Specification C8WT803

Z-Power LED
X10490
Technical
Data
Sheet
Specification
C8WT803
SSC
Drawn
Approval
CUSTOMER
Approval
April 2013
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1.
Description
2.
Absolute Maximum Ratings
3.
Electro-Optical Characteristics
4.
Optical characteristics
5.
Reliability Test
6.
Color & Binning
7.
Bin Code Description
8.
Outline Dimension
9.
Reel Structure
10. Packing
11. Soldering
12. Precaution for use
13. Handling of Silicone Resin LEDs
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
C8WT803
1. Description
C8WT803
Features
•
This surface-mount
LED comes in standard
package dimension.
It has a substrate made up
of a molded plastic reflector
sitting on top of a bent lead frame.
The die is attached within the reflector cavity
and the cavity is encapsulated by silicone.
White colored SMT
package.
•
Pb-free Reflow Soldering
Application
•
Suitable for all SMT
assembly methods ;
Suitable for all soldering
methods
•
RoHS Compliant
The package design coupled with careful
selection of component materials allow these
products to perform with high reliability.
Applications
•
Interior lighting
•
General lighting
•
Indoor and out door
displays
•
Architectural / Decorative
lighting
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
Parameter
[1]
Symbol
Value
Unit
Power Dissipation
Pd
111
mW
Forward Current
IF
30
mA
Operating Temperature
Topr
-40~+85
℃
Storage Temperature
Tstg
-40~+100
℃
Junction Temperature
Tj
125
℃
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
* LED’s properties might be different from suggested values like above and below tables if operation condition
will be exceeded our parameter range.
3. Electro-Optical characteristics
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
VF
IF=20mA
2.9
3.2
3.4
V
IR
VF=5V
-
-
10
μA
Iv
IF=20mA
-
1,800
-
Mcd
Color Correlated Temperature
CCT
IF=20mA
2,600
-
7,000
K
Viewing Angle [2]
2Θ1/2
IF=20mA
-
115
-
deg.
Ra
IF=20mA
75
80
-
-
1.5kΩ;100p
F
1
-
-
KV
Forward Voltage
Reverse Voltage
[1]
Luminous Intensity*
Color Rendering Index*
ESD (HBM)
Thermal resistance
[3]
RthJS
IF=20mA
ºC/W
76
[1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package.
[2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[3] Thermal resistance: RthJS (Junction / solder)
* Tolerance : VF :±0.1V, IV :±10%, Ra :±3, x,y :±0.01
[Note] All measurements were made under the standardized environment of SSC.
April 2013
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SSC-QP-7-07-24 (Rev.00)
Forward Voltage
vs. Forward Current
Forward Current
vs. Relative Luminous Intensity
30
1.4
25
Forward Current IF [mA]
Ta=25℃
Ta=25℃
Relative Luminous Intensity [%]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
20
15
10
5
0
2.6
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.8
3.0
3.2
3.4
0
10
20
30
Forward Current IF [mA]
Forward Voltage VF [V]
Forward Current
vs. Chromaticity Coordinate
Directivity
Ta=25℃
0.360
Ta=25℃
0.355
30mA
60mA
90mA
0.350
0
y
120mA
150mA
180mA
210mA
240mA
300mA
270mA
0.345
-30
-60
30
60
0.340
0.335
0.30
0.31
0.32
0.33
0.34
0.35
0.36
-90
90
x
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
Relative Light Output
vs. Junction Temperature
Forward Voltage Shift
vs. Junction Temperature
IF=20mA
1.0
1.0
0.8
0.8
Relative Light Output
