NSC LP5550SQ

LP5550
PowerWise™ Technology Compliant Energy
Management Unit
General Description
Features
The LP5550 is a PWI 1.0 compliant Energy Management
System for reducing power consumption of stand-alone mobile phone processors such as base-band or applications
processors.
The LP5550 contains an advanced, digitally controlled
switching regulator for supplying variable voltage to processor core and memory. The device also incorporates 3 programmable LDO-regulators for powering I/O, PLLs and
maintaining memory retention in shutdown-mode.
The device is controlled via the PWI open-standard interface. The LP5550 operates cooperatively with PowerWise
technology compatible processors to optimize supply voltages adaptively over process and temperature variations or
dynamically using frequency/voltage pre-characterized
look-up tables.
n Supports high-efficiency PowerWise Technology
Adaptive Voltage Scaling
n PWI open standard interface for system power
management
n Digitally controlled intelligent voltage scaling
n 1 MHz PWM switching frequency
n Auto or PWI controlled PFM mode transition
n Internal soft start/startup sequencing.
n 3 programmable LDOs for I/O, PLL, and memory
retention supply generation.
n Power OK output.
Applications
n
n
n
n
n
GSM/GPRS/EDGE & UMTS cellular handsets
Hand-held radios
PDAs
Battery powered devices
Portable instruments
System Diagram
20154563
FIGURE 1. System Diagram
© 2005 National Semiconductor Corporation
DS201545
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LP5550 PowerWise™ Technology Compliant Energy Management Unit
October 2005
LP5550
Connection Diagrams and Package Mark Information
16 - Pin LLP
NS Package Number SQA16A
20154502
FIGURE 2. LP5550 Pinout
Package Mark
20154546
Note: The actual physical placement of the package marking will vary from part to part.
FIGURE 3. Top View
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2
LP5550
Typical Application
20154530
FIGURE 4. Typical Application Circuit
Pin Descriptions
Pin #
Name
I/O
Type
Description
1
SCLK
I
D
PowerWise Interface (PWI) clock input
2
SPWI
I/O
D
PowerWise Interface (PWI) bi-directional data
3
RESETN
I
D
Reset, active low
4
VO2
O
A
LDO2 output, for supplying the I/O voltage on the SoC
5
VBAT1
P
P
Battery supply voltage
6
VO1
O
A
LDO1 output, for supplying a fixed voltage to a PLL etc. on the SoC
7
DGND
G
G
Digital ground
8
PWROK
O
D
Power OK, active high output signal
9
VBATSW
P
P
Battery supply voltage for switching regulator
10
SW
O
A
Switcher pin connected to coil
11
SWGND
G
G
Switcher ground
12
VBAT2
P
P
Battery supply voltage
13
VO3
O
A
LDO3 output, on-chip memory supply voltage
14
VFB
I
A
Switcher output voltage for supplying SoC core logic
15
AGND
G
G
Analog Ground
16
ENABLE
I
D
Enable, active high
A: Analog Pin
D: Digital Pin
I: Input Pin
O: Output Pin
I/O: Input/Output Pin
P: Power Pin
G: Ground Pin
3
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LP5550
Ordering Information
Voltage Option
Order Number
Package Marking
Supplied As
LP5550SQ
LP5550SQ
1000 units, Tape-and-Reel
LP5550SQX
LP5550SQ
4500 units, Tape-and-Reel
*Released. Samples available.
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4
ESD Rating (Note 3)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Human Body Model:
VBAT1, VBAT2, VBATSW
VO1, VO2, VO3 to GND
LP5550
Absolute Maximum Ratings (Notes 1, 2)
SW pin
1.0kV
All other pins
2.0kV
-0.3 to +6.0V
-0.3 to +VBAT1+0.3V
Operating Ratings (Notes 1, 2)
ENABLE, RESETN, VFB,
SW,
SPWI, SCLK, PWROK
-0.3 to VBAT2+0.3V
DGND, AGND, SWGND to
GND SLUG
± 0.3V
Junction Temperature
(TJ-MAX)
150˚C
VBAT1, VBAT2, VBATSW
3.0V to 5.5V
Junction Temperature (TJ)
Range
−40˚C to +125˚C
Ambient Temperature (TA)
Range(Note 5)
−40˚C to +85˚C
Thermal Properties(Note 6)
Storage Temperature Range
-65˚C to 150˚C
Maximum Continuous
Power Dissipation
(PD-MAX) (Note 3)
Maximum Lead
Temperature (Soldering)
39.8˚C/W
Junction-to-Ambient
Thermal Resistance (θJA)
1.0 W
Note 4
General Electrical Characteristics Unless otherwise noted, VBAT1,2,SW , RESETN, ENABLE = 3.6V.
Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the entire
junction temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8, 9)
Symbol
Parameter
Conditions
Typ
Max
IQ
Shutdown Supply current
VBAT1,2,SW = 2.0V, all circuits off.
