TOSHIBA TLEGC1002

TL(BC,EGC)1002(T02)
TOSHIBA LED Lamps
TLBC1002(T02), TLEGC1002(T02)
Panel Circuit Indicator
•
•
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•
•
•
•
•
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•
Unit: mm
Surface-mount devices
2.0 (L) × 1.25 (W) × 1.1 (H) mm
InGaN LEDs
High luminous intensity
Low drive current, high-intensity light emission
Colors:
Blue
λd=472nm (typ)
Green
λd=535nm (typ)
Pb-free reflow soldering is possible
ESD withstand voltage according to MIL STD 883D,
Method 3015.7 : ≧800V
Applications: message signboards, backlighting etc.
Standard embossed tape packing: T02 (3000/reel)
8-mm tape reel
Color and Material
Product Name
Color
TLBC1002
Material
Blue
TLEGC1002
InGaN
Green
JEDEC
―
JEITA
―
TOSHIBA
4-1D1
Weight: 0.002g (typ.)
Absolute Maximum Ratings (Ta = 25°C)
Product Name
Forward Current
IF (mA)
Please see Note 1
Reverse Voltage
VR (V)
Power Dissipation
PD (mW)
Operation
Temperature
Topr (°C)
Storage
Temperature
Tstg (°C)
15
4
63
-40~85
-40~100
TLBC1002
TLEGC1002
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
IF – Ta
Allowable forward current
IF
(mA)
20
15
10
5
0
0
20
40
60
Ambient temperature
80
Ta
100
(°C)
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TL(BC,EGC)1002(T02)
Electrical Characteristics (Ta = 25°C)
Reverse Current
IR
Forward Voltage VF
Product Name
Min
Typ.
Max
TLBC1002
⎯
3.3
4.2
TLEGC1002
⎯
3.3
4.2
Unit
V
IF
Max
VR
10
10
4
mA
μA
V
Optical Characteristics–1 (Ta = 25°C)
Product Name
Luminous Intensity IV
Min
Typ.
Max
TLBC1002
16
45
⎯
TLEGC1002
40
120
⎯
Unit
mcd
IF
10
mA
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Product Name
Peak Emission
Wavelength λp
Min
Typ.
Max
Δλ
Dominant Wavelength λd
Typ.
Min
Typ.
Max
TLBC1002
⎯
470
⎯
25
463
472
480
TLEGC1002
⎯
520
⎯
35
523
535
547
Unit
nm
nm
nm
IF
10
mA
Note: Caution
• This product is designed as a general display light source usage, and it has applied the measurement
standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional
application (ex. Light source for sensor, optical communication and etc) except general display light source.
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TL(BC,EGC)1002(T02)
TLBC1002
IF – V F
IV – IF
(typ.)
100
(typ.)
300
IV (mcd)
30
Ta = 25°C
100
50
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
50
10
5
3
1
2.4
2.6
2.8
3.0
Forward voltage
3.2
VF
3.4
30
10
5
3
1
3.6
(V)
3
5
10
30
Forward current
IV – Tc
IF
1.0
(typ.)
IF = 10 mA
Ta = 25°C
5
0.8
3
Relative luminosity
IV
100
(mA)
Relative luminosity - λ
(typ.)
10
Relative luminosity
50
1
0.5
0.3
0.1
0.6
0.4
0.2
−20
0
20
40
Case temperature
60
Tc
80
0
360
100
(°C)
400
440
480
Wavelength
3
520
560
600
λ (nm)
2007-10-01
TL(BC,EGC)1002(T02)
TLEGC1002
IF – V F
IV – IF
(typ.)
100
(typ.)
300
IV (mcd)
30
Ta = 25°C
100
50
Luminous intensity
Forward current
IF
(mA)
Ta = 25°C
50
10
5
3
1
2.4
2.6
2.8
3.0
Forward voltage
3.2
VF
3.4
30
10
5
3
1
3.6
(V)
3
5
10
30
Forward current
IV – Tc
IF
1.0
(typ.)
IF = 10 mA
Ta = 25°C
5
0.8
3
Relative luminosity
IV
100
(mA)
Relative luminosity - λ
(typ.)
