Low Input Current, High Gain Optocouplers Technical Data 6N139 HCPL-0701 HCNW139 6N138 HCPL-0700 HCNW138 Features Applications Description • High Current Transfer Ratio – 2000% Typical (4500% Typical for HCNW139/138) • Low Input Current Requirements – 0.5 mA • TTL Compatible Output – 0.1 V VOL Typical • Performance Guaranteed over Temperature 0°C to 70°C • Base Access Allows Gain Bandwidth Adjustment • High Output Current – 60 mA • Safety Approval UL Recognized – 2500 V rms for 1 Minute and 5000 V rms* for 1 Minute per UL 1577 CSA Approved VDE 0884 Approved with VIORM = 1414 V peak for HCNW139 and HCNW138 BSI Certified (HCNW139 and HCNW138) • Available in 8-Pin DIP or SOIC-8 Footprint or Widebody Package •MIL-STD-1772 Version Available (HCPL-5700/1) • Ground Isolate Most Logic Families – TTL/TTL, CMOS/ TTL, CMOS/CMOS, LSTTL/ TTL, CMOS/LSTTL • Low Input Current Line Receiver • High Voltage Insulation (HCNW139/138) • EIA RS-232C Line Receiver • Telephone Ring Detector • 117 V ac Line Voltage Status Indicator – Low Input Power Dissipation • Low Power Systems – Ground Isolation These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in TTL compatible saturation voltages and high speed operation. Where desired the VCC and VO terminals may be tied together to achieve conventional photodarlington operation. A base access terminal allows a gain bandwidth adjustment to be made. Functional Diagram NC 1 8 VCC ANODE 2 7 VB CATHODE 3 6 VO NC 4 TRUTH TABLE LED VO ON LOW OFF HIGH 5 GND *5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only. A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 2 The 6N139, HCPL-0701, and CNW139 are for use in CMOS, LSTTL or other low power applications. A 400% minimum current transfer ratio is guaranteed over 0 to 70°C operating range for only 0.5 mA of LED current. The 6N138, HCPL-0700, and HCNW138 are designed for use mainly in TTL applications. Current Transfer Ratio (CTR) is 300% minimum over 0 to 70°C for an LED current of 1.6 mA (1 TTL Unit load ). A 300% minimum CTR enables operation with 1 TTL Load using a 2.2 kΩ pull-up resistor. Selection for lower input current down to 250 µA is available upon request. The HCPL-0701 and HCPL-0700 are surface mount devices packaged in an industry standard SOIC-8 footprint. The SOIC-8 does not require “through holes” in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. The HCNW139 and HCNW138 are packaged in a widebody encapsulation that provides creepage and clearance dimensions suitable for safety approval by regulatory agencies worldwide. Selection Guide 8-Pin DIP (300 Mil) Small Outline SO-8 Single Dual Channel Channel Package Package HCPLHCPL- Single Channel Package Dual Channel Package HCPL- 6N139 2731[1] 0701 6N138 2730[1] HCPL-4701[1] 4731[1] Widebody Package (400 mil) Single Channel Package Minimum Input ON Current (IF ) Minimum CTR Absolute Maximum VCC 0731 HCNW139 0.5 mA 400% 18 V 0700 0730 HCNW138 1.6 mA 300% 7V 