1
6
µA
Sleep State Supply Current
(VO3 load 1 mA)
VBAT1,2,SW = 3.6V, LDO3 (VO3) on,
PWI on. All other circuits off.
70
85
µA
Acitve State Supply Current
(No load, PFM mode)
VBAT1,2,SW = 3.6V, LDOs 1 and 2 on,
Switcher on, PWI on.
140
165
µA
TSD
Min
Thermal Shutdown Threshold
160
Thermal Shutdown Hysteresis
10
Units
˚C
LDO1 (PLL/Fixed Voltage) Characteristics Unless otherwise noted, VBAT1,2,SW, RESETN, ENABLE = 3.6V. Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply
over the entire junction temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
1mA ≤ IOUT ≤ 100mA,VOUT = 2V,
3.0V ≤ VBAT1,2,SW ≤ 5.5V
-3%
2
3%
V
0.7
1.2
2.2
V
VOUT
Accuracy
Output Voltage
VOUT Range
Programmable Output Voltage 0µA ≤ IOUT ≤ 100mA, Programming
Range
Resolution=100mV
IOUT
Recommended Output Current 3.0V ≤ VBAT1,2,SW ≤ 5.5V
Short Circuit Current Limit
100
VOUT = 0V
IQ
Quiescent Current
IOUT = 0mA(Note 11)
∆VOUT
Line Regulation
3.0V ≤ VBAT1,2,SW ≤ 5.5V, IOUT =
50mA
-0.0125
-0.0085
eN
mA
350
35
45
µA
0.0125 %/V
Load Regulation
VIN = 3.6V, 1mA ≤ IOUT ≤ 100mA
Line Transient Regulation
3.6V ≤ VIN ≤ 3.9V, TRISE,FALL = 10
µs
27
mV
Load Transient Regulation
VIN = 3.6V, 10mA ≤ IOUT ≤ 90 mA,
TRISE,FALL = 100 ns
86
mV
Output Noise Voltage
10Hz ≤ f ≤ 100kHz,COUT = 2.2µF
5
0.0085 %/mA
0.103
mVRMS
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LP5550
LDO1 (PLL/Fixed Voltage) Characteristics Unless otherwise noted, VBAT1,2,SW, RESETN,
ENABLE = 3.6V. Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type
apply over the entire junction temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8) (Continued)
Symbol
Parameter
Conditions
Min
PSRR
Power Supply Ripple Rejection f = 1kHz,COUT = 2.2µF
Ratio
f = 10kHz,COUT = 2.2µF
COUT
Output CapacitanceOutput
Capacitor ESR
tSTART-UP
Start-Up Time from Shut-down COUT = 1µF, IOUT = 100mA
0µA ≤ IOUT ≤ 100mA
Typ
Max
56
dB
36
1
2.2
5
Units
dB
20
500
54
µF
mΩ
µs
LDO2 (I/O Voltage) Characteristics Unless otherwise noted, VBAT1,2,SW , RESETN, ENABLE = 3.6V.
Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the entire
junction temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VOUT
Accuracy
Output Voltage
1mA ≤ IOUT ≤ 250mA,VOUT = 3.3V,
VOUT +0.4V ≤ VBAT1,2,SW ≤ 5.5V
-3%
3.3
3%
V
VOUT Range
Programmable Output Voltage 0µA ≤ IOUT ≤ 250mA, 1.5-2.3V
Range
=100mV step, 2.5V, 2.8V, 3.0V and
3.3V
1.5
3.3
3.3
V
IOUT
Recommended Output Current VOUT +0.4V ≤ VBAT1,2,SW ≤ 5.5V
250
mA
Output Current Limit
VOUT = 0V
Dropout Voltage(Note 10)
IOUT = 125mA
70
260
mV
IQ
Quiescent Current
IOUT = 0mA (Note 11)
55
60
µA
∆VOUT
Line Regulation
VOUT +0.4V ≤ VBAT1,2,SW ≤ 5.5V,
IOUT = 125mA
-0.0125
-0.011
740
0.0125 %/V
Load Regulation
VIN = 3.6V, 1mA ≤ IOUT ≤ 250mA
Line Transient Regulation
3.6V ≤ VIN ≤ 3.9V, TRISE,FALL = 10 us
24
mV
Load Transient Regulation
VIN = 3.6V, 25mA ≤ IOUT ≤ 225 mA,
TRISE,FALL = 100 ns
246
mV
eN
Output Noise Voltage
10Hz ≤ f ≤ 100kHz,COUT = 4.7µF
PSRR
Power Supply Ripple Rejection f = 1kHz, COUT = 4.7µF
Ratio
f = 10kHz, COUT = 4.7µF
COUT
Output Capacitance
0µA ≤ IOUT ≤ 250mA
Output Capacitor ESR
tSTART-UP
0.011
0.120
%/mA
mVRMS
46
dB
34
2
4.7
5
Start-Up Time from Shut-down COUT = 4.7µF, IOUT = 250mA
20
µF
500
mΩ
144
µs
LDO3 (Memory Retention Voltage) Characteristics Unless otherwise noted, VBAT1,2,SW ,
RESETN, ENABLE = 3.6V. Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VOUT
Accuracy
Output Voltage Active state:
Tracking VAVS
IOUT ≤ 50mA,VOUT = 1.2V, 3.0V ≤
VBAT1,2,SW ≤ 5.5V
-3%
1.2
3%
V
Sleep state: Memory retention
voltage regulation
IOUT ≤ 5mA,VOUT = 1.2V, 3.0V ≤
VBAT1,2,SW ≤ 5.5V
-3%
1.2
3%
V
Active State Buffer offset (=
VO3-VFB)
IOUT = 50 mA,
VOUT = 0.6 V
13
mV
IOUT = 50 mA,
VOUT = 1.2V
28
mV
VOFFSET
VOUT Range
Programmable Output Voltage
Range (Sleep state)
0µA ≤ IOUT ≤ 5mA, Programming
Resolution=50mV
IQ
Quiescent Current
Active mode, IOUT = 10µA (Note 11)
33
44
µA
Sleep mode, IOUT = 10µA (Note 11)
