MELEXIS MLX90283ELD

MLX90283
BLDC Vibration Motor Driver
Features and Benefits
Application Examples
Low supply voltage
Low current consumption
“Active Start” (proprietary design to address
Dead Point issue)
High motor efficiency
High sensitivity Hall sensor
Full Bridge output driver
Reverse voltage protection
Thermal Protection
Ultra thin leadless RoHS compliant package
No external components
BLDC vibration motors
BLDC micro-motors
Mobile phones
Pagers
Game consoles (force feedback devices)
Other portable devices
Ordering Information
Part No.
MLX90283
1 Functional Diagram
Temperature Code
E (-40°C to 85°C)
Package Code
LD (UTQFN 6L)
2 General Description
The MLX90283 is a one-chip solution for driving
single-coil brushless DC vibration motors.
Designed in mixed signal CMOS technology, the
device integrates Hall sensor with dynamic offset
cancellation, control logic and full bridge output
driver.
Targeting
vibration
motor
application
requirements, Melexis innovates by introducing
the new “Active Start” function that improves
motor start-up reliability.
The device is delivered in an Ultra Thin QFN
package. Its 0.4mm thickness enables thin and
competitive vibration motor design.
This 6-pin leadless package is RoHS compliant.
3901090283
Rev 001
Page 1 of 10
Datasheet
October/07
MLX90283
BLDC Vibration Motor Driver
Table of Contents
1 Functional Diagram ........................................................................................................ 1
2 General Description........................................................................................................ 1
3 Glossary of Terms .......................................................................................................... 3
4 Absolute Maximum Ratings ........................................................................................... 3
5 Pin Definitions and Descriptions................................................................................... 3
6 General Electrical Specifications .................................................................................. 4
7 Magnetic Characteristics ............................................................................................... 4
8 Output Behaviour versus Magnetic Pole ...................................................................... 4
9 Detailed General Description ......................................................................................... 5
10 Unique Features............................................................................................................ 5
11 Performance Graphs .................................................................................................... 6
11.1 Magnetic parameters vs. TJ .....................................................................................................................6
11.2 Magnetic parameters vs. VDD...................................................................................................................6
11.3 RDSON vs. TJ..............................................................................................................................................6
11.4 RDSON vs. VDD ...........................................................................................................................................6
11.5 IDD vs. TJ...................................................................................................................................................6
11.6 IDD vs. VDD ................................................................................................................................................6
11.7 TFW vs. TJ .................................................................................................................................................7
11.8 TFW vs. VDD ...............................................................................................................................................7
12 Application Information................................................................................................ 7
13 Application Comments ................................................................................................. 7
14 Standard information regarding manufacturability of Melexis products with
different soldering processes........................................................................................... 8
15 ESD Precautions ........................................................................................................... 8
16 LD Package Information ............................................................................................... 9
17 Disclaimer.................................................................................................................... 10
3901090283
Rev 001
Page 2 of 10
Datasheet
October/07
MLX90283
BLDC Vibration Motor Driver
3 Glossary of Terms
BLDC
Full Bridge (H-Bridge)
MilliTesla (mT), Gauss
Freewheel
Dead Point
Brush-Less Direct Current
Two push-pull output drivers enabling bidirectional current flow through the
connected load
Units of magnetic flux density:
1mT = 10 Gauss
Period of time while the rotor continues spinning after disengagement from the
drive mechanism, i.e. after switching off the coil output drivers in a BLDC motor.
Rotor angular position where the motor torque is zero
4 Absolute Maximum Ratings
Parameter
Supply Voltage
Continuous Output Current (1)
Peak Output Current
Magnetic Flux Density
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Single-layer (1S0P) PCB
Power dissipation
Multi-layer (1S2P) PCB
ESD Sensitivity (2)
Table 1: Absolute maximum ratings
Symbol
VDD
IOUT
IOUTp
B
TA
TS
TJ
PD
PD
-
Value
-5 to 5
150
250
Unlimited
-40 to 85
-65 to 150
125
500
1600
4000
Units
V
mA
mA
mT
°C
°C
°C
mW
mW
V
Note 1: Value of continuous output current using recommended land pattern – Exposed pad connected to PCB substrate with solder
Note 2: Human Body Model according JESD22-A114 standard – 100pF capacitor discharged through 1.5kΩ resistor into each pin.
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability.
