1-1-1 Linear Regulator ICs SI-3000KS Series Surface-Mount, Low Current Consumption, Low Dropout Voltage Linear Regulator ICs ■Features ■Absolute Maximum Ratings • Compact surface-mount package (SOP8) Parameter (Ta=25°C) Symbol Ratings Unit VIN*1 17 V Output Control Terminal Voltage VC VIN V DC Output Current IO*1 1.0 A • Low circuit current at output OFF Iq ≤ 350 µA (IO = 0 A, VC = 2 V) Power Dissipation PD*1, *2 0.76 W Junction Temperature Tj –40 to +125 °C • Low current consumption Iq (OFF) ≤ 1 µA (VC = 0 V) Storage Temperature Tstg –40 to +125 °C Thermal Resistance (Junction to Ambient Air) θ j-a* θ j-l 130 °C/W 22 °C/W DC Input Voltage • Output current: 1.0 A • Compatible with low ESR capacitor Thermal resistance (Junction to Lead (pin 7)) • Low dropout voltage VDIF ≤ 0.6 V (IO = 1 A) *1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO. Please calculate these values referring to the Copper laminate area vs. Power dissipation data as shown hereinafter. *2: When mounted on a glass epoxy board of 1600 mm2 (copper laminate area 2%). • 3 types of output voltages (2.5 V, 3.3 V, and variable type) available • Output ON/OFF control terminal voltage compatible with LS-TTL • Built-in drooping-type-overcurrent and thermal protection circuits ■Applications • Local power supplies • Battery-driven electronic equipment ■Electrical Characteristics (Ta=25°C, Vc=2 V unless otherwise specified) Ratings Parameter Symbol SI-3012KS (variable type) min. Input Voltage Output Voltage (Reference voltage VADJ for SI-3012KS) VIN 2.4 VO (VADJ) 1.24 Conditions max. min. 1.28 1.32 2.45 Load Regulation Quiescent Circuit Current Circuit Current at Output OFF Temperature Coefficient of Output Voltage Ripple Rejection Overcurrent Protection Starting Current*2 VC Terminal min. 2.50 2.55 3.234 VIN=3.3V, IO=10mA 0.3 Conditions Conditions Conditions 10 VIN=5V, IO=0 to 1A 350 VIN=3.3V, IO=0A, VC=2V 1 VIN=5V, IO=0A, VC=2V 1 1 VIN=3.3V, VC=0V VIN=5V, VC=0V ±0.3 ±0.3 Tj=0 to 100°C (VO=2.5V) Tj=0 to 100°C Tj =0 to 100°C 55 55 55 VIN =3.3V, f=100 to 120HZ (VO=2.5V) VIN=3.3V, f=100 to 120HZ VIN=5V, f=100 to 120HZ RREJ IS1 50 350 VIN=3.3V, VC=0V Conditions Conditions 15 VIN=5 to 10V, IO=10mA VIN=3.3V, IO=0 to 1A VIN=3.3V, IO=0A, VC=2V, R2=24kΩ ∆VO/∆Ta 0.6 40 350 1.2 Conditions ±0.3 1.2 VIN=3.3V (VO=2.5V) Control Voltage (Output OFF) VC, IL 0.8 0.8 0.8 IC, IH 40 40 40 Control Current (Output OFF) IC, IL Conditions 2.0 VC=2V Conditions –5 0 –5 0 –5 0 VC=0V *1: Refer to the Dropout Voltage parameter. *2: The Is1 is specified at the 5% drop point of output voltage VO on the condition that VIN = VO + 1 V, and IO = 10 mA. *3: Output is OFF when the output control terminal VC is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs. 14 ICs mV µA µA A VIN=5V VC, IH 2.0 mV dB Control Voltage (Output ON)*3 Control Current (Output ON) V mV/ °C 1.2 VIN=3.3V 2.0 V IO=1A 10 VIN=3.3V, IO=0 to 1A (VO=2.5V) Conditions V IO=0.5A VIN=3.3 to 8V, IO=10mA 40 Iq (OFF) 3.366 0.4 IO=1A VIN=3.3 to 8V, IO=10mA (VO=2.5V) Iq 3.300 0.6 IO=1A (VO=2.5V) ∆VOLOAD max. VIN=5V, IO=10mA IO=0.5A 0.6 ∆VOLINE typ. 0.4 IO=0.5A (VO=2.5V) Conditions Line Regulation max. *1 VIN=3.3V, IO=10mA Conditions Unit SI-3033KS typ. *1 VDIF Dropout Voltage SI-3025KS typ. V µA µA SI-3000KS Series ■External Dimensions (SOP8) (Unit : mm) 5.1±0.4 1.27 6 5 1 2 3 4 0.5±0.1 7 6.2 4.4±0.2 8 10 ° 1.27 0.10 0.12 M 1.55±0.15 Plastic Mold Package Type Flammability: UL 94V-0 Product Mass: Approx. 