10
16
µA
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0.6
1.2
1.35
V
Symbol
Parameter
IOUT
Recommended Output Current, 3.0V ≤ VBAT1,2,SW ≤ 5.5V
Active state
Conditions
Min
50
Recommended Output Current, 3.0V ≤ VBAT1,2,SW ≤ 5.5V
Sleep state
5
Short Circuit Current Limit,
Active state
VOUT = 0V
eN
Output Voltage Noise
10Hz ≤ f ≤ 100kHz,COUT = 1µF
PSRR
Power Supply Ripple Rejection f = 217Hz, COUT = 1.0µF
Ratio
COUT
Output Capacitance
Typ
Max
Units
mA
230
0µA ≤ IOUT ≤ 5mA
Output Capacitor ESR
0.158
mVRMS
36
0.7
1
5
dB
2.2
µF
500
mΩ
Switcher (Core Voltage) Characteristics Unless otherwise noted, VBAT1,2,SW , RESETN, ENABLE
= 3.6V. Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over
the entire junction temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8)
Symbol
Parameter
Conditions
VOUT
Accuracy
Output Voltage
IOUT = 1 mA, VOUT = 1.2V, 3.0V <
VBAT1,2,SW < 5.5V
1.53%
Min
2.70% V
IOUT = 1-300 mA, 3.0V < VBAT1,2,SW
< 5.5V
-0.44%
2.70%
VOUT Range
Programmable Output Voltage 0mA ≤ IOUT ≤ 300mA, Programming
Range
Resolution = 4.7mV
∆VOUT
Line regulation
3.0V < VBAT1,2,SW < 5.5V,
IOUT = 10 mA
Load regulation
VBAT1,2,SW = 3.6V
IOUT = 100-300mA
0.6
Typ
1.2
Max
Units
1.2
V
0.18
%/V
0.0019
%/mA
IQ
Quiescent current consumption IOUT = 0mA
15
30
µA
RDSON(P)
P-FET resistance
VBAT1,2,SW = VGS = 3.6V
360
690
mΩ
RDSON(N)
N-FET resistance
VBAT1,2,SW = VGS = 3.6V
250
660
mΩ
ILIM
Switch peak current limit
3.0V < VBAT1,2,SW < 5.5V
400
620
750
mA
fOSC
Internal oscillator frequency
PWM-mode
800
1000
1360
kHz
Output Capacitance
0mA ≤ IOUT ≤ 300mA
5
10
COUT
Output Capacitor ESR
L
Inductor inductance
RVFB
VFB pin resistance to ground
5
0uA ≤ IOUT ≤ 300mA
22
µF
500
mΩ
650
kΩ
4.7 / 10
150
µH
Logic and Control Inputs Unless otherwise noted, VBAT1,2,SW , RESETN, ENABLE = 3.6V. Typical values
and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8, 9)
Symbol
Parameter
Conditions
VIL
Input Low Level
ENABLE, RESETN, SPWI, SCLK
3.0V ≤ VBAT1 ≤ 5.5V
Min
VIH
Input High Level
ENABLE, RESETN 3.0V ≤ VBAT1 ≤
5.5V
VIH_PWI
Input High Level, PWI
SPWI, SCLK, 1.5V ≤VO2 ≤ 3.3V
IIL
Logic Input Current
ENABLE, RESETN, 0V ≤ VBAT1 ≤
5.5V
-5
5
µA
IIL_PWI
Logic Input Current, PWI
SPWI, SCLK, 1.5V ≤ VO2 ≤ 3.3V
-5
15
µA
7
Typ
Max
Units
0.2
V
2
V
VO2-0.2V
V
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LP5550
LDO3 (Memory Retention Voltage) Characteristics Unless otherwise noted, VBAT1,2,SW ,
RESETN, ENABLE = 3.6V. Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in
boldface type apply over the entire junction temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8) (Continued)
LP5550
Logic and Control Inputs Unless otherwise noted, VBAT1,2,SW , RESETN, ENABLE = 3.6V. Typical values
and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction
temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8, 9) (Continued)
Symbol
Parameter
RPD_PWI
Pull-down resistance for PWI
signals
TEN_LOW
Minimum low pulse width to
enter STARTUP state
Conditions
Min
Typ
Max
0.5
1
2
ENABLE pulsed high - low - high
from SHUTDOWN state
100
ENABLE pulsed high - low - high
from SLEEP or ACTIVE state
4
Units
MΩ
µsec
Logic and Control Outputs Unless otherwise noted, VBAT1,2,SW , RESETN, ENABLE = 3.6V. Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction
temperature range for operation, -40 to +125˚C. (Notes 2, 7, 8, 9)
Symbol
Parameter
Conditions
VOL
Output low level
PWROK, SPWI, ISINK ≤ 1 mA
Min
VOH
Output high level
PWROK, ISOURCE ≤ 1 mA
VOH_PWI
Output high level, PWI
SPWI, ISOURCE ≤ 1 mA
Typ
Max
0.4
Units
V
VBAT1-0.4V
V
VO2-0.4V
V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
The amount of Absolute Maximum power dissipation allowed for the device depends on the ambient temperature and can be calculated using the formula P = (TJ
– TA)/θJA, (1) where TJ is the junction temperature, TA is the ambient temperature, and JA is the junction-to-ambient thermal resistance.