5 Pin Definitions and Descriptions
Pin №
Pin Name
Function
1
VDD
Power Supply
2
NC
Not Connected
3
OUT1
Coil Driver 1
4
GND
Ground
5
OUT2
Coil Driver 2
6
NC
Not Connected
Table 2: Pin definitions and descriptions
Note : Exposed Pad connected to ground
3901090283
Rev 001
Page 3 of 10
Datasheet
October/07
MLX90283
BLDC Vibration Motor Driver
6 General Electrical Specifications
o
DC Operating Parameters TJ = 25 C, VDD = 3V (unless otherwise specified)
Parameter
Supply Voltage
Supply Current
Symbol
VDD
IDD
Output ON Resistance ( Full Bridge)
RON
“Active Start” Detection Period
“Active Start” Frequency
“Active Start” Duty Cycle
Freewheel Delay
Sensing Propagation Delay
Thermal Protection Shutdown
Thermal Protection Release
TON
FAS
DAS
TFW
TSENSE
TSD
TREL
Package Thermal Resistance
RTHj-a
Test Conditions
Operating
No load between OUT1/OUT2
TJ = 25°C
TJ = 85°C
Fixed magnetic field direction
See Note 3
See Note 4
Min
1.8
75
8
60
See Note 5
See Note 6
See Note 6
Single layer (1S0P) PCB
Multi-layer (1S2P) PCB
Typ
3
2.1
2.3
2.7
150
13
87.5
92
36
170
160
250
78
Max
3.6
3.2
4
5
170
20
140
Units
V
mA
Ω
Ω
ms
Hz
%
µs
µs
°C
°C
°C/W
Table 3: Electrical specifications
Note 3: The Active Start Frequency is determined as follow:
Where:
1
FAS =
TAS_FW is the Active Start forward driving duration
TAS _ FW + TAS _ RV
TAS_RV is the Active Start reverse driving duration
Note 4: The Active Start Duty Cycle represents the percentage of forward driving compared to the total Active Start period:
Where:
TAS _ FW
D AS (%) =
TAS_FW is the Active Start forward driving duration
TAS _ FW + TAS _ RV
TAS_RV is the Active Start reverse driving duration
Note 5: The sensing propagation delay represents the delay from the magnetic field change (B>BOP or B<BRP) to the beginning of the
output change.
Note 6: Guarantied by design
7 Magnetic Characteristics
o
DC Operating Parameters TJ = 25 C, VDD = 3V (unless otherwise specified)
Parameter
Symbol
Operate point
BOP
Release point
BRP
Hysteresis
BHYST
Table 4: Magnetic specifications
Min
0
-5
1
Typ
2
-2
4
Max
5
0
8
Units
mT
mT
mT
8 Output Behaviour versus Magnetic Pole
Parameter
Test conditions
OUT1
South pole
B > BOP
High
North pole
B < BRP
Low
Table 5: Output behaviour versus magnetic pole
OUT2
Low
High
Note : The magnetic pole is applied facing the branded side of the package
3901090283
Rev 001
Page 4 of 10
Datasheet
October/07
MLX90283
BLDC Vibration Motor Driver
9 Detailed General Description
The MLX90283 is a complete one-chip solution for driving BLDC vibration motors.
As a result of the low output resistance of the full bridge output and the low supply current, the IC provides
high driving performance and increased motor efficiency.
The built-in reverse voltage protection avoids any damage in case the supply voltage is accidentally reversed.
2
The UTQFN package requires only 3mm PCB surface. The 0.4mm thickness enables production of very
small and thin vibration motors.
The package also includes an Exposed Pad for enhanced thermal performance.
10 Unique Features
The new proprietary design from Melexis “Active Start” provides an appropriate solution against the major
source of vibration motor start-up reliability issue: rotor stalled close to the dead point. When the rotor
position is close to the dead point the force produced by the stator is not sufficient to overcome the
mechanical friction. The rotor is stalled and cannot start rotating without an additional external force.
The “Active Start” function is activated if the magnetic pole sensed by the device does not change for more
than 110ms typical. In this mode the device effectively decreases the mechanical friction by applying a
special shaking signal to the motor coil which helps to overcome the dead point position. The function is
immediately deactivated after a change in the magnetic pole sensed by the device.
A BLDC vibration motor is designed and optimised for one rotation direction (clockwise or counter-clockwise).
Rotating in the reverse direction inevitably leads to a reduction of the motor performance as loss in revolution
per minute and higher current consumption.
The Active Start favours the normal rotation direction to always ensure the highest motor performance.
Vibration motors are predominantly used in battery-powered applications. Low power consumption is a critical
characteristic to ensure longer operation time.
Based on the “Freewheel” principle, the MLX90283 features a special motor driving technique to lower the
motor current consumption. With optimized position of the Hall sensor in the vibration motor, the Freewheel
event occurs only when the motor torque is low. Cutting this part of the motor torque does not affect the
rotation speed while the motor current consumption is reduced proportionally to the rotation speed. This
simple and efficient system directly improves the motor efficiency.
The Freewheel principle enables to reach high rotation speed with lower power consumption than usual.
