LWH1025 - CONTENTS - 1. Features 2. Outline dimensions 3. Package material 4. Absolute Maximum Ratings 5. Electrical Optical Characteristics 6. Ranks 7. Taping 8. Packing Struction 9. Characteristic Diagrams 10. Precautions to taken 11. Reliability 12. Precautions in use 13. Revision history sheet Different and Better 1/14 LWH1025 1. Features • Package : SMD Side View Type • Yellow colored diffusion • 2.8 × 1.2 × 0.8 mm(L×W×H) small size surface mount type • Color Coordinates : x = 0.31, y = 0.32 acc. to CIE 1931, at If=20mA • Viewing angle : extremely wide(110˚) • Technology : InGaN • ESD Class(Mil Std-883d Methode 3015.7) based on Human Body Model(HBM) : 950V • Soldering methods : IR reflow soldering • Taping : 8 mm conductive black carrier tape & antistatic clear cover tape. 3,500pcs/reel, Φ180 mm wheel 2. Outline dimensions (unit : mm) General Tolerance : ±0.1 Different and Better 2/14 LWH1025 3. Package material (1) Material construction Number Item Material 1 LED Chip InGaN/Sapphire 2 Au wire 1.0mil Gold Wire 3 Lead Frame Copper Alloy/Ni/Ag plating 4 Encapsulation Encapsulate + YAG phosphor 5 Heat-Resistant Polymer PPA Different and Better 3/14 LWH1025 4. Absolute Maximum Ratings Parameter (TA = 25℃) Symbol Value Unit Power dissipation PD 120 mW Forward Current IF 30 mA IFP 100 mA Reverse Voltage VR 5 V Operating Temperature Topr -30∼+85 ℃ Storage Temperature Tstg -40∼+100 ℃ Soldering Temperature Tsol *1Peak Forward Current 260℃ for 10 seconds *1.Duty ratio = 1/16, Pulse width = 0.1ms 5. Electrical - Optical Characteristics (TA = 25℃) Characteristic Symbol Test Condition Min. Typ. Max. Unit ESD Check Forward Voltage VF2 IF= 10uA 2.0 - - V Reverse Current IR VR=5V - - 10 uA *6Half Angle θ1/2 IF= 20mA - ±55 - deg *6. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity Different and Better 4/14 LWH1025 6. Ranks (1) Chromaticity Coordinates ranks (If=20mA, Ta=25℃) Rank A Rank B x 0.27 0.27 0.29 0.29 x 0.29 0.29 0.31 0.31 y 0.24 0.28 0.27 0.31 y 0.27 0.31 0.30 0.34 Rank C x 0.31 0.31 0.33 0.33 y 0.30 0.34 0.33 0.37 * The CIE(1931) standard colorimetric system * Chromaticity coordinates Measured : 0.01sr(CIE. LED_B) * Measurement Uncertainty of the Color Coordinates : ±0.01 Different and Better 5/14 LWH1025 (2) Luminous intensity ranks Iv RANK (Ta=25℃) Test Condition R Min. Typ. Max. 291 405 405 583 T 583 810 R 360 500 500 720 720 1000 S IF= 15mA Unit mcd S IF= 20mA T * Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ±11%. * Luminous Intensity Measured : 0.01sr(CIE. LED_B) (3) Forward Voltage Test Condition IF= 15mA (Ta=25℃) Min. Typ. Max. 3.26 3.45 Unit V IF= 20mA 3.4 3.6 * Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V. Different and Better 6/14 LWH1025 7. Taping (1) Dimension of wheel((Material : PS Conductive, 10E9~12Ω) (Unit : mm) (2) Dimension of tape(Material : PS Conductive, 10E4~5Ω) (Unit : mm) Different and Better 7/14 LWH1025 (3) Details of CHIPLEDs loading on tape (End) more than 40mm unloaded tape (Start) mounted with LED (3,500ea) more than 40mm unloaded tape 150 ~ 380mm leading part (4) Loading quantity per reel : 3,500pcs 8. Packing Struction Different and Better 8/14 LWH1025 9. Characteristic Diagrams (1) Relative Luminous Intensity (2) Max. Permissible Forward Current vs Forward Current (IF-Iv) Encapsulat 35 2.5 30 25 Allowable If(mA) Relative Luminosity 2 1.5 1 20 ` 15 10 0.5 5 0 0 0 20 40 60 80 0 20 60 80 100 Ambient Temp Ta(℃) Forward Current(mA) (3) Forward Current vs Forward Voltage(If-Vf) (4) Ambient Temperature vs Relative Luminosity 10 Relative Luminosity 100 Forward Current If(mA) 40 10 0.1 -40 1 2.5 3 3.5 4 1 4.5 -20 0 20 40 60 80 100 Ambient Temp(℃) Forward Voltage(V) Different and Better 9/14 LWH1025 (4) Relative Spectral Emission V(λ) = Standard eye response curve (5) Radiation Characteristic TA=25℃ , IF = 20mA TA=25℃ , IF = 20mA Different and Better 10/14 LWH1025 10. Precautions to taken (1) Reflow soldering (2) For manual solder Not more than 3sec @max350℃, under soldering iron (3) Recommendable soldering pattern(For reflow soldering) Different and Better 11/14 LWH1025 11. Reliability (1) The Reliability criteria of SMD LED Limit ITEM Symbol Test Condition Min. Max. Forward Voltage VF IF = 20mA I.V × 0.8 I.V × 1.2 Reverse Voltage VR IR = 10㎂ LSL - Luminous intensity Iv IF = 20mA I.V × 0.7 I.V × 1.3 * I : Initial Value U : Upper Spec Limit L : Lower Spec Limit (2) Results of reliability Test Item Test Conditions Test Hours /Cycle Sample Size Ac/Re 1 Temperature Cycle H : +100℃ 30min 25℃ 5min L : -40℃ 30min 100 Cycle 21 pcs 0/1 2 High Temperature Operating Life TEMP : 85℃ (IF=5mA) 1000HR’s 21 pcs 0/1 3 Low Temperature Operating Life TEMP : -30℃ (IF=20mA) 1000HR’s 21 pcs 0/1 4 DC Operating Life TEMP : 24℃ (IF=30mA) 500HR’s 21 pcs 0/1 5 High Humidity Heat Operating Life 60℃/90% RH, (IF=15mA) 500HR’s 21 pcs 0/1 6 Solder Heat Test 260℃, 10sec. 2 Time 21 pcs 0/1 NO Different and Better 12/14 LWH1025 12. Precautions in use (1) Soldering Conditions 1) When soldering, leave minimum clearance between the resin and the soldering point. 2) Maximum allowable soldering conditions Soldering dipping : 260 degrees C max., 10 seconds max., 2 time. Soldering iron : 350 degrees C max., 3 seconds max., 1 time, power 40w max. 3) Contact between molten solder and the resin must be avoided. 4) Correction the soldered position after soldering must be avoided. 5) In soldering, do not apply any stress to the lead frame, particularly when heated. 6) When other SMD parts on the same circuit board and adhesive is to be cured, maximum allowable conditions are : 120 degrees C max., 60 seconds max. (2) Lead forming and cut 1) 2) 3) 4) Lead forming must be done below the tie bar cutting portion. When forming a lead, do not stress the resin case. Lead forming must be done before soldering. Cutting the lead frame at high temperature may result in personal injury. Cut the lead frame at room temperature. (3) Assembly 1) Do not apply any stress to the lead frame while assembling. 2) When mounting products onto PCBs, the pitch between the mounting holes must match the pitch of the LEDs. (4) Static Electricity 1) These products are sensitive, a high standard of care must be used. Particularly if an overcurrent and over-voltage which exceeds the Absolute Maximum Rating of Products is applied, the overflow in energy may cause damage to, or possibly result in destruction of, the Products. Customer shall take absolutely secure countermeasures against static electricity and surge when handling Products. 2) A protection device should be installed in the LED driving circuit, which dose not exceed the max. rating for surge current during on/off switching. 3) Proper grounding of Products, use of conductive mat, semiconductive working uniform and shoes, and semiconductive containers are considered to be effective as countermeasures against static electricity and surge. 4) A soldering iron with a grounded tip is recommended. An ionizer should also be installed where risk of static generation is high. (5) Safety Precautions 1) Users must comply with the laws and public regulations concerning safety. The light output of the products may cause injuries to human eyes in circumstances where the products are viewed directly with unshielded eyes for more than a few seconds. Different and Better 13/14 LWH1025 13. Revision history sheet Spec NO. Title Specification for Approval Times Date Summary of revision 1 2 3 2002. 12. 23 2003. 01. 10 2003. 03. 04 신규제정 Iv Rank 변경 색좌표 변경 및 IF=15mA 측정조건 추가 Remarks Different and Better 14/14