070A[1] 073A[1] 40 µA 800% 18 V 0.5 mA 300% 20 V Note: 1. Technical data are on separate HP publications. Hermetic Single and Dual Channel Packages HCPL- 5701[1] 5700[1] 5731[1] 5730[1] 3 Ordering Information Specify Part Number followed by Option Number (if desired). Example: 6N139#XXX 020 = 5000 V rms/1 Minute UL Rating Option* 300 = Gull Wing Surface Mount Option† 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information. *For 6N139 and 6N138 only. †Gull wing surface mount option applies to through hole parts only. Schematic VCC 8 ICC 2 ANODE IF + VF CATHODE – IO 3 6 5 SHIELD IB 7 VB VO GND 4 Package Outline Drawings 8-Pin DIP Package (6N139/6N138)** 7.62 ± 0.25 (0.300 ± 0.010) 9.65 ± 0.25 (0.380 ± 0.010) TYPE NUMBER 8 7 6 5 OPTION CODE* 6.35 ± 0.25 (0.250 ± 0.010) DATE CODE HP XXXXZ YYWW RU 1 2 3 4 UL RECOGNITION 1.78 (0.070) MAX. 1.19 (0.047) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 5° TYP. 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. 0.65 (0.025) MAX. 1.080 ± 0.320 (0.043 ± 0.013) DIMENSIONS IN MILLIMETERS AND (INCHES). *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED. 2.54 ± 0.25 (0.100 ± 0.010) **JEDEC Registered Data. 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138) PAD LOCATION (FOR REFERENCE ONLY) 9.65 ± 0.25 (0.380 ± 0.010) 8 7 6 1.016 (0.040) 1.194 (0.047) 5 4.826 TYP. (0.190) 6.350 ± 0.25 (0.250 ± 0.010) 1 2 3 9.398 (0.370) 9.906 (0.390) 4 1.194 (0.047) 1.778 (0.070) 1.19 (0.047) MAX. 1.780 (0.070) MAX. 9.65 ± 0.25 (0.380 ± 0.010) 7.62 ± 0.25 (0.300 ± 0.010) 4.19 MAX. (0.165) 1.080 ± 0.320 (0.043 ± 0.013) 0.635 ± 0.130 2.54 (0.025 ± 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 0.381 (0.015) 0.635 (0.025) 0.635 ± 0.25 (0.025 ± 0.010) + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 12° NOM. 5 Small Outline SO-8 Package (HCPL-0701/HCPL-0700) 8 7 6 5 5.994 ± 0.203 (0.236 ± 0.008) XXX YWW 3.937 ± 0.127 (0.155 ± 0.005) TYPE NUMBER (LAST 3 DIGITS) DATE CODE PIN ONE 1 2 3 4 0.406 ± 0.076 (0.016 ± 0.003) 1.270 BSG (0.050) * 5.080 ± 0.127 (0.200 ± 0.005) 7° 3.175 ± 0.127 (0.125 ± 0.005) 45° X 0.432 (0.017) 0 ~ 7° 0.228 ± 0.025 (0.009 ± 0.001) 1.524 (0.060) 0.203 ± 0.102 (0.008 ± 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 ± 0.254 (0.205 ± 0.010) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. 8-Pin Widebody DIP Package (HCNW139/HCNW138) 11.00 MAX. (0.433) 11.15 ± 0.15 (0.442 ± 0.006) 8 7 6 9.00 ± 0.15 (0.354 ± 0.006) 5 TYPE NUMBER HP HCNWXXXX DATE CODE YYWW 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) MAX. 7° TYP. + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) 0.51 (0.021) MIN. 2.54 (0.100) TYP. 1.78 ± 0.15 (0.070 ± 0.006) 0.40 (0.016) 0.56 (0.022) DIMENSIONS IN MILLIMETERS (INCHES). 