HANBIT HMD4M32M8AG-5

HANBit
HMD4M32M8G
16Mbyte(4Mx32) Fast Page Mode, 2K/4K Refresh 72Pin SIMM
Part No. HMD4M32M8G, HMD4M32M8AG
GENERAL DESCRIPTION
The HMD4M32M8G is a 4M x 32bit dynamic RAM high-density memory module. The module consists of eight CMOS
4M x 4bit DRAMs in 24-pin SOJ packages mounted on a 72-pin, double-sided, FR-4-printed circuit board.
A 0.1 or
0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM components. The module is a single
In-line Memory Module with edge connections and is intended for mounting in to 72-pin edge connector sockets. All
module components may be powered from a single 5V DC power supply and all inputs and outputs are TTL-compatible.
PIN ASSIGNMENT
FEATURES
w Part Identification
HMD4M32M8G- -2,048 Cycles/32ms Ref . Gold
HMD4M32M8AG- 4,096 Cycles/64ms Ref . Gold
w Access times : 50, 60ns
w High-density 16MByte design
w Single + 5V ±0.5V power supply
w JEDEC standard pinout
w FP(Fast Page) mode operation
w TTL compatible inputs and outputs
w FR4-PCB design
OPTIONS
MARKING
w Timing
PIN
SYMBOL
PIN
SYMBOL
PIN
SYMBOL
1
Vss
25
DQ22
49
DQ8
2
DQ0
26
DQ7
50
DQ24
3
DQ16
27
DQ23
51
DQ9
4
DQ1
28
A7
52
DQ25
5
DQ17
29
A11
53
DQ10
6
DQ2
30
Vcc
54
DQ26
7
DQ18
31
A8
55
DQ11
8
DQ3
32
A9
56
DQ27
9
DQ19
33
NC
57
DQ12
10
Vcc
34
/RAS2
58
DQ28
11
NC
35
NC
59
Vcc
12
A0
36
NC
60
DQ29
13
A1
37
NC
61
DQ13
50ns access
-5
14
A2
38
NC
62
DQ30
60ns access
-6
15
A3
39
Vss
63
DQ14
16
A4
40
/CAS0
64
DQ31
17
A5
41
/CAS2
65
DQ15
18
A6
42
/CAS3
66
NC
19
A10
43
/CAS1
67
Vss
20
DQ4
44
/RAS0
68
PD2
DQ20
45
NC
69
PD3
w Packages
72-pin SIMM
M
PERFORMANCE RANGE
Speed
tRAC
tCAC
tRC
21
5
50ns
13ns
90ns
22
DQ5
46
NC
70
PD4
23
DQ21
47
/WE
71
NC
24
DQ6
48
NC
72
Vss
6
60ns
15ns
110ns
PRESENCE DETECT PINS
Pin
50ns
60ns
PD1
Vss
Vss
PD2
NC
NC
PD3
Vss
NC
PD4
Vss
NC
A0 – A11 : Address Input(4K Ref.)
A0 – A10 : Address Input(2K Ref.)
*Note : A11 is used for only HMD4M32M8AG
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REV. 1.0(August. 2002)
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HANBit
HMD4M32M8G
FUNCTIONAL BLOCK DIAGRAM
/CAS0
/RAS0
DQ0
DQ1
DQ2
A0-A10(A11) DQ3
U1
CAS
RAS
OE
W
/RAS2
DQ0
DQ1
DQ2
A0-A10(A11) DQ3
DQ8-DQ11
DQ0
DQ1
DQ2
A0-A10(A11) DQ3
DQ12-DQ15
U5
DQ0
DQ1
DQ2
A0-A10(A11) DQ3
U6
CAS
RAS
OE
W
DQ16-DQ19
DQ0
DQ1
DQ2
A0-A10(A11) DQ3
U7
CAS
RAS
OE
W
/CAS3
DQ4-DQ7
U4
CAS
RAS
OE
W
CAS
RAS
OE
W
/CAS2
DQ0
DQ1
DQ2
A0-A10(A11) DQ3
U2
CAS
RAS
OE
W
/CAS1
DQ0-DQ3
DQ20-DQ23
DQ0
DQ1
DQ2
A0-A10(A11) DQ3
U8
CAS
RAS
OE
W
DQ24-DQ27
DQ0
DQ1
DQ2
A0-A10(A11) DQ3
U9
CAS
RAS
OE
W
DQ28-DQ31
/WE
A0-A10(A11)
Vcc
0.1uFor0.22uFCapacitor
foreachDRAM
Vss
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REV. 1.0(August. 2002)
2
To all DRAMs
HANBit Electronics Co.,Ltd.