0.1 g 0.05±0.05 1.5±0.1 0~ 0.995max. 0.4±0.1 Pin Assignment q VC w VIN e VO r Sence (ADJ for SI-3012KS) t GND y GND u GND i GND 0.15+0.1 –0.05 0.4±0.1 ■Block Diagram ●SI-3012KS ●SI-3025KS, SI-3033KS VIN 2 3 VOUT VIN 2 VC 1 4 ADJ VC 1 3 VOUT 4 Sense TSD - TSD - + + 8 8 7 7 6 REF 6 REF 5 GND 5 GND ■Typical Connection Diagram ●SI-3012KS ●SI-3025KS, SI-3033KS VIN 2 VO 3 R1 + VC GND ADJ 1 4 5 to 8 CIN VIN 2 CO Load CIN VO 3 sense VC GND 4 1 5 to 8 CO Load R2 R2 CIN: Input capacitor (22 µF or larger) CO: Output capacitor (22 µF or larger) For SI-3000KS series, Co has to be a low ESR capacitor. When using the electrolytic capacitor, the SI-3000KS series may oscillate at a low temperature. R1, R2: Output voltage setting resistors The output voltage can be set by connecting R1 and R2 as shown above. The recommended value of R2 is 24 kΩ . R1=(VO–VADJ)÷(VADJ/R2) ■Reference Data Copper Laminate Area vs. Thermal Resistance 140 Copper Laminate Area vs. Power Dissipation Area of PC board : 40×40mm 1.2 Tj=100°C Area of PC board : 40×40mm 1 120 Power dissipation PD (W) Thermal resistance θ j-a (°C/W) Ta=25°C 100 80 Ta=50°C Ta=80°C 0.8 • Obtaining the junction temperature Measure the temperature TL at the lead part of the GND pin (pin 7) with a thermocouple, etc. Then, substitute this value in the following formula to obtain the junction temperature. Tj=PD × θ j–L + TL 0.6 ( θ j–L = 22°C/W) 0.4 60 0.2 40 10 100 Copper laminate area (mm2) (GND terminal) 1000 0 10 100 Copper laminate area (mm2) (GND terminal) 1000 ICs 15 ●SI-3000KS Series ■Example of Solder Pattern Design L L b2 e1 l2 e1 B2 B1 L b e e α e e Symbol e1 e α β1 β2 L b2 l2 Dimensions (mm) 5.72 1.27±0.15 0.2 0.2 to 0.5 0.2 0.6 0.76 L+β1+β2 e e *1 GND pattern b2 8 7 6 5 l2 (Reference value conforming to EIAJ Standard ED-7402-1) e1 *1 The inner frame stage on which a monolithic IC is mounted is directly connected to the GND pins (pins 5 through 8). By expanding the area of the copper connected to the GND pins, the heat radiation can be improved. It is recommended to design the solder pattern by opening the insulation film of the solder patterns of pins 5, 6, 7, and 8, on the wide GND pattern as shown in Figure 1. 1 2 e 3 e 4 e Figure 1 ■Reference Data Thermal resistance vs. Copper area 140 Power dissipation vs. Copper area Area of PC board : 40×40mm 1.2 Tj=100°C Area of PC board : 40×40mm 120 Power dissipation PD (W) Thermal resistance θ j-a (°C/W) Ta=25°C 1 100 80 Ta=50°C Ta=80°C 0.8 0.6 0.4 60 0.2 40 10 100 1000 Copper area (mm2) 0 10 100 Copper area (mm2) 1000 • Calculating junction temperature Measure the temperature TL of the lead of the GND pin (pin 7) by using a thermocouple, and