规格书编号 SPEC NO : 产品规格书 SPECIFICATION CUSTOMER 客 户： PRODUCT 产 品： SAW FILTER MODEL NO 型 号： HDBF19900A22 PREPARED 编 制： CHECKED 审 核： APPROVED 批 准： D A T E 日 期： 客户确认 CUSTOMER RECEIVED: 审核 CHECKED 批准 APPROVED 日期 DATE 无锡市好达电子有限公司 Shoulder Electronics Limited www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 1 of 6 SAW FILTER HDBF19900A22 更改历史记录 History Record 更改日期 Date www.shoulder.cn 规格书编号 Spec No 产品型号 Part No 客户产品型号 Customer No Tel:0755-82916880 Fax:0755-82916881 更改内容描述 Modify Content E-mail:[email protected] 备注 Remark Page 2 of 6 SAW FILTER HDBF19900A22 1. SCOPE This specification shall cover the characteristics of SAW filter with the page system. HDBF19900A22 used for 2. ELECTRICAL SPECIFICATION Maximum incident power in passband Max.DC voltage between any 2 terminals Storage temperature range Operation temperature range Suitable for lead-free soldering-Max.soldering profile +15dBm 30VDC -40℃ to +85℃ -10℃ to +85℃ 260℃ for 30s Electronic Characteristics Parameter Center Frequency Insertion Loss 1dB Bandwidth Amplitude Ripple over f0±100KHz f0-800 to f0-600KHz and f0+600 to f0+800KHz f0-30MHz to f0-800KHz f0+800KHz to f0+17MHz f0-80MHz to f0-30MHz f0+17MHz to f0+80MHz Group Delay Variation overf0±100KHz Frequency Temperature coefficient www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 Minimum ±100 20 28 28 35 35 - Typical 199.0 0.032 E-mail:[email protected] Maximum 7 0.5 500 Unit MHz dB KHz dB dB dB dB dB dB nsec ppm/°C Page 3 of 6 SAW FILTER HDBF19900A22 TEST CIRCUIT www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 4 of 6 SAW FILTER HDBF19900A22 4.DIMENSION Dimension A B C D E H P min 8.9 6.9 0.72 mm typ 9.1 7.1 0.9 0.8 0.76 2.54 max 9.3 7.3 1.5 0.80 Pin Configuration 2 Input 7 Output Other Ground www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 5 of 6 SAW FILTER HDBF19900A22 5. ENVIRONMENTAL CHARACTERISTICS 5-1 Temperature cycling Subject the device to a low temperature of -40℃for 30 minutes. Following by a high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30 Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the measurement. It shall meet the specifications in table 1. 5-2 Resistance to solder heat Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec. Then release the device into the room conditions for 4 hours. It shall meet the specifications in table 1. 5-3 Solderability Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the soldering pad must be covered with new solder. It shall meet the specifications in table 1. 5-4 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the filter shall fulfill the specifications in table 1. 5-5 Vibration Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in table 1. 6. REMARK 6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component. www.shoulder.cn Tel:0755-82916880 Fax:0755-82916881 E-mail:[email protected] Page 6 of 6