AVAGO HSDL-9100-001

HSDL - 9100
Surface-Mount Proximity Sensor
Data Sheet
Description
Features
The HSDL-9100 is an analog-output reflective sensor with
an integrated high efficiency infrared emitter and photodiode housed in a small form factor SMD package. The
optical proximity sensor is housed in a specially designed
metal-shield to ensure excellent optical isolation resulting
in low optical cross-talk.
• Excellent optical isolation resulting in near zero optical
cross-talk
HSDL-9100 is a class of its own with its small form SMD
package and at a detection range from near zero to 60mm.
It is specifically optimized for size, performance and ease of
design in mobile constrained applications such as mobile
phones and notebooks.
• High efficiency emitter and high sensitivity photodiode
for high signal-to-noise ratio
• Low cost & lead-free miniature surface-mount
package
Height – 2.70 mm
Width – 2.75 mm
Length – 7.10 mm
• Detect objects from near zero to 60mm
HSDL-9100 has extremely low dark current and high
signal to noise ratio (SNR) where high SNR is achieved
with a pair of highly efficient infrared emitter and highly
sensitive detector.
• Low dark current
Application Support Information
Applications
The Application Engineering Group is available to assist
you with the application design associated with HSDL-9100
Proximity Sensor. You can contact them through your local
sales representatives for additional details.
• Mobile phones
• Guaranteed Temperature Performance
-40°C to 85°C
• Lead-free and RoHS Compliant
• Notebooks
• Industrial Control
• Printers, Photocopiers and Facsimile machines
• Home Appliances
• Vending Machines
Order Information
Part Number
Packaging Type
Package
Quantity
HSDL-9100-001
Tape and Reel
PCB Substrate, moulded package
500
HSDL-9100-021
Tape and Reel
PCB Substrate, moulded package
2500
Block Layout
Pins Configuration Table
Photodiode
LED
Pin
Symbol
Description
Notes
1
LED_A
DET_K
1
LED_A
LED Anode
1
LED_K
DET_A
2
LED_K
LED Cathode
-
3
DET_A
Photodiode Anode
-
4
DET_K
Photodiode Cathode
-
TOP VIEW
Figure 1. Block Layout of HSDL-9100
Notes:
Voltage to supply across the LED; VLED
Absolute Maximum Ratings (Ta=25°C)
Ratings
Parameter
Symbol
Min.
Max
Units
Emitter
Continuous Forward Current
IDC
-
100
mA
Coupled
Total Power Dissipation (refer to Figure 1)
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
PTOT
TOP
TSTG
TSOL
-40
-40
-
165
+85
+100
260
mW
°C
°C
°C
Electrical-Optical Characteristics (Ta=25°C)
Ratings
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
Emitter
Forward Voltage
Reverse Voltage
Peak Wavelength
Spectrum Width of Half Value
VF
VR
lp
Dp
IF = 100mA
IR = 10uA
IF = 20mA
IF = 20mA
5
-
1.50
940
50
1.65
-
V
V
nm
nm
Detector
Dark Current
Forward Voltage
Reverse Breakdown Voltage
IDark
VF
VBR
VR = 10V, L**
=0
IF = 10mA , L=0
IR = 100uA, L
=0
0.5
-
2
-
10
1.3
35
nA
V
V
IO
Refer to Fig 2
Refer Note 1
Refer to Fig 3
RL = 50W
RL = 50W
RL = 5.1KW
RL = 5.1KW
-
0.1
5
50
50
6
6
200
-
mA
mm
nA
ns
ns
ms
ms
Coupled
Output Current
Peak Output Distance
Operating Cross Talk Current
Rise Time (LED)
Fall Time (LED)
Rise Time (Photodiode)
Fall Time (Photodiode)
DO
IFD
TRL
TFL
TRD
TRD
** L = 0 (zero light condition)
Note:
1. ILed = 300mA Pulse, 5% Duty Cycle (Kodak 18% Reflectance Gray Card)
Output Current Test Condition (Ta=25°C)
Dark Current Test Condition (Ta=25°C)
LIGHT SEALED DARK BOX
D
KODAK GRAY CARD
1% REFLECTION
LED
PHOTODIODE
IF
LED
IO
IF
PHOTODIODE
IDARK
Figure 2.
