SEOUL C8WT728

Z-Power LED
X10490
Technical
Data
Sheet
Specification
C8WT728
SSC
Drawn
Approval
CUSTOMER
Approval
Rev. 03
June 2009
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1.
Description
2.
Absolute Maximum Ratings
3.
Electro-Optical Characteristics
4.
Optical characteristics
5.
Reliability Test
6.
Color & Binning
7.
Bin Code Description
8.
Outline Dimension
9.
Reel Structure
10. Packing
11. Soldering
12. Precaution for use
13. Handling of Silicone Resin LEDs
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
C8WT728
1. Description
C8WT728
Features
•
White & Warm colored
SMT package.
TOP VIEW LED is designed for
high current operation and
high flux output applications.
•
High CRI PKG
•
Pb-free Reflow Soldering
Application
•
Furthermore, its thermal management characteristic
assembly methods ;
Suitable for all soldering
is better than other LED solutions by package SMD
design and good thermal emission material.
According to these advantages, it enables to apply
Suitable for all SMT
methods
•
RoHS Compliant
•
MSL LEVEL 2a
various lighting applications and design solution,
automotive lighting etc.
Applications
•
Interior lighting
•
General lighting
•
Indoor and out door
displays
•
Architectural / Decorative
lighting
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
324
mW
Forward Current
IF
90
mA
100
mA
Peak Forward Current
(Per die)
IFM
*2
Reverse Voltage (per die)
VR
5
V
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric & Optical characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage (per die)
VF
IF =20mA
3.0
3.3
3.6
V
Reverse Current (per die)
IR
VR=5V
-
-
10
µA
Luminance Intensity *1
[4,700 ~ 7,000 K]
IV
IF =60mA
4.0
5.2
-
cd
Luminance Intensity *1
[2,600 ~ 4,700 K ]
IV
IF =60mA
4.0
5.0
-
cd
Luminance Flux
[CIE X = 0.31, Y = 0.31]
ΦV
IF =60mA
-
16.5
-
lm
Color Temperature
CCT
7,000
K
Optical Efficiency
Ŋelc
IF =60mA
-
83
-
lm/W
Viewing Angle
2θ½
IF =60mA
-
120
-
deg
Ra
IF =60mA
*2
Color Rendering Index
2,600
83
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[Note] All measurements were made under the standardized environment of SSC.
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SSC-QP-7-07-24 (Rev.00)
Forward Voltage
vs. Forward Current (Per die)
Forward Current
vs. Relative Luminous Intensity
2.5
Relative luminouce Flux [lm]
Forward Current [mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
10
1
2.0
2.5
3.0
3.5
2.0
1.5
1.0
0.5
0.0
4.0
0
50
Forward Voltage[V]
100
150
200
Forward Current IF[mA]
Ambient Temperature
vs. Maximum Forward Current (per die)
Directivity
35
0
Forward Current IF[mA]
30
-30
25
30
20
-60
15
60
10
5
0
-90
-25
0
25
50
75
90
100
O
A m bient tem p erature Ta( C )
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Reliability Test
Item
Reference
Test Conditions
Duration /
Cycle
Number
of
Damaged
Thermal Shock
EIAJ
ED-4701
Ta =-40oC(30min) ~
100oC(30min)
1000
Cycle
0/22
High Temperature
Storage
EIAJ
ED-4701
Ta =100oC
1000 Hours
0/22
High Temp. High
Humidity Storage
EIAJ
ED-4701
Ta =60oC, RH=90%
1000 Hours
0/22
Low Temperature
Storage
EIAJ
ED-4701
Ta =-40oC
1000 Hours
0/22
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =60mA
1000 Hours
0/22
High Temperature
High Humidity Life
Test
Internal
Reference
Ta =60oC, RH=90%, IF =60mA
500
Hours
0/22
High Temperature
Life Test
Internal
Reference
Ta =85oC, IF =60mA
Low Temperature
Life Test
Internal
Reference
Ta =-40oC, IF =60mA
1000 Hours
0/22
MIL-STD883D
1KV at 1.5kΩ; 100pF
3 Time
0/22
ESD(HBM)
1000
Hours
0/22
□ CRITERIA FOR JUDGING THE DAMAGE
Item
Symbol
Condition
Forward Voltage
VF
Reverse Current
Luminous Intensity
Criteria for Judgment
MIN
MAX
IF =60mA
(20mA per die)
-
USL*1 × 1.2
IR
VR=5V
-
USL*1 × 2.0
IV
IF =60mA
(20mA per die)
LSL*2 × 0.5
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
