The
device resumes normal operation when SHDN is again
brought high.
Description
Shutdown input
3.3
Inductor Switch Output (LX)
LX is the drain of an internal N-channel switching transistor. This terminal drives the external inductor, which
ultimately provides current to the load.
Inductor switch output
Ground terminal
3.4
Ground Terminal (GND)
Connect to circuit ground.
3.1
Power and Voltage Sense Input
(PS)
PS is a dual function input that provides both feedback
voltage sensing and internal chip power. It should be
connected to the regulator output (See Section 5.0,
“Applications”).
DS21361D-page 4
3.5
No Connect (NC)
No internal connection.
 2002-2012 Microchip Technology Inc.
TC115
4.0
DETAILED DESCRIPTION
4.3
Low Power Shutdown Mode
The TC115 is a combination PFM/PWM step-up
(boost) regulator. It is particularly useful in battery-powered 1, 2 and 3 cell applications where the required output current is 140 mA or less, and size/cost issues are
a concern. The device operates in PWM mode when
the output load is sufficient to demand a 10% (or
greater) duty cycle. While in PWM mode, the TC115
behaves as any other PWM switching regulator to a
maximum duty cycle of 92%. At low output loads (i.e.,
output loads requiring < 10% duty cycle to support), the
TC115 automatically switches to pulse frequency modulation (PFM) operating mode with a fixed duty cycle of
25% (max) (17%, typical). While in PFM mode, the
inductor is modulated with individual fixed width pulses
only as needed to maintain output voltage. This action
reduces supply current, thereby improving power
efficiency at low output loads.
The TC115 enters a low power shutdown mode when
SHDN is brought low. While in shutdown, the oscillator
is disabled and the internal switch is shut off. Normal
regulator operation resumes when SHDN is brought
high. SHDN may be tied to the input supply if not used.
4.1
The TC115 is designed to operate as a step-up
regulator only. As such, VIN is assumed to always be
less than the factory-programmed VOUT setting (VR).
Operating the TC115 with VIN > VR causes regulating
action to be suspended (and corresponding supply
current reduction to 9 µA, typical) until VIN is again less
than VR. While regulating action is suspended, VIN is
connected to VOUT through the series combination of
the inductor and Schottky diode. Care must be taken to
add the appropriate isolation (MOSFET output switch
or post LDO with shutdown) during system design if
this VIN/VOUT leakage path is problematic.
Input Power and Sensing
The TC115 is powered from the PS input, which must
be connected to the regulated output, as shown in
Figure 5-1. PS also senses output voltage for closedloop regulation. Start-up current is furnished through
the inductor when input voltage is initially applied. This
action starts the oscillator, causing the voltage at the
PS input to rise, bootstrapping the regulator into full
operation.
4.2
Output Diode
Note:
4.4
Because the TC115 uses an external
diode, a leakage path between the input
voltage and the output node (through the
inductor and diode) exists while the regulator is in shutdown. Care must be taken in
system design to assure the input supply
is isolated from the load during shutdown.
Behavior When VIN is Greater
Than the Factory-Programmed
VOUT Setting
For best results, use a Schottky diode, such as the
MA735, 1N5817, EC10 or equivalent. Connect the
diode between the PS and LX pins as close to the IC as
possible. While ultra fast diodes can be used, lower efficiency will result due to their higher forward voltage
drop. Ordinary rectifiers should be avoided because of
their slow recovery characteristics.
 2002-2012 Microchip Technology Inc.
DS21361D-page 5
TC115
5.0
5.1
APPLICATIONS
Input Bypass Capacitors
Using an input bypass capacitor reduces peak current
transients drawn from the input supply and reduces the
switching noise generated by the regulator. The source
impedance of the input supply determines the size of
the capacitor that should be used.
The inductor value directly affects the output ripple
voltage. Equation 5-3 is derived as shown below, and
can be used to calculate an inductor value, given the
required output ripple voltage (VRIPPLE) and output
capacitor series resistance:
EQUATION 5-1:
V RIPPLE  ESR  di 
Where:
VIN
+
C1
L1
5
D1
4
GND
VOUT
C2+
1
Expressing di in terms of switch ON resistance and
time:
PS SHDN
2
3
OFF ON
(Tie to VIN or VOUT
if not used)
FIGURE 5-1:
5.2
di: represents the peak to peak ripple
current in the inductor.
