APX9266 Single-Phase Full-Wave Motor Driver for Silent Fan Motor Features General Description • Single Phase Full Wave Fan Driver • Silent Driver The APX9266 is a single-phase full-wave motor driver for DC fan motor, and its speed can be controlled by PWM • Low Supply Current • Low Standby Current (PWM=0), Supply current less than 200µA • Speed controllable by PWM input signal • Built-in Quick Start Function • Lock Protection and Auto Restart Function • Built-in FG Output • Built-in Hall Bias Circuit • Built-in Thermal Protection Circuit • Lead Free and Green Devices Available input signal. The output signal of this IC is the amplified hall input signal. It is suitable for both game machine and CPU cooler that need silent drivers. The device has lock protection function and the lock-restart timing can be tunable by CT capacitor. The device is also with thermal shutdown function. In normal operation, the supply current is less than 3mA, but in PWM=0 standby mode, it is just around 130µA. Moreover, this feature will shutdown HB, Amplifier, and FG. The APX9266 is available in MSOP-10 package. Pin Configuration (RoHS Compliant) Applications • OUT2 CT IN+ HB IN- Motor Drivers For Silent Fan Motors 1 2 3 4 5 Ordering and Marking Information MSOP-10 Package Code X : MSOP-10 Operating Ambient Temperature Range I : -40 to 105 °C Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device APX9266 Assembly Material Handling Code Temperature Range Package Code APX9266 X : 10 GND 9 OUT1 8 VCC 7 PWM 6 FG A9266 XXX XX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol VCC (Note 1) Parameter VCC Pin Supply Voltage Rating Unit 7 V IOUT Output Pin Output Current 1 A VOUT Output Pin Output Voltage 7 V HB Pin Output Current 25 mA IHB ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 1 www.anpec.com.tw APX9266 Absolute Maximum Ratings (Cont.) Symbol Rating Unit VFG FG Pin Output Voltage Parameter 7 V IFG FG Pin Sink Current 10 mA 192 °C/W Thermal Resistance-Junction to Ambient RTH, JA MSOP-10 PD Power Dissipation (Note2) 0.8 W TJ Junction Temperature -40 to 150 °C TSTG Storage Temperature -65 to 150 °C TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 °C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 2: Mounted on a board (48x38x1.6t mm, Glass epoxy). Recommended Operating Conditions Symbol Parameter Ratings Unit VCC VCC Pin Supply Voltage 2 to 5.5 V VHall Hall Input Voltage Range 0.2 to Vcc-1.1 V -40 to 105 °C TA Ambient Temperature Electrical Characteristics Symbol Parameter (VCC = 5V, TA=-25°C, unless otherwise specified) Test Conditions APX9266 Unit Min. Typ. Max. 1.2 1.3 1.4 V - 0 - V - 15 20 mA SUPPLY CURRENT IHB=5mA VHB Hall Bias Voltage IHB HB Supply Current THBR HB Recovery Time None Capacitor - 5 10 µSec ICC1 Operating Current Rotation Mode - 3 5 mA ICC2 Standby Supply Current PWM=0 - 130 200 µA VCTH CT Pin High Level Voltage CCT=0.47µF 1.4 1.3 1.5 V VCTL CT Pin Low Level Voltage CCT=0.47µF 0.25 0.325 0.4 V ICT1 CT Charge Current VCT=0V 0.75 0.95 1.15 µA ICT2 CT Discharge Current VCT=2V 0.13 0.16 0.19 µA RCT CT Charge/Discharge Current Ratio RCT=ICT1/ICT2 5 6 7 Lock Protect TOFF or PWM=0 CT PWM VPWMH PWM Input High Level Voltage 2.5 - VCC+0.5 V VPWML PWM Input Low Level Voltage 0 - 1 V FPWM PWM Input Frequency 0.02 - 50 kHz Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 2 www.anpec.com.tw APX9266 Electrical Characteristics (Cont.) Symbol Parameter (VCC = 5V, TA=-25°C, unless otherwise specified) Test Conditions APX9266 Min. Typ. Max. Unit OUTPUT VOL Output Lower Side Saturation IO=250mA - 0.15 0.22 V VOH Output Upper Side Saturation IO=250mA - 0.15 0.22 V VFG FG Pin Low Voltage IFG=3mA - 0.2 0.3 V IFG FG Pin Leak Current VFG=5V - - 1 µA GAIN - ±1 ±6 mV 45 48 51 dB Over Temperature Shutdown - 170 - Over Temperature