LESHAN RADIO COMPANY, LTD. 2–Input NAND Gate / CMOS Logic Level Shifter with LSTTL–Compatible Inputs L74VHC1GT00 The L74VHC1GT00 is a single gate 2–input NAND fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The device input is compatible with TTL–type input thresholds and the output has a full 5 V CMOS level output swing. The input protection circuitry on this device allows overvoltage tolerance on the input, allowing the device to be used as a logic–level translator from 3.0 V CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high–voltage power supply. The L74VHC1GT00 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage. This allows the L74VHC1GT00 to be used to interface 5 V circuits to 3 V circuits. The output structures also provide protection when V CC = 0 V. These input and output structures help prevent device destruction caused by supply voltage – input/output voltage mismatch, battery backup, hot insertion, etc. • High Speed: t PD = 3.1 ns (Typ) at V CC = 5 V • Low Power Dissipation: I CC = 2mA (Max) at T A = 25°C • TTL–Compatible Inputs: V IL = 0.8 V; V IH = 2.0 V • CMOS–Compatible Outputs: V OH > 0.8 V CC ; V OL < 0.1 V CC @Load • Power Down Protection Provided on Inputs and Outputs • Balanced Propagation Delays • Pin and Function Compatible with Other Standard Logic Families • Chip Complexity: FETs = 64; Equivalent Gates = 14 MARKING DIAGRAMS 5 4 1 2 VHd 3 SC–70/SC–88A/SOT–353 DF SUFFIX Pin 1 d = Date Code Y Figure 1. Pinout (Top View) 5 4 VHd 1 2 3 SOT–23/TSOP–5/SC–59 DT SUFFIX Figure 2. Logic Symbol Pin 1 d = Date Code FUNCTION TABLE Inputs PIN ASSIGNMENT 1 2 3 4 5 IN B IN A GND OUT Y V CC A L L H H B L H L H Output Y H H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. 1/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT00 MAXIMUM RATINGS Parameter Value Unit – 0.5 to + 7.0 V – 0.5 to +7.0 V V CC=0 – 0.5 to +7.0 V High or Low State –0.5 to V cc + 0.5 I IK Input Diode Current –20 mA I OK Output Diode Current V OUT < GND; V OUT > V CC +20 mA I OUT DC Output Current, per Pin + 25 mA I CC DC Supply Current, V CC and GND +50 mA PD Power dissipation in still air SC–88A, TSOP–5 200 mW θ JA Thermal resistance SC–88A, TSOP–5 333 °C/W TL Lead Temperature, 1 mm from Case for 10 s 260 °C TJ Junction Temperature Under Bias + 150 °C T stg Storage temperature –65 to +150 °C V ESD ESD Withstand Voltage Human Body Model (Note 2) >2000 V Machine Model (Note 3) > 200 Charged Device Model (Note 4) N/A I LATCH–UP Latch–Up Performance Above V CC and Below GND at 125°C (Note 5) ± 500 mA 1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22–A114–A 3. Tested to EIA/JESD22–A115–A 4. Tested to JESD22–C101–A 5. Tested to EIA/JESD78 DC Supply Voltage DC Input Voltage DC Output Voltage RECOMMENDED OPERATING CONDITIONS Symbol Parameter V CC DC Supply Voltage V IN DC Input Voltage V OUT DC Output Voltage TA t r ,t Operating Temperature Range Input Rise and Fall Time f V CC=0 High or Low State V CC = 3.3 ± 0.3 V V CC = 5.0 ± 0.5 V DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 NORMALIZED FAILURE RATE Symbol V CC V IN V OUT Min 3.0 0.0 0.0 0.0 – 55 0 0 Max 5.5 5.5 5.5 V CC + 125 100 20 Unit V V V °C ns/V 1 1 10 100 1000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature 2/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT00 DC ELECTRICAL CHARACTERISTICS V Symbol V IH Parameter Minimum High–Level Test Conditions Input Voltage V IL (V) Min Max Min Max Min 3.0 4.5 1.4 2.0 1.4 2.0 1.4 2.0 5.5 2.0 2.0 2.0 Max Minimum High–Level V IN = V IH or V IL Output Voltage V IN = V IH or V IL I OH = – 50 µA Maximum Low–Level Output Voltage V IN = V IH or V IL Unit V V 3.0 4.5 0.53 0.8 0.53 0.8 0.53 0.8 5.5 0.8 0.8 0.8 V V IN = V IH or V IL I OH = –4 mA V OL Typ T A < 85°C –55°C to 125°C Maximum Low–Level Input Voltage V OH T A = 25°C CC 3.0 4.5 2.9 4.4 3.0 4.0 2.9 4.4 2.9 4.4 3.0 2.58 2.48 2.34 I OH = –8 mA V IN = V IH or V IL 4.5 3.94 3.80 3.66 I OL = 50 µA 3.0 4.5 V 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 V IN = V IH or V IL I OL = 4 mA 3.0 0.36 0.44 0.52 4.5 0 to5.5 0.36 ±0.1 0.44 ±1.0 0.52 ±1.0 µA I IN Maximum Input I OL = 8 mA V IN = 5.5 V or GND I CC Leakage Current Maximum Quiescent V IN = V CC or GND 5.5 2.0 20 40 µA I CCT Supply Current Quiescent Supply Input: V IN = 3.4 V 5.5 1.35 1.50 1.65 mA I OPD Current Output Leakage V OUT = 5.5 V 0.0 0.5 5.0 10 µA Current AC ELECTRICAL CHARACTERISTICS C load = 50 pF, Input t r = t f = 3.0 ns T A = 25°C T A < 85°C –55°C<TA<125°C Symbol Parameter Test Conditions Min Typ Max Min Max Min Max Unit t PLH , Maximum V CC = 3.3± 0.3 V C L = 15 pF 4.1 10.0 11.0 13.0 ns Propagation Delay, C L = 50 pF 5.5 13.5 15.0 17.5 t PHL Input A or B to Y V CC = 5.0± 0.5 V C L = 15 pF C L = 50 pF C IN C PD Maximum Input Capacitance Power Dissipation Capacitance (Note 6) 3.1 3.6 5.5 6.9 7.9 10 8.0 9.0 10 Typical @ 25°C, V CC = 5.0 V 11 9.5 10.5 10 pF pF 6. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD • V CC • f in + I CC . C PD is used to determine the no– load dynamic power consumption; P D = C PD • V CC 2 • f in + I CC • V CC . 3/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT00 Y *Includes all probe and jig capacitance. A 1–MHz square input wave is recommended for propagation delay tests. Figure 5. Test Circuit Figure 4. Switching Waveforms DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number Logic Temp Circuit Range Technology Indicator Identifier Package Type Device Package Tape and Function Suffix Reel Suffix L74VHC1GT00DFT1 L 74 VHC1G T00 DF T1 L74VHC1GY00DFT2 L 74 VHC1G T00 DF T2 L74VHC1GT00DFT4 L 74 VHC1G T00 DF T4 L74VHC1GT00DTT1 L 74 VHC1G T00 DT T1 L74VHC1GT00DTT3 L 74 VHC1G T00 DT T3 (Name/SOT#/ Common Name) SC–70/SC–88A/ SOT–353 SC–70/SC–88A/ SOT–353 SC–70/SC–88A/ SOT–353 SOT–23/TSOPS/ SC–59 SOT–23/TSOPS/ SC–59 Tape and Reel Size 178 mm (7 in) 3000 Unit 178 mm (7 in) 3000 Unit 330 mm (13 in) 10,000 Unit 178 mm (7 in) 3000 Unit 330 mm (13 in) 10,000 Unit 4/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT00 PACKAGE DIMENSIONS SC70−5/SC−88A/SOT−353 DF SUFFIX A G 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 4 DIM A B C D G H J K N S −B− S 1 2 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J C K H SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches 5/6 LESHAN RADIO COMPANY, LTD. L74VHC1GT00 PACKAGE DIMENSIONS SOT23−5/TSOP−5/SC59−5 DT SUFFIX NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. D S 5 4 1 2 3 B L G DIM A B C D G H J K L M S A J C 0.05 (0.002) H M K MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches 6/6