NSC 54F322DM

54F/74F322
Octal Serial/Parallel Register with Sign Extend
General Description
Features
The ’F322 is an 8-bit shift register with provision for either
serial or parallel loading and with TRI-STATEÉ parallel outputs plus a bi-state serial output. Parallel data inputs and
parallel outputs are multiplexed to minimize pin count. State
changes are initiated by the rising edge of the clock. Four
synchronous modes of operation are possible: hold (store),
shift right with serial entry, shift right with sign extend and
parallel load. An asynchronous Master Reset (MR) input
overrides clocked operation and clears the register.
Y
Commercial
Package
Number
Military
74F322PC
N20A
54F322DM (Note 2)
74F322SJ (Note 1)
Y
Y
Y
Multiplexed parallel I/O ports
Separate serial input and output
Sign extend function
TRI-STATE outputs for bus applications
Package Description
20-Lead (0.300× Wide) Molded Dual-In-Line
J20A
20-Lead Ceramic Dual-In-Line
M20D
20-Lead (0.300× Wide) Molded Small Outline, EIAJ
54F322FM (Note 2)
W20A
20-Lead Cerpack
54F322LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13× reel. Use suffix e SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB.
Logic Symbols
IEEE/IEC
TL/F/9516 – 3
TL/F/9516 – 5
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation
TL/F/9516
RRD-B30M105/Printed in U. S. A.
54F/74F322 Octal Serial/Parallel Register with Sign Extend
May 1995
Connection Diagrams
Pin Assignment
for DIP, SOIC and Flatpak
Pin Assignment
for LCC
TL/F/9516 – 2
TL/F/9516–1
2
Unit Loading/Fan Out
54F/74F
Pin Names
RE
S/P
SE
S
D0, D1
CP
MR
OE
Q0
I/O0 – I/O7
Description
U.L.
HIGH/LOW
Input IIH/IIL
Output IOH/IOL
Register Enable Input (Active LOW)
1.0/1.0
20 mA/b0.6 mA
Serial (HIGH) or Parallel (LOW) Mode Control Input
1.0/1.0
20 mA/b0.6 mA
Sign Extend Input (Active LOW)
1.0/3.0
20 mA/b1.8 mA
Serial Data Select Input
1.0/2.0
20 mA/b1.2 mA
Serial Data Inputs
1.0/1.0
20 mA/b0.6 mA
Clock Pulse Input (Active Rising Edge)
1.0/1.0
20 mA/b0.6 mA
Asynchronous Master Reset Input (Active LOW)
1.0/1.0
20 mA/b0.6 mA
TRI-STATE Output Enable Input (Active LOW)
1.0/1.0
20 mA/b0.6 mA
b 1 mA/ b 20 mA
Bi-State Serial Output
50/33.3
Multiplexed Parallel Data Inputs or
3.5/1.083
70 mA/b0.65 mA
TRI-STATE Parallel Data Outputs
150/40 (33.3) b3 mA/24 mA (20 mA)
Functional Description
on SE enables serial entry from either D0 or D1, as determined by the S input. A LOW signal on SE enables shift right
but Q7 reloads its contents, thus performing the sign extend
function required for the ’F384 Twos Complement Multiplier.
A HIGH signal on OE disables the TRI-STATE output buffers, regardless of the other control inputs. In this condition
the shifting and loading operations can still be performed.
The ’F322 contains eight D-type edge triggered flip-flops
and the interstage gating required to perform right shift and
the intrastage gating necessary for hold and synchronous
parallel load operations. A LOW signal on RE enables shifting or parallel loading, while a HIGH signal enables the hold
mode. A HIGH signal on S/P enables shift right, while a
LOW signal disables the TRI-STATE output buffers and enables parallel loading. In the shift right mode a HIGH signal
Mode Select Table
Inputs
Mode
Outputs
Q0
MR
RE
S/P
SE
S
OE*
CP
I/O7
I/O6
I/O5
I/O4
I/O3
I/O2
I/O1
I/O0
L
L
X
X
X
X
X
X
X
X
L
H
X
X
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
Z
L
L
Parallel
Load
H
L
L
X
X
X
L
I7
I6
I5
I4
I3
I2
I1
I0
I0
Shift
Right
H
H
L
L
H
H
H
H
L
H
L
L
L
L
D0
D1
O7
O7
O6
O6
O5
O5
O4
O4
O3
O3
O2
O2
O1
O1
O1
O1
Sign
Extend
H
L
H
L
X
L
L
O7
O7
O6
O5
O4
O3
O2
O1
O1
Hold
H
H
X
X
X
L
L
NC
NC
NC
NC
NC
NC
NC
NC
NC
Clear
*When the OE input is HIGH all I/On terminals are at the high impedance state; sequential operation or clearing of the register is not affected.