Shutdown Hysteresis - 35 - - 66.5 90 VHOFS Input Offset Voltage Gio Input – Output Gain VO/(IN+ - IN-) (ratio) THERMAL SHUTDOWN OTS °C QUICK START TQS Quick Start Enable Time Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 3 mSec www.anpec.com.tw APX9266 Typical Operating Characteristics VCC Supply Current vs. VCC Supply Voltage VCC Supply Current vs. VCC Supply Voltage 300 4 Operation Mode Standby Mode VCC Supply Current (µA) VCC Supply Current (mA) 3.5 3 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 250 200 150 100 50 0 7 0 1 VCC Supply Voltage (V) 5 6 7 1.2 1 0.8 0.6 0.4 0.2 0 0 -40 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 -20 0.8 0.7 1.2 CT Pin Voltage (V) 0.6 Upper Side MOSFET 0.4 0.3 0.2 20 40 60 80 CT Pin Voltage vs. VCC Supply Voltage 1.4 0.5 0 Ambient Temperature (°C) Saturation Voltage vs. Output Current Saturation Voltage (V) 4 Offset Voltage vs. Ambient Temperature FG Pin Low Voltage (V) CT High Lev el Voltage 1 0.8 0.6 0.4 Low Side MOSFET CT Low Lev el Voltage 0.2 0.1 0 3 1.4 Offset Voltage (mV) FG Pin Current (mA) FG Pin Current vs. FG Pin Low Voltage 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 2 VCC Supply Voltage (V) 0 0 100 200 300 400 500 600 700 800 0 Output Current (mA) Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 1 2 3 4 5 6 7 VCC Supply Voltage(V) 4 www.anpec.com.tw APX9266 Typical Operating Characteristics (Cont.) HB Voltage vs. VCC Supply Voltage 1.4 1 0.9 1.2 0.7 0.6 0.5 0.4 0.3 CT Discharge Current 0.2 1 0.8 0.6 0.4 0.2 0.1 0 IHB=5mA CT Charge Current 0.8 HB Voltage (V) CT Charge/Discharge Current (uA) 1.1 CT Charge/Discharge Current vs. VCC Supply Voltage 0 0 1 2 3 4 5 6 7 0 1 VCC Supply Voltage (V) 2 3 4 5 6 7 VCC Supply Voltage (V) Maximum Power Dissipation vs. Ambient Temperature Maximum Power Dissipation (W) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 25 50 75 100105 125 150 Ambient Temperature (°C) Operating Waveforms Rotation Waveform 1 Rotation Waveform 2 PWM Mode IN+(50mV/div) OUT1(2V/div) Full Speed IN-(50mV/div) OUT2(2V/div) OUT1(2V/div) Time (0.2ms/div) Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 IN-(50mV/div) IN+(50mV/div) OUT2(2V/div) Time (0.2ms/div) 5 www.anpec.com.tw APX9266 Operating Waveforms (Cont.) Rotation Waveform 3 Rotation Waveform 4 PWM Mode Full Speed IIN (200mA/div) IIN (200mA/div) OUT2(2V/div) OUT2(2V/div) OUT1(2V/div) OUT1(2V/div) FG(5V/div) FG(5V/div) Time (0.2ms/div) Time (0.2ms/div) Lock Protection Waveform 1 Lock Protection Waveform 2 OUT1(5V/div) OUT1(5V/div) OUT2(5V/div) OUT2(5V/div) CT(0.5V/div) CT(0.5V/div) FG(5V/div) FG(5V/div),always High Time (1s/div) Time (1s/div) Pin Description PIN Description No. Name 1 OUT2 2 CT Shutdown Time and Restart Time Setting. 3 IN+ Hall Input +. 4 HB Hall Bias. 5 IN- Hall Input -. 6 FG Rotation Speed Output. 7 PWM PWM Signal Input Terminal. 8 VCC Supply Voltage Input Pin. 9 OUT1 H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. 10 GND Power Ground. H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 6 www.anpec.com.tw APX9266 Block Diagram Discharge Circuit CT GND 150kΩ VCC 500Ω OUT1 3µA HB 90kΩ Vcc Hall Bias Control TSD PWM 10kΩ IN+ OUT2 500Ω 150kΩ FG IN- Typical Application Circuit CCT 1 OUT2 GND 10 2 CT OUT1 9 3 IN+ VCC 8 0.47µF D1 Zener Hall 4 HB PWM 7 5 IN- FG 6 VIN D2 C1 6V 1µF PWM control signal FG output RFG 10kΩ Pull High Voltage Note 3: In hot plug application, it’s necessary to protect against a hot plug input voltage overshoot. Add an input zener diode, between the VCC and GND, to clamp the overshoot. In normal operation, the zener diode isn’t stressed because output current doesn’t reverse to VCC. Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 7 www.anpec.com.tw APX9266 Function Description Lockup Protection and Automatic Restart Lock protect function does not work if PWM input frequency is slower than 15Hz (typ.). Therefore, the PWM input The APX9266 provides the lockup protection and auto- frequency must be more than 20Hz. matic restart functions for preventing the coil burnout in the locked fan. Connecting the capacitor from CT pin to GND determines the shutdown time and restart time. As the fan is locked the charge/discharge circuit, charging PWM 66.5ms (typ.) the CT capacitor to 1.3V by a 0.95µA source current for a locked detection time and then switches the capacitor Lock protect enable (internal) enable disable enable to discharge. During this discharge interval, the output drivers are switched off until the CT voltage is discharged to 0.325V by a 0.16µA sink current and switches the capacitor to charge. During this charging CT interval, the IC enters the restart time; one output is high and another is low, which makes a torque for fan rotation until the CT voltage is charged to 1.3V by a 0.95µA source current. If the locked condition is not removed, the charge/ HB HB recovery time (typ.=5us) discharge process will be recurred until the locked condition is released (See Figure 1. Lockup Protection and Automatic Restart Waveform). OUT1 ININ+ Figure 2. Quick Start Waveform TOFF OUT1 TOFF Frequency Generator Function The FG pin is an open collector output, connecting a pull up resistor to a high level voltage for the frequency generator TON OUT2 function. CT During the Lock Mode, the FG will be always high (switch off). (See Truth Table) Open the terminal is at no use. FG Thermal Protection The APX9266 has thermal protection. W hen internal HB Lock Lock Detection junction temperature reaches 170°C, the output devices will be switched off. When the IC’s junction temperature Release cools by 35°C, the thermal sensor will turn the output devices on again, resulting in a pulsed output during Figure 1. Lockup Protection and Automatic Restart Waveform continuous thermal protection. Quick Start This IC disables the lock protection function when the PWM input keeps low level for more than 66.5ms (typ.) (see Figure 2. Quick Start Waveform). Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 8 www.anpec.com.tw APX9266 Truth Table Input IN- IN+ L H H L H L L H L H H L - - Output PWM CT H L L - H L - OUT1 OUT2 FG H L L L H OFF L L OFF L L L L L OFF L L OFF OFF OFF OFF Mode Operation Mode Lock Mode Standby Mode Application Information Input Protection Diode & Capacitor (IN+)-(IN-) It should be added a protection diode (D1) to protect the damage from the power reverse connection. However, the protection diode will cause a voltage drop on the supply voltage. The current rating of the diode must be larger than the maximum output current. Connecting a capacitor (C1) between VCC and GND is used for a OUT1 noise reduction purpose ( See the Application Circuit). HB pin & Hall input (IN+)-(IN-) 1.3V reference is for hall element bias. In case VCC influences the hall signal by board wiring pattern, please connect 0.1µF capacitor between HB and GND. The supply current is just around 130µA at PWM=0 standby mode. This feature will shutdown HB, Amplifier and FG. The output signal of this IC is the amplified hall input OUT1 signal, therefore, the output signal depends on hall input. When the hall input is small, the output signal becomes Figure 3. Different of output signal depending on the shape of Hall input signal gentle. Oppositely, the input signal is large, the output becomes steep (See Figure 3. Different of output signal PWM input depending on the shape of Hall input signal).The input/ output gain is 48dB (typ.). Therefore, please adjust the It is possible to change rotation speed of the motor by amplitude of hall input to meet the adequate output voltage. In the case of long