0.9
515
0.8
520 525
530
510
535
0.7
540
545
550
555
505
560
0.6
565
570
CIE (y)
500
575
580
585
590
595
600
0.5
0.4
0.3
0.2
0.1
0.0
0.0
495
610
620
630
830
490
485
480
475
470
460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
CI E(x)
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
0.44
ENERGY STAR RANK
(7000K~2600K)
0.42
0.40
CIE Y
0.38
0.36
0.34
0.32
2700K2600K
2900K
3000K
3200K
H1 H3
G3
3500K
G1
3700K
F3
H4
H2
4000K
F1
G4
E3
G2
4200K
F4
4500K
E1
F2
4700K
D3
E4
5000K
D1 E2
5300K C3
D4
C1 D2
5600K
C4
6000K
C2
B2
6500K
B1
Z
7000K
A2
A1
Y
X
0.30
0.28
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
CIE X
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
● COLOR RANK
<IF=60mA, Ta=25℃>
7000 ~ 6500 K
A1
CIE X
CIE Y
6500 ~ 6000 K
A2
CIE X
CIE Y
6000 ~ 5600 K
B1
CIE X
CIE Y
5600 ~ 5300 K
B2
CIE X
CIE Y
0.3028
0.3068
0.3145
0.3117
0.3117
0.3145
0.3221
0.3205
0.3207
0.3222
0.3294
0.3292
0.3292
0.3294
0.3366
0.3376
0.3304
0.3113
0.3187
0.3393
0.3393
0.3187
0.3261
0.3481
0.3462
0.3243
0.3306
0.3539
5300 ~ 5000 K
C1
CIE X
0.3376
0.3371
0.3451
0.3463
5000 ~ 4700 K
C2
CIE Y
0.3616
0.349
0.3554
0.3687
CIE X
0.3371
0.3366
0.344
0.3451
C3
CIE Y
0.349
0.3369
0.3428
0.3554
CIE X
0.3463
0.3451
0.3533
0.3551
C4
CIE Y
0.3687
0.3554
0.362
0.376
7000 ~ 6000 K
X
CIE X
CIE Y
6000 ~ 5300 K
Y
CIE X
CIE Y
5300 ~ 4700 K
Z
CIE X
CIE Y
0.3104
0.3068
0.3221
0.3234
0.3234
0.3222
0.3366
0.3365
0.3365
0.3366
0.3515
0.35
0.294
0.3113
0.3261
0.3105
0.3539
0.3306
0.3369
0.3616
0.3105
0.3243
0.3369
0.3258
CIE X
0.3451
0.344
0.3515
0.3533
CIE Y
0.3554
0.3428
0.3487
0.362
0.3258
0.3369
0.3487
0.34
● A~C, X~Z -> CCT 4700 ~ 7000 K
Rev. 03
June 2009
* Measurement Uncertainty of the Color Coordinates : ± 0.01
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
● COLOR RANK
<IF=60mA, Ta=25℃>
4700 ~ 4500 K
D1
D2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3548
0.3529
0.3615
0.3641
0.3641
0.3615
0.3702
0.3736
0.3804
0.3659
0.3722
0.3874
0.3615
0.359
0.367
0.3702
0.3659
0.3521
0.3578
0.3722
0.3736
0.3597
0.3659
0.3804
0.3529
0.3512
0.359
0.3615
0.3597
0.3465
0.3521
0.3659
4500 ~ 4200 K
D3
4200 ~4000 K
E1
4000 ~ 3700 k
E2
CIE X
0.3736
0.3702
0.3825
0.3869
CIE Y
0.3874
0.3722
0.3798
0.3958
CIE X
0.3702
0.367
0.3783
0.3825
E3
CIE Y
0.3722
0.3578
0.3646
0.3798
CIE X
0.3869
0.3825
0.395
0.4006
E4
CIE Y
0.3958
0.3798
0.3875
0.4044
3700 ~ 3500 K
F1
D4
CIE X
0.3825
0.3783
0.3898
0.395
CIE Y
0.3798
0.3646
0.3716
0.3875
3500 ~ 3200 K
F2
F3
F4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3996
0.3941
0.408
0.4146
0.4015
0.3848
0.3916
0.4089
0.3941
0.3889
0.4017
0.408
0.3848
0.369
0.3751
0.3916
0.4146
0.408
0.4221
0.4299
0.4089
0.3916
0.3984
0.4165
0.408
0.4017
0.4147
0.4221
0.3916
0.3751
0.3814
0.3984
3200 ~3000 K
G1
CIE X
0.4299
0.4221
0.4342
0.443
3000 ~ 2900 k
G2
CIE Y
0.4165
0.3984
0.4028
0.4212
CIE X
0.4221
0.4147
0.4259
0.4342
G3
CIE Y
0.3984
0.3814
0.3853
0.4028
CIE X
0.443
0.4342
0.4465
0.4562
G4
CIE Y
0.4212
0.4028
0.4071
0.426
CIE X
0.4342
0.4259
0.4373
0.4465
CIE Y
0.4028
0.3853
0.3893
0.4071
2900 ~ 2700 K
H1
H2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4562
0.4465
0.4582
0.4687
0.4687
0.4582
0.47
0.4813
0.4289
0.4099
0.4126
0.4319
0.4582
0.4483
0.4593
0.47
0.4099
0.3919
0.3944
0.4126
0.426
0.4071
0.4099
0.4289
0.4465
0.4373
0.4483
0.4582
0.4071
0.3893
0.3919
0.4099
2700 ~ 2600 K
H3
● D~H -> CCT 2600 ~ 4700 K
H4
Rev. 03
June 2009
* Measurement Uncertainty of the Color Coordinates : ± 0.01
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7. Bin Code Description
Bin Code
Luminous Intensity [mcd]
Color Rank
Forward Voltage [V]
M0
A1
Z1
4,700K
4,700K ~ 7,000K
Color Rank
@ IF = 60mA
Luminous Intensity [mcd]
@ IF = 60mA
Average for Total
Forward Voltage [V]
@ IF = 60mA
RANK
Min.
