AOSMD AOD2922

AOS Semiconductor
Product Reliability Report
AOD2922,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOD2922. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOD2922 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
routine monitored for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Reliability Stress Test Summary and Results
Reliability Evaluation
I. Product Description:
• Latest Trench Power AlphaMOS (αMOS MV) technology
• Very Low RDS(ON)
• Low Gate Charge
• Optimized for fast-switching applications
• RoHS and Halogen-Free Compliant
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bond
Mold Material
Moisture Level
AOD2922
Standard sub-micron
100V N-Channel AlphaMOS
TO252
Bare Cu
Soft solder
Al & Cu wire
Epoxy resin with silica filler
Up to Level 1
2
III. Reliability Stress Test Summary and Results
Test Item*
Test Condition
Time Point
Total
Sample
Size**
Number
of
Failures
Reference
Standard
MSL
Precondition
168hr 85°C / 85%RH +
3 cycle [email protected]°C
(MSL 1)
-
3003pcs
0
JESD22-A113
HTGB
Temp = 150°C ,
Vgs=100% of Vgsmax
168 / 500 /
1000 hrs
539pcs
HTRB
Temp = 150°C ,
Vds=80% of Vdsmax
168 / 500 /
1000 hrs
539pcs
HAST
130°C , 85%RH,
33.3 psi, Vds = 80% of
Vdsmax before arcing
(typically ≤42V)
96 hrs
924 pcs
0
JESD22-A110
Pressure Pot
121°C , 29.7psi,
RH=100%
96 hrs
924 pcs
0
JESD22-A102
Temperature
Cycle
-65°C to 150°C ,
air to air,
250 / 500
cycles
1155 pcs
0
JESD22-A104
0
JESD22-A108
0
JESD22-A108
**Note: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 4.90
MTTF = 23277 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 4.90
9
MTTF = 10 / FIT = 23277 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
130 deg C
150 deg C
2.59
1
3