board wiring pattern from switching high side output transistor. The on-duty of switching depends on the input signal to PWM terminal. hall element to hall signal input terminal, please connect a capacitor between IN+ and IN-. (See Figure 4. PWM Input Waveform) Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 9 www.anpec.com.tw APX9266 Application Information (Cont.) Where: PWM input (Cont.) C CT = CT pin capacitor The input level of PWM terminal is For example: H : High side output transistor is ON L : High side output transistor is OFF CCT= 0.47µF (see Truth Table). Restart Time=0.52s, When PWM terminal is open, it is equal to high Shutdown Time=3.13s The value of charge capacitor in range of 0.47µF to 1µF is recommended . FG Resistor IN+ The value of the FG resistor could be decided by the following equation: RFG = PWM V CC − VFG I For example: VCC= 5V, I=3mA, VFG= 0.2V, RFG= 1.6kΩ The value of resistor in the range of 1KΩ to 10KΩ is recommended. OUT1 Thermal Consideration Refer to “Maximum Power Dissipation vs. Ambient Temperature”, the IC is safe to operate below the curve and it will eable the thermal protection if the operating area is above the line. For example, T A = 75°C, the OUT2 maximum power dissipation is about 0.48w. The power dissipation can be calculated by the following equation: FG PD = ( VCC − VOUT1− VOUT 2 ) × IOUT + VCC × ICC Figure 4.PWM Input Waveform For example: CT Capacitor if VCC=5V, ICC=4mA, IOUT=300mA, VOUT1=4.81V, The capacitor that is connected from CT pin to GND VOUT2=0.17V, then PD=0.128W determines the shutdown time and restart time. Restart Time = The GND pin provides an electrical connection to ground and channeling heat away. The printed circuit board (PCB) CCT × (VCTH − VCTL ) ICT1 Shutdown Time = forms a heat sink and dissipates most of the heat into ambient air. CCT × (VCTH − VCTL ) ICT 2 Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 10 www.anpec.com.tw APX9266 Packaging Information MSOP-10 D b A 0.25 c A2 e E E1 SEE VIEW A L 0 A1 GAUGE PLANE SEATING PLANE VIEW A S Y M B O L MSOP-10 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 0.043 1.10 A1 0.00 0.15 0.000 0.006 A2 0.75 0.95 0.030 0.037 0.013 b 0.17 0.33 0.007 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.70 5.10 0.185 0.201 E1 2.90 3.10 0.114 e 0.50 BSC 0.122 0.020 BSC L 0.40 0.80 0.016 0.031 0 0° 8° 0° 8° Note: 1. Follow JEDEC MO-187 BA. 2. Dimension “D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not flash or protrusions. 3. Dimension “E1” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 6 mil per side. Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 11 www.anpec.com.tw APX9266 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application A H 330.0±2.00 50 MIN. MSOP-10 P0 T1 C d D W E1 12.4+2.00 13.0+0.50 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 -0.00 -0.20 P1 P2 4.00±0.10 8.00±0.10 2.00±0.10 D0 D1 1.5+0.10 -0.00 1.5 MIN. T A0 B0 F 5.5±0.10 K0 0.6+0.00 6.70±0.20 3.30±0.20 1.40±0.20 -0.40 (mm) Devices Per Unit Package Type Unit Quantity MSOP- 10 Tape & Reel 3000 Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 12 www.anpec.com.tw APX9266 Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Time Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245°C, 5 sec 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Time 25°C to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package. Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 13 www.anpec.com.tw APX9266 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures 3 3 Package Thickness <2.5 mm ≥2.5 mm Volume mm ≥350 225 +0/-5°C 225 +0/-5°C Volume mm <350 240 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Package Thickness Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.4 - Mar., 2008 14 www.anpec.com.tw