LX
TC115
NC
ESR: the equivalent series resistance of the
output filter capacitor; VRIPPLE is in
volts.
TC115 Typical Application.
Inductor Selection
Selecting the proper inductor value is a trade-off
between physical size and power conversion requirements. Lower value inductors cost less, but result in
higher ripple current and core losses. They are also
more prone to saturate since the coil current ramps to
a higher value. Larger inductor values reduce both
ripple current and core losses, but are larger in physical
size and tend to increase the start-up time slightly.
Practical inductor values, therefore, range from 50 µH
to 300 µH. Inductors with a ferrite core (or equivalent)
are recommended. For highest efficiency, use an
inductor with a series resistance less than 0.1).
EQUATION 5-2:
  V IN – V SW t ON 
VRIPPLE  -------------------------------------------L
Where:
VSW = voltage drop across the switch.
TON = the amount of time the switch is ON.
Solving for L:
EQUATION 5-3:
  V IN – VSW t ON 
L  -------------------------------------------V RIPPLE
Care must be taken to ensure the inductor can handle
peak switching currents, which can be several times
load currents. Exceeding rated peak current will result
in core saturation and loss of inductance. The inductor
should be selected to withstand currents greater than
IPK (Equation 5-10) without saturating.
Calculating the peak inductor current is straightforward.
Inductor current consists of an AC (sawtooth) current
centered on an average DC current (i.e., input current).
Equation 5-6 calculates the average DC current. Note
that minimum input voltage and maximum load current
values should be used:
EQUATION 5-4:
Output Power
Input Power = --------------------------------Efficiency
DS21361D-page 6
 2002-2012 Microchip Technology Inc.
TC115
Rewriting in terms of input and output currents and voltages:
EQUATION 5-5:
 VIN
MIN
  I IN
 V OUT   IOUT 
MAX
MAX
 = -------------------------------------------------MAX
Efficiency
Solving for input current:
EQUATION 5-6:
IIN
MAX
 V OUT   I OUT 
MAX
MAX
= --------------------------------------------------- Efficiency   V IN 
MIN
The sawtooth current is centered on the DC current
level, swinging equally above and below the DC current
calculated in Equation 5-6. The peak inductor current is
the sum of the DC current plus half the ac current. Note
that minimum input voltage should be used when
calculating the ac inductor current (Equation 5-9).
EQUATION 5-7:
V L = L  di  dt 
EQUATION 5-8:
di = VL  di  dt 
EQUATION 5-9:
 VIN – VSW t ON
MIN
di = --------------------------------------------L
Where:
VSW = The voltage drop across the internal
N-channel MOSFET.
Combining the DC current calculated in Equation 5-6,
with half the peak ac current calculated in Equation 5-9,
the peak inductor current is given by:
5.3
Internal Transistor Switch
The LX pin has a typical ON resistance of 1.4.
Therefore, peak switch current is given by (VIN/1.4).
The internal transistor switch has a maximum design
rating of 350 mA. An oscillator frequency doubling circuit is an included guard against high switching currents. Should the voltage on the LX pin rise above 1.3V
(max) while the internal N-channel switch is ON, the
oscillator frequency automatically doubles to minimize
ON time. Although reduced, switch current still flows
because the PWM remains in operation. Therefore, the
LX input is not internally current-limited and care must
be taken never to exceed the 350 mA maximum limit.
Failure to observe this will result in damage to the
regulator.
5.4
Output Capacitor
The effective series resistance of the output capacitor
directly affects the amplitude of the output voltage
ripple (The product of the peak inductor current and the
ESR determines output ripple amplitude). Therefore, a
capacitor with the lowest possible ESR should be
selected. Smaller capacitors are acceptable for light
loads (or in applications where ripple is not a concern).
The Sprague® 595D series of tantalum capacitors are
among the smallest of all low ESR surface mount
capacitors available. Table 5-1 lists suggested
components and suppliers.
5.5
Board Layout Guidelines
As with all inductive switching regulators, the TC115
generates fast switching waveforms which radiate
noise. Interconnecting lead lengths should be
minimized to keep stray capacitance, trace resistance
and radiated noise as low as possible. In addition, the
GND pin, input bypass capacitor and output filter
capacitor ground leads should be connected to a single
point.
