MARKTECH TLGTE1100B

TL(BE,GTE,EGE)1100B(T11)
TLBE1100B(T11), TLGTE1100B(T11), TLEGE1100B(T11)
Panel Circuit Indicator
Unit: mm
•
Surface-mount devices
•
3.2 (L) × 2.8 (W) × 1.9 (H) mm
•
Flat-top type
•
InGaN LEDs
•
High luminous intensity
•
Low drive current, high-intensity light emission
•
Colors:
λd=470nm(typ)
Blue
Bluish Green λd=505nm(typ)
λd=528nm(typ)
Green
•
Pb free reflow soldering is possible
•
Applications: automotive use, message signboards, backlighting
etc.
•
Standard embossed tape packing: T11 (2000/reel)
8-mm tape reel
Color and Material
Product Name
Color
TLBE1100B
Blue
TLGTE1100B
Bluish green
TLEGE1100B
Green
Material
JEDEC
―
JEITA
―
TOSHIBA
4-3R1
Weight: 0.035 g (typ.)
InGaN
Maximum Ratings (Ta = 25°C)
Forward Current
IF (mA)
Please see Note 1
Product Name
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
TLBE1100B
Operation
Temperature
Topr (°C)
Storage
Temperature
Tstg (°C)
−40~100
−40~100
129
30
TLGTE1100B
4
135
TLEGE1100B
132
Note 1: Forward current derating
TLBE1100B
TLGTE1100B,TLEGE1100B
IF – Ta
IF – Ta
40
(mA)
IF
30
Allowable forward current
Allowable forward current
IF
(mA)
40
20
10
0
0
20
40
60
Ambient temperature
80
Ta
30
20
10
0
0
100
(°C)
20
40
60
Ambient temperature
80
Ta
100
(°C)
For part availability and ordering information please call Toll Free: 800.984.5337
Website: www.marktechopto.com | Email: [email protected]
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2006-06-01
TL(BE,GTE,EGE)1100B(T11)
Electrical Characteristics (Ta = 25°C)
Reverse Current
IR
Forward Voltage VF
Product Name
Min
Typ.
Max
TLBE1100B
2.8
3.2
4.3
TLGTE1100B
3.0
3.3
4.5
TLEGE1100B
2.9
3.4
4.4
Unit
V
IF
Max
VR
20
10
4
mA
µA
V
Optical Characteristics–1 (Ta = 25°C)
Product Name
Luminous Intensity IV
Available Iv rank
Min
Typ.
Max
IF
Please see Note 2
TLBE1100B
63
100
320
20
QA / RA / SA
TLGTE1100B
160
300
800
20
SA / TA / UA
RA / SA / TA / UA
TLEGE1100B
100
350
800
20
Unit
mcd
mcd
mcd
mA
Note 2: The specification as following table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Iv rank
Rank symbol
Min
Max
QA
63
125
RA
100
200
SA
160
320
TA
250
500
UA
400
800
Unit
mcd
mcd
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Peak Emission
Wavelength λp
Product Name
Min
Typ.
∆λ
Max
Typ.
Dominant Wavelength λd
Min
Typ.
Max
TLBE1100B
⎯
468
⎯
25
463
470
477
TLGTE1100B
⎯
496
⎯
30
496
505
514
TLEGE1100B
⎯
523
⎯
35
518
528
537
Unit
nm
nm
nm
IF
20
mA
Note 3: Caution
ESD withstand voltage according to MIL STD 883D, Method 3015.7 : ≥1000V
When handling this LED, take the following measures to prevent the LED from being damaged or otherwise
adversely affected.
1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.
2) Operators handling laser diodes must be grounded via a high resistance (about 1MΩ). A conductive strap is
good for this purpose.
3) Ground all tools including soldering irons.
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2006-06-01
TL(BE,GTE,EGE)1100B(T11)
TLBE1100B
IF – V F
IV – IF
(typ.)
100
(typ.)
300
IV (mcd)
50
30
Ta = 25°C
100
50
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
10
5
3
1
2.4
2.6
3.0
3.4
Forward voltage
3.8
4.2
VF
10
5
3
1
4.6
(V)
3
5
10
50
30
Forward current
IV – Tc
10
30
IF
100
(mA)
Relative Iv - λ
(typ.)
(typ.)
1.0
IF = 20 mA
Ta = 25°C
5
0.8
Relative luminosity
Relative luminosity
IV
3
1
0.5
0.3
0.1
−20
0
20
40
Case temperature
60
Tc
80
0.6
0.4
0.2
0
360
100
(°C)
400
440
480
Wavelength
520
λ
560
600
(nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
80°
90°
0
0.2
0.4
0.6
0.8
90°
1.0
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2006-06-01
TL(BE,GTE,EGE)1100B(T11)
TLGTE1100B
IF – V F
IV – IF
(typ.)