Note 1: I7 –I0 e The level of the steady-state input at the respective I/O terminal is loaded into the flip-flop while the flip-flop outputs (except Q0) are isolated from
the I/O terminal.
Note 2: D0, D1 e The level of the steady-state inputs to the serial multiplexer input.
Note 3: O7 –O0 e The level of the respective Qn flip-flop prior to the last Clock LOW-to-HIGH transition.
H e HIGH Voltage Level
L e LOW Voltage Level
Z e High Impedance Output State
L e LOW-to-HIGH Transition
NC e No Change
3
Logic Diagram
TL/F/9516 – 4
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
4
Absolute Maximum Ratings (Note 1)
Voltage Applied to Output
in HIGH State (with VCC e 0V)
b 0.5V to VCC
Standard Output
b 0.5V to a 5.5V
TRI-STATE Output
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature
b 65§ C to a 150§ C
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
b 55§ C to a 125§ C
b 55§ C to a 175§ C
b 55§ C to a 150§ C
VCC Pin Potential to
Ground Pin
Recommended Operating
Conditions
b 0.5V to a 7.0V
Free Air Ambient Temperature
Military
Commercial
b 0.5V to a 7.0V
Input Voltage (Note 2)
Input Current (Note 2)
b 30 mA to a 5.0 mA
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
b 55§ C to a 125§ C
0§ C to a 70§ C
Supply Voltage
Military
Commercial
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
a 4.5V to a 5.5V
a 4.5V to a 5.5V
DC Electrical Characteristics
Symbol
54F/74F
Parameter
Min
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Units
Input Clamp Diode Voltage
VOH
Output HIGH
Voltage
54F 10% VCC
54F 10% VCC
74F 10% VCC
74F 10% VCC
74F 5% VCC
74F 5% VCC
VCC
Conditions
Max
2.0
VCD
VOL
Typ
V
Recognized as a HIGH Signal
0.8
V
Recognized as a LOW Signal
b 1.2
V
2.5
2.4
2.5
2.4
2.7
2.7
Min
IIN e b18 mA
V
Min
IOH
IOH
IOH
IOH
IOH
IOH
IOL e 20 mA (Q0, I/On)
IOL e 20 mA (Q0)
IOL e 24 mA ( I/On)
e
e
e
e
e
e
b 1 mA (Q0, I/On)
b 3 mA (I/On)
b 1 mA (Q0, I/On)
b 3 mA (I/On)
b 1 mA (Q0, I/On)
b 3 mA (I/On)
Output LOW
Voltage
54F 10% VCC
74F 10% VCC
74F 10% VCC
0.5
0.5
0.5
V
Min
IIH
Input HIGH
Current
54F
74F
20.0
5.0
mA
Max
VIN e 2.7V
IBVI
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
mA
Max
VIN e 7.0V (Non-I/O Inputs)
IBVIT
Input HIGH Current
Breakdown Test (I/O)
54F
74F
1.0
0.5
mA
Max
VIN e 5.5V (I/On)
ICEX
Output HIGH
Leakage Current
54F
74F
250
50
mA
Max
VOUT e VCC
VID
Input Leakage
Test
74F
V
0.0
IID e 1.9 mA
All Other Pins Grounded
IOD
Output Leakage
Circuit Current
74F
3.75
mA
0.0
VIOD e 150 mV
All Other Pins Grounded
IIL
Input LOW Current
b 0.6
b 1.2
b 1.8
mA
mA
mA
Max
Max
Max
VIN e 0.5V (RE, S/P, Dn, CP, MR, OE)
VIN e 0.5V (S)
VIN e 0.5V (SE)
IIH a
IOZH
Output Leakage Current
70
mA
Max
VI/O e 2.7V (I/On)
IIL a
IOZL
Output Leakage Current
b 650
mA
Max
VI/O e 0.5V (I/On)
IOS
Output Short-Circuit Current
b 150
mA
Max
VOUT e 0V
IZZ
Bus Drainage Test
500
mA
0.0V
VOUT e 5.25V
ICC
Power Supply Current
90
mA
Max
4.75
b 60
60
5
AC Electrical Characteristics
Symbol
Parameter
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
CL e 50 pF
TA, VCC e Mil
CL e 50 pF
TA, VCC e Com
CL e 50 pF
Max
Min
Max
Min
Typ
fmax
Maximum Clock Frequency
70
90
tPLH
tPHL
Propagation Delay
CP to I/On
3.5
5.0
7.0
8.5
7.5
11.0
3.5
3.5
9.5
10.0
3.5
5.0
8.5
12.0
tPLH
tPHL