EQUATION 5-10:
I PK = IIN
TABLE 5-1:
MAX
+ 0.5  di 
SUGGESTED COMPONENTS AND SUPPLIERS
Type
Surface Mount
Through-Hole
Inductors
Capacitors
Sumida®
Matsuo®
CD54 Series
CDR125 Series
Coiltronics™
CTX Series
267 Series
Sprague®
595D Series
Nichicon™
F93 Series
Sumida®
RCH855 Series
RCH110 Series
Renco®
RL1284-12
Sanyo™
OS-CON Series
Nichicon™
PL Series
 2002-2012 Microchip Technology Inc.
Diodes
Nihon
EC10 Series
Matsushita™
MA735 Series
ON Semiconductor®
1N5817 - 1N5822
DS21361D-page 7
TC115
TC115301
VIN = 1.0V
ILOAD = 10 mA
CH1: VOUT (DC)
CH2: VOUT (AC Ripple)
L = 100 µH
C = 47 µF
D1 = MA735
TC115301
VIN = 2.0V
ILOAD = 40 mA
CH1: VOUT (DC)
CH2: VOUT (AC Ripple)
L = 100 µH
C = 47 µF
D1 = MA735
TC115301
VIN = 2.5V
ILOAD = 80 mA
CH1: VOUT (DC)
CH2: VOUT (AC Ripple)
L = 100 µH
C = 47 µF
D1 = MA735
FIGURE 5-2:
DS21361D-page 8
Typical Ripple Waveforms.
 2002-2012 Microchip Technology Inc.
TC115
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
SOT-89-5
5
4
2
4
1
3
1
2
3
1
represents product classification; TC115 = 1
2
represents first integer of voltage and frequency
3
4
Symbol
(100 kHz)
Voltage
1
1.
2
2.
3
3.
4
4.
5
5.
6
6.
represents first decimal of voltage and frequency
Symbol
(100 kHz)
Voltage
0
.0
1
.1
2
.2
3
.3
4
.4
5
.5
6
.6
7
.7
8
.8
9
.9
represents production lot ID code
Example: For TC115331, the marking code is:
3
X
1
3
 2002-2012 Microchip Technology Inc.
DS21361D-page 9
TC115
5-Lead Plastic Small Outline Transistor Header (MT) (SOT-89)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
B1
B1
4
3
B
B2
D1
p1
2
p
2
1
5
B1
B1
L
L
H
E
D
A
C
Units
Dimension Limits
p
Pitch
Outside lead pitch (basic)
Overall Height
Overall Width
Molded Package Width
Overall Length
Tab Width
Foot Length
Lead Thickness
Lead 2 Width
Leads 1,3, 4 & 5 Width
Tab Lead Width
p1
A
H
E
D
D1
L
c
B
B1
B2
INCHES
MIN
MAX
.059 BSC
.118 BSC
.055
.063
.177
.090
.102
.173
.181
.055
.071
.031
.015
.017
.016
.021
.014
.019
.013
.019
MILLIMETERS*
MIN
MAX
1.50 BSC
3.00 BSC
1.40
1.60
4.50
2.29
2.60
4.40
4.60
1.40
1.80
0.80
0.37
0.44
0.41
0.53
0.36
0.48
0.32
0.48
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
Drawing No. C04-030
DS21361D-page 10
 2002-2012 Microchip Technology Inc.
TC115
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
XX
X
X
XXXX
Device
Output
Voltage
Oscillator
Frequency
Temperature
Range
Package
Examples:
a) TC115301EMTTR: 3.0V Converter
b) TC115331EMTTR: 3.3V Converter
c)
Device:
TC115:
Output Voltage:
30
33
50
= 3.0V
= 3.3V
= 5.0V
Oscillator Frequency:
1
= 100 kHz
Temperature Range:
E
= -40°C to +85°C
Package:
MTTR = 5L SOT-89, Tape and Reel
TC115501EMTTR: 5.0V Converter
PFM/PWM Step-Up DC/DC Converter
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002-2012 Microchip Technology Inc.
DS21361D-page 11
TC115
NOTES:
DS21361D-page 12
 2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
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OTHERWISE, RELATED TO THE INFORMATION,
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
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PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
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Company are registered trademarks of Microchip Technology
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Analog-for-the-Digital Age, Application Maestro, BodyCom,
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dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
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All other trademarks mentioned herein are property of their
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© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767474
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2002-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21361D-page 13
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
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Taiwan - Taipei
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UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21361D-page 14
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
10/26/12
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