6 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138) 11.15 ± 0.15 (0.442 ± 0.006) 6 7 8 PAD LOCATION (FOR REFERENCE ONLY) 5 6.15 (0.242)TYP. 9.00 ± 0.15 (0.354 ± 0.006) 12.30 ± 0.30 (0.484 ± 0.012) 1 3 2 4 1.3 (0.051) 0.9 (0.035) 12.30 ± 0.30 (0.484 ± 0.012) 1.55 (0.061) MAX. 11.00 MAX. (0.433) 4.00 MAX. (0.158) 1.78 ± 0.15 (0.070 ± 0.006) 1.00 ± 0.15 (0.039 ± 0.006) 0.75 ± 0.25 (0.030 ± 0.010) 2.54 (0.100) BSC + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) DIMENSIONS IN MILLIMETERS (INCHES). 7° NOM. LEAD COPLANARITY = 0.10 mm (0.004 INCHES). TEMPERATURE – °C Solder Reflow Temperature Profile (HCPL-07XX and Gull Wing Surface Mount Option 300 Parts) 260 240 220 200 180 160 ∆T = 145°C, 1°C/SEC ∆T = 115°C, 0.3°C/SEC 140 120 100 80 60 40 20 0 ∆T = 100°C, 1.5°C/SEC 0 1 2 3 4 5 6 7 8 9 10 11 12 TIME – MINUTES Note: Use of nonchlorine activated fluxes is highly recommended. 7 Regulatory Information The 6N139/138, HCNW139/138, and HCPL-0701/0700 have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. VDE Approved according to VDE 0884/ 06.92 (HCNW139/138 only). BSI Certification according to BS415:1994, (BS EN60065:1994); BS EN60950:1992 (BS7002:1992) and EN41003:1993 for Class II applications (HCNW139/ HCNW138 only.) Insulation and Safety Related Specifications Parameter Minimum External Air Gap (External Clearance) Minimum External Tracking (External Creepage) Minimum Internal Plastic Gap (Internal Clearance) Minimum Internal Tracking (Internal Creepage) Tracking Resistance (Comparative Tracking Index) Isolation Group Symbol L(101) 8-Pin DIP (300 Mil) Value 7.1 SO-8 Value 4.9 L(102) 7.4 4.8 10.0 mm 0.08 0.08 1.0 mm NA NA 4.0 mm 200 200 200 Volts IIIa IIIa IIIa CTI Widebody (400 Mil) Value Units 9.6 mm Conditions Measured from input terminals to output terminals, shortest distance through air. Measured from input terminals to output terminals, shortest distance path along body. Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Measured from input terminals to output terminals, along internal cavity. DIN IEC 112/VDE 0303 Part 1 Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance with CECC 00802. 8 VDE 0884 Insulation Related Characteristics (HCNW139 and HCNW138) Description Installation Classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 600 V rms for rated mains voltage ≤ 1000 V rms Climatic Classification Pollution Degree (DIN VDE 0110/1.89) Maximum Working Insulation Voltage Input to Output Test Voltage, Method b* VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VPR = 1.5 x VIORM, Type and Sample Test, tP = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 11, Thermal Derating curve.) Case Temperature Current (Input Current I F, PS = 0) Output Power Insulation Resistance at TS, VIO = 500 V Symbol Characteristic Units VIORM I-IV I-III 55/100/21 2 1414 V peak VPR 2652 V peak VPR 2121 V peak VIOTM 8000 V peak TS IS,INPUT PS,OUTPUT RS 175 400 700 > 109 °C mA mW Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884) for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. 