Agilent HSMx-C220 High Performance ChipLEDs Data Sheet Description The HSMx-C220 is the smallest and the most efficient ChipLED package available in the market. The package contains a reflector cup and lens to maximize light extraction. They are available in a wide range of colors. All packages come in 8 mm tape on 7 inch reels which make them suitable for automated pick and place process. The parts are also compatible with IR reflow solder processes. The small package size makes these LEDs prime choices for all backlighting applications and front panel illumination especially where space is a premium. The directional viewing angle of less than 90 degrees makes the parts suitable for use with light guide/ pipe. Device Selection Guide Part Number HSMA-C220 HSMC-C220 HSML-C220 HSMU-C220 HSMM-C220 HSMN-C220 HSMD-C220 HSMG-C220 HSMS-C220 HSMY-C220 HSMH-C220 Color AS AlInGaP Amber AS AlInGaP Red AS AlInGaP Orange TS AlInGaP Amber InGaN Green InGaN Blue GaP Orange GaP Green GaP HER GaP Yellow AS AlGaAs Red Package Description Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Features • Small size (2 x 1.25 x 1.2 mm) • High performance (with reflector cup and lens) • Directional optics • Industry standard footprint • Compatible with IR solder • Operating temperature range of –40°C to +85°C • Available in 8 mm tape on 7 in. (178 mm) diameter reels Applications (Indoor) • Keypad backlighting • Push-button backlighting • LCD backlighting • Symbol backlighting • Front panel indicator Package Dimensions 2.00 (0.08) 1.25 (0.05) 0.63 (0.025) POLARITY 1.20 (0.048) 0.50 (0.02) 1.25 (0.05) GREEN CATHODE MARKING 0.45 (0.018) 1.16 (0.046) 1.25 (0.05) SOLDERING PAD NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 Absolute Maximum Ratings at TA = 25˚C Parameter AlInGaP InGaN AlGaAs GaP Units DC Forward Current 30 25 25 20 mA Peak Pulsing Current[1] 100 100 100 100 mA Power Dissipation 78 105 65 52 mW Reverse Voltage (IR = 100 µA) 5 5 5 5 V LED Junction Temperature 95 95 95 95 ˚C Operating Temperature Range –40 to +85 ˚C Storage Temperature Range –40 to +100 ˚C Note: 1. Pulse condition of 1/10 duty and 0.1 ms width. Electrical Characteristics at TA = 25˚C Color Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C(pF), VR = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN Typ. AS Amber 1.9 2.6 5 48 485 AS Red 1.9 2.6 5 48 485 AS Orange 1.9 2.6 5 52 485 TS Amber 2.2 2.6 5 40 485 InGaN Green 3.5 4.1 5 53 380 InGaN Blue 3.5 4.1 5 55 380 GaP Orange 2.2 2.6 5 10 450 GaP Green 2.2 2.6 5 7 450 GaP HER 2.1 2.6 5 4 450 GaP Yellow 2.1 2.6 5 3 450 AlGaAs Red 1.8 2.6 5 26 350 3 Optical Characteristics at TA = 25˚C Color Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength λpeak (nm) Typ. Color, Dominant Wavelength λd[2] (nm) Typ. Viewing Angle 2 θ1/2 Degrees[3] Typ. Luminous Efficacy ηv (lm/w) Typ. AS Amber 63 180 595 592 85 500 AS Red 63 180 637 626 85 155 AS Orange 63 180 609 605 85 385 TS Amber 100 300 595 592 85 490 InGaN Green 63 230 523 525 65 490 InGaN Blue 25 70 468 470 65 70 GaP Orange 6.3 25 605 604 75 350 GaP Green 10 30 570 572 75 540 GaP HER 6.3 20 630 626 75 135 GaP Yellow 6.3 20 589 586 75 480 AlGaAs Red 25 80 660 639 75 75 Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4 1.0 RELATIVE INTENSITY GREEN AIGaAs YELLOW 0.5 ORANGE 0 500 HER 550 600 650 700 750 WAVELENGTH - nm Figure 1a. Relative intensity vs. wavelength for GaP and AlGaAs. 1 RELATIVE INTENSITY ORANGE 0.8 RED AMBER 0.6 0.4 0.2 0 500 550 600 650 700 WAVELENGTH - nm Figure 1b. Relative intensity vs. wavelength for AlInGaP. RELATIVE INTENSITY – % 1.0 GREEN BLUE 0.5 0 350 400 450 500 550 WAVELENGTH – nm Figure 1c. Relative intensity vs. wavelength for InGaN. 