AOS Semiconductor Product Reliability Report AOC2806, rev A Molded CSP Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOC2806. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOC2806 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be routine monitored for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Reliability Stress Test Summary and Results Reliability Evaluation I. Product Description: • Trench Power AlphaMOS (αMOS LV) technology • Low RSS(ON) • With ESD protection to improve battery performance and safety • Common drain configuration for design simpicity • RoHS and Halogen-Free Compliant Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond Mold Material Moisture Level AOC2806 Standard sub-micron 20V Dual N-Channel AlphaMOS AlphaDFN 1.7x1.7_4 N/A N/A Solder ball Epoxy resin with silica filler Level 1 2 III. Reliability Stress Test Summary and Results Test Item Test Condition Time Point Total Sample Size Number of Failures Reference Standard HTGB Temp = 150°C , Vgs=100% of Vgsmax 168 / 500 / 1000 hours 462 pcs 0 JESD22-A108 HTRB Temp = 150°C , Vds=80% of Vdsmax 168 / 500 / 1000 hours 462 pcs 0 JESD22-A108 MSL Precondition 168hr 85°C / 85%RH + 3 cycle reflow@260°C (MSL 1) - 2772 pcs 0 JESD22-A113 HAST 130°C , 85%RH, 33.3 psia, Vds = 80% of Vdsmax 96 hours 693 pcs 0 JESD22-A110 H3TRB 85°C , 85%RH, Vds = 80% of Vdsmax 1000 hours 693 pcs 0 JESD22-A101 Autoclave 121°C , 29.7psia, RH=100% 96 hours 693 pcs 0 JESD22-A102 Temperature -65°C to 150°C , 250 / 500 / 693 pcs 0 JESD22-A104 air to air, 1000 cycles Cycle Note: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 5.09 MTTF = 22440 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 5.09 9 MTTF = 10 / FIT = 22440 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from burn-in tests H = Duration of burn-in testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 259 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 130 deg C 150 deg C 2.59 1 3