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care
must be paid to thermal dissipation issues in board design.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150˚C (typ.) and disengages at TJ=140˚C (typ.).
Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1187: Leadless Leadframe Package (LLP)
(AN-1187).
Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125˚C), the maximum power
dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the
following equation: TA-MAX = TJ-MAX-OP – (θJA x PD-MAX).
Note 6: Junction-to-ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC
standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2x1 array of thermal vias. The ground plane on the board
is 50mm x 50mm. Thickness of copper layers are 36µm/18µm/18µm/36µm (1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22˚C, still air. Power
dissipation is 1W.
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care
must be paid to thermal dissipation issues in board design.
The value of θJA of this product can vary significantly, depending on PCB material, layout, and environmental conditions. In applications where high maximum power
dissipation exists (high VIN, high IOUT), special care must be paid to thermal dissipation issues. For more information on these topics, please refer to Application
Note 1187: Leadless Leadframe Package (LLP) and the Power Efficiency and Power Dissipation section of this datasheet.
Note 7: All limits are guaranteed by design, test and/or statistical analysis. All electrical characteristics having room-temperature limits are tested during production
with TJ = 25C. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process
control.
Note 8: Capacitors: Low-ESR Surface-Mount Ceramic Capacitors are (MLCCs) used in setting electrical characteristics
Note 9: Guaranteed by design.
Note 10: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100mV below its nominal value. This specification does not apply
in cases it implies operation with an input voltage below the 3.0V minimum appearing under Operating Ratings. For example, this specification does not apply for
devices having 1.5V outputs because the specification would imply operation with an input voltage at or about 1.5V
Note 11: Quiescent current for LDO1, LDO2, and LDO3 do not include shared functional blocks such as the bandgap reference.
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LP5550
Simplified Functional Diagram
20154532
FIGURE 5. Simplified Functional Diagram
9
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LP5550
Typical Performance Characteristics
Unless otherwise stated: VIN=3.6V
IQ vs. VIN
Shutdown
IQ vs. VIN
Sleep, no load on LDO3
20154504
20154505
Start-up Sequence
VO1, VO2, VOSW
Start-up Sequence
VOSW, VO3
20154506
20154507
Start-up Sequence
Inrush Current
Line Transient Response
VOSW, VO3
20154556
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20154509
10
Line Transient Response
VO1, VO2
LP5550
Typical Performance Characteristics Unless otherwise stated: VIN=3.6V
(Continued)
Load Transient Response
VO2
20154553
20154554
Load Transient Resoponse
VO1
LDO1 PSRR
20154555
20154557
LDO2 PSRR
LDO3 PSRR
20154558
20154559
11
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LP5550
Typical Performance Characteristics Unless otherwise stated: VIN=3.6V
(Continued)
Load Transient Response
Switcher, Automatic PWM/PFM Transition
Switching Frequency vs. VIN
20154513
20154510
Load Trainsiet Response
Switcher, PWM only
Load Transient Response
Switcher, PFM only
20154514
20154515
VOUT Transient Response
Min to Max Transient
VOUT Transient Response
Max to Min Transient
20154516
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20154517
12
Switch Current Limit vs. VIN
LP5550
Typical Performance Characteristics Unless otherwise stated: VIN=3.6V
(Continued)
Efficiency vs. Load (Switcher)
20154518
20154519
Switching Waveforms
PWM
Switching Waveforms
PFM
20154520
20154521
LP5550 PWI Register Map
The PWI standard supports sixteen 8-bit registers on the PWI slave. The table below summarizes these registers and shows
default register bit values after reset. The following sub-sections provide additional detail on the use of each individual register.