5 600 650 IF – FORWARD CURRENT – mA 100 AIGaAs GREEN 10 YELLOW 1 ORANGE HER 0.1 1.5 1.7 1.9 2.1 2.3 2.5 VF – FORWARD VOLTAGE – V IF – FORWARD CURRENT – mA 100 TS AllnGap 10 InGaN GREEN AS AllnGaP 1 InGaN BLUE 0.1 1.5 2.5 3.5 4.5 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. LUMINOUS INTENSITY (NORMALIZED AT 20 mA) LUMINOUS INTENSITY (NORMALIZED AT 20 mA) AlGaAs 1.2 0.8 0.4 GaP 0 0 10 20 30 IF – FORWARD CURRENT – mA Figure 3a. Luminous intensity vs. forward current – GaP and AlGaAs. 6 40 1.4 1.2 1.2 1.0 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.6 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 IF – FORWARD CURRENT – mA Figure 3b. Luminous intensity vs. forward current – AlInGaP. 30 0.8 0.6 0.4 0.2 0 0 5 10 15 20 IF – FORWARD CURRENT – mA Figure 3c. Luminous intensity vs. forward current – InGaN. 25 IF MAX. – MAXIMUM FORWARD CURRENT IF MAX. – MAXIMUM FORWARD CURRENT 35 R0JA = 600°C/W 30 25 AS AllnGaP 20 15 10 TS AllnGaP 5 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE TA – DEG 30 R0JA = 600°C/W 25 AIGaAs GaP 20 15 10 InGaN 5 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE TA – DEG Figure 4. Maximum forward current vs. ambient temperature. 1 RELATIVE INTENSITY 0.9 85° 0.8 0.7 75° 0.6 0.5 65° 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE – DEGREES Figure 5. Radiation pattern. 7 TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 1.15 (0.045) –3°C/SEC. MAX. 4°C/SEC. MAX. 0.90 (0.035) OVER 2 MIN. TIME USER FEED DIRECTION PRINTED LABEL CATHODE SIDE Figure 8. Reeling orientation. 180 Ø (7.08) 21.0 (0.83) 2.0 (0.08) 60.0 Ø (2.36) Ø 13.0 (0.51) LABEL 13.0 (0.51) 10.0 (0.39) Figure 9. Reel dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. 8 0.90 (0.035) Figure 7. Recommended soldering pattern. Figure 6. Recommended reflow soldering profile. 1.5 TYP. (0.06) 1.06 (0.042) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) PART NUMBER HSMx-C220 SERIES 2.44 (0.096) 1.68 (0.066) Figure 10. Tape dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 11. Tape leader and trailer dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. 9 MINIMUM OF 230 mm (9.05 INCHES) MAY CONSIST OF CARRIER AND/OR COVER TAPE. 1.30 (0.051) Intensity Bin Limits Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y HSMG-C220 Intensity Range (mcd) Min. Max. 0.10 0.20 0.16 0.32 0.25 0.50 0.40 0.80 0.63 1.25 1.00 2.00 1.60 3.20 2.50 5.00 4.00 8.00 6.30 12.50 10.00 20.00 16.00 32.00 25.00 50.00 40.00 80.00 63.00 125.00 100.00 200.00 160.00 320.00 250.00 500.00 400.00 800.00 630.00 1250.00 1000.00 2000.00 1600.00 3200.00 2500.00 5000.00 HSMN-C220 Bin ID A B C D E Dom. Wavelength (nm) Min. Max. 459.0 465.0 463.0 469.0 467.0 473.0 471.0 477.0 475.0 481.0 HSMM-C220 Bin ID A B C D E 10 Dom. Wavelength (nm) Min. Max. 514.0 521.0 519.0 526.0 524.0 531.0 529.0 536.0 534.0 541.0 Bin ID A B C D E Dom. Wavelength (nm) Min. Max. 561.0 565.0 564.0 568.0 567.0 571.0 570.0 574.0 573.0 577.0 HSMA-C220 Bin ID A B C D H J Dom. Wavelength (nm) Min. Max. 581.5 585.0 584.0 587.5 586.5 590.0 589.5 592.5 591.5 595.0 594.0 597.5 HSMD-C220 Bin ID A B C D E F Dom. Wavelength (nm) Min. Max. 596.0 601.0 599.0 604.0 602.0 607.0 605.0 610.0 608.0 613.0 611.0 616.0 Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicators Components and Application Note 1217 Pick and Place and Soldering of the Agilent HSMXC540, HSMx-C220 Surface Mount LEDs respectively. Storage Condition: 5 to 30°C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicators becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5°C for 20 hours. 11 www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes 5988-6549EN June 24, 2002 5988-7126EN