Test Condition used are D = 5mm 18% Gray Card,
ILED = 300mA Pulse, 5% Duty Cycle
Figure 3.
Test Condition used are ILED = 300mA Pulse, 5% Duty Cycle
Response Time Test Condition (Ta=25°C)
mm
KODAK GRAY CARD
1% REFLECTION
LED
IF
PHOTODIODE
0%
IO
R LED
PULSE
GENERATOR
RL
Figure 4. Response Time Test Condition
INPUT
OUTPUT
10%
SCOPE
TR
TF
Typical Characteristics
Power Dissipation Vs Temperature
00
0
10
0
10
0
10
0
10
Power (mW)
Forward Current
LED Forward Current Vs Temperature
100
0
0
100
0
0
0
0
0
10
0
0
0
0
10
0
0
0
0
0
0
0
0
0
10
0
0
Temperature (˚C)
LED Forward Current Vs Forward Voltage @ Across Temperature
-
0.1
1
-
.0E
0
Forward Current (A)
0.1
Forward Current (A)
E
0.0
0.0
0.0
0.0
10
0
0
(Photodiode) Forward Current Vs Forward [email protected] Temp
-
-
.0E
-
.0E
0
-
.0E
0
-
.0E
0
0
0
0.
0.
0.
0.
1
1.
1.
+0
.0E 0
1.
0
00
Forward Voltage (V)
Forward Current (A) Vs Temperature (degC) @Vcc=1V and 1.V
0.1
+
0.0
0.0
0.0
1V
0.0
1.V
0.0
0.0
0.0
0.01
0
-0
-0
0
0
0
Temperature (˚C)
0
0
100
Response Time (us)
0.0
Forward Current (A)
0
0
0.0
0
0
0
Temperature (˚C)
E
1.0 0
+
.0 0E 0
0 E+
0.0 0
0 E+
0.0 0
0 E+
0.0 0
0 E+
0.0 0
0 E+
.0
0
0 E+0
0.0 0
0 E+
0.0
0 E+0
0.0 0
10 E+ 0.1
0.0
00
0.
0.
0.
0.
1
Forward Voltage (V)
1.
1.
1.
(Photodiode) Rise/Fall Time Vs Load [email protected] Temp,
ILED=00mA Pulse
(Rise
(Fall)
Mean
(Fall)
1
10
100
Load Resistance (kohm)
1000
10000
1.0
E
(Photodiode) Dark Current Vdet = //V vs Across Temperature
Output Voltage vs Distance @ Room Temp and RL = 100K
Ohm ILED = 100mA, 00mA and 00mA Pulse
V
E+
1.0
V
00mA
00mA
100mA
1.0
E
10
.0E
-
Output Voltage (mV)
Dark Current (A)
10
0.0
E
V
-0
-0
0
0
0
0
0
.0E
10
0
E+
1.0
mm
mm
mm
00
00
10 0 0 0 0 0 0 100 10 00 00 0
Distance (mm)
The diagram below illustrates the explanation of edge
distance. Edge detection is labeled as D in the diagram
below.
Output Voltage Vs Edge Distance @ Room Temp
and RL=100K Ohm ILED=00mA, D=//mm
00
Output Voltage (mV)
0
+0
100
Temperature (˚C)
1000
+0
.0E
0
10
00
00
00
00
1% Reflection
Gray Card
00
100
0
-10
-
-
-
-
0
Edge Distance (mm)
Distance = D(mm)
LED
Distance = -D(mm)
PIN
mm
.0
Mounting Centre
.
Tx
0.1
.
Rx
1.
.
.
1.
1.1
R1
R0.
HSDL-9100 Package Outline
UNIT: mm
Tolerance: ± 0.mm
0.
.
.
.
.
.
0.
.1
1.1
LED Cathode
0.
.
Photodiode Anode
LED Anode
Figure 5. Package outline dimensions
0.
Photodiode Cathode
1.55±0.05
1.75
Rx Anode
Tx Cathode
2±0.1
4±0.1
B
7.5
Rx Cathode
Tx Anode
1.5
2.78±0.07
16
7.35±0.1
B-B Section
0.35
5˚ (MAX)
HSDL-9100-021 Tape and Reel Dimensions
8±0.1
A
A
2.95±0.1
B
PROGRESSIVE DIRECTION
EMPTY
PARTS MOUNTED
UNIT: MM
LEADER
(400 mm MIN.)