Summary
Reset Default Value
Register
Address
Register
Name
Register Usage
Type
7
6
5
4
3
2
1
0
0x0
R0
Core voltage
R/W
0
1
1
1
1
1
1
1
0x1
R1
Unused
R/W
-
-
-
-
-
-
-
-
0x2
R2
Memory retention voltage
R/W
0
1
1
0
0
-
-
-
0x3
R3
Status register
R/O
0
0
0
0
1
1
1
1
0x4
R4
PWI version number
R/O
0
0
0
0
0
0
0
1
0x5
R5
Unused
R/W
-
-
-
-
-
-
-
-
0x6
R6
Unused
R/W
-
-
-
-
-
-
-
-
0x7
R7
LDO2 voltage
R/W
0
1
1
1
1
-
-
-
0x8
R8
LDO1 voltage
R/W
0
0
1
0
1
-
-
-
0x9
R9
PFM/PWM force
R/W
0
0
-
-
-
-
-
-
13
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LP5550
LP5550 PWI Register Map
Summary
(Continued)
(Continued)
Reset Default Value
Register
Address
Register
Name
Register Usage
Type
7
6
5
4
3
2
1
0
0xA
R10
Unused
R/W
-
-
-
-
-
-
-
-
0xB
R11
Unused
R/W
-
-
-
-
-
-
-
-
0xC
R12
Unused
R/W
-
-
-
-
-
-
-
-
0xD
R13
Unused
R/W
-
-
-
-
-
-
-
-
0xE
R14
Unused
R/W
-
-
-
-
-
-
-
-
0xF
R15
Reserved
R/W
-
-
-
-
-
-
-
-
R0 - Core Voltage Register
Address 0x0
Type R/W
Reset Default 8h’7F
Bit
Field Name
Description or Comment
7
Sign
This bit is fixed to ‘0’. Reading this bit will result in a ‘0’. Any data written into
this bit position using the Register Write command is ignored.
6:0
Voltage
Core voltage value. Default value is in bold.
Voltage Data Code [7:0]
Voltage Value (V)
7h’00
0.6
7h’xx
Linear scaling
7h’7f
1.2 (default)
R1 - Unused Register
Address 0x1
Type R/W
Reset Default 8h’00
Bit
Field Name
Description or Comment
7:0
Unused
Write transactions to this register are ignored. Read transactions will
return a “No Response Frame.” A no response frame contains all
zeros (see PWI 1.0 specification).
R2 – VO3 Voltage Register (Memory Retention Voltage)
Address 0x2
Type R/W
Reset Default 8h’60
Bit
Field Name
Description or Comment
7
Sign
This bit is fixed to ‘0’. Reading this bit will result in a ‘0’. Any data written into
this bit position using the Register Write command is ignored.
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14
LP5550
R2 – VO3 Voltage Register (Memory Retention Voltage)
(Continued)
Bit
Field Name
Description or Comment
6:3
Voltage
Fixed voltage value. A code of all ones indicates maximum voltage while a code
of all zero indicates minimum voltage. Default value is in bold.
2:0
Unused
Voltage Data Code [6:3]
Voltage Value (volts)
4h’0
0.6
4h’1
0.65
4h’2
0.7
4h’3
0.75
4h’4
0.8
4h’5
0.85
4h’6
0.9
4h’7
0.95
4h’8
1
4h’9
1.05
4h’A
1.1
4h’B
1.15
4h’C
1.20 (default)
4h’D
1.25
4h’E
1.3
4h’F
1.35
These bits are fixed to ‘0’. Reading
these bits will result in a ‘000’. Any data
written into these bits using the
Register Write command is ignored.
R3 - Status Register
Address 0x3
Type Read Only
Reset Default 8h’0F
Bit
Field Name
Description or Comment
7
Reserved
Reserved, read returns 0
6
Reserved
Reserved, read returns 0
5
User Bit
Unused, read returns 0
4
User Bit
Unused, read returns 0
3
Fixed OK
Unused, read returns 1
2
IO OK
Unused, read returns 1
1
Memory OK
Unused, read returns 1
0
Core OK
Unused, read returns 1
R4 - PWI Version Number Register
Address 0x4
Type Read Only
Reset Default 8h’01
Bit
Field Name
Description or Comment
7:0
Version
Read transaction will return 8h’01 indicating PWI 1.0 specification.
Write transactions to this register are ignored.
15
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LP5550
R5-R6 - Unused Registers
Address 0x5, 0x6
Type R/W
Reset Default 8h’00
Bit
Field Name
Description or Comment
7:00
Unused
Write transactions to this register are ignored. Read transactions will
return a “No Response Frame.” A no response frame contains all
zeros (see PWI 1.0 specification).
R7 – VO2 Voltage Register (I/O Voltage)
Address 0x7
Type R/W
Reset Default 8h’78
Bit
Field Name
Description or Comment
7
Sign
This bit is fixed to ‘0’. Reading this bit will result in a ‘0’. Any data written into
this bit position using the Register Write command is ignored.