Relative Forward Voltage
IF=20mA
0.6
0.4
0.2
0.0
30
0.6
0.4
0.2
45
60
75
90
105
0.0
30
120
O
45
60
75
90
105
120
O
Junction temperature Tj( C)
Junction tem perature Tj( C)
Junction Temperature (℃)
vs. Chromaticity Coordinate
IF=20mA
0.315
0.310
25
40
0.305
y
60
80
0.300
100
0.295
120
0.290
0.285
0.285
0.290
0.295
0.300
0.305
0.310
0.315
x
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
Ambient Temperature
vs. Maximum Forward Current
35
25
F
Forward Current I [mA]
30
20
15
10
5
0
-2 5
0
25
50
75
100
O
A m b ie n t te m p e r a tu r e T a ( C )
Spectrum
Ta=25℃, IF=20mA
2600~3700K
3700~4700K
4700~7000K
Relative Emission Intensity
1.0
0.5
0.0
300
400
500
600
700
800
Wavelength [nm]
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Reliability Test
Item
Reference
Test Conditions
Duration /
Cycle
Number
of
Damaged
Thermal Shock
EIAJ
ED-4701
Ta =-40oC(30min) ~
100oC(30min)
100 Cycle
0/22
High Temperature
Storage
EIAJ
ED-4701
Ta =100oC
1000 Hours
0/22
High Temp. High
Humidity Storage
EIAJ
ED-4701
Ta =60oC, RH=90%
1000 Hours
0/22
Low Temperature
Storage
EIAJ
ED-4701
Ta =-40oC
1000 Hours
0/22
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =20mA
1000 Hours
0/22
High Temperature
High Humidity Life
Test
Internal
Reference
Ta =60oC, RH=90%, IF =20mA
500 Hours
0/22
High Temperature
Life Test
Internal
Reference
Ta =85oC, IF =20mA
500 Hours
0/22
Low Temperature
Life Test
Internal
Reference
Ta =-40oC, IF =20mA
1000 Hours
0/22
ESD(HBM)
MIL-STD883D
1KV at 1.5kΩ; 100pF
3 Time
0/22
Reflow
Tsol
260℃< 10sec. Reflow
Soldering
3 Time
0/22
□ CRITERIA FOR JUDGING THE DAMAGE
Criteria for Judgment
Item
Symbol
Condition
Forward Voltage
VF
Luminous Intensity
IV
MIN
MAX
IF =20mA
-
USL [1] × 1.2
IF =20mA
LSL [2] × 0.7
-
Note : [1] USL : Upper Standard Level
[2] LSL : Lower Standard Level
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
0.44
Energy Star Rank
2900K
0.42
G0
F1
4000K
4200K
CIE Y
0.38
4700K
D1
D0
5000K
C1
5300K
0.36
B1
6000K
B0
0.34
C0
5600K
6500K
7000K
A0
A2
0.32
A1
A3
C2
D2
C3
D4
D3
F3
E3
H1
H3
H2
G3
G5
H4
H5
G4
F2
E0
E2
G2
F0
E1
H0
G1
3500K
3700K
4500K
2600K
3000K
3200K
0.40
2700K
F5
F4
E5
E4
D5
C5
B3 C4
B2 B5
B4
A5
A4
0.30
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
CIE X
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
● COLOR RANK
<IF=20mA, Ta=25℃>
A0
A1
A2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3028
0.3304
0.3115
0.3393
0.3041
0.324
0.3041
0.324
0.3126
0.3324
0.3055
0.3177
0.3126
0.3324
0.321
0.3408
0.3136
0.3256
0.3115
0.3393
0.3205
0.3481
0.3126
0.3324
A3
A4
A5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3126
0.3324
0.3055
0.3177
0.3136
0.3256
0.3136
0.3256
0.3068
0.3113
0.3146
0.3187
0.3216
0.3334
0.3146
0.3187
0.3221
0.3261
0.321
0.3408
0.3136
0.3256
0.3216
0.3334
B0
B1
B2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3207
0.3462
0.3292
0.3539
0.3212
0.3389
0.3212
0.3389
0.3293
0.3461
0.3217
0.3316
0.3293
0.3461
0.3373
0.3534
0.3293
0.3384
0.3292
0.3539
0.3376
0.3616
0.3293
0.3461
B3
B4
B5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3293
0.3461
0.3217
0.3316
0.3293
0.3384
0.3293
0.3384
0.3222
0.3243
0.3294
0.3306
0.3369
0.3451
0.3294
0.3306
0.3366
0.3369
0.3373
0.3534
0.3293
0.3384
0.3369
0.3451
April 2013
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
