Surface Mount Chip LEDs Technical Data HSMx-C110/C120/C150/ C170/C177/C190/C191/ C197/C265 Features Description • • • • • These chip LEDs are designed in an industry standard package for ease of handling and use. Various different LED colors are available in nine compact, single color packages. Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of -30°C to +85°C • Right Angle & Reverse Mount Package Available • Various Colors Available • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels Applications • • • • • Keypad Backlighting Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator The HSMx-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMx-C170 has the widely used 2.0 x 1.25 mm footprint with 0.8 mm profile. The HSMx-C177 has the widely used 2.0 x 1.25 mm footprint with 0.4 mm profile. The HSMx-C19x series has the industry standard 1.6 x 0.8 mm footprint with varying profile to suit designers needs, the HSMx-C190 has 0.8 mm profile, the HSMxC191 has a low profile of 0.6 mm, and the HSMx-C197 has the ultra low profile of 0.4 mm. This family with its thin profile and wide viewing angle makes this LED exceptional for backlighting applications. The HSMx-C110 is a right angle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. The HSMx-C120 is a smaller right angle package with industry standard 1.6 x 0.6 x 1.0 mm. HSMx-C265 is a reverse mount package with dimensions of 3.4 x 1.25 x 1.1 mm. These devices are ideal for LCD backlighting and sidelighting applications. In order to facilitate pick and place operation, these chip LEDs are shipped in tape and reel with 4000 units per reel for HSMxC120, C170, C177, C190, C191, C197 packages, and 3000 units per reel for HSMx-C110, C150, C265 packages. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium. 2 Device Selectiion Guide GaP Green HSMG-C110 HSMG-C120 HSMG-C150 HSMG-C170 HSMG-C177 HSMG-C190 HSMG-C191 HSMG-C197 HSMG-C265 As AlGaAs Red HSMH-C110 HSMH-C120 HSMH-C150 HSMH-C170 HSMH-C190 HSMH-C191 HSMH-C265 HER HSMS-C110 HSMS-C120 HSMS-C150 HSMS-C170 HSMS-C177 HSMS-C190 HSMS-C191 HSMS-C197 – Orange HSMD-C110 HSMD-C120 HSMD-C150 HSMD-C170 HSMD-C177 HSMD-C190 HSMD-C191 HSMD-C197 – Description Untinted, Non-Diffused Untinted, Non-Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Non-Diffused Yellow HSMY-C110 – HSMY-C150 HSMY-C170 – HSMY-C190 HSMY-C191 HSMY-C197 – Description Untinted, Non-Diffused Untinted, Non-Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Non-Diffused 3 Package Dimensions CATHODE (ANODE MARK FOR MARK HSMH-C170) CATHODE (ANODE MARK FOR HSMH-C150) MARK LED DIE LED DIE 1.25 (0.049) 1.6 (0.063) 0.8 (0.031) 0.62 (0.024) 2.0 (0.079 ) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY[3] 2.0 (0.079) 0.6 (0.024) POLARITY[3] 1.4 (0.055) DIFFUSED EPOXY 0.3 (0.012) 1.1 (0.043) PC BOARD PC BOARD 0.8 (0.031) CATHODE LINE 0.5 (0.020) 0.50 ± 0.2 (0.020 ± 0.008) 0.50 ± 0.2 (0.020 ± 0.008) 0.3 (0.012) CATHODE LINE 0.4 ± 0.15 (0.016 ± 0.006) 0.4 ± 0.15 (0.016 ± 0.006) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C150 HSMx-C170 CATHODE (ANODE MARK FOR HSMH-C190) MARK LED DIE CATHODE LINE LED DIE (ANODE MARK FOR HSMH-C110) 1.0 (0.039) 0.8 (0.031) 2.6 (0.102 ) 0.4 (0.016) 1.6 (0.063 ) 3.2 (0.126 ) 1.0 (0.039) POLARITY[3] POLARITY CLEAR EPOXY 0.3 (0.012) 1.5 (0.059) DIFFUSED EPOXY PC BOARD PC BOARD CATHODE LINE 1.6 (0.063 ) 0.8 (0.031) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.5 (0.020) 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE 1.0 (0.039) 0.7 (0.028) MIN. SOLDERING TERMINAL HSMx-C190 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. 