6:3
Voltage
Fixed voltage value. A code of all ones indicates maximum voltage while a code
of all zero indicates minimum voltage. Default value is in bold.
2:0
Unused
Voltage Data Code [6:3]
Voltage Value (volts)
4h’0
1.5
4h’1
1.5
4h’2
1.5
4h’3
1.5
4h’4
1.6
4h’5
1.7
4h’6
1.8
4h’7
1.9
4h’8
2
4h’9
2.1
4h’A
2.2
4h’B
2.3
4h’C
2.5
4h’D
2.8
4h’E
3
4h’F
3.3 (default)
These bits are fixed to ‘0’. Reading these bits will result in a ‘000’. Any data
written into these bits using the Register Write command is ignored.
R8 – VO1 Voltage Register (PLL/Fixed Voltage)
Address 0x8
Type R/W
Reset Default 8h’28
Bit
Field Name
Description or Comment
7
Sign
This bit is fixed to ‘0’. Reading this bit will result in a ’0’. Any data written into
this bit position using the Register Write command is ignored.
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16
LP5550
R8 – VO1 Voltage Register (PLL/Fixed Voltage)
(Continued)
Bit
Field Name
Description or Comment
6:3
Voltage
Fixed voltage value. A code of all ones indicates maximum voltage while a code
of all zero indicates minimum voltage. Default value is in bold.
2:0
Unused
Voltage Data Code [6:3]
Voltage Value (volts)
4h’0
0.7
4h’1
0.8
4h’2
0.9
4h’3
1
4h’4
1.1
4h’5
1.2 (default)
4h’6
1.3
4h’7
1.4
4h’8
1.5
4h’9
1.6
4h’A
1.7
4h’B
1.8
4h’C
1.9
4h’D
2
4h’E
2.1
4h’F
2.2
These bits are fixed to ‘0’. Reading these bits will result in a 3b’000. Any data
written into these bits using the Register Write command is ignored.
R9– PFM/PWM Force Register
Address 0x9
Type R/W
Reset Default 8h’00
Bit
Field Name
7:6
PFM/PWM
Force
5:0
Unused
Description or Comment
User Register
PFM Force (bit 7)
PWM Force (bit 6)
Automatic Transition
0
0
Automatic Transition
1
1
Forced PFM Mode
1
0
Forced PWM Mode
0
1
These bits are fixed to ‘0’. Reading these bits will result in a ‘000000’. Any data written into
these bits using the Register Write command is ignored.
R10-R14 – Unused Registers
Address 0xA, 0xB, 0xC, 0xD, 0xE
Type R/W
Reset Default 8h’00
Bit
Field Name
Description or Comment
7:0
Unused
Write transactions to this register are ignored. Read transactions will
return a “No Response Frame.” A no response frame contains all
zeros (see PWI 1.0 specification) frame.
17
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LP5550
Reset Default 8h’00
R15 – Manufacturer Register
Adress 0xF
Type R/W
Bit
Field Name
Description or Comment
7:0
Reserved
Do not write to this register
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18
DEVICE INFORMATION
their default levels. LP5550 can be turned off by supplying
the Shutdown command over PWI, or by setting ENABLE
and/or RESETN to ’0’. The LP5550 can be switched to the
Sleep state by issuing the Sleep command.
The LP5550 is a PowerWise Interface (PWI) compliant
power management unit (PMU) for application or baseband
processors in mobile phones or other portable equipment. It
operates cooperatively with processors using National Semiconductor’s Advanced Power Controller (APC) to provide
Adaptive or Dynamic Voltage Scaling (AVS, DVS) which
drastically improves processor efficiencies compared to conventional power delivery methods. The LP5550 consists of a
high efficiency switching DC/DC buck converter to supply the
AVS or DVS voltage domain, three LDOs for supplying the
logic, PLL, and memory, and PWI registers and logic.
In the Sleep state the core voltage regulator is off, but the
PWROK output is still ‘1’. The memory voltage regulator
(VO3) provides the programmed memory retention voltage.
LDO1 and LDO2 are on. The LP5550 can be activated from
the Sleep state by giving the Wake-up command. This resumes the last programmed Active state configuration. The
device can also be switched off by giving the Shutdown
command, or by setting ENABLE and/or RESETN to ‘0’
In the Shutdown-state all output voltages are ‘0’, and
PWROK-signal is ‘0’ as well. The LP5550 can exit the
Shutdown-state if either ENABLE or RESETN is ‘0’. In either
case the device moves to the Start-up state. See the ENABLE
Figure 6 shows the LP5550 state diagram. The figure assumes that supply voltage to the regulator IC is in the valid
range.
OPERATION STATE DIAGRAM
The LP5550 has four operating states: Start-up, Active,
Sleep and Standby.
The Start-up state is the default state after reset. All regulators are off and PWROK output is ‘0’. The device will power
up when the external enable-input is pulled high. After the
power-up sequence LP5550 enters the Active state.