HANBit
HMD4M32M8G
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATING
VIN ,OUT
-1V to 7.0V
Voltage on Vcc Supply Relative to Vss
Vcc
-1V to 7.0V
Power Dissipation
PD
8W
TSTG
-55oC to 150oC
Voltage on Any Pin Relative to Vss
Storage Temperature
Short Circuit Output Current
IOS
50mA
w Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be
restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
( Voltage reference to VSS, TA=0 to 70 o C )
PARAMETER
SYMBOL
MIN
TYP
MAX
UNIT
Supply Voltage
Vcc
4.5
5.0
5.5
V
Ground
Vss
0
0
0
V
Input High Voltage
VIH
2.4
-
Vcc+1
V
Input Low Voltage
VIL
-1.0
-
0.8
V
DC AND OPERATING CHARACTERISTICS
SYMBOL
SPEED
-5
MIN
-
MAX
880
UNITS
mA
-6
-
800
mA
-
16
mA
-5
-
880
mA
-6
-
800
mA
-5
-
720
mA
-6
-
640
mA
-
8
mA
-5
-
880
mA
-6
-
800
mA
Il(L)
-40
40
µA
IO(L)
-5
5
µA
VOH
2.4
-
V
VOL
-
0.4
V
ICC1
ICC2
ICC3
ICC4
ICC5
ICC6
ICC1 : Operating Current * (/RAS , /CAS , Address cycling @t RC=min.)
ICC2 : Standby Current ( /RAS=/CAS=VIH )
ICC3 : /RAS Only Refresh Current * ( /CAS=V IH, /RAS, Address cycling @tRC=min )
ICC4 : Fast Page Mode Current * (/RAS=VIL, /CAS, Address cycling @tPC=min )
ICC5 : Standby Current (/RAS=/CAS=Vcc-0.2V )
ICC6 : /CAS-Before-/RAS Refresh Current * (/RAS and /CAS cycling @tRC=min )
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REV. 1.0(August. 2002)
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HANBit
HMD4M32M8G
IIL : Input Leakage Current (Any input 0V ≤ VIN ≤ 6.5V, all other pins not under test = 0V)
IOL : Output Leakage Current (Data out is disabled, 0V ≤ VOUT ≤ 5.5V
VOH : Output High Voltage Level (IOH= -5mA )
VOL : Output Low Voltage Level (IOL = 4.2mA )
* NOTE: ICC1, ICC3, ICC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the
output open. ICC is specified as an average current. In ICC1 and ICC3, address cad be changed maximum once
while /RAS=VIL. In ICC4, address can be changed maximum once within one page mode cycle.
CAPACITANCE
o
( TA=25 C, Vcc = 5V, f = 1Mz )
DESCRIPTION
SYMBOL
MIN
MAX
UNITS
Input Capacitance (A0-A10)
CIN1
-
64
pF
Input Capacitance (/W)
C IN2
-
70
pF
Input Capacitance (/RAS0,/RAS2)
CIN3
-
70
pF
Input Capacitance (/CAS0-/CAS3)
CIN4
-
36
pF
Input/Output Capacitance (DQ0-31)
CDQ1
-
17
pF
AC CHARACTERISTICS
o
( 0 C ≤ TA ≤ 70oC , Vcc = 5V±10%, See notes 1,2.)
-5
STANDARD OPERATION
-6
SYMBOL
UNIT
MIN
MAX
MAX
Random read or write cycle time
tRC
Access time from /RAS
tRAC
50
60
ns
Access time from /CAS
tCAC
13
15
ns
Access time from column address
tAA
25
30
ns
/CAS to output in Low-Z
tCLZ
0
Output buffer turn-off delay
tOFF
0
13
0
15
ns
Transition time (rise and fall)
tT
3
50
3
50
ns
/RAS precharge time
tRP
30
/RAS pulse width
tRAS
50
/RAS hold time
tRSH
13
15
ns
/CAS hold time
tCSH
50
60
ns
/CAS pulse width
tCAS
13
10K
15
10K
ns
/RAS to /CAS delay time
tRCD
20
37
20
45
ns
/RAS to column address delay time
tRAD
15
25
15
30
ns
/CAS to /RAS precharge time
tCRP
5
5
ns
Row address set-up time
tASR
0
0
ns
Row address hold time
tRAH
10
10
ns
Column address set-up time
tASC
0
0
ns
Column address hold time
tCAH
10
10
ns
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REV. 1.0(August. 2002)
4
90
MIN
110
ns
0
ns
40
10K
60
ns
10K
ns
HANBit Electronics Co.,Ltd.
