CPC1927 ISOPLUS™-264 Power Relay Parameter Blocking Voltage Load Current, TA=25ºC With 5°C/W Heat Sink No Heat Sink On-resistance RθJC Rating 250 Units VP 6.7 2.7 0.2 0.30 Arms Description Clare and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power Solid State Relays. Ω As part of this family, the CPC1927 single pole normally open (1-Form-A) Solid State Power Relay is rated for up to 6.7Arms continuous load current with a 5ºC/W heat sink. ºC/W Features • • • • • • • • • • 100% Solid State Compact ISOPLUS-264 Power Package Low Thermal Resistance (0.30°C/W) 6.7Arms Load Current with 5°C/W Heat Sink Low Drive Power Requirements Electrically Non-conductive Thermal Pad for Heat Sink Applications Arc-Free With No Snubbing Circuits 2500Vrms Input/Output Isolation No EMI/RFI Generation Machine Insertable, Wave Solderable Applications • • • • • Industrial Controls Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Energy Meters • Transportation Equipment • Aerospace/Defense Pin Configuration The CPC1927 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output is constructed with efficient MOSFET switches and photovoltaic die that use Clare’s patented OptoMOS architecture while the input, a highly efficient GaAlAs infrared LED provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS-264 package pioneered by IXYS allows solid state relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.3 °C/W). Approvals • UL recognized component: File # E69938 • Certified to: UL 508 Ordering Information Part Number CPC1927J Description ISOPLUS-264 (25 per tube) Switching Characteristics of Normally Open (Form A) Devices CONTROL ILOAD + 90% 10%+ RoHS 2002/95/EC e3 DS-CPC1927-R01 TON www.clare.com TOFF 1 CPC1927 Absolute Maximum Ratings Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Isolation Voltage, Input to Output Operational Temperature Storage Temperature Ratings 250 5 100 1 150 2500 -40 to +85 -40 to +125 Units VP V mA A mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical absolute maximum ratings are at 25°C Electrical Characteristics Parameter Output Characteristics Load Current 1 Peak Continuous Continuous Continuous On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current 3 Input Dropout Current Input Voltage Drop Reverse Input Current Common Characteristics Capacitance Input to Output 1 2 3 2 Conditions TA=25°C t ≤ 10ms No Heat Sink TC=25ºC TC=99ºC IF=10mA, IL=1A VL=250V IF=20mA, VL=10V V=25V, f=1MHz TA=25°C IL=1A IF=5mA VR=5V TA=25°C - Symbol Min Typ Max Units AP IL(99) RON ILEAK - 0.15 - 25 2.7 15 3.25 0.2 1 TON TOFF COUT - 12 0.22 1100 25 10 - ms IF IF VF IR 0.6 0.9 - 1.2 - 10 1.4 10 mA mA V µA CI/O - 1 - pF IL - - Arms Ω µA pF Higher load currents are possible with proper heat sinking. Measurement taken within 1 second of on time. For applications requiring high temperature operation (greater than 60oC) an LED drive current of 20mA is recommended. www.clare.com R01 CPC1927 Thermal Characteristics Parameter Thermal Resistance (junction to case) Thermal Resistance (junction to ambient) Junction Temperature (operation) Conditions Free air - Symbol RθJC RθJA TJ Min -40 Typ 33 - Max 0.3 100 Units °C/W °C/W °C Thermal Management Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5°C/W. Heat Sink Calculation Higher load currents are possible by using lower thermal resistance heat sink combinations. Heat Sink Rating RθCA = (TJ - TA) IL(99)2 I 2 L • RθJC - RθJC TJ = Junction Temperature (°C), TJ ≤ 100°C * TA = Ambient Temperature (°C) IL(99) = Load Current with Case Temperature @ 99°C (Arms) IL = Desired Operating Load Current (Arms), IL ≤ IL(MAX) RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) * Elevated junction temperature reduces semiconductor lifetime. R01 www.clare.com 3 CPC1927 PERFORMANCE DATA* 35 25 20 15 10 15 10 0 0 1.31 1.32 1.33 1.34 15 10 0 0.142 0.146 0.150 0.154 0.158 9.5 13.5 14.5 