100
1000
IV (mcd)
50
30
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
10
5
3
1
2.4
2.6
3.0
3.4
3.8
Forward voltage
VF
4.2
500
300
100
50
30
(V)
3
5
10
30
Forward current
IV – Tc
10
Ta = 25°C
10
1
4.6
(typ.)
IF
50
(mA)
Relative Iv - λ
(typ.)
100
(typ.)
1.0
IF = 20 mA
Ta = 25°C
5
Relative luminosity
Relative luminosity
IV
0.8
3
1
0.5
0.3
0.1
0.6
0.4
0.2
−20
0
20
40
60
Case temperature
Tc
0
400
100
80
(°C)
440
480
560
520
Wavelength
λ
600
640
(nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
90°
80°
0
0.2
0.4
0.6
0.8
90°
1.0
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2006-06-01
TL(BE,GTE,EGE)1100B(T11)
TLEGE1100B
IF – V F
IV – IF
(typ.)
1000
100
IV (mcd)
30
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
50
10
5
3
1
2.4
2.6
3.4
3.0
3.8
Forward voltage
VF
500
300
100
50
30
10
1
4.6
4.2
(V)
3
5
10
30
Forward current
IV – Tc
(typ.)
Ta = 25°C
IF
100
(mA)
Relative Iv - λ
(typ.)
10
(typ.)
1.0
IF = 20 mA
Ta = 25°C
5
0.8
IV
3
Relative luminosity
Relative luminosity
50
1
0.5
0.6
0.4
0.3
0.2
0.1
−20
0
20
40
60
Case temperature
Tc
0
400
100
80
(°C)
440
480
520
Wavelength
560
λ
600
640
(nm)
Radiation pattern
Ta = 25°C
(typ.)
20°
10°
0°
10°
30°
20°
30°
40°
40°
50°
50°
60°
60°
70°
70°
80°
80°
90°
0
0.2
0.4
0.6
0.8
90°
1.0
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2006-06-01
TL(BE,GTE,EGE)1100B(T11)
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
5 s max(*)
10 s max (*)
(*)
(*)
140~160°C max(*)
(*)
4°C/s max(*)
4°C/s max
60~120 s max(*)
Time
•
•
•
•
•
260°C max
Package surface
temperature (°C)
Package surface
temperature (°C)
240°C max
4°C/s max(*)
max(*)
150~180°C 230°C
4°C/s max(*)
max(*)
60~120 s
Time
(s)
30~50s max(*)
(s)
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time
: within 3 s
If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba
sales representative.
Recommended soldering pattern
1.65
1.15
Unit: mm
1.65
2.41
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2006-06-01
TL(BE,GTE,EGE)1100B(T11)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES
KAO CLEAN TROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
: (made by ASAHI GLASS)
: (made by KAO)
: (made by ARAKAWA CHEMICAL)
: (made by GE TOSHIBA SILICONES)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T14 (4-mm pitch)
(2) Example
TLBE1100B (T11)
Tape type
Toshiba product No.
2.
Tape dimensions
Unit: mm
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
1.5
+0.1/−0
P2
2.0
±0.05
E
1.75
±0.1
W
8.0
±0.3
P0
4.0
±0.1
P
4.0
±0.1
t
0.3
±0.05
A0
2.9
±0.1
F
3.5
±0.05
B0
3.7
±0.1
D1
1.5
±0.1
K0
2.3
±0.1
K0
P0
D
t
P2
E
F
W
B0
P
D1
Polarity
A0
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2006-06-01
TL(BE,GTE,EGE)1100B(T11)
3. Reel dimensions
Unit: mm
9 ± 0.3
φ60
2 ± 0.5
φ13
φ44
+0
180 −4
11.4 ± 1.0
4. Leader and trailer sections of tape
40 mm or more
40 mm or more
(Note 1)
(Note 2)
Leading part: 190 mm (min)
Note1: Empty trailer section
Note2: Empty leader section
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2006-06-01
TL(BE,GTE,EGE)1100B(T11)
5. Packing display
(1) Packing quantity
Reel
2,000 pcs
Carton
10,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Example: TLBE1100B (T11)
P/N:
TOSHIBA
TYPE
TLBE1100B
ADDC
(T11)
Q’TY
Lot Number
Key code for TSB
(RANK SYMBOL)
32C
2,000 pcs
2000
Use under 5-30degC/6-%RH within 168h
SEAL DATE:
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y3804xxxxxxxxxxxxxxxxx*
(2) Label location
• Reel
• Carton
Tape feel direction
Label position
Label position
• The aluminum package in which the reel is supplied also has the label attached to
center of one side.
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2006-06-01
TL(BE,GTE,EGE)1100B(T11)
RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
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2006-06-01