In the Active state all regulators are on and PWROK-output
is ‘1’. Immediately after Start-up the output voltages are at
20154545
FIGURE 6. LP5550 State Diagram
19
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LP5550
Operation Description
LP5550
Operation Description
•
•
•
•
•
•
(Continued)
VOLTAGE SCALING
The LP5550 is designed to be used in a voltage scaling
system to lower the power dissipation of baseband or application processors in mobile phones or other portable equipment. By scaling supply voltage with the clock frequency of a
processor, dramatic power savings can be achieved. Two
types of voltage scaling are supported, dynamic voltage
scaling (DVS) and adaptive voltage scaling (AVS). DVS
systems switch between pre-characterized voltages which
are paired to clock frequencies used for frequency scaling in
the processor. AVS systems track the processor performance and optimize the supply voltage to the required performance. AVS is a closed loop system that provides process and temperature compensation such that for any given
processor, temperature, or clock frequency, the minimum
supply voltage is delivered.
Synchronize
PWM/PFM OPERATION
The switching converter in the LP5550 has two modes of
operation: pulse width modulation (PWM) and pulse frequency modulation (PFM). In PWM the converter switches at
1MHz. Each period can be split into two cycles. During the
first cycle, the high-side switch is on and the low-side switch
is off, therefore the inductor current is rising. In the second
cycle, the high-side switch is off and the low-side switch is on
causing the inductor current to decrease. The output ripple
voltage is lowest in PWM mode Figure 7. As the load current
decreases, the converter efficiency becoms worse due to the
increased percentage of overhead current needed to operate in PWM mode. The LP5550 can operate in PFM mode to
increase efficiency at low loads.
By default, the part will automatically transition into PFM
mode when either of two conditions occurs for a duration of
32 or more clock cycles:
DIGITALLY CONTROLLED VOLTAGE SCALING
The LP5550 delivers fast, controlled voltage scaling transients with the help of a digital state machine. The state
machine automatically optimizes the control loop in the
LP5550 switching regulator to provide large signal transients
with minimal over- and undershoot. This is an important
characteristic for voltage scaling systems that rely on minimal over- and undershoot to set voltages as low as possible
and save energy.
A. The inductor valley current goes below 0 A
B. The peak PMOS switch current drops below the IMODE
level:
LARGE SIGNAL TRANSIENT RESPONSE
The switching converter in the LP5550 is designed to work in
a voltage scaling system. This requires that the converter
has a well controlled large signal transient response. Specifically, the under- and over-shoots have to be minimal or
zero while maintaining settling times less than 100 usec.
Typical response plots are shown in the Typical Performance
section.
During PFM operation, the converter positions the output
voltage slightly higher than the nominal output voltage during
PWM operation, allowing additional headroom for voltage
drop during a load transient from light to heavy load. The
PFM comparators sense the output voltage via the feedback
pin and control the switching of the output FETs such that the
output voltage ramps between 0.8% and 1.6% (typ) above
the nominal PWM output voltage. If the output voltage is
below the ‘high’ PFM comparator threshold, the PMOS
power switch is turned on. It remains on until the output
voltage exceeds the ‘high’ PFM threshold or the peak current
exceeds the IPFM level set for PFM mode. The peak current
in PFM mode is:
PowerWise (TM) INTERFACE
To support DVS and AVS, the LP5550 is programmable via
the low power, 2 wire PowerWise Interface (PWI). This serial
interface controls the various voltages and states of all the
regulators in the LP5550. In particular, the switching regulator voltage can be controlled between 0.6V and 1.2V in 128
steps (linear scaling). This high resolution voltage control
affords accurate temperature and process compensation in
AVS. The LDO voltages can also be set, however they are
not intended to be dynamic in operation. The LP5550 supports the full command set as described in PWI 1.0 specification:
• Core Voltage Adjust
• Reset
• Sleep
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Shutdown
Wakeup
Register Read
Register Write
Authenticate
20
LP5550
Operation Description
(Continued)
20154503
FIGURE 7. Operation in PFM Mode and Transfer to PWM Mode
21
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LP5550
INDUCTOR
A 10uH or 4.7uH inductor should be used with the LP5550.
The inductor should be rated to handle the peak load current
plus the ripple current:
Application Information
PWM/PFM FORCE REGISTER (R9)
By default, the LP5550 automatically transitions between
PFM and PWM to optimize efficiency. The PWM/PFM force
register (R9) provides the option to override the automatic
transition and force PFM or PWM operation (see R9 –
PWM/PFM Force Register declaration). Note that if the operating mode of the regulator is forced to be PFM then the
switch current limit is reduced to 100 mA (50 mA average
load current).
EN/RESETN
The LP5550 can be shutdown via the ENABLE or RESETN
pins, or by issuing a shutdown command from PWI. To
disable the LP5550 via hardware (as opposed to the PWI
shutdown command), pull the ENABLE and/or the RESETN
pin(s) low. To enable the LP5550, both the ENABLE and the
RESETN pins must be high. Once enabled, the LP5550
engages the power-up sequence and all voltages return to
their default values.