● COLOR RANK
<IF=20mA, Ta=25℃>
C0
C1
C2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3376
0.3616
0.3463
0.3687
0.3373
0.3534
0.3373
0.3534
0.3456
0.3601
0.3369
0.3451
0.3456
0.3601
0.3539
0.3669
0.3448
0.3514
0.3463
0.3687
0.3552
0.376
0.3456
0.3601
C3
C4
C5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3456
0.3601
0.3369
0.3451
0.3448
0.3514
0.3448
0.3514
0.3366
0.3369
0.344
0.3428
0.3526
0.3578
0.344
0.3428
0.3514
0.3487
0.3539
0.3669
0.3448
0.3514
0.3526
0.3578
D0
D1
D2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3548
0.3736
0.3641
0.3804
0.3536
0.3646
0.3536
0.3646
0.3625
0.3711
0.3523
0.3555
0.3625
0.3711
0.3714
0.3775
0.3608
0.3616
0.3641
0.3804
0.3736
0.3874
0.3625
0.3711
D3
D4
D5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3625
0.3711
0.3523
0.3555
0.3608
0.3616
0.3608
0.3616
0.3511
0.3465
0.359
0.3521
0.3692
0.3677
0.359
0.3521
0.367
0.3578
0.3714
0.3775
0.3608
0.3616
0.3692
0.3677
April 2013
* Measurement Uncertainty of the Color Coordinates : ± 0.01
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
● COLOR RANK
<IF=20mA, Ta=25℃>
E0
E1
E2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3736
0.3874
0.3869
0.3958
0.3714
0.3775
0.3714
0.3775
0.3842
0.3855
0.3692
0.3677
0.3842
0.3855
0.397
0.3935
0.3813
0.3751
0.3869
0.3958
0.4006
0.4044
0.3842
0.3855
E3
E4
E5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3842
0.3855
0.3692
0.3677
0.3813
0.3751
0.3813
0.3751
0.367
0.3578
0.3783
0.3646
0.3934
0.3825
0.3783
0.3646
0.3898
0.3716
0.397
0.3935
0.3813
0.3751
0.3934
0.3825
F0
F1
F2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3996
0.4015
0.4146
0.4089
0.396
0.3907
0.396
0.3907
0.4104
0.3978
0.3925
0.3798
0.4104
0.3978
0.4248
0.4048
0.4062
0.3865
0.4146
0.4089
0.4299
0.4165
0.4104
0.3978
F3
F4
F5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4104
0.3978
0.3925
0.3798
0.4062
0.3865
0.4062
0.3865
0.3889
0.369
0.4017
0.3751
0.4198
0.3931
0.4017
0.3751
0.4147
0.3814
0.4248
0.4048
0.4062
0.3865
0.4198
0.3931
April 2013
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
● COLOR RANK
<IF=20mA, Ta=25℃>
G0
G1
G2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4299
0.4165
0.443
0.4212
0.4248
0.4048
0.4248
0.4048
0.4374
0.4093
0.4198
0.3931
0.4374
0.4093
0.4499
0.4138
0.4317
0.3973
0.443
0.4212
0.4562
0.426
0.4374
0.4093
G3
G4
G5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4374
0.4093
0.4198
0.3931
0.4317
0.3973
0.4317
0.3973
0.4147
0.3814
0.4259
0.3853
0.4436
0.4015
0.4259
0.3853
0.4373
0.3893
0.4499
0.4138
0.4317
0.3973
0.4436
0.4015
H0
H1
H2
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4562
0.426
0.4687
0.4289
0.4499
0.4138
0.4499
0.4138
0.462
0.4166
0.4436
0.4015
0.462
0.4166
0.474
0.4194
0.4551
0.4042
0.4687
0.4289
0.481
0.4319
0.462
0.4166
H3
H4
H5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.462
0.4166
0.4436
0.4015
0.4551
0.4042
0.4551
0.4042
0.4373
0.3893
0.4483
0.3919
0.4666
0.4069
0.4483
0.3919
0.4593
0.3944
0.474
0.4194
0.4551
0.4042
0.4666
0.4069
April 2013
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7. Bin Code Description
Bin Code
Luminous Intensity
Color Rank
Forward Voltage
J8
G1
Z1
2,600K ~ 7,000K
Luminous Intensity [mcd]
*[1]
@ IF = 20mA
Flux *[2]
[lm]
Color Rank
@ IF = 20mA
Forward Voltage [V]
@ IF = 20mA
RANK
Min.