(40 mm MIN.)
EMPTY
(40 mm MIN.)
OPTION #
"B"
"C"
QUANTITY
001
178
60
500
021
330
80
2500
UNIT: mm
DETAIL A
2.0 ± 0.5
B
C
16.4
+2
0
� 13.0 ±
� 0.5
�
R 1.0
LABEL
DETAIL A
Figure 6. Tape and Reel Dimensions
21 ±
� 0.8
�
2.0 ±
� 0.5
�
HSDL-9100 Moisture Proof Packaging
Baking Conditions Chart
All HSDL-9100 options are shipped in moisture proof package. Once opened, moisture absorption begins.
Units in A Sealed
Moisture-Proof
Package
This part is compliant to JEDEC Level 4.
Baking Conditions
If the parts are not stored in dry conditions, they must be
baked before reflow to prevent damage to the parts.
Package
In reels
In bulk
Temp
Time
60 °C
≥ 48hours
100 °C
≥ 4hours
125 °C
≥ 2 hours
150 °C
≥ 1 hour
Baking should only be done once.
Environment
less than deg C,
and less than
0% RH
Yes
No Baking
Is Necessary
Package Is
Opened less
Than hours
Yes
No
Perform Recommended
Baking Conditions
Recommended Storage Conditions
STORAGE
TEMPERATURE
10°C to 30°C
Relative Humidity
below 60% RH
Time from unsealing to soldering
After removal from the bag, the parts should be soldered
within three days if stored at the recommended storage
conditions.
Package Is
Opened (Unsealed)
Figure 7. Baking conditions chart
No
Recommended Reflow Profile
The reflow profile is a straight-line representation of a
nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four
process zones, each with different DT/Dtime temperature
change rates. The DT/Dtime rates are detailed in the above
table. The temperatures are measured at the component
to printed circuit board connections.
In process zone P1, the PC board and HSDL-9100 castellation pins are heated to a temperature of 160°C to activate
the flux in the solder paste. The temperature ramp up rate,
R1, is limited to 4°C per second to allow for even heating
of both the PC board and HSDL-9100 castellations.
Process zone P2 should be of sufficient time duration (60
to 120 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder,
usually 200°C (392°F).
Process zone P4 is the cool down after solder freeze. The
cool down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum.
This limitation is necessary to allow the PC board and HSDL9100 castellations to change dimensions evenly, putting
minimal stresses on the HSDL-9100 transceiver.
MAX 0C
T - TEMPERATURE (˚C)
Process zone P3 is the solder reflow zone. In zone P3, the
temperature is quickly raised above the liquidus point of
solder to 255°C (491°F) for optimum results. The dwell time
above the liquidus point of solder should be between 20
and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder
and the formation of good solder connections. Beyond a
dwell time of 60 seconds, the intermetallic growth within
the solder connections becomes excessive, resulting in
the formation of weak and unreliable connections. The
temperature is then rapidly reduced to a point below the
solidus temperature of the solder, usually 200°C (392°F), to
allow the solder within the connections to freeze solid.
R
0
0
00
10
R
0 sec
MAX
Above 0 C
10
R1
10
R
R
0
0
P1
HEAT
UP
100
0
10
P
SOLDER PASTE DRY
P
SOLDER
REFLOW
00
0
P
COOL DOWN
00
t-TIME
(SECONDS)
Figure 8. Reflow graph
Process Zone
D
T
Maximum T/time
D
Heat Up
P1, R1
25°C to 160°C
4°C/s
Solder Paste Dry
P2, R2
160°C to 200°C
0.5°C/s
P3, R3P3, R4
200°C to 255°C (260°C at 10 seconds max)
255°C to 200°C
4°C/s
-6°C/s
P4, R5
200°C to 25°C
-6°C/s
Solder Reflow
Cool Down
Symbol
D
Recommended land pattern
Appendix A:
HSDL-9100 SMT Assembly Application Note
Component
placement
0.