HANBit
HMD4M32M8G
Column address hold referenced to /RAS
tAR
40
45
ns
Column Address to /RAS lead time
tRAL
25
30
ns
Read command set-up time
tRCS
0
0
ns
Read command hold referenced to /CAS
tRCH
0
0
ns
Read command hold referenced to /RAS
tRRH
0
0
ns
Write command hold time
tWCH
10
10
ns
Write command hold referenced to /RAS
tWCR
40
45
ns
Write command pulse width
tWP
10
10
ns
Write command to /RAS lead time
tRWL
15
15
ns
Write command to /CAS lead time
tCWL
13
15
ns
Data-in set-up time
tDS
0
0
ns
Data-in hold time
tDH
10
15
ns
Data-in hold referenced to /RAS
tDHR
40
45
ns
Refresh period 2K Ref.
tREF
Write command set-up time
tWCS
0
0
ns
/CAS setup time (C-B-R refresh)
tCSR
5
5
ns
/CAS hold time (C-B-R refresh)
tCHR
10
10
ns
/RAS precharge to /CAS hold time
tRPC
5
5
ns
Access time from /CAS precharge
tCPA
Fast page mode cycle time
tPC
35
40
ns
/CAS precharge time (Fast page)
tCP
10
10
ns
/RAS pulse width (Fast page )
tRASP
50
/W to /RAS precharge time (C-B-R refresh)
tWRP
10
10
ns
/W to /RAS hold time (C-B-R refresh)
tWRH
10
10
ns
tCPT
20
20
ns
/CAS precharge(C-B-R counter test)
NOTES
32
32
30
200K
35
60
200K
ns
ns
ns
1.An initial pause of 200µs is required after power-up followed by any 8 /RAS-only or /CAS-before-/RAS refresh cycles
before proper device operation is achieved.
2.VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Transition times are measured between
VIH(min) and VIL(max) and are assumed to be 5ns for all inputs.
3.Measured with a load equivalent to 2TTL loads and 100pF
4.Operation within the tRCD(max) limit insures that tRAC(max) can be met. tRCD(max) is specified as a reference point only. If tRCD
is greater than the specified tRCD(max) limit, then access time is controlled exclusively by t CAC.
5.Assumes that tRCD ≥ tRCD(max)
6. tAR, tWCR, tDHR are referenced to tRAD(max)
7.This parameter defines the time at which the output achieves the open circuit condition and is not referenced to VOH or
VOL.
8. tWCS, tRWD, tCWD and tAWD are non restrictive operating parameter.
They are included in the data sheet as electrical characteristic only. If t WCS ≥ tWCS(min) the cycle is an early write
cycle and the data out pin will remain high impedance for the duration of the cycle.
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REV. 1.0(August. 2002)
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HANBit
HMD4M32M8G
9. Either tRCH or tRRH must be satisfied for a read cycle.
10. These parameters are referenced to the /CAS leading edge in early write cycles and to the /W leading edge in readwrite cycles.
11. Operation within the tRAD(max) limit insures that tRAC(max) can be met. tRAD(max) is specified as a reference
point only. If tRAD is greater than the specified tRAD(max) limit. then access time is controlled by tAA.
TIMING DIAGRAM
Please refer to attached timing diagram chart (I)
PACKAGING INFORMATION
SIMM Design ( Unit : mm)
2.54 mm MAX
0.25 mm MAX
1.27
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REV. 1.0(August. 2002)
Gold : 1.04±0.10 mm
Solder:0.914±0.10mm
6
1.27±0.08
HANBit Electronics Co.,Ltd.
HANBit
HMD4M32M8G
ORDERING INFORMATION
Part Number
Density
Org.
Package
HMD4M32M8G-5
16MByte
4MX 32bit
72 Pin-SIMM
HMD4M32M8AG-5
16MByte
4MX 32bit
72 Pin-SIMM
HMD4M32M8G-6
16MByte
4MX 32bit
72 Pin-SIMM
HMD4M32M8AG-6
16MByte
4MX 32bit
72 Pin-SIMM
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REV. 1.0(August. 2002)
7
Refresh
Cycle
2,048 Cycles
32ms Ref.
4,096 Cycle
64ms Ref.
2,048 Cycles
32ms Ref.
4,096 Cycle
64ms Ref.
Vcc
SPEED
5.0V
50ns
5.0V
50ns
5.0V
60ns
5.0V
60ns
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