3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings. SOLDERING TERMINAL HSMx-C110 4 CATHODE MARK CATHODE MARK LED DIE LED DIE 0.8 (0.031) 1.25 (0.049) 0.4 (0.016) 1.6 (0.063 ) 0.62 (0.025) 2.00 (0.079) 1.0 (0.039) POLARITY POLARITY DIFFUSED EPOXY 0.40 (0.016) 0.3 (0.012) DIFFUSED EPOXY PC BOARD PC BOARD 0.16 (0.006) 0.8 (0.031) 0.26 (0.010) CATHODE LINE CATHODE LINE 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 0.7 (0.028) MIN. 1.10 (0.043) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C177 HSMx-C191 3.4 (0.134) CATHODE MARK (ETCHED) [ANODE MARK FOR HSMH-C265] LED DIE CATHODE MARK LED DIE 1.25 (0.049) 0.80 (0.031) GREEN SOLDER MASK 1.60 (0.063) POLARITY 1.2 (0.047) UNDIFFUSED EPOXY 1.1 (0.043) 0.40 (0.016) POLARITY DIFFUSED EPOXY 1.1 (0.043) 0.40 (0.016) PC BOARD PC BOARD 0.16 (0.006) 0.3 (0.012) CATHODE LINE CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) 0.30 ± 0.15 (0.012 ± 0.006) 0.70 (0.028) MIN. SOLDERING TERMINAL HSMx-C265 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. 3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings. SOLDERING TERMINAL HSMx-C197 5 CATHODE MARK (ANODE MARK FOR HSMH-C120) LED DIE 0.3 (0.012) 0.6 (0.024) 1.6 (0.063) POLARITY 1.2 (0.047) CLEAR EPOXY 1.0 (0.039) PC BOARD 0.4 (0.016) 3 – 0.3 (0.012) CATHODE LINE SOLDERING TERMINAL HSMx-C120 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. 3. Polarity for HSMH-C1x0 will be the opposite of what is shown on above drawings. 6 Absolute Maximum Ratings for GaP at TA=25°C Parameter DC Forward Current [1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (I R=100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature C110/150/265 25 100 65 5 95 -30 to +85 -40 to +85 C120/170/177/190/191/197 Units 20 mA 100 mA 52 mW 5 V 95 °C -30 to +85 °C -40 to +85 °C See reflow soldering profile (Figure 9 & 10) Absolute Maximum Ratings for AlGaAs at TA=25°C Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR =100µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature C110/150 30 100 78 5 95 -30 to +85 -40 to +85 C120/170/177/190/191/197/265 25 100 65 5 95 -30 to +85 -40 to +85 See reflow soldering profile (Figure 9 & 10) Units mA mA mW V °C °C °C Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. Electrical Characteristics at TA=25°C Reverse Capacitance Forward Voltage Breakdown C(pF), Thermal Part Number Color VF(Volts) VR(Volts) @ VF = 0 V, Resistance @ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ-P (°C/W) Typ. Max. Min. Typ. Typ. HSMS-C110/150 HER 2.1 2.6 5 5 400 HSMS-C120 350 HSMS-C170/177/190/191/197 250 HSMD-C110/150 Orange 2.2 2.6 5 7 400 HSMD-C120 350 HSMD-C170/177/190/191/197 250 HSMY-C110/150 Yellow 2.1 2.6 5 6 400 HSMY-C170/190/191/197 250 HSMG-C110/150 Green 2.2 2.6 5 9 400 HSMG-C120 350 HSMG-C170/177/190191/197/265 250 HSMH-C110/150 AlGaAs 1.8 2.6 5 18 460 HSMH-C120 400 HSMH-C170/190/191/265 300 7 Optical Characteristics at TA=25°C Part Number HSMG-C110/177/197 HSMG-C120 HSMG-C150/170/190/191/265 HSMS-C110/177/197 HSMS-C120 HSMS-C150/170/190/191 HSMD-C110/177/197 HSMD-C120 HSMD-C150/170/190/191 HSMY-C110/197 HSMY-C150/170/190/191 HSMH-C110 HSMH-C120 HSMH-C150/170/190/191/265 Luminous Peak Dominant Intensity[1] Wavelength Wavelength Viewing Color Iv(mcd)@20mA lpeak(nm) ld(nm) Angle 2u1/2(°)[2] Min. Typ. Typ. Typ. Typ. Green 4.5 15.0 570 572 130 155 170 HER 2.8 10.0 630 626 130 155 170 Orange 2.8 8.0 605 604 130 155 170 Yellow 2.8 8.0 589 586 130 170 AlGaAs 7.2 17.0 660 639 130 155 170 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits [1] Green Color Bins[1] Dom. Wavelength (nm) Min. Max. 561.5 564.5 564.5 567.5 567.5 570.5 570.5 573.5 573.5 576.5 Bin ID A B C D E Tolerance: ± 0.5 nm Yellow/Amber Color Bins[1] Bin ID A B C D E F Dom. Wavelength (nm) Min. Max. 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5 594.5 597.0 Tolerance: ± 0.5 nm Orange Color Bin ID A B C D E F Tolerance: ± 1 nm Bins[1] Dom. Wavelength (nm) Min. Max. 597.0 600.0 600.0 603.0 603.0 606.0 606.0 609.0 609.0 612.0 612.0 615.0 8 Light Intensity (Iv) Bin Limits[1] Intensity Min. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 Bin ID A B C D E F G H J K L M (mcd) Max. 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 Intensity Min. 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 Bin ID N P Q R S T U V W X Y (mcd) Max. 