3901090283
Rev 001
Page 5 of 10
Datasheet
October/07
MLX90283
BLDC Vibration Motor Driver
11 Performance Graphs
11.1 Magnetic parameters vs. TJ
11.2 Magnetic parameters vs. VDD
5
5
Bop, VDD=3V
4
Bop, Tj=-40°C
Bop, Tj=25°C
Bop, Tj=125°C
4
3
3
2
2
Magnetic field (mT)
Magnetic field (mT)
Brp, VDD=3V
1
0
-1
1
0
-1
-2
-2
-3
-3
-4
-4
-5
Brp, Tj=-40°C
Brp, Tj=25°C
Brp, Tj=125°C
-5
-40
-20
0
20
40
60
80
100
120
1.8
2
2.2
2.4
Tj (°C)
2.6
2.8
3
3.2
3.4
3.6
3.4
3.6
VDD (Volts)
11.3 RDSON vs. TJ
11.4 RDSON vs. VDD
5
5
VDD = 1.8V
VDD = 3V
VDD = 3.6V
Tj = -40°C
4
Tj = 25°C
4
Tj = 85°C
Ron (ohms)
Ron (ohms)
Tj = 125°C
3
2
1
3
2
1
0
0
-40
-20
0
20
40
60
80
100
120
1.8
2
2.2
2.4
Tj (°C)
2.6
2.8
3
3.2
VDD (Volts)
11.5 IDD vs. TJ
11.6 IDD vs. VDD
4
4
VDD = 1.8V
VDD = 3V
3
VDD = 3.6V
IDD (mA)
IDD (mA)
3
2
2
Ta = -40°C
Ta = 25°C
1
Ta = 85°C
1
Ta = 125°C
0
0
-40
-20
0
20
40
60
80
100
120
1.8
Tj (°C)
3901090283
Rev 001
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
VDD (Volts)
Page 6 of 10
Datasheet
October/07
MLX90283
BLDC Vibration Motor Driver
11.7 TFW vs. TJ
11.8 TFW vs. VDD
150
150
Tj = -40°C
Tj = 25°C
Tj = 85°C
Tj = 125°C
140
140
130
120
Freewheel duration (us)
Freewheel duration (us)
130
110
100
90
80
120
110
100
90
80
70
70
60
60
50
VDD = 1.8V
VDD = 3V
VDD = 3.6V
50
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
-40
VDD (Volts)
-20
0
20
40
60
80
100
120
Tj (°C)
12 Application Information
13 Application Comments
For proper operation, the power supply should be decoupled by a 22nF ~ 100nF capacitor.
In order to protect the device against over voltages spikes on the VDD line, a zener diode with VZ < 5V should
be connected between VDD and ground, thus limiting the spikes below the absolute maximum rating.
3901090283
Rev 001
Page 7 of 10
Datasheet
October/07
MLX90283
BLDC Vibration Motor Driver
14 Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
•
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
15 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901090283
Rev 001
Page 8 of 10
Datasheet
October/07
MLX90283
BLDC Vibration Motor Driver
16 LD Package Information
1.50 BSC
0.75 BSC
Notes:
1. All dimensions are in millimeters.
2. The terminal #1 identifier and terminal numbering
convention shall conform JEDEC publication 95
SPP-002. Details of terminal #1 identifier are
optional, but must be located within the zone
indicated. The terminal #1 identifier may be
marked feature.
INDEX AREA
see note 2
3. Depopulation is possible in a symmetrical fashion.
4. Pad length applies to metallized terminal and is
measured between 0.15mm and 0.30mm from the
terminal tip. If the terminal has the optional radius
on the other end of the terminal, the pad length
should not be measured in that radius area.
SEATING PLANE
Marking:
0.50 BSC
Terminal Tip
1st Line : .83
“.” (dot) - used to show the 1st pin
83 - Name of the device (MLX90283)
R0.20
0.25+/-0.05
2nd Line : YWW
Y - Year (last digit)
WW - Calendar Week
see note 4
INDEX AREA
see note 2
EXPOSED PAD
1.10+/-0.10
Hall plate location
0.2 MIN
4
1. All dimensions are in millimeters.
3. Recommended minimal distance to prevent solder bridging.
3. Hall Plate position in X and Y axis relative to
package center
1
2
3
Package line
0.00
0.05
4. Recommended distance for good solder filleting.
5. To enable thermal and electrical characteristics
enhancement, the Exposed Pad must be connected to the
PCB substrate with solder.
6. Exposed pad land pattern should be extended whenever
possible. Therefore, its width is not limited whereas its
height should respect the minimal distance as mentioned in
note 3.
Package line
0.24+/-0.02
see note 3
2. Top view is represented. Terminals and exposed
pad are for illustration only.
0.019
2. Top view is represented.
Package pads and outline are for reference.
0.15 MIN
1. All dimensions are in millimeters.
see note 4
Notes:
0.005
Notes:
0.25+/-0.05
0.30+/-0.05
5
0.05 MIN
6
Land Pattern
7. Land pattern based on package supplier’s specification.
LD package dimensions - Blue
Corresponding land pattern - Green
SEATING PLANE
3901090283
Rev 001
Page 9 of 10
Datasheet
October/07
MLX90283
BLDC Vibration Motor Driver
17 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with Melexis for current information. This
product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by
Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© 2005 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia:
Phone: +32 1367 0495
E-mail: [email protected]
America:
Phone: +1 603 223 2362
E-mail: [email protected]
ISO/TS 16949 and ISO14001 Certified
3901090283
Rev 001
Page 10 of 10
Datasheet
October/07