10
Relative luminosity
50
1
0.5
0.3
0.1
0.6
0.4
0.2
−20
0
20
40
Case temperature
60
Tc
80
0
400
100
(°C)
440
480
520
Wavelength
4
560
600
640
λ (nm)
2007-10-01
TL(BC,EGC)1002(T02)
Radiation pattern
Horizontal to polarity
Vertical to polarity
(typ.)
Ta=25˚C
(typ.)
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2007-10-01
TL(BC,EGC)1002(T02)
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/70% RH or below.
When performing lead(Pb)-free soldering, the devices should be assembled within 72 hours in an environment
of 5°C to 30°C/70% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the air tightness would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Package surface
temperature (°C)
10 s max(*)
240°C max(*)
140~160°C max(*)
4°C/s max(*)
4°C/s max(*)
60~120 s max(*)
Time
•
•
•
•
•
(s)
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 70% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time
: within 3 s
Do not perform wave soldering.
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TL(BC,EGC)1002(T02)
•
Reflow soldering (example)
Temperature profile for Pb-free soldering (example)
Package surface
temperature (°C)
5 s max (*)
260°C max(*)
4°C/s max (*)
(*)
150~180°C max 230°C
4°C/s max(*)
(*)
60~120 s max
30~50 s max(*)
Time
•
•
•
•
•
(s)
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 72 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 72 h of the first reflow under the above conditions.
Storage conditions before the second reflow soldering: 30°C, 70% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time
: within 3 s
Do not perform wave soldering.
Recommended soldering pattern
1.2
1.0
Unit: mm
1.2
(1.2)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES
KAO CLEAN TROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
: (made by ASAHI GLASS)
: (made by KAO)
: (made by ARAKAWA CHEMICAL)
: (made by GE TOSHIBA SILICONES)
Precaution when mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
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TL(BC,EGC)1002(T02)
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (However, this method does not apply to products whose
electrical/optical characteristics differ from standard Toshiba specifications)
(1)
(2)
Tape Type: T02 (4-mm pitch)
Example
TLBC1002
(T02)
Tape type
Toshiba product No.
2. Handling precautions
Tape material protected against static electricity. However, static electricity may occur depending on
quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when
peeling a tape cover.
(a) Since tape materials may accumulate an electrostatic charge, use an ionizer to neutralize the ambient
air.
(b) For transport and temporary storage of devices, use containers (boxes and bags) and jigs that are
made of anti-static materials or of materials which dissipate electrostatic charge.
3.
Tape dimensions
Unit: mm
Symbol
Value
Tolerance
Symbol
Value
Tolerance
D
1.50
+0.1/−0
P2
2.00
±0.05
E
1.75
±0.1
W
8.00
±0.3
P0
4.00
±0.1
P
4.00
±0.1
t
0.20
±0.05
A0
1.45
±0.1
F
3.50
±0.05
B0
2.25
±0.1
D1
1.10
±0.1
K0
1.30
±0.05
K0
P0
D
t
P2
E
F
W
B0
P
D1
Polarity
A0
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2007-10-01
TL(BC,EGC)1002(T02)
4.
Reel dimensions
Unit: mm
φ180
+0
−4
11.4 ± 1
9 ± 0.3
φ13 ± 0.5
φ60
φ21 ± 0.8
2 ± 0.5
5. Leader and trailer section of tape
40 mm or more
40 mm or more
(Note 1)
(Note 2)
Leading part 190 mm (min)
Note 1: Empty trailer section
Note 2: Empty leader section
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TL(BC,EGC)1002(T02)
6. Packing display
(1) Packing quantity
Reel
3,000 pcs
Carton
15,000 pcs
(2) Package form: Each reel is sealed in an aluminum pack with silica gel.
7. Label format
(1) Example: TLBC1002 (T02)
P/N:
TOSHIBA
TYPE
TLBC1002
ADDC
(T02)
Q’TY
Lot Number
Key code for TSB
(RANK SYMBOL)
32C
3,000 pcs
3000
Use under 5-30degC/70%RH within 72h
SEAL DATE:
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y3804xxxxxxxxxxxxxxxxx*
(2) Label location
• Reel
• Carton
Tape reel direction
Label position
Label position
• The aluminum package in which the reel is supplied also has a copy of the label
attached to center of one side.
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TL(BC,EGC)1002(T02)
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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