RMT 1MD10-037-08

RMT Ltd
Thermoelectric Module Datasheet
Performance Parameters
ΔTmax
K
Type
Qmax
W
1MD10-037-XX
Imax
A
Umax
V
AC R
Ohm
H
mm
h
mm
0.60
1.65
0.8
1MD10-037-xx (N=37)
1MD10-037-08
72
15.2
5.8
4.5
Performance data are given at 300K, vacuum
Technical Drawing
Options available
A. TEC Assembly:
Solder SnSb (Tmelt=230°C)
C. Ceramics Surface Options
D. Thermistor (optional)
1. Blank ceramics
Can be mounted to cold side
2. Metallized:
ceramics edge. Calibration
2.1 Ni / Sn(Bi)
B. Ceramics:
is available.
2.2 Gold plating
1.Pure Al2O3(100%)
3. Metallized and pre-tinned:
2.Alumina (Al2O3- 96%)
E. Terminal wires
3.1 Solder 94 (PbSnBi, Tmelt=94°C)
1. Pre-tinned Copper
3.2 Solder 117 (In-Sn, Tmelt=117°C)
2. Insulated Wires
3.3 Solder 138 (Sn-Bi, Tmelt=138°C)
100% Al2O3 used as standard
3. Insulated Color Coded
3.4 Solder 183 (Pb-Sn, Tmelt=183°C)
4. Wire Bonding Pads
53 Leninskij prosp. Moscow 119991 Russia, ph: +7-499-132-6817, fax: +7-499-783-3664, web: www.rmtltd.ru
Copyright 2010. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 1 of 2
Performance Plots
1MD10-037-08
C.O.P
Voltage, V
Temperature difference, K
RMT Ltd
Temperature difference, K
Thermoelectric Module Datasheet
Color Legend: Imax, 0.8 Imax, 0.6 Imax, 0.4 Imax
Application Tips
1. Never heat TE module more than 200˚C (TEC
assembled at 230˚C).
2. Never use TE module without attached heat sink
at hot (bottom) side.
3. Connect TE module to DC power supply
according to polarity.
4. Do not apply DC current higher than Imax.
Installation
1. Mechanical Mounting. TEC is placed between two heat exchangers . This construction is fixed by screws or
in another mechanical way. It is suitable for large modules (with dimensions 30x30mm and larger). Miniature
types require other assembling methods in most cases.
2. Soldering. This method is suitable for a TE module with metallized outside surfaces. RMT provides this
option and also makes pre-tinning for TE modules.
3. Glueing. It is an up-to-date method that is used by many customers due to availability of glues with good
thermoconductive properties. A glue is usually based on some epoxy compound filled with some
thermoconductive material such as graphite or diamond powders, silver, SiN and others. The application of
a specific type depends on application features and the type of a TE module.
Object being cooled
Object being cooled
TEC
TEC
1
3
2
Screw mounting
Heatsink
Soldering
Heatsink
Gluing
53 Leninskij prosp. Moscow 119991 Russia, ph: +7-499-132-6817, fax: +7-499-783-3664, web: www.rmtltd.ru
Copyright 2010. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 2 of 2