LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOT MATRIX DIGIT LED DISPLAY (2.3Inch) LMD8821/2DHRFVG-XX DATA SHEET DOC. NO : QW0905- LMD8821/2DHRFVG-XX REV. : A DATE : 24 - May.- 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/9 PART NO. LMD8821/2DHRFVG-XX Package Dimensions 60.1(2.37") 8.9 (0.35") 7.62X7=53.34(2.1") 7.62X7 =53.34 (2.1") 60.1 (2.37") LMD8821/2DHRFVG-XX LIGITEK ψ5.0(0.197") 5.4± 0.5 ψ0.51 TYP 2.54X11=27.97 (1.1") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 45.8 (1.803") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8821/2DHRFVG-XX Page 2/9 Internal Circuit Diagram LMD8821DHRFVG-XX 1 2 3 4 5 6 23 24 20 21 17 18 14 15 2 1 5 4 COLUMN ROW PIN 7 8 7 11 10 8 1 22 2 19 3 16 4 13 5 3 6 6 7 9 8 12 LMD8822DHRFVG-XX COLUMN ROW PIN 1 4 5 2 3 23 24 20 21 17 18 14 15 2 1 6 5 7 4 8 8 7 11 10 1 22 2 19 3 16 4 13 5 3 6 6 7 9 8 12 RED GREEN LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8821/2DHRFVG-XX Page 3/9 Electrical Connection PIN NO. LMD8821DHRFVG-XX PIN NO. LMD8821DHRFVG-XX 1 Cathode Column 5 (Green) 13 Anode Row 2 Cathode Column 5 (Red) 14 Cathode Column 4 (Red) 3 Anode Row 5 15 Cathode Column 4 (Green) 4 Cathode Column 6 (Green) 16 Anode Row 5 Cathode Column 6 (Red ) 17 Cathode Column 3 (Red) 6 Anode Row 6 18 Cathode Column 3 (Green) 7 Cathode Column 7 (Green) 19 Anode Row 8 Cathode Column 7 (Red) 20 Cathode Column 2 (Red) 9 Anode Row 7 21 Cathode Column 2 (Green) 10 Cathode Column 8 (Green) 22 Anode Row 1 11 Cathode Column 8 (Red) 23 Cathode Column 1 (Red) 12 Anode Row 8 24 Cathode Column 1 (Green) 4 3 2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/9 PART NO. LMD8821/2DHRFVG-XX Electrical Connection PIN NO. LMD8822DHRFVG-XX PIN NO. LMD8822DHRFVG-XX 1 Anode Column 5 (Green) 13 Cathode Row 4 2 Anode Column 5 (Red) 14 Anode Column 4 (Red) 3 Cathode Row 5 15 Anode Column 4 (Green) 4 Anode Column 6 (Green) 16 Cathode Row 3 5 Anode Column 6 (Red ) 17 Anode Column 3 (Red) 6 Cathode Row 6 18 Anode Column 3 (Green) 7 Anode Column 7 (Green) 19 Cathode Row 2 8 Anode Column 7 (Red) 20 Anode Column 2 (Red) 9 Cathode Row 7 21 Anode Column 2 (Green) 10 Anode Column 8 (Green) 22 Cathode Row 1 11 Anode Column 8 (Red) 23 Anode Column 1 (Red) 12 Cathode Row 8 24 Anode Column 1 (Green) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8821/2DHRFVG-XX Page 5/9 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HRF VG Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 120 mA Power Dissipation PD 75 100 mW Reverse Current @5V Ir μA 10 V Electrostatic Discharge( * ) ESD Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ 2000 ---- Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic *glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Part Selection And Application Information(Ratings at 25℃) Electrical common λP λD △λ Vf(v) Iv(mcd) IV-M cathode (nm) (nm) (nm) Material Emitted or anode Min. Typ. Max. Min. Typ. CHIP PART NO AlGaInP LMD8821DHRFVG-XX GaP AlGaInP Red Green Red LMD8822DHRFVG-XX GaP Green Common Cathode Common Anode --- 630 20 1.5 1.8 2.4 8.5 15.2 565 --- 30 1.7 2.1 2.6 4.0 6.0 --- 630 20 1.5 1.8 2.4 8.5 15.2 565 --- 30 1.7 2.1 2.6 4.0 6.0 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8821/2DHRFVG-XX Page 6/9 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λp nm If=20mA Dominant Wavelength λD nm If=20mA Spectral Line Half-Width △λ nm If=20mA Ir μA Vr=5V Parameter Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8821/2DHRFVG-XX Page 7/9 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 ℃ 1.2 Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 100 1.0 0.5 0 550 600 650 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8821/2DHRFVG-XX Page 8/9 Typical Electro-Optical Characteristics Curve VG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 1.0 5.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LMD8821/2DHRFVG-XX Page 9/9 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11