VL370-5-15

VL370-5-15
TECHNICAL DATA
UV LED, 5 mm
InGaN
Features
•
•
•
•
Zener diode is built in the protective circuit against static electricity
Low Voltage DC Operated
High Power Intensity
Complies with RoHS Directive
Specifications (25°C)
Item
Absolute Maximum Ratings
DC Forward Current
Peak Pulse Forward Current *
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature (for 5 sec.)
Symbol
Value
Unit
IF
IFP
IR
PD
TOP
TSTG
TSOL
30
100
50
80
-40 … +85
-40 … +100
260 ± 5
mA
mA
mA
mW
°C
°C
°C
* Note: 1/10 duty cycle, 0.1 ms pulse width
Item
Optical Specifications
CW Output Power *1
Peak Wavelength *2
Viewing Angle
Electrical Specifications
Forward Current
Forward Voltage *3
Symbol
Min.
Typ.
Max.
Unit
PO
λP
φ
2.0
365
370
15
4.0
375
mW
nm
deg.
IF
VF
3.2
20
-
4.2
mA
V
* Note:
1. Peak wavelength measurement allowance is ± 2 nm
2. Optical ouput measurement allowance is ± 10%
3. Forward voltage measurement allowance is ± 0.2 V
Outline Dimensons
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Device Materials
Item
Material
InGaN based
Si
Ag Plating, Iron Alloy
Au
UV-resistant Epoxy Resin (Water Clear)
Chip Die
Zener Diode
Lead Frame
Bonding wire
Encapsulation
Typical Performance Curves
Forward Voltage vs.
Forward Current
Relative Luminous Intensity vs.
Ambient Temperature
Forward Current vs. Ambient Temperature
Relative Intensity vs. Forward Current
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Reliability
1. Test item and result
No.
Test Item
Standard Test
Methode
Test Conditions
Note
Sample
Pass
1
Steady State
operating Life
Internal Ref.
IF=20mA, Ta=25°C
1000 Hr
20
OK
2
Soldering Test
JEITA ED-4701
330 302
Tsol=260 ± 5°C, 3sec
3mm from the base
of the epoxy bulb
2 Times
60
OK
3
Themal Shock
JESD22-A106-A
-40°C … +85°C
84 Cycles
20
OK
4
Temperature Cycle
JESD22-A104-A
-35°C … +75°C
168 Cycles
20
OK
5
High Temperature
Storage
JESD22-A103-A
Tstg=100°C
1000 Hr
20
OK
6
Low Temperature
Storage
Internal Ref.
Tstg=-40°C
1000 Hr
20
OK
7
High Temperature
High Humidity
JESD22-A101-B
Ta=85°C, RH=85%
1000 Hr
20
OK
8
On-Off Test
Internal Ref.
2sec ON, 2sec OFF
IF=20mA
100000 cycle
20
OK
2. Criteria for judging the damage
Item
Forward Voltage
Optical Power Ouput
Symbol
Test Conditions
VF
PO
IF=20mA
IF=20mA
Criteria for Judgment
Min.
Max.
U.S.L x 1.1
L.S.L x 0.7
-
* Note:
1. U.S.L: Upper Standard Level
2. L.S.L: Lower Standard Level
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Precaution for Use
1. Cautions
• This device is a UV LED, which radiates UV light during operation.
• DO NOT look directly into the UV light or look through the optical system. To prevent in
adequate exposure of UV radiation, wear UV protective glasses.
2. Lead Forming
• When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
• Lead forming should be done before soldering.
• DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• Recommended soldering conditions:
Pre-Heat
Pre-Heat Time
Solder Bath Temperature
Dipping Time
Dipping Position
•
•
•
•
•
Dip Soldering
120 °C Max.
60 Seconds Max.
260 °C Max.
5 Seconds Max.
No lower than 3 mm from the base of the epoxy bulb
DO NOT apply any stress to the lead particularly when heat.
The LEDs must not be reposition after soldering.
After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
5. Heat Generation
• The powered LEDs generate heat. Heat dissipation should be considered in the application
design to avoid the environmental conditions for operation in excess of the absolute
maximum ratings.
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