CPC1927 Typical Blocking Voltage Distribution (TA=25ºC) CPC1927 Maximum Load Current vs. Temperature with Heat Sink (IF=20mA) 35 16 30 5 14 25 Load Current (Arms) 10 20 15 10 5 0 0.20 0.21 0.22 0.23 274 0.24 10 6 10ºC/W 4 Free Air 276 278 280 282 286 284 0 0 35 290 30 0.10 0.08 0.06 0.04 0.02 20 40 60 80 285 Turn-On (ms) Blocking Voltage (VP) 295 0.12 280 275 270 265 40 60 80 100 IF = 10mA 25 20 IF = 20mA 15 10 5 260 255 -40 100 20 CPC1927 Typical Turn-On vs. Temperature (IL=1ADC) CPC1927 Blocking Voltage vs. Temperature 0.14 0 5ºC/W 8 Blocking Voltage (VP) CPC1927 Typical Leakage vs. Temperature at Maximum Rated Voltage (Measured Across Pins 1 & 2) -20 1ºC/W 12 2 Turn-Off (ms) -20 0 20 40 60 80 0 -40 100 -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) CPC1927 Typical Turn-Off vs. Temperature (IL=1ADC) CPC1927 Typical LED Forward Voltage Drop vs. Temperature CPC1927 Typical Turn-On vs. LED Forward Current (IL=1ADC) 0.30 IF = 10mA 0.25 0.20 0.15 -20 0 20 40 60 Temperature (ºC) 80 100 1.8 60 1.6 50 1.4 IF=50mA IF=20mA IF=10mA 1.2 1.0 Turn-On (ms) IF = 20mA 0.35 LED Forward Voltage Drop (V) Temperature (ºC) 0.40 0.10 -40 12.5 CPC1927 Typical Turn-Off Time (N=50, TA=25ºC, IL=1ADC, IF=20mA) 15 0.45 11.5 Turn-On (ms) 20 0 -40 10.5 On-Resistance (Ω) 0.19 Leakage (μA) 20 LED Forward Voltage (V) 0 Turn-Off (ms) 25 5 0.138 Device Count (N) Device Count (N) 20 5 1.30 30 25 5 CPC1927 Typical Turn-On Time (N=50, TA=25ºC, IL=1ADC, IF=20mA) 35 30 Device Count (N) Device Count (N) 30 25 CPC1927 Typical On-Resistance Distribution (N=50, TA=25ºC, IL=1ADC, IF=10mA) Device Count (N) 35 CPC1927 Typical LED Forward Voltage Drop (N=50, TA=25ºC, IL=1ADC, IF=10mA) 40 30 20 10 0.8 0 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Unless otherwise specified, all performance data was acquired without the use of a heatsink. 4 www.clare.com R01 CPC1927 PERFORMANCE DATA* 0.45 0.40 LED Current (mA) Turn-Off (ms) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 CPC1927 Typical On-Resistance vs. Temperature (IL=1ADC) 0.45 0.40 0.35 0.30 0.25 IF = 10mA 0.20 0.15 0.10 0.05 -40 -20 0 20 40 60 80 100 Temperature (ºC) 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) CPC1927 Energy Rating Curve (Free Air, No Heat Sink) 30 25 Load Current (AP) Load Current (A) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 50 CPC1927 Typical Load Current vs. Load Voltage (TA=25ºC, IF=10mA) 2.5 2.0 1.5 1.0 0.5 0 -0.5 -1.0 -1.5 -2.0 -2.5 -0.51 CPC1927 Typical IF for Switch Operation vs. Temperature (IL=1ADC) On-Resistance (Ω) CPC1927 Typical Turn-Off vs. LED Forward Current (IL=1ADC) 20 15 10 5 0 -0.34 0 -0.17 0.17 Load Voltage (V) 0.34 0.51 10μs 100μs 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Unless otherwise specified, all performance data was acquired without the use of a heatsink. R01 www.clare.com 5 CPC1927 Manufacturing Information Soldering For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated solvents. RoHS 2002/95/EC e3 MECHANICAL DIMENSIONS: 4.83 - 5.21 (0.190 - 0.205) ISOPLUS-264 Package 19.56 - 20.29 (0.770 - 0.799) 5.33 - 5.97 (0.210 - 0.235) 1.17 - 1.40 (0.046 - 0.055) 1.65 - 2.03 (0.065 - 0.080) 16.97 - 17.53 (0.668 - 0.690) 2.54 - 4.57 (0.100 - 0.180) 25.91 - 26.42 (1.020-1.040) 12.54 - 13.03 (0.490 - 0.513) 1 2 3 2.54 - 3.03 (0.100 - 0.130) 4 2.03 - 2.59 (0.080 - 0.102) 19.81 - 20.83 (0.780 - 0.820) 7.62 BSC (0.300 BSC) 20.34 - 20.85 (0.801 - 0.821) 3.81 BSC (0.150 BSC) 0.51 - 0.74 (0.020 - 0.029) DIMENSIONS MIN - MAX mm (MIN - MAX inches) 2.59 - 3.00 (0.102 - 0.118) 1.47 - 1.73 (0.058 - 0.068) 1.14 - 1.40 (0.045 - 0.055) NOTE: Bottom heat sink meets 2500Vrms isolation to the pins. For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. 6 DS-CPC1927-R01 ©Copyright 2007, Clare, Inc. OptoMOS® is a registered trademark of Clare, Inc. ISOPLUS™ is a trademark of IXYS Corporation All rights reserved. Printed in USA. 11/6/07