9 Absolute Maximum Ratings* (No Derating Required up to 85°C) Parameter Storage Temperature Operating Temperature** Average Forward Input Current Peak Forward Input Current (50% Duty Cycle, 1 ms Pulse Width) Peak Transient Input Current (<1 µs Pulse Width, 300 pps) Reverse Input Voltage HCNW139/138 Input Power Dissipation Output Current (Pin 6) Emitter Base Reverse Voltage (Pin 5-7) Symbol TS TA IF(AVG) IFPK Supply Voltage and Output Voltage (6N139, HCPL-0701, HCNW139) Supply Voltage and Output Voltage (6N138, HCPL-0700, HCNW138) Output Power Dissipation Total Power Dissipation Lead Solder Temperature (for Through Hole Devices) HCNW139/138 Reflow Temperature Profile (for SOIC-8 and Option #300) VCC VCC Min. -55 -40 Max. 125 85 20 40 Units °C °C mA mA IF(TRAN) 1.0 A VR 5 3 35 60 0.5 V V mW mA V -0.5 18 V -0.5 7 V PI IO VEB PO 100 mW PT 135 mW 260°C for 10 sec., 1.6 mm below seating plane 260°C for 10 sec., up to seating plane See Package Outline Drawings section *JEDEC Registered Data for 6N139 and 6N138. **0°C to 70°C on JEDEC Registration. Recommended Operating Conditions Parameter Power Supply Voltage Forward Input Current (ON) Forward Input Voltage (OFF) Operating Temperature Symbol VCC IF(ON) VF(OFF) TA Min. 4.5 0.5 0 0 Max. 18 12.0 0.8 70 Units V mA V °C 10 Electrical Specifications 0°C ≤ TA ≤ 70°C, 4.5 V ≤ VCC ≤ 18 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified. All Typicals at TA = 25°C. See Note 7. Parameter Current Transfer Ratio Sym. CTR Device Min. Typ.** Max. Units Test Conditions Fig. Note 6N139 400* 2000 5000 % IF = 0.5 mA VCC = 4.5 2, 3 1, 2, HCPL-0701 VO = 0.4 V 4 HCNW139 400 4500 6N139 500* 1600 2600 IF = 1.6 mA HCPL-0701 HCNW139 500 3000 300 1600 IF = 5.0 mA 200 850 IF = 12 mA 6N138 300* 1600 2600 IF = 1.6 mA HCPL-0700 HCNW138 1500 Logic Low Output VOL 6N139 0.1 0.4 V IF = 0.5 mA, VCC = 4.5 1 2 Voltage HCPL-0701 IO = 2 mA HCNW139 IF = 1.6 mA, IO = 8 mA IF = 5.0 mA, IO = 15 mA 0.2 IF = 12 mA, IO = 24 mA 6N138 0.1 IF = 1.6 mA, HCPL-0700 IO = 4.8 mA HCNW138 Logic High IOH 6N139 0.05 100 µA VO = VCC = 18 V IF = 0 mA 2 Output Current HCPL-0701 HCNW139 6N138 0.1 250 VO = VCC = 7 V HCPL-0700 HCNW138 Logic Low Supply ICCL 6N138/139 0.4 1.5 mA IF = 1.6 mA, VO = Open, 10 2 Current HCPL-0701/ VCC = 18 V 0700 HCNW139 0.5 2 HCNW138 Logic High ICCH 6N138/139 0.01 10 µA IF = 0 mA, VO = Open, 2 Supply Current HCPL-0701/ VCC = 18 V 0700 HCNW139 1 HCNW138 Input Forward VF 6N138 1.25 1.40 1.7* V TA = 25°C IF = 1.6 mA 4, 8 Voltage 6N139 HCPL-0701 1.75 HCPL-0700 HCNW139 1.0 1.45 1.85 TA = 25°C HCNW138 0.95 1.95 Input Reverse BVR 5.0* V IR = 10 µA, TA = 25°C Breakdown HCNW139 3.0 IR = 100 µA, TA = 25°C Voltage HCNW138 Temperature ∆VF -1.8 mV/°C IF = 1.6 mA 8 Coefficient of ∆TA Forward Voltage Input CIN 60 pF f = 1 MHz, VF = 0 V Capacitance HCNW139 90 HCNW138 *JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted. 11 Switching Specifications (AC) Over recommended operating conditions (TA = 0 to 70°C), VCC = 5 V, unless otherwise specified. Parameter Propagation Delay Time to Logic Low at Output Sym. tPHL Device Min. 6N139 HCPL-0701 HCNW139 6N139 HCPL-0701 HCNW139 6N138 HCPL-0700 HCNW138 Propagation Delay Time to Logic High at Output tPLH HCNW138 6N139 HCPL-0701 HCNW139 HCNW139 6N139 HCPL-0701 HCNW139 HCNW139 6N138 HCPL-0700 HCNW138 6N138 HCPL-0700 HCNW139 Typ.