Max.
A1
A2
M0
4,000
4,500
B1
B2
RANK
Min.
Max.
M5
4,500
5,000
C1
C2
Z1
3.0
3.1
N0
5,000
5,500
C3
C4
Z2
3.1
3.2
N5
5,500
6,000
X
Y
Z3
3.2
3.3
P0
6,000
6,500
Z
A1
3.3
3.45
A2
3.45
3.6
2,600K
2,600K ~ 4,700K
Color Rank
@ IF = 60mA
D1
D2
D3
D4
E1
E2
E3
E4
F1
F2
F3
F4
G1
G2
G3
G4
H1
H2
H3
H4
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
8.Outline Dimension
Package Outlines
Package
Marking
(Cathode)
6
5
4
1
2
3
Front View
Right View
Rear View
( Tolerance: ±0.2, Unit: mm )
Circuit Diagram
R ecom m ended
S o ld e r P a d
White Anode
5
6
W1
W2
1
4
W3
2
3
White Cathode
* MATERIALS
PARTS
MATERIALS
Package
Heat-Resistant Polymer
Encapsulating Resin
Silicone Resin
Electrodes
Ag Plating Copper Alloy
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SSC-QP-7-07-24 (Rev.00)
1.75±0.1
,-0
0.1
.5+
?1
4±0.1
2±0.05
5.3
8±0.1
5.7±0.1
12.0±0.2
(4.75)
5.5±0.05
0.3-0.05
2.1±0.1
Package
Marking
15.4±1.0
180
13±0.3
2
60
Z-Power LED
X10490
Technical
Data
Sheet
9. Reel Structure
22
13
( Tolerance: ±0.2, Unit: mm )
1)Quantity : 1,000pcs/Reel
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10 to the carrier tape
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
10. Packing
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
c
a
b
245 220 102
7inch
245 220 142
TYPE
1 SIDE
c
TUV
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
MADE IN KOREA
Acriche
1
Semiconductor EcoLight
b
RoHS
a
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
11. Soldering
(1) Lead Solder
Lead Solder
Lead Solder
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time Condition
10 sec. Max.
2.5~5 o C / sec.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-free Solder
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time Condition
10 sec. Max.
1~5 oC / sec.
1~5 oC / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter,
the picking up nozzle that does not affect the silicone resign should be used.
[Note] In case that the soldered products are reused in soldering process, we don’t guarantee the products.
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
12. Precaution for use
1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator)
with a desiccant. Otherwise, to store them in the following environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 65%RH
2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light
transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
3) In the case of more than 4 week passed after opening or change color of indicator on desiccant,
components shall be dried 10-12hr. at 60±5ºC.
4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temperature after soldering.
5) Quick cooling shall be avoided.
6) Components shall not be mounted on warped direction of PCB.
7) Anti radioactive ray design is not considered for the products.
8) This device should not be used in any type of fluid such as water, oil, organic solvent etc.
When washing is required, IPA should be used.
9) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more
after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage.
11) The LEDs must be soldered within seven days after opening the moisture-proof packing.
12) Repack unused products with anti-moisture packing, fold to close any opening and then store
in a dry place.
13) The appearance and specifications of the product may be modified for improvement without notice.
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
13. Handling of Silicone Resin LEDs
1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
3) When populating boards in SMT production, there are basically no restrictions regarding the form of the
pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions
must be considered during the handling of such devices. Compared to standard encapsulants, silicone is
generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution
must be applied to the surface after the
soldering of components.
5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
6) Please do not mold this product into another resin (epoxy, urethane, etc) and
do not handle this product with acid or sulfur material in sealed space.
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SSC-QP-7-07-24 (Rev.00)