FIDUCIAL
FIDUCIAL
Recommended Metal solder Stencil Aperture
It is recommended that only a 0.152 mm (0.006 inch) or a
0.127 mm (0.005 inch) thick stencil be used for solder paste
printing. This is to ensure adequate printed solder paste
volume and no shorting. See Table 1 below the drawing for
combinations of metal stencil aperture and metal stencil
thickness that should be used. Aperture opening for shield
pad is 3.05 mm x 1.1 mm as per land pattern.
Table 1. Combinations of metal stencil aperture and
metal stencil thickness
Aperture size (mm)
Stencil
thickness,
t (mm)
Length,
l
Width,
w
0.152
1.60+/-0.05
0.55+/-0.05
0.127
1.92
0.55+/-0.05
Adjacent Land Keep out and Solder Mask Areas
Adjacent land keep out is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The minimum
solder resist strip width required to avoid solder bridging adjacent pads is 0.2mm.It is recommended that two
fiducial crosses be placed at mid length of the pads for
unit alignment. Also do take note that there should not
be any electrical routing with the component placement
compartment.
1.
0.
1.
Mounting Center
.
.
Figure 10. Recommended land pattern
t
Apertures as per
Land Dimensions
l
w
Figure 11. Solder stencil aperture
Dim.
mm
h
4.15
l
11
k
5.5
j
3.5
k
Component placement
j
Note:
Wet/Liquid Photo-imaginable solder resist/mask is recommended
h
Solder Pad, Mask and Metal Stencil
Metal stencil for
solder paste printing
Mounting Center
Solder Mask
Stencil Aperture
l
Land Pattern
Solder Mask
PCBA
Figure 9. Stencil and PCBA
10
Figure 12. Keep-out area
Appendix B: General Application Guide for the HSDL-9100
Description
Interface to the Recommended I/O chip
The Proximity sensor has several possible applications for
multimedia product, Automation, and Personal handled.
The proximity sensor is basically made up of the emitter
(infrared LED) and detector (photodiode). The block diagram of the sensor is shown in Figure 13. The emitter will
emit IR light pulse. This light travels out in the field of view
and will either hit an object or continue. No light will be
reflected when no object is detected. On the other hand,
the detector will detect the reflected IR light when it hits
the object.
The HSDL-9100 is general interface with the GPIO pin of
the controller chipset. The LED_A, pin1 is connected to the
PWM port alternatively the external timer circuitry can be
used to drive the LED. The DET_K, pin 4 is interface to the
signal conditioning before driving the GPIO port.
Figure 14 shows the hardware reference design with
HSDL-9100.
Photodiode
Photodiode
anode
LED
cathode
1
Photodiode
cathode
LED
anode
LED
Figure 13. Proximity sensor block diagram
(refer to Pins Configuration Table)
Key Pad
STN/TFT LCD Panel
LCD Control
Touch Panel
Peripherial
interface
A/D
IrDA
interface
Mobile Application
chipset
Memory Expansion
Logic Bus Driver
AC
sound
PCM Sound
IS
Audio Input
Memory I/F
Baseband
controller
ROM
IR Transceiver
Power Management
GPIO
PWM
Antenna
FLASH
SDRAM
*IR LED driver
Signal Conditional
HSDL-100
* The LED can be driven by the PWM output or the external timer circuitry.
Figure 14. Mobile Application Platform
11
The next section discusses interfacing configuration with
general processor including the recommended signal
conditional circuitry.
The DET_K pin of HSDL-9100 is connected to the filter
circuit then to the comparator before interfacing with
the GPIO pin. The filter circuit is implement to provide
the ambient light filter. The PWM is pulse to drive the
LED_K pin alternative the external timer 555 can also be
replaced. The detector distance can be varies with the
increase/decrease of the LED current supply.
Interfacing circuitry with signal conditional circuitry
VCC
HSDL-100
LEDA
LEDK
PWM
DETK
DETA
VCC
0 Ohm
VCC
K Ohm
BC
K Ohm
0 pf
10 Ohm
GND
BCB
K Ohm
GND
1M Ohm
VCC GND
k Ohm
GPIO
controller chipset
00 Ohm
GND
Signal conditioning circuitry
Figure 15. HSDL9100 configuration with controller chipset
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5989-3179EN - March 29, 2006