** Max. Units Test Conditions 5 25* µs TA = 25°C 30 IF = 0.5 mA, Rl = 4.7 kΩ 0.2 1* µs TA = 25°C 2 IF = 12 mA, Rl = 270 Ω 1.1 1.6 10* µs TA = 25°C IF = 1.6 mA, 15 Rl = 2.2 kΩ 11 18 60* µs TA = 25°C 90 IF = 0.5 mA, Rl = 4.7 kΩ 115 2 7* µs TA = 25°C 10 IF = 12 mA, Rl = 270 Ω 1.1 10 35* µs TA = 25°C IF = 1.6 mA, Rl = 2.2 kΩ 50 Fig. Note 5, 6, 2, 4 7, 9, 12 5, 6, 7, 9, 12 2, 4 13 5, 6 13 5, 6 70 Common Mode Transient Immunity at Logic High Output |CMH | 1000 10000 V/µs Common Mode Transient Immunity at Logic Low Output |CML| 1000 10000 V/µs *JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted. IF = 0 mA, TA = 25°C Rl = 2.2 kΩ |VCM | = 10 Vp-p IF = 1.6 mA, TA = 25°C Rl = 2.2 kΩ |VCM | = 10 Vp-p 12 Package Characteristics Parameter Input-Output Momentary Withstand Voltage† Option 020 HCNW139 HCNW138 Resistance (Input-Output) Sym. VISO Min. Typ.** Max. Units 2500 V rms RI-O 1012 Ω Capacitance (Input-Output) CI-O 0.6 pF Test Conditions RH < 50%, t = 1 min., TA = 25°C 5000 Fig. Note 3, 8 3, 9 VI-O = 500 Vdc RH < 45% f = 1 MHz 3 3 **All typicals at TA = 25°C, unless otherwise noted. †The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.” Notes: 1. DC CURRENT TRANSFER RATI0 (CTR) is defined as the ratio of output collector current, I O, to the forward LED input current, I F, times 100%. 2. Pin 7 Open. 3. Device considered a two-terminal device. Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 4. Use of a resistor between pin 5 and 7 will decrease gain and delay time. Significant reduction in overall gain can occur when using resistor values below 47 kΩ. For more information, please contact your local HP Components representative. 5. Common mode transient immunity in a Logic High level is the maximum toler- able (positive) dVCM /dt of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 6. In applications where dV/dt may exceed 50,000 V/µs (such as static discharge) a series resistor, RCC, should be included to protect the detector IC from destructively high surge currents. The recommended value is RCC = 220 Ω. 7. Use of a 0.1 µF bypass capacitor connected between pins 8 and 5 adjacent to the device is recommended. 8. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 3000 V rms for 1 second (leakage detection current limit, II-O < 5 µA). This test is performed before the 100% production test shown in the VDE 0884 Insulation Related Characteristics Table, if applicable. 9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection current limit, II-O < 5 µA). This test is performed before the 100% production test for partial discharge (method b) shown in the VDE 0884 Insulation Related Characteristics Table, if applicable. 