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Tolerance: ± 15% 1.0 RELATIVE INTENSITY GREEN AlGaAs YELLOW 0.5 ORANGE 0 500 HER 550 600 650 700 750 WAVELENGTH – nm 1.6 AlGaAs HER AlGaAs GREEN 10 1 YELLOW 0.1 1.7 1.9 1.2 0.8 0.4 GaP ORANGE 1.5 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 2.1 VF – FORWARD VOLTAGE – V Figure 2. Forward Current vs. Forward Voltage. 2.3 0 0 10 20 30 IF – FORWARD CURRENT – mA Figure 3. Luminous Intensity vs. Forward Current. 40 IF MAX. – MAXIMUM FORWARD CURRENT – mA Figure 1. Relative Intensity vs. Wavelength. 35 C110/C150 AlGaAs 30 C110/C150/C265 HER, ORANGE, YELLOW, GREEN C120/C170/C177/ C190/C191/C197/ C265 AlGaAs 25 20 10 5 0 RθJ-A = 600°C/W C120/C170/ C177/C190/ C191/C197 HER, ORANGE, YELLOW, GREEN 15 0 20 RθJ-A = 800°C/W 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum Forward Current vs. Ambient Temperature. 9 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative Intensity vs. Angle for HSMx-C110. 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 RELATIVE INTENSITY 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative Intensity vs. Angle for HSMx-C120. 10 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative Intensity vs. Angle for HSMx-C177 and C197. 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 8. Relative Intensity vs. Angle for HSMx-C150, C170, C190, C191 and C265. 10 to 20 SEC. 255 °C (+5/-0) TEMPERATURE 217 °C TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 100 - 150 °C 60 to 150 SEC. MAX. 120 SEC. 3°C/SEC. MAX. 4°C/SEC. MAX. TIME OVER 2 MIN. TIME * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 9. Recommended Reflow Soldering Profile. Figure 10. Recommended Pb-Free Reflow Soldering Profile. 0.8 (0.031) 1.5 (0.059) 1.2 (0.047) 1.2 (0.047) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 11. Recommended Soldering Pattern for HSMx-C150. 1.2 (0.047) 0.9 (0.035) Figure 12. Recommended Soldering Pattern for HSMx-C170 and C177. 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) Figure 13. Recommended Soldering Pattern for HSMx-C190, C191 and C197. 11 5.0 (0.200) 0.9 (0.035) 0.4 (0.016) 0.9 (0.035) 0.4 (0.016) 1.0 (0.039) 0.2 (0.008) 0.7 (0.028) 0.15 (0.006) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) CENTERING BOARD 1.5 (0.059) 0.8 (0.031) Figure 14. Recommended Soldering Pattern for HSMx-C110. 1.2 (0.047) 0.8 (0.031) Figure 15. Recommended Soldering Pattern for HSMx-C120. USER FEED DIRECTION 2.2 (0.087) DIA. PCB HOLE CATHODE SIDE 1.25 (0.049) 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) PRINTED LABEL Figure 16. Recommended Soldering Pattern for HSMx-C265. Figure 17. Reeling Orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS Figure 18. Reel Dimensions. Note: All dimensions in millimeters (inches). 5.0 ± 0.5 (0.197 ± 0.020) 12 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) HSMx-C110/C120 POSITION IN CARRIER TAPE PART NUMBER HSMx-C110 SERIES HSMx-C120 SERIES HSMx-C150 SERIES HSMx-C170 SERIES HSMx-C177 SERIES HSMx-C190 SERIES HSMx-C191 SERIES HSMx-C197 SERIES DIM. A (SEE TABLE 1) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A ± 0.10 (0.004) 3.40 (0.134) 1.90 (0.075) 3.50 (0.138) 2.30 (0.091) 2.30 (0.091) 1.80 (0.071) 1.86 (0.073) 1.75 (0.069) DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) 1.70 (0.067) 1.20 (0.047) 1.15 (0.045) 0.80 (0.031) 1.88 (0.074) 1.27 (0.050) 1.45 (0.057) 0.95 (0.037) 1.40 (0.055) 0.60 (0.024) 0.95 (0.037) 0.87 (0.034) 0.89 (0.035) 0.87 (0.034) 0.95 (0.037) 0.60 (0.024) R 1.0 ± 0.05 (0.039 ± 0.002) DIM. B (SEE TABLE 1) R 0.5 ± 0.05 (0.020 ± 0.002) 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) Figure 19. Tape Dimensions. COVER TAPE 1.30 (0.051) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 20. Tape Leader and Trailer Dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.)unless otherwise specified. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30˚ C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5˚C for 20 hours. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-6271EN May 17, 2004 5989-0463EN