Max.
Typ.
J4
1,400
1,500
3.9
RANK
Min.
Max.
J5
1,500
1,600
4.2
Y3
2.9
3.0
J6
1,600
1,700
4.4
Z1
3.0
3.1
J7
1,700
1,800
4.7
Z2
3.1
3.2
J8
1,800
1,900
5.0
Z3
3.2
3.3
J9
1,900
2,000
5.3
A1
3.3
3.4
K0
2,000
2,100
5.5
K1
2,100
2,200
5.8
K2
2,200
2,300
6.1
K3
2,300
2,400
6.4
Available ranks
K4
2,400
2,500
6.6
Not yet available ranks
A~H
CCT
IV Rank
4700~
7000 K
J4
J5
J6
J7
J8
J9
K0
K1
K2
K3
K4
3700~
4700 K
J4
J5
J6
J7
J8
J9
K0
K1
K2
K3
K4
2600~
3700 K
J4
J5
J6
J7
J8
J9
K0
K1
K2
K3
K4
[Note] All measurements were made under the standardized environment of SSC.
In order to ensure availability, single color rank will not be orderable.
[1] Classification criteria : Luminous intensity IV
[2] Please use for only reference.
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
8.Outline Dimension
Package Outlines
Front View
Side View
Circuit Diagram
Recommended Solder Pattern
( Tolerance: ±0.2, Unit: mm )
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
9. Reel Structure
Package
Marking
( Tolerance: ±0.2, Unit: mm )
1)Quantity : 3,000pcs/Reel
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10 to the carrier tape
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
10. Packing
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
TYPE
SIZE (mm)
ⓐ
ⓑ
ⓒ
7inch 245
220
102
245
220
142
1 SIDE
ⓒ
①
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
ⓑ
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
ⓐ
April 2013
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SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
11. soldering
(1) Lead Solder
Lead Solder
Lead Solder
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time Condition
10 sec. Max.
2.5~5 o C / sec.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-free Solder
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time Condition
10 sec. Max.
1~5 oC / sec.
1~5 oC / sec.
Pre-heating
150~200 oC
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter, the picking up nozzle that does not affect the silicone
resign should be used.
(5) It is recommended that the customer use the nitrogen reflow method.
(6) Repairing should not be done after the LEDs have been soldered.
(7) Reflow soldering should not be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.
[Note] In case that the soldered products are reused in soldering process, we don’t guarantee the products.
April 2013
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
12. Precaution for use
1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator)
with a desiccant. Otherwise, to store them in the following environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light
transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
3) In the case of more than 1 week passed after opening or change color of indicator on desiccant,
components shall be dried 10-12hr. at 60±5ºC.
4) Silver plating might be tarnished in the environment that contains corrosive gases and materials.
Also any product that has tarnished lead might be decreased the solder-ability and optical-electrical
properties compare to normal ones.
Please do not expose the product in the corrosive environment during the storage.
5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temperature after soldering.
6) Quick cooling shall be avoided.
7) Components shall not be mounted on warped direction of PCB.
8) Anti radioactive ray design is not considered for the products.
9) This device should not be used in any type of fluid such as water, oil, organic solvent etc.
When washing is required, IPA should be used.
10) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
11) The LEDs must be soldered within seven days after opening the moisture-proof packing.
12) Repack unused products with anti-moisture packing, fold to close any opening and then store
in a dry place.
13) The appearance and specifications of the product may be modified for improvement without notice.
14) Please note the information contained herein is subject to change.
SSC reserves the right to modify or change the design of LED package inside structure without prior
notice unless optical performance changes.
15) We recommend using solder paste composed of AgCuSn, because pastes that contain Bi or B might
cause color change of Ag during surface mount technology.
April 2013
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
13. Handling of Silicone Resin LEDs
1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
3) When populating boards in SMT production, there are basically no restrictions regarding the form of the
pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions
must be considered during the handling of such devices. Compared to standard encapsulants, silicone is
generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution
must be applied to the surface after the
soldering of components.
5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
6) Please do not mold this product into another resin (epoxy, urethane, etc) and
do not handle this product with acid or sulfur material in sealed space.
April 2013
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)