Propagation Delay
CP to Q0
3.5
3.5
7.0
7.0
9.0
8.0
3.5
3.5
11.0
10.0
3.5
3.5
10.0
9.0
tPHL
Propagation Delay
MR to I/On
6.0
10.0
13.0
6.0
15.0
6.0
14.0
ns
tPHL
Propagation Delay
MR to Q0
5.5
7.5
12.0
5.5
14.0
5.5
13.0
ns
tPZH
tPZL
Output Enable Time
OE to I/On
3.0
4.0
6.5
8.5
9.0
11.0
3.0
4.0
12.5
14.5
3.0
4.0
10.0
12.0
tPHZ
tPLZ
Output Disable Time
OE to I/On
2.0
2.0
4.5
5.0
6.0
7.0
2.0
2.0
8.0
10.0
2.0
2.0
7.0
8.0
tPZH
tPZL
Output Enable Time
S/P to I/On
4.5
5.5
8.0
10.0
10.5
14.0
4.5
5.5
13.5
17.0
4.5
5.5
11.5
15.0
tPHZ
tPLZ
Output Disable Time
S/P to I/On
5.0
6.0
9.0
12.0
11.5
15.5
5.0
6.0
16.5
19.5
5.0
6.0
12.5
16.5
50
Min
Units
Max
70
MHz
ns
ns
ns
AC Operating Requirements
Symbol
Parameter
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
TA, VCC e Mil
TA, VCC e Com
Min
Min
Min
Max
Max
Units
Max
ts(H)
ts(L)
Setup Time, HIGH or LOW
RE to CP
6.0
14.0
14.0
18.0
7.0
16.0
ns
th(H)
th(L)
Hold Time, HIGH or LOW
RE to CP
0
0
0
0
0
0
ns
ts(H)
ts(L)
Setup Time, HIGH or LOW
D0, D1 or I/On to CP
6.5
6.5
8.5
8.5
7.5
7.5
ns
th(H)
th(L)
Hold Time, HIGH or LOW
D0, D1 or I/On to CP
2.0
2.0
3.0
3.0
3.0
3.0
ns
ts(H)
ts(L)
Setup Time, HIGH or LOW
SE to CP
7.0
2.5
9.0
11.0
8.0
3.5
ns
th(H)
th(L)
Hold Time, HIGH or LOW
SE to CP
2.0
0.0
2.0
1.0
2.0
0.0
ns
ts(H)
ts(L)
Setup Time, HIGH or LOW
S/P to CP
11.0
13.5
13.0
21.0
12.0
15.5
ns
ts(H)
ts(L)
Setup Time, HIGH or LOW
S to CP
6.5
9.0
8.5
11.0
7.5
10.0
ns
th(H)
th(L)
Hold Time, HIGH or LOW
S or S/P to CP
0
0
1.0
0
0
0
ns
tw(H)
tw(L)
CP Pulse Width, HIGH or LOW
7.0
8.0
7.0
ns
tw(L)
MR Pulse Width, LOW
5.5
7.5
6.5
trec
Recovery Time
MR to CP
8.0
12.0
8.0
6
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
322
S
Temperature Range Family
74F e Commercial
54F e Military
C
X
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13× reel
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
SJ e Small Outline SOIC EIAJ
L e Leadless Chip Carrier (LCC)
Temperature Range
C e Commercial (0§ C to a 70§ C)
M e Military (b55§ C to a 125§ C)
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
7
Physical Dimensions inches (millimeters) (Continued)
20-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J20A
8
Physical Dimensions inches (millimeters) (Continued)
20-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M20D
20-Lead (0.300× Wide) Molded Dual-In-Line Package (P)
NS Package Number N20A
9
54F/74F322 Octal Serial/Parallel Register with Sign Extend
Physical Dimensions inches (millimeters) (Continued)
20-Lead Ceramic Flatpak (F)
NS Package Number W20A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
Corporation
1111 West Bardin Road
Arlington, TX 76017
Tel: 1(800) 272-9959
Fax: 1(800) 737-7018
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
National Semiconductor
Europe
Fax: (a49) 0-180-530 85 86
Email: cnjwge @ tevm2.nsc.com
Deutsch Tel: (a49) 0-180-530 85 85
English Tel: (a49) 0-180-532 78 32
Fran3ais Tel: (a49) 0-180-532 93 58
Italiano Tel: (a49) 0-180-534 16 80
National Semiconductor
Hong Kong Ltd.
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Hong Kong
Tel: (852) 2737-1600
Fax: (852) 2736-9960
National Semiconductor
Japan Ltd.
Tel: 81-043-299-2309
Fax: 81-043-299-2408
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.