substitute the measured value into the following expression to calculate the junction temperature. Tj=PD × θj–L + TL ( θj–L = 22°C/W) ●SI-3000KS Series ■Taping Specifications Carrier tape Surface resistance of embossed tape: 100 kΩ maximum (among 10 pockets) Leader Vacant seal section IC compartments Vacant seal section Cover tape (Unit : mm) Trailer 160 to 240mm (About 25 pockets) 160 to 240mm (About 25 pockets) 1,000PCS (1,000 pockets) 400 to 600mm 4 2 8 Tape draw-out direction φ1.55 t=3 5.5 12 5.75 5.55 (4.75) 2.1 φ2 7.0 6.7 ° Hole Hole Hole Hole φ 60 φ 180 Hole 0 13±0.3 15.4±1.0 Expanded view of center 2 5 .5 10 4 Hole Hole Hole Hole 5 2 R2 11.9 Hole φ1 φ R2 3 2 φ13±0.2 B 30° 60 φ1 3 60 φ3 ° Hole 1.5 Reel: Number of packed products: 1000 φ 10 Hole 60 ° 3 ° 60 ●SI-3000KS Series ■Typical Characteristics Examples of SI-3012KS and SI-3025KS (Ta=25°C) *Vout=2.5 V for SI-3012KS (RS=24 kΩ) Dropout voltage Rise characteristics 1 Line regulation 3 2.54 2.52 0.8 0.6 0.4 Output voltage V Output voltage V Dropout voltage V 2.50 2 IO=0 to 1A 0.25A step 1 2.48 2.46 IO=0 to 1A 0.25A step 2.44 0.2 2.42 0 0.2 0.4 0.6 Output current A 0.8 1 0 Load regulation 1 2 Input voltage V 3 4 2.40 0 Overcurrent protection characteristics 4 6 Input voltage V 8 10 Input voltage vs. Quiescent current 600 3 2.52 2 IO=0A VC=2V 500 2.48 VIN=3.3V 4V 5V 6V 8V 2.46 2.44 Quiescent Current µ A Output voltage V Output voltage V 2.50 2 VIN=3.3V 4V 5V 6V 1 2.42 2.40 0 400 300 200 100 0.2 0.4 0.6 Output current A 0.8 0 1 Circuit current 0.2 0.4 0.6 0.8 1 1.2 Output current A 1.4 1.6 0 Control terminal voltage vs. Output voltage 4 6 8 10 12 Input voltage V 14 16 18 Control terminal voltage vs. Control terminal current 3 60 2 30 IO=1A 0.75A 20 Control terminal current µ A 40 Output voltage V GND current mA 25 2 IO=0A 1 0.5A 2 4 Input voltage V 15 10 5 0A 0.25A 0 20 6 8 0 0.5 1 1.5 Control ternimal voltage V 2 0 1 2 3 Control terminal voltage V 4 ●SI-3000KS Series ■Typical Characteristics Examples of SI-3033KS (Ta=25°C) Dropout voltage Rise characteristics 1 Line regulation 3.34 4 3.32 0.8 0.6 0.4 3.30 2 Output voltage V Output voltage V Dropout voltage V 3 IO=0 to 1A 0.25A step 3.28 3.26 3.24 IO=0 to 1A 0.25A step 1 0.2 3.22 0 0.2 0.4 0.6 Output current A 0.8 1 0 Load regulation 1 2 Input voltage V 3 3.20 0 4 Overcurrent protection characteristics 10 12 Input voltage vs. Quiescent current 3.32 IO=0A VC=2V 500 Output voltage V 3.28 3.26 VIN=4V 5V 6V 8V 3.24 3.22 3.20 0 0.2 Quiescent Current µ A 3 3.30 Output voltage V 4 6 8 Input voltage V 600 4 3.34 2 VIN=4V 5V 6V 2 1 400 300 200 100 0.4 0.6 Output current A 0.8 0 1 Circuit current 0.2 0.4 0.6 0.8 1 1.2 Output current A 1.4 1.6 0 Control terminal voltage vs. Output voltage 60 2 4 6 8 10 12 Input voltage V 14 16 18 Control terminal voltage vs. Control terminal current 30 4 Control terminal current µ A 25 40 Output voltage V GND current mA 3 IO=1A 0.75A 20 0A IO=0A 2 1 0.5A 20 15 10 5 0.25A 0 2 4 Input voltage V 6 8 0 0.5 1 1.5 Control terminal voltage V 2 0 1 2 3 Control terminal voltage V 4