4.0 mA A 1.5 m 25 1.0 mA 0.5 mA VCC = 5 V TA = 25° C 0 1.0 2.0 1200 800 400 TA = 85°C TA = 70°C TA = 25°C 0.01 TA = 0°C TA = -40°C 1.3 1.4 1.5 tP – PROPAGATION DELAY – µs IF – FORWARD CURRENT – mA + VF – 1.2 0 0.1 35 1.0 Figure 4. Input Diode Forward Current vs. Forward Voltage. 10 TA = 85° C 1.0 0.1 0.01 0.01 10 tPLH 25 20 15 10 tPHL 5 0 -60 -40 -20 1.6 100 TA = 70° C TA = 25° C TA = 0° C TA = -40° C 0.1 10 1 IF – INPUT DIODE FORWARD CURRENT – mA Figure 3. 6N138/6N139 Output Current vs. Input Diode Forward Current. 24 IF = 0.5 mA RL = 4.7 kΩ 1/f = 50 µs 30 VF – FORWARD VOLTAGE – V 0 20 40 60 21 tPLH 15 12 9 6 tPHL 3 0 -60 -40 -20 80 100 Figure 5. Propagation Delay vs. Temperature. IF = 1.6 mA RL = 2.2 kΩ 1/f = 50 µs 18 0 20 40 60 80 100 TA – TEMPERATURE – °C TA – TEMPERATURE – °C Figure 6. Propagation Delay vs. Temperature. 1.6 IF = 12 mA RL = 270 kΩ 1/f = 50 µs 3 VF – FORWARD VOLTAGE – V 4 tP – PROPAGATION DELAY – µs VCC = 5 V VO = 0.4 V 40 IF 0.1 0.001 1.1 -40°C Figure 2. Current Transfer Ratio vs. Forward Current 6N138/6N139. 10 1.0 70°C IF – FORWARD CURRENT – mA Figure 1. 6N138/6N139 DC Transfer Characteristics. 100 25°C 1600 VO – OUTPUT VOLTAGE – V 1000 70°C tP – PROPAGATION DELAY – µs 0 85°C 2000 IO – OUTPUT CURRENT – mA A 3.5 m A 3.0 m A 2.5 m A 2.0 m tPLH 2 1 tPHL 0 -60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – °C Figure 7. Propagation Delay vs. Temperature. 100 IF = 1.6 mA TA = 25° C tf 1.5 TIME – µs IO – OUTPUT CURRENT – mA 5.0 mA 50 4.5 mA CTR – CURRENT TRANSFER RATIO – % 13 1.4 tr 10 1.3 IF – ADJUSTED FOR VOL = 2 V 1.2 -60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – °C Figure 8. Forward Voltage vs. Temperature. 1 0.1 1.0 10 RL – LOAD RESISTANCE – kΩ Figure 9. Nonsaturated Rise and Fall Times vs. Load Resistance. OUTPUT POWER – PS, INPUT CURRENT – IS ICCL – LOGIC LOW SUPPLY CURRENT – mA 14 0.8 0.7 0.6 0.5 VCC = 18 V 0.4 VCC = 5 V 0.3 0.2 0.1 0 0 4 2 6 8 10 12 14 16 WIDEBODY 1000 PS (mW) 900 IS (mA) 800 700 600 500 400 300 200 100 0 0 25 50 75 100 125 150 175 TS – CASE TEMPERATURE – °C IF – FORWARD CURRENT Figure 10. Logic Low Supply Current vs. Forward Current. Figure 11. Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per VDE 0884. IF 0 5V VO (SATURATED RESPONSE) 1.5 V PULSE GEN. ZO = 50 Ω t r = 5 ns IF 10% DUTY CYCLE I/f < 100 µs 1.5 V 1 8 2 7 3 6 VOL t PHL t PLH +5 V RL VO 0.1 µF I F MONITOR 4 5 CL = 15 pF* RM VO (NON-SATURATED RESPONSE) 5V 90% 10% 90% 10% tf Figure 12. Switching Test Circuit. tr * INCLUDES PROBE AND FIXTURE CAPACITANCE 15 VCM 10 V 0 V 10% IF tr, tf = 16 ns 90% 90% tr VO 8 RCC (SEE NOTE 6) +5 V 2 7 RL 3 6 4 5 B 10% tf A 5V SWITCH AT A: IF = 0 mA VO 1 VFF VOL SWITCH AT B: IF = 1.6 mA VCM + – PULSE GEN. Figure 13. Test Circuit for Transient Immunity and Typical Waveforms. VO www.hp.com/go/isolator For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright © 1998 Hewlett-Packard Co. Obsoletes 5965-3599E Printed in U.S.A. 5968-1085E (7/98)