Surface Mount Chip LEDs Technical Data HSMF-C155/C156/C157 Features Description • • • • • The HSMF-C15x series of bicolor chip-type LEDs is designed in an industry standard package for ease of handling and use. These bicolor LEDs are available as high efficiency red/green, yellow/ green and orange/green. The HSMF-C15x has the widely used 3.2 x 2.7 mm footprint and wide viewing angle make this LED exceptional for backlighting applications. Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of –30°C to +85°C • Three Color Combinations Available: Red/Green, Yellow/Green, and Orange/Green. • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels Applications • • • • Push-Button Backlighting Symbol Backlighting Status Indicator Front Panel Indicator All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel indicators especially where space is a premium. Device Selection Guide Part Number HSMF-C155 HSMF-C156 HSMF-C157 Color Combinations High Efficiency Red/Green Yellow/Green Orange/Green Parts Per Reel 3000 3000 3000 2 Package Dimensions LED DIE CATHODE MARK 2 1 1.4 (0.055) 2.7 (0.106) 3 4 3.2 (0.126 ) 0.60 (0.024) 2.00 (0.079) PART NUMBER DIFFUSED EPOXY POLARITY HSMF-C-155 HSMF-C-156 HSMF-C-157 1 2 GREEN GREEN GREEN 3 4 RED YELLOW ORANGE 1.10 (0.043) PC BOARD 0.50 (0.020) 0.55 (0.022) POSITION OF COLOR SOURCE ON DEVICE 0.55 (0.022) R 0.25 (0.010) TYP. SOLDERING TERMINAL 1.10 (0.043) 0.40 (0.016) 4 – 0.05 (0.002) MAX. CATHODE LINE NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. HSMF-C155/C156/C157 3 Absolute Maximum Ratings at TA=25°C Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMF-C155/C156/C157 Units 25 mA 100 mA 65 mW 5 V 95 °C –30 to +85 °C –40 to +85 °C See IR soldering profile (Figure 6) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. Optical Characteristics at TA=25°C Color HER Orange Yellow Green Luminous Intensity[1] Iv(mcd) @ 20mA Min. Typ. 2.50 10.0 2.50 8.0 2.50 8.0 4.00 15.0 Peak Wavelength lpeak(nm) Typ. 630 605 589 570 Dominant Wavelength ld(nm) Typ. 626 604 586 572 Viewing Angle 2u1/2 Degrees[2] Typ. 170 170 170 170 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA=25 °C Color HER Orange Yellow Green Forward Voltage VF(V) @ IF= 20 mA Typ. Max. 2.1 2.6 2.2 2.6 2.1 2.6 2.2 2.6 Reverse Capacitance Breakdown VR(V) C(pF) @ IR = 100 µA @ VF = 0, f = 1Mhz Min. Typ. 5 5 5 7 5 6 5 9 Thermal Resistance RuJ-P ( °C/W) Typ. 325 325 325 325 Note: The bicolor package contains two individual light sources of different color. The specifications above refer to each color of a particular package. 4 Color Bin Limits Green Color Bins[1] Orange Color Bins[1] Dom. Wavelength (nm) Min. Max. Bin ID Bin ID Yellow/Amber Color Bins[1] Dom. Wavelength (nm) Min. Max. Bin ID Dom. Wavelength (nm) Min. Max. A 561.5 564.5 A 597.0 600.0 A 582.0 584.5 B 564.5 567.5 B 600.0 603.0 B 584.5 587.0 C 567.5 570.5 C 603.0 606.0 C 587.0 589.5 D 570.5 573.5 D 606.0 609.0 D 589.5 592.0 E 573.5 576.5 E 609.0 612.0 H 592.0 594.5 F 612.0 615.0 J 594.5 597.0 Tolerance: ± 0.5 nm Tolerance: ± 1 nm Tolerance: ± 0.5 nm Light Intensity (Iv) Bin Limits[1] Bin ID Intensity (mcd) Min. Max. Bin ID Intensity (mcd) Min. Max. A 0.11 0.18 N 28.50 45.00 B 0.18 0.29 P 45.00 71.50 C 0.29 0.45 Q 71.50 112.50 D 0.45 0.72 R 112.50 180.00 E 0.72 1.10 S 180.00 285.00 F 1.10 1.80 T 285.00 450.00 G 1.80 2.80 U 450.00 715.00 H 2.80 4.50 V 715.00 1125.00 J 4.50 7.20 W 1125.00 1800.00 K 7.20 11.20 X 1800.00 2850.00 L 11.20 18.00 Y 2850.00 4500.00 M 18.00 28.50 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Tolerance: ± 15% 1.0 RELATIVE INTENSITY GREEN YELLOW 0.5 ORANGE 0 500 HER 550 600 650 WAVELENGTH – nm Figure 1. Relative Intensity vs. Wavelength. 700 750 5 1.6 HER LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 GREEN 10 1 YELLOW 0.1 1.2 0.8 0.4 ORANGE 1.5 1.7 1.9 2.1 0 2.3 20 30 40 1.00 35 0.90 30 RELATIVE INTENSITY – % IF MAX. – MAXIMUM FORWARD CURRENT – mA 10 Figure 3. Luminous Intensity vs. Forward Current (All Colors). Figure 2. Forward Current vs. Forward Voltage. 25 20 RθJ-A = 600°C/W 15 RθJ-A = 800°C/W 10 5 0 0 IF – FORWARD CURRENT – mA VF – FORWARD VOLTAGE – V 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 20 40 60 80 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 100 TA – AMBIENT TEMPERATURE – °C 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 4. Maximum Forward Current vs. Ambient Temperature. Figure 5. Relative Intensity vs. Angle for HSMx-C155, C156 and C157. 10 to 20 SEC. 255 °C (+5/-0) TEMPERATURE 217 °C 1.0 (0.039) 3 °C/SEC. MAX. 6 °C/SEC. MAX. 140 - 160 °C 0.4 (0.016) 60 to 150 SEC. MAX. 120 SEC. 1.0 (0.039) TIME * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 6. Recommended Pb Free Reflow Soldering Profile. 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Note: 1. All dimensions in millimeters (inches). Figure 7. Recommended Solder Pad Pattern. 6 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reeling Orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Note: All dimensions in millimeters (inches). Figure 9. Reel Dimensions. 7 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMF-C15x SERIES 3.52 (0.139) 3.02 (0.119) 1.40 (0.055) Figure 10. Tape Dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30˚C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5˚C for 20 hours. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2003 Agilent Technologies, Inc. Obsoletes 5988-6268EN October 28, 2003 5988-7414EN