When using PWI to issue a shutdown command, the PWI will
be disabled along with the regulators in the LP5550. To
re-enable the part, either the ENABLE, RESETN, or both
pins must be toggled (high – low – high). The part will then
enter the power-up sequence and all voltages will return to
their default values. Figure 8 summarizes the ENABLE/
RESETN control.
The ENABLE and RESETN pins provide flexibility for system
control. In larger systems such as a mobile phone, it can be
advantageous to enable/disable a subsystem independently.
For example, the LP5550 may be powering the applications
processor in a mobile phone. The system controller can
power down the applications processor via the ENABLE pin,
but leave on other subsystems. When the phone is turned off
or in a fault condition, the system controller can have a
global reset command that is connected to all the subsystems (RESETN for the LP5550). However, if this type of
control is not needed, the ENABLE and RESETN pins can
be tied together and used as a single enable/disable pin.
CURRENT LIMIT
The switching converter in the LP5550 detects the peak
inductor current and limits it for protection (see Electrical
Characteristics table and/or Typical Performance section).
To determine the average current limit from the peak current
limit, the inductor size, input and output voltage, and switching frequency must be known. The LP5550 is designed to
work with a 4.7uH or 10uH inductor, so:
INPUT CAPACITOR
The input capacitor to the switching converter supplies the
AC switching current drawn from the switching action of the
internal power FETs. The input current of a buck converter is
discontinuous, so the ripple current supplied by the input
capacitor is large. The input capacitor must be rated to
handle this current:
The power dissipated in the input capacitor is given by:
The input capacitor must be rated to handle both the RMS
current and the dissipated power. A 10 µF ceramic capacitor
is recommended for the LP5550.
20154551
FIGURE 8. ENABLE and RESETN operation
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22
LP5550
Application Information
(Continued)
OUTPUT CAPACITOR
The switching converter in the LP5550 is designed to be
used with a 10uF ceramic output capacitor. The dielectric
should be X5R, X7R, or comparable material to maintain
proper tolerances. The output capacitor of the switching
converter absorbs the AC ripple current from the inductor
and provides the initial response to a load transient. The
ripple voltage at the output of the converter is the product of
the ripple current flowing through the output capacitor and
the impedance of the capacitor. The impedance of the capacitor can be dominated by capacitive, resistive, or inductive elements within the capacitor, depending on the frequency of the ripple current. Ceramic capacitors are
predominately used in portable systems and have very low
ESR and remain capacitive up to high frequencies.
LDO INFORMATION
The LDOs included in the LP5550 provide static supply
voltages for various functions in the processor. Use the
following sections to determine loading and external components.
LDO LOADING CAPABILITY
The LDOs in the LP5550 can regulate to a variety of output
voltages, depending on the need of the processor. These
voltages can be programmed through the PWI. Table 1
summarizes the parameters of the LP5550 LDOs.
The switcher peak - to - peak output voltage ripple in steady
state can be calculated as:
TABLE 1. LDO Parameters
PWI Register
Output voltage
range
Recommended
Maximum Output
Current
Dropout Voltage
(typical)
Typical Load
LDO1
R8
0.6 V – 2.2 V
100 mA
200 mV
PLL
LDO2
R7
1.5 V – 3.3 V
250 mA
150 mV
I/O
LDO3
R2
VOSW + 0.05 V1
0.7 V – 1.35 V2
50 mA
200 mV
Memory/Memory
retention
1. LDO3 tracks the switching converter output voltage (VOSW) plus a 50 mV offset when the LP5550 is in active state.
2. LDO3 regulates at the set memory retention voltage when the LP5550 is in shutdown state.
LDO OUTPUT CAPACITOR
The output capacitor sets a low frequency pole and a high
frequency zero in the control loop of an LDO. The capacitance and the equivalent series resistance (ESR) of the
capacitor must be within a specified range to meet stability
requirements. The LDOs in the LP5550 are designed to be
used with ceramic output capacitors. The dielectric should
be X5R, X7R, or comparable material to maintain proper
tolerances. Use the following table to choose a suitable
output capacitor:
TABLE 2. Output Capacitor Selection Guide
Output Capacitance Range
(Recommended Typical Value)
ESR range
LDO1
1 µF – 20 µF (2.2 µF)
5 mohm – 500 mohm
LDO2
2 µF – 20 µF (4.7 µF)
5 mohm – 500 mohm
LDO3
0.7 µF – 2.2 µF (1.0 µF)
5 mohm– 500 mohm
23
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LP5550
Application Information
(Continued)
BOARD LAYOUT CONSIDERATIONS
20154561
FIGURE 9. Board Layout Design Recommendations for the LP5550
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24
inches (millimeters) unless otherwise noted
16-Lead LLP Package
NS Package Number SQA16A
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the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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LP5550 PowerWise